JPH11251509A - Radio ic card and manufacture therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a connecting terminal from being deformed and to automate a manufacturing line, by fixing both ends of a loop antenna to the loop antenna across the hollow portion of the loop antenna. SOLUTION: A wound antenna coil 28 constituting a loop antenna for sending/receiving a radio wave with a semiconductor chip 22 processing information is mounted on a wiring substrate 21 having a wiring pattern. The terminal parts 33-1, 33-2 of the wound antenna coil 28 crosses the hollow portion of the wound antenna coil 28 and fixedly adhere to the parts 34-1, 34-2 of the wound antenna coil 28 in a state of stretch, thereby integrating the terminal parts 33-1, 33-2 with the wound antenna coil 28 and connecting itself to the wiring substrate 21 at the predetermined portion 30 of a metal wire part crossing the hollow portion of the wound antenna coil 28. This prevents a connecting terminal from being shifted in position or deformed and hence can provide a radio IC card which is suitable for automation and is excellent in productivity.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an IC card mounting structure and a manufacturing method thereof suitable for quickly and accurately manufacturing a wireless IC card.

[0002]

2. Description of the Related Art In recent years, companies have become more secure, and practical use of employee ID systems using ID cards is progressing. In the future, the use of credit cards and cash cards as IC cards is rapidly increasing in the financial industry.

[0003] Since security of these IC cards is required, electric contacts are provided in the IC cards to read and write data.

On the other hand, as the rationalization of physical distribution and distribution systems is progressing, rapid development of wireless IC cards and tag systems capable of simultaneously communicating and processing a plurality of data is expected. .

A wireless IC card and a tag need to form an antenna inside the card in order to transmit and receive data, but their shapes and characteristics vary depending on a communication frequency and a communication distance.

In general, when a high communication frequency such as 13.5 MHz is used, the inductance of the antenna can be reduced. For example, it is possible to form an antenna only by a wiring pattern formed on a wiring board. it can. However, when a low communication frequency such as 125 kHz is used, it is necessary to increase the inductance of the antenna. Therefore, a winding coil in which a metal wire is wound a plurality of times is used as the antenna.

Since a wireless IC card or tag generally transmits and receives radio waves, it is composed of an antenna for transmitting and receiving data and a semiconductor element for holding data.
Several capacitors are mounted as needed.

Referring to the drawings, FIG. 4A is a cross-sectional side view of a wireless IC card using a loop antenna using a winding coil, and FIG. 4B is a plan view thereof.

That is, on a wiring board 1 having a wiring pattern formed on a surface thereof, a semiconductor chip 2 for performing information processing and a winding antenna coil 8 constituting a loop antenna for transmitting and receiving radio waves are mounted and formed. I have.

In this manufacturing method, a die for mounting a semiconductor chip 2 at a predetermined position on a wiring board 1 in which a wiring pattern of copper, aluminum or the like is formed on a base material such as glass epoxy or polyester. A bonding pad 3 is provided, and the semiconductor chip 2 is mounted on the pad 3 using a silver paste or the like and cured.

Next, an electrical connection is made between the bonding pad 4 of the semiconductor chip 2 and a predetermined connection land 5 on the wiring board 1 by a wire bonding method using a wire 6 of gold, aluminum or the like. Then, resin sealing 7 is performed by potting, transfer molding, or the like.

Next, a winding antenna coil 8 formed by winding a plurality of thin wires of copper or the like into a plurality of turns is fixed to a predetermined location on the wiring board 1 using an adhesive 9 or the like, and the winding antenna coil 8 is fixed. Electrical connection is made between the connection terminals 10 of the coil 8 and predetermined connection lands 11 on the wiring board 1 by soldering 12 or the like.

The winding antenna coil 8 is bent inside the winding antenna coil 8 with the start end 10-1 and the end 10-2, which are the connection terminals 10 of the winding, as free ends. It is connected to a predetermined connection land 11.

The surface of the metal wire used for the wound antenna coil 8 is covered with an insulating resin, and the wires are heat-sealed with the insulating resin to maintain the shape. And only the connection terminal 10 is formed in a structure of a free end drawn out to a predetermined place.

In order to obtain a predetermined inductance, the metal wire requires several tens to several hundreds of turns, and a wire having a very small diameter of usually Φ25 to Φ100 μm is used.

[0016]

As described above, the connection terminal 10 of the winding antenna coil is a free end.
It is very difficult to maintain a constant shape because the wire is extremely rigid.

In addition, since the deformation of the wire during transport and mounting is large, it is very difficult to position the connection terminal 10 at a predetermined position, which greatly hinders the automation of a production line. I was

As described above, when the processed wound antenna coil is used, there is a problem that productivity is remarkably reduced because automation is difficult. In order to solve this, a method of simultaneously performing connection and winding processing is also being studied. However, for example, in the case of performing 200 turns of winding processing, a processing time of about 10 to 20 seconds is required. This is not a preferable method as a manufacturing process of a wireless IC card in which a remarkable increase in production is expected.

Therefore, in the conventional mounting structure of the wireless IC card and the method of manufacturing the same, it is difficult to make the manufacturing line self-service due to deformation of the connection terminal of the wound antenna coil and the like.
There is a problem that productivity is significantly reduced.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a wireless IC force mounting structure and a method of manufacturing the same, which can automate a manufacturing line without deforming connection terminals of a winding antenna coil as a loop antenna. I have.

[0021]

According to the present invention, a loop antenna formed by winding a metal wire into a loop is connected to both ends of the loop antenna through hollow portions of the loop antenna. In a wireless IC card having a semiconductor element, both ends of the loop antenna
The wireless IC card is characterized by being fixed to the loop antenna across the hollow portion of the loop antenna.

According to the present invention, there is provided a wireless IC card characterized in that both ends of the loop antenna are bent toward the hollow portion of the loop antenna and fixed to the loop antenna itself in a stretched state. is there.

According to the present invention, there is provided a wireless IC card, wherein both ends of the loop antenna are connected to the semiconductor element at an intermediate position traversing a hollow portion of the loop antenna. .

Further, according to the present invention, the metal wire is provided with an insulating coating, and both ends of the loop antenna are fixed by heat fusion of the insulating coating or melting by a solvent. It is on the IC card.

According to the present invention, there is provided the wireless IC card, wherein both ends of the loop antenna are fixed to the loop antenna body with an adhesive.

Further, according to the present invention, a first step of electrically connecting a semiconductor element, and a metal wire previously wound in a loop around the semiconductor element connected on the wiring board by the first step. A second step of positioning a cross-connecting portion of the loop antenna, both ends of which are fixed to the loop antenna in a state of being stretched across the hollow portion of the loop; and the semiconductor positioned in the second step. A third step of electrically connecting the element and the transverse connection portion of the loop antenna to each other.

According to the invention, the electrical connection between the semiconductor element and the loop antenna in the third step is as follows:
A method for manufacturing a wireless IC card, wherein the method is performed by soldering.

According to the invention, the electrical connection between the semiconductor element and the loop antenna in the third step is as follows:
Radio I characterized by performing low-temperature spot welding
The method for manufacturing a C card.

Further, according to the present invention, the first position of the semiconductor element is determined at the transverse connection portion of the loop antenna in which the metal wire is wound in a loop in advance and both ends thereof are fixed across the hollow portion of the loop. And a second step of electrically joining the semiconductor element positioned in the first step and the transverse connection portion of the loop antenna.

According to the present invention, the electrical connection between the semiconductor element and the loop antenna in the second step is performed by applying an ultrasonic wave.
The method for manufacturing a C card.

[0031]

Embodiments of the present invention will be described below in detail with reference to the drawings.

(First Embodiment) FIG. 1A is a cross-sectional side view of a wireless IC card using a loop antenna using a winding coil, and FIG. 1B is a plan view thereof. FIG. 2 is a flowchart of the manufacturing process.

That is, the semiconductor chip 2 for performing information processing is placed on the wiring board 21 having the wiring pattern formed on the surface.
2 and a winding antenna coil 28 constituting a loop antenna for transmitting and receiving radio waves.

This manufacturing method has a thickness of about 25 μm to 150 μm.
A die bonding pad 23 for mounting the semiconductor chip 22 is provided on a wiring board 21 having a wiring pattern made of copper, aluminum, or the like formed on a base material of glass epoxy, polyester, or the like having a size of about 10 mm square, A silver paste or the like is applied thereon (S ₁ ), and the semiconductor chip 2 having a size of about 3 mm square is mounted and fixed with a die bond (S ₂ ) (curing conditions are, for example, 150 ° C./H).
I do.

Next, between the bonding pad 24 of the semiconductor chip 2 and a predetermined connection land 25 on the wiring board 21, a wire 2 of Φ20 μm to Φ30 μm made of gold, aluminum or the like is formed.
6, electrical connection is made by a wire bonding method (S ₃ ) or the like. Thereafter, resin sealing (S ₄ ) is performed by potting, transfer molding, or the like, and the resin is cured (curing conditions are, for example, 150 ° C./2H), and packaging 2 is performed.
7 is formed.

Although the wire bonding method has been described as an example of a method of mounting and connecting a semiconductor chip, other connection methods such as a flip chip connection method can be used.

Next, a thin wire of copper or the like is wound by one or more turns, and has an outer shape of about 80 × 50 (mm).
, So that both terminal portions 31-1 and 31-2 are on the wiring board 21 side, as described later.
An adhesive 29 such as epoxy is applied to a predetermined portion on the wiring board 21.
And the like are applied (S ₅ ), mounted and adhered (S ₆ ), and fixed (curing conditions are normal temperature curing or, for example, 100 ° C./30 min).
I do.

Next, the cross section 3 of the wound antenna coil 28
Then, a solder paste 32 is applied to the predetermined connection land 31 on the wiring board 21 (S ₇ ), and a predetermined portion 30 in the middle of the winding antenna 28 is soldered (S ₈ ). That is, the connection terminals 30 and the connection lands 31 made of the paste 32
Make electrical connection with The soldering condition at this time is, for example, 220 ° C./2 sec.

As shown in the plan view of FIG. 1B, both terminal portions 33-1 and 33-2 of the wound antenna coil 28 traverse the hollow portion of the wound antenna coil 28, and The two terminal portions 33-1 and 33-2 and the wound antenna coil 28 are integrated with each other in a state of being stretched to a part 34-1 and 34-2 of 28.

Then, at a predetermined position 30 of the metal wire portion crossed by the hollow portion of the wound antenna coil 28, the wiring board 2
1 is connected.

The surface of the metal wire used for the wound antenna coil 28 is coated with an insulating resin such as polyester or polyamide, and each wire is made of an insulating resin to maintain the shape. In this case, the insulating film is erased by heating, and the terminal portions 33-1 and 3-3 are heated.
3-2 is a part 34-1, 34 of the winding antenna coil 28.
-2.

That is, the connection terminal 33 of the coil 28 is fixed in a stretched state by this fixation, so that it is not a free end but a fixed end. Is fixed. As a result, the wound antenna coil 28 can be handled as one solid body, and thus handling by the assembling apparatus becomes extremely easy.

Therefore, even when, for example, a fine wire of Φ40 μm to Φ60 μm is used, it is possible to easily perform positioning soldering to the connection lands 31 on the wiring board 21 without causing deformation or the like in the transverse connection portion 30. .

Also, when the coiled antenna coil 28 is mounted on the wiring board 2l, no deformation or the like occurs in the connection terminal portion 30, so that automation becomes possible and productivity can be remarkably improved.

In this embodiment, the winding antenna coil 2
Although soldering has been described as an example of a method for connecting the wiring board 8 and the wiring board 21, it is also possible to use, for example, low-temperature spot welding using ultrasonic waves or the like or silver paste connection, and the method is not limited to this. .

Since the insulating coating formed on the coil 28 can be easily removed by heating at about 150 ° C. or more, a heating process must be performed at the time of connection. Is desirable.

Although a heat-sealing type insulated wire has been described as an example of the metal wire forming the wound antenna coil 28, the same effect can be obtained by using an insulated wire such as an alcohol solvent-fused type polyamide. Can be In this case, it is more effective to use, for example, heating at 130 ° C. to 140 ° C. in fusion.

Further, the terminal portions 33-1 and 33-2 may be fixed to the main body of the coil antenna coil 28 by an adhesive instead of heat fusion.

(Embodiment 2) FIG. 3 (a) is a cross-sectional side view of a wireless IC card using a loop antenna with a winding coil for explaining a second embodiment of the present invention. (b) is a plan view thereof.

Here, the semiconductor chip and the wound antenna coil are directly connected without using a wiring board.

As in the first embodiment, the wound antenna coil 28 has both terminal portions 33-1 and 33-2 bent into a hollow portion of the wound antenna coil 28, and a part of the wound antenna coil 28 is formed. 34-1 and 34-2, and are fixed on the wound antenna coil 28 in a stretched state.

At this time, as shown in the plan view of FIG.
Both terminal parts 33-1 and 33-2 of the wound antenna coil 28
Is folded across the hollow portion of the wound antenna coil 28 to form a hollow portion of the wound antenna coil 28, and is folded back to a part 34-1 and 34-2 of the wound antenna coil 28 and fixed to the wound wire antenna coil 28. Is done.

Next, the semiconductor chip 32 is positioned in the middle of the hollow portion of the wound antenna coil 28, and the bonding pad 24 of the semiconductor chip 32 and the middle of the metal wire portion traversed by the hollow portion of the wound antenna coil 28. The electrical connection is made to the transverse connection portion 30 in the portion by, for example, an ultrasonic connection method or the like.

The integrated semiconductor chip 32 and the wound antenna coil 28 are mounted on the IC card body in a later step.

By adopting such a structure, the productivity can be improved, and it is possible to use only a minimum number of members.

As described above, in the present invention, since the connection terminals of the wound antenna coil are fixed, no deformation or the like occurs, so that automation becomes possible and productivity can be remarkably improved.

Further, by directly connecting the semiconductor chip and the wound antenna coil, it is possible to reduce the thickness and cost.

[0058]

As described above, according to the mounting structure of the wireless IC card and the method of manufacturing the same of the present invention, the connection terminal of the wound antenna coil extends across the hollow portion of the wound antenna coil. Since it is integrally fixed to the wound antenna coil body in a stretched state, there is no displacement or deformation of the connection terminals, and therefore, a radio IC excellent in productivity suitable for automation.
You can get a card.

[Brief description of the drawings]

FIG. 1A is a cross-sectional side view of a wireless IC card using a loop antenna formed by a winding coil according to the present invention, and FIG. 1B is a plan view thereof.

FIG. 2 is a flowchart of a manufacturing process of the present invention.

FIG. 3 (a) A wireless IC using a loop antenna with a winding coil for describing a second embodiment of the present invention.
It is sectional side view of a card, (b) It is the top view.

4A is a cross-sectional side view of a wireless IC card using a conventional loop antenna with a winding coil, and FIG. 4B is a plan view thereof.

[Explanation of symbols]

21: wiring board, 22: semiconductor chip, 23, 25, 3
DESCRIPTION OF SYMBOLS 1 ... Connection land, 26 ... Wire, 27 ... Sealing resin, 28
... winding antenna coil, 29 ... adhesive, 30 ... transverse connection part, 33-1 and 33-2 ... connection terminal

Claims (10)

[Claims] 1. A wireless IC card comprising: a loop antenna formed by winding a metal wire in a loop; and a semiconductor element connected to both ends of the loop antenna in a hollow portion of the loop antenna. A wireless IC card, wherein both ends of the loop antenna are fixed to the loop antenna across the hollow portion of the loop antenna. 2. The wireless IC card according to claim 1, wherein both ends of the loop antenna are bent toward the hollow portion of the loop antenna and fixed to the loop antenna itself in a stretched state. 3. The wireless IC card according to claim 1, wherein both ends of the loop antenna are connected to the semiconductor element at a halfway point traversing a hollow portion of the loop antenna. 4. The radio communication system according to claim 1, wherein said metal wire is provided with an insulating coating, and both ends of said loop antenna are fixed by heat sealing of said insulating coating or melting by a solvent. IC card. 5. The wireless IC card according to claim 1, wherein both ends of the loop antenna are fixed to the loop antenna body with an adhesive. 6. A first step of electrically connecting a semiconductor element, and a metal wire wound in a loop on the semiconductor element connected on the wiring board by the first step, and both ends of the metal wire are looped. A second step of locating a transverse connection portion of the loop antenna fixedly attached to the loop antenna itself in a state of traversing the hollow portion of the semiconductor device, and the semiconductor element and the loop antenna positioned in the second step. And a third step of electrically connecting the cross-connecting portion of the wireless IC card to the wireless IC card. 7. The method according to claim 6, wherein the electrical connection between the semiconductor element and the loop antenna in the third step is performed by soldering. 8. The method according to claim 6, wherein the electrical connection between the semiconductor element and the loop antenna in the third step is performed by low-temperature spot welding. 9. A first step of positioning a semiconductor element at a transverse connection portion of a loop antenna in which a metal wire is previously wound in a loop shape and both ends of which are fixed across the hollow portion of the loop; A second step of electrically connecting the semiconductor element positioned in one step and the transverse connection part of the loop antenna to each other. 10. The method according to claim 9, wherein the electrical connection between the semiconductor element and the loop antenna in the second step is performed by applying an ultrasonic wave.