JP2002298109A - Contactless ic medium and manufacturing method thereof - Google Patents

Contactless ic medium and manufacturing method thereof

Info

Publication number
JP2002298109A
JP2002298109A JP2001101129A JP2001101129A JP2002298109A JP 2002298109 A JP2002298109 A JP 2002298109A JP 2001101129 A JP2001101129 A JP 2001101129A JP 2001101129 A JP2001101129 A JP 2001101129A JP 2002298109 A JP2002298109 A JP 2002298109A
Authority
JP
Japan
Prior art keywords
antenna
sheet
adhesive
jumper
contact type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001101129A
Other languages
Japanese (ja)
Inventor
Toru Maruyama
徹 丸山
Yasuhiro Endo
康博 遠藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Edge Inc
Original Assignee
Toppan Forms Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Forms Co Ltd filed Critical Toppan Forms Co Ltd
Priority to JP2001101129A priority Critical patent/JP2002298109A/en
Publication of JP2002298109A publication Critical patent/JP2002298109A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PROBLEM TO BE SOLVED: To easily manufacture a contactless IC medium at a low cost using a sheet type base material made of paper or synthetic resin such as PVC or PET without need of heat resistance. SOLUTION: Thermosetting conductive ink is printed and cured on a release sheet 1 with high heat resistance to form an antenna part 3 in a plurally wound coil shape and lands 2a, 2b, 5. Thermosetting insulation ink is printed and cured so as to cross over the antenna 3 to form a resist part 6. Thermosetting conductive ink is printed and cured so as to cross on the resist part 6 and connect the lands 5 with 2a to form a jumper part 8. An IC chip 9 is mounted so as to be connected with the lands 2a, 5. A low-cost adhesive sheet 11 with low heat resistance is closely contacted with the sheet 1 and torn off again, and the antenna part 3, the lands 2a, 2b, 5, the resist part 6, the IC chip 9 are integrally transferred to an adhesive face of the adhesive sheet 11.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は非接触型ＩＣメディ
アおよびその製造方法に関し、特に、アンテナ回路を備
えたシート状の非接触型ＩＣメディアおよびその製造方
法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC medium and a method of manufacturing the same, and more particularly, to a sheet-shaped non-contact type IC medium having an antenna circuit and a method of manufacturing the same.

【０００２】[0002]

【従来の技術】従来、非接触型ＩＣタグなどのように非
接触状態でデータの送受信を行ってデータの記録、消去
などが行える情報記録メディア（RF-ID（Radio Frequen
cy IDentification）メディア）として用いられる非接
触型ＩＣメディアである非接触型データ送受信体は、シ
ート状の基材上にアンテナ部を形成し、このアンテナ部
にＩＣチップを実装するなどして構成したアンテナ回路
を有している。2. Description of the Related Art Conventionally, an information recording medium (RF-ID (Radio Frequenque) such as a non-contact type IC tag capable of transmitting and receiving data in a non-contact state to record and erase data.
The non-contact type data transmitter / receiver, which is a non-contact type IC media used as cy IDentification (media), is configured by forming an antenna portion on a sheet-like base material and mounting an IC chip on the antenna portion. It has an antenna circuit.

【０００３】この非接触型ＩＣメディアは、幅広い用途
に対応するために、薄型で可撓性のシート状であること
が望ましく、そのアンテナ部は、通常、銅やアルミのエ
ッチングや導線、あるいは導電インキや導電ペーストな
どの印刷方式により形成されている。[0003] The non-contact type IC media is desirably in the form of a thin and flexible sheet so as to be applicable to a wide range of uses. The antenna portion is usually formed by etching copper or aluminum, conducting wires, or conducting wires. It is formed by a printing method such as ink or conductive paste.

【０００４】この非接触型ＩＣメディアにおけるアンテ
ナ回路の形成方法について説明する。[0004] A method of forming an antenna circuit in this non-contact type IC medium will be described.

【０００５】まず、可撓性のシート状の基材に導電イン
キをスクリーン印刷し固化して複数のループを有するコ
イル状のアンテナ部を形成する。次に、複数のコイル状
のアンテナ部に跨るように絶縁インキを印刷し固化して
レジスト部を形成する。さらに、レジスト部上を横切っ
て導電インキを印刷し固化して、複数のアンテナ部のラ
ンド部に接続しこれらを短絡させるジャンパー部を形成
する。そして、アンテナ部のランド部にＩＣチップを実
装する。その後、必要に応じて保護シート等により被覆
して、非接触型ＩＣメディアが完成する。[0005] First, a conductive ink is screen-printed on a flexible sheet-like base material and solidified to form a coil-shaped antenna portion having a plurality of loops. Next, an insulating ink is printed and solidified so as to straddle the plurality of coil-shaped antenna portions to form a resist portion. Further, a conductive ink is printed and solidified across the resist portion to form a jumper portion which is connected to lands of the plurality of antenna portions and short-circuits them. Then, an IC chip is mounted on the land of the antenna unit. Thereafter, if necessary, the non-contact type IC media is completed by covering with a protective sheet or the like.

【０００６】このような従来のアンテナ回路形成方法に
おいて、アンテナ部を構成する導電インキとして、熱硬
化性や溶剤揮発性を有する導電インキ等を用いる場合が
ある。この場合、導電インキが印刷されたシート状の基
材を、例えば１５０℃で３０分程度加熱することによ
り、導電インキを熱硬化させて固化させている。In such a conventional antenna circuit forming method, a conductive ink having thermosetting properties or solvent volatility may be used as the conductive ink forming the antenna portion. In this case, by heating the sheet-shaped substrate on which the conductive ink is printed at, for example, 150 ° C. for about 30 minutes, the conductive ink is thermally cured and solidified.

【０００７】[0007]

【発明が解決しようとする課題】このような非接触型Ｉ
Ｃメディアは、様々な用途に対応できるように、前記し
た通り薄型のシート状であることが好ましく、さらに大
量生産することを考えると、できるだけ安価な基材を用
いることが好ましい。SUMMARY OF THE INVENTION Such a non-contact type I
The C media is preferably in the form of a thin sheet as described above so as to be applicable to various uses, and in view of mass production, it is preferable to use a substrate as inexpensive as possible.

【０００８】このような非接触型ＩＣメディアにおいて
は、外部とのデータの送受信の感度が良好であることが
必要であり、そのためには、アンテナ部の面積はできる
だけ大きいことが望ましい。そこで、非接触型ＩＣメデ
ィアの外周に近い部分を複数周周回するコイル状のアン
テナ部が形成されている。そして、アンテナ部の一端の
ランド部を、他端のランド部近傍のランド部まで引き回
し、両者に接続するようにＩＣチップを実装している。
そのため、複数のコイル状のアンテナ部に跨る絶縁性の
レジスト部を形成し、このレジスト部上に、ランド部と
ランド部とを接続させるジャンパー部を形成している。[0008] In such a non-contact type IC medium, it is necessary that the sensitivity of data transmission / reception with the outside be good, and for that purpose, it is desirable that the area of the antenna unit be as large as possible. In view of this, a coil-shaped antenna portion is formed so as to make a plurality of rounds of a portion near the outer periphery of the non-contact type IC medium. Then, a land portion at one end of the antenna portion is routed to a land portion near the land portion at the other end, and an IC chip is mounted so as to be connected to both.
For this reason, an insulating resist portion is formed over a plurality of coil-shaped antenna portions, and a jumper portion for connecting the land portions to each other is formed on the resist portion.

【０００９】アンテナ部は、損失を小さくするために低
抵抗であることが求められ、また、薄いカード状、ラベ
ル状、フォーム状形態では、物理的ストレスが加わり易
く、耐折り曲げ性があることが求められる。一方、ＩＣ
チップが実装されるランド部はＩＣチップの接続端子と
の導電接続の信頼性を向上させることが必要であるた
め、実装時の熱や圧力への耐性、接続端子を固定できる
形状安定性、異方性導電フィルム、異方導電ペースト、
非導電フィルム、非導電ペースト、導電ペースト、封止
樹脂などを用いる場合にはそれらとの相性（界面が安定
であることや、それぞれの機能を阻害するような作用が
無いことなど）も検討する必要があるが、これらの要求
を全て満たす導電インキを用いることが望ましい。The antenna section is required to have low resistance in order to reduce the loss. In the case of a thin card, label or foam, the antenna section is liable to be subjected to physical stress and has a bending resistance. Desired. On the other hand, IC
Since the land on which the chip is mounted needs to improve the reliability of the conductive connection with the connection terminals of the IC chip, it is resistant to heat and pressure during mounting, has shape stability for fixing the connection terminals, and has a different shape. Anisotropic conductive film, anisotropic conductive paste,
When using a non-conductive film, non-conductive paste, conductive paste, sealing resin, etc., consider compatibility with them (such as a stable interface and no action that would impair each function). Although it is necessary, it is desirable to use a conductive ink that satisfies all of these requirements.

【００１０】また、アンテナ部、ランド部、ジャンパー
部を形成するために、フェノール樹脂やポリエステル樹
脂などをベースとする熱硬化性の導電インキを用いる場
合や、レジスト部を形成するために熱硬化性の絶縁イン
キを用いる場合には、固化させるために熱が加えられる
ので、シート状の基材は熱による変形や劣化を防ぐため
に十分な耐熱性を有している必要がある。従って、シー
ト材は高い耐熱性を有する特定の材料（ポリイミド、ポ
リアミド、ＰＥＮ、ガラスエポキシなど）からなるもの
に限定される。そして、高い耐熱性を有する材料は一般
に高価であり、非接触型ＩＣメディアの製造コストを上
昇させてしまう。In addition, a thermosetting conductive ink based on a phenol resin or a polyester resin is used for forming an antenna portion, a land portion, and a jumper portion, and a thermosetting conductive ink is used for forming a resist portion. When the insulating ink described above is used, heat is applied to solidify it, so that the sheet-shaped substrate needs to have sufficient heat resistance to prevent deformation and deterioration due to heat. Therefore, the sheet material is limited to a material made of a specific material having high heat resistance (polyimide, polyamide, PEN, glass epoxy, or the like). In addition, materials having high heat resistance are generally expensive, and increase the manufacturing cost of non-contact IC media.

【００１１】そこで、本発明の目的は、紙やＰＶＣ、Ｐ
ＥＴといった合成樹脂などの耐熱性が低い材料からなる
シート状の基材を使用可能であり、簡単かつ安価に製造
でき、さらに、アンテナ部においては要求される低抵抗
や耐折り曲げ性を有し、ＩＣチップが搭載される部分に
おいてはＩＣチップのバンプとの導電接続の信頼性が高
い非接触型ＩＣメディアおよびその製造方法を提供する
ことにある。Therefore, an object of the present invention is to provide a paper, PVC, P
It is possible to use a sheet-like base made of a material having low heat resistance such as a synthetic resin such as ET, can be manufactured easily and inexpensively, and further has a required low resistance and bending resistance in the antenna portion, It is an object of the present invention to provide a non-contact type IC medium having high reliability of conductive connection with bumps of the IC chip in a portion where the IC chip is mounted, and a method of manufacturing the same.

【００１２】[0012]

【課題を解決するための手段】本発明の非接触型ＩＣメ
ディアの製造方法は、剥離シートに導電インキを印刷し
てアンテナ部を形成する工程と、剥離シートに印刷され
た前記導電インキを固化させる工程と、剥離シートの前
記アンテナ部形成面と、接着シートの接着面とを重ね合
わせ、固化した前記アンテナ部を前記接着シートの前記
接着面に転移させる工程とを含む。導電インキ固化工程
は、剥離シートの加熱を含む工程であってもよい。According to the present invention, there is provided a method for manufacturing a non-contact type IC medium, comprising the steps of printing conductive ink on a release sheet to form an antenna portion, and solidifying the conductive ink printed on the release sheet. And a step of superimposing the antenna portion forming surface of the release sheet and the adhesive surface of the adhesive sheet and transferring the solidified antenna portion to the adhesive surface of the adhesive sheet. The conductive ink solidification step may be a step including heating the release sheet.

【００１３】これによると、接着シート上で導電インキ
の固化工程が行わないので、耐熱性を必要とせず、紙や
ＰＶＣ、ＰＥＴといった合成樹脂などの安価な材料を用
いることができ、製造コストの低減が図れる。また、耐
熱性や強度以外の性質を優先して接着シートの材料を選
択することができ、非接触型ＩＣメディアの特性を向上
させることができる。According to this, since the step of solidifying the conductive ink on the adhesive sheet is not performed, heat resistance is not required, and inexpensive materials such as paper, synthetic resin such as PVC and PET can be used, and the production cost can be reduced. Reduction can be achieved. Further, the material of the adhesive sheet can be selected by giving priority to properties other than heat resistance and strength, and the characteristics of the non-contact IC media can be improved.

【００１４】導電インキ固化工程の後、剥離シートの前
記アンテナ部形成面にＩＣチップを実装する工程をさら
に含み、転移工程において、ＩＣチップも、アンテナ部
と同時に剥離シートから前記接着シートの前記接着面に
転移させてもよい。After the step of solidifying the conductive ink, the method further comprises the step of mounting an IC chip on the surface of the release sheet on which the antenna section is formed. In the transfer step, the IC chip is attached to the adhesive sheet from the release sheet at the same time as the antenna section. It may be transferred to a surface.

【００１５】転移工程の後、接着シートの接着面にＩＣ
チップを実装する工程をさらに含んでいてもよい。After the transfer step, an IC is attached to the adhesive surface of the adhesive sheet.
The method may further include a step of mounting the chip.

【００１６】導電インキ固化工程の後、剥離シートに、
アンテナ部の一部を覆う絶縁性のレジスト部を形成する
工程と、剥離シートのレジスト部上を横切ってアンテナ
部に接続された導電性のジャンパー部を形成する工程と
をさらに含み、転移工程において、レジスト部および前
記ジャンパー部も、アンテナ部と同時に剥離シートから
接着シートの接着面に転移させてもよい。After the step of solidifying the conductive ink, the release sheet
A step of forming an insulating resist part covering a part of the antenna part, and a step of forming a conductive jumper part connected to the antenna part across the resist part of the release sheet; The resist section and the jumper section may also be transferred from the release sheet to the adhesive surface of the adhesive sheet at the same time as the antenna section.

【００１７】アンテナ部が転移された前記接着面を覆う
ように保護シートを積層する工程を含んでもよい。また
は、アンテナ部が転移された接着面を覆うように封止材
を塗布する工程を含んでもよい。The method may include a step of laminating a protective sheet so as to cover the adhesive surface to which the antenna portion has been transferred. Alternatively, the method may include a step of applying a sealing material so as to cover the adhesive surface to which the antenna unit has been transferred.

【００１８】接着シートは、可撓性を有するシート基材
に接着剤層が形成されたものであってもよい。The adhesive sheet may be one in which an adhesive layer is formed on a flexible sheet substrate.

【００１９】剥離シートは、アンテナ部形成面に剥離剤
層が形成されたものであってもよく、また、耐熱性を有
していることが好ましい。The release sheet may have a release agent layer formed on the antenna section forming surface, and preferably has heat resistance.

【００２０】剥離シートを、アンテナ部を接着シートに
転移させた後で繰り返し使用することが好ましい。これ
により、導電インキの固化工程が行われる剥離シート
を、耐熱性や強度に優れた材料により形成して、製造コ
ストをさほど高めることなく、非接触型ＩＣメディアを
安定して大量生産可能にすることができる。It is preferable to use the release sheet repeatedly after transferring the antenna section to the adhesive sheet. As a result, the release sheet in which the conductive ink is solidified is formed of a material having excellent heat resistance and strength, and non-contact type IC media can be stably mass-produced without significantly increasing the manufacturing cost. be able to.

【００２１】また、本発明の非接触型ＩＣメディアは、
接着シートの接着面に、ＩＣチップと、導電性のジャン
パー部と、部分的にジャンパー部上を覆っている絶縁性
のレジスト部と、部分的にレジスト部上に重なっており
ジャンパー部およびＩＣチップと接続されている、固化
された導電インキからなるアンテナ部とが同時に転移さ
れたものである。Further, the non-contact type IC media of the present invention comprises:
An IC chip, a conductive jumper, an insulating resist partially covering the jumper, and a jumper and the IC chip partially overlapping the resist on the adhesive surface of the adhesive sheet; And the antenna portion made of the solidified conductive ink, which is connected to the antenna portion, is transferred at the same time.

【００２２】また、本発明のもう１つの非接触型ＩＣメ
ディアは、接着シートの接着面に、導電性のジャンパー
部と、部分的にジャンパー部上に重なっている絶縁性の
レジスト部と、部分的にレジスト部上に重なっておりジ
ャンパー部と接続されている、固化された導電インキか
らなるアンテナ部とが同時に転移され、ジャンパー部、
レジスト部、およびアンテナ部が転移された接着面上
に、アンテナ部と接続されるＩＣチップが実装されたも
のである。Further, another non-contact type IC medium according to the present invention is characterized in that a conductive jumper portion, an insulating resist portion partially overlapping on the jumper portion, The antenna part made of solidified conductive ink, which is overlapped on the resist part and is connected to the jumper part, is simultaneously transferred, and the jumper part,
An IC chip to be connected to the antenna unit is mounted on the bonding surface to which the resist unit and the antenna unit have been transferred.

【００２３】[0023]

【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照して説明する。Embodiments of the present invention will be described below with reference to the drawings.

【００２４】非接触型ＩＣメディアは、非接触でデータ
の授受を行ってデータの記憶や消去等が可能な、ＩＣチ
ップを内蔵したカード、タグ、ラベル、フォーム、葉
書、封筒等の総称であり、非接触でデータの授受を行う
ためにアンテナ回路を有している。The non-contact type IC media is a general term for cards, tags, labels, forms, postcards, envelopes, and the like, which include an IC chip and which can store and delete data by transmitting and receiving data in a non-contact manner. And an antenna circuit for transmitting and receiving data without contact.

【００２５】この非接触型ＩＣメディアの構成は、図１
（ａ）〜（ｂ）に示すように、紙や合成樹脂等の安価で
薄いシート状の基材（接着シート１１）上にアンテナ回
路が形成されている。アンテナ回路は、アンテナ部３
と、アンテナ部の端子部であるランド部２ａ，２ｂおよ
び独立したランド部５と、コイル状のアンテナ部３に跨
って形成されているレジスト部６と、レジスト部６を横
切るように形成されてランド部２ａ，５を接続させるジ
ャンパー部８と、ランド部２ｂ，５に接続するように実
装されているＩＣチップ９とからなる。The structure of this non-contact type IC media is shown in FIG.
As shown in (a) and (b), an antenna circuit is formed on an inexpensive and thin sheet-like base material (adhesive sheet 11) such as paper or synthetic resin. The antenna circuit is the antenna unit 3
And land portions 2a and 2b and independent land portions 5 which are terminal portions of the antenna portion, a resist portion 6 formed over the coil-shaped antenna portion 3, and a cross portion formed across the resist portion 6. It comprises a jumper 8 for connecting the lands 2a, 5 and an IC chip 9 mounted so as to be connected to the lands 2b, 5.

【００２６】［第１の実施形態］本発明の非接触型ＩＣ
メディアの製造方法の第１の実施形態について、図１〜
５を参照して以下に説明する。[First Embodiment] Non-Contact IC of the Present Invention
FIGS. 1 to 1 show a first embodiment of a method for manufacturing a medium.
5 will be described below.

【００２７】まず、図２（ａ）に示す、耐熱性が高い材
料からなり、少なくとも片面が剥離性を有する剥離面と
なっている剥離シート１を用意する。図３に示す例で
は、この剥離シート１は連続紙である。図２（ｂ）に示
すように、この剥離シート１の剥離面に、熱硬化性の導
電インキをスクリーン印刷し、加熱して導電インキを硬
化させ、アンテナ部３を形成する（ステップＳ１）。ま
た、これと同時に導電インキの印刷および硬化によっ
て、完成状態のアンテナ部３の両端部となるべき位置に
ランド部２ａ，２ｂを一体的に形成するとともに、ラン
ド部２ｂの近傍に独立したランド部５を形成する。First, as shown in FIG. 2A, a release sheet 1 made of a material having high heat resistance and having at least one release surface having a release property is prepared. In the example shown in FIG. 3, the release sheet 1 is a continuous paper. As shown in FIG. 2 (b), a thermosetting conductive ink is screen-printed on the release surface of the release sheet 1, and the conductive ink is cured by heating to form the antenna section 3 (step S1). At the same time, the lands 2a and 2b are integrally formed at positions to be both ends of the antenna portion 3 in a completed state by printing and curing of the conductive ink, and independent land portions are provided near the lands 2b. 5 is formed.

【００２８】次に、図２（ｃ）に示すように、アンテナ
部３のランド部２ａと独立したランド部５との間のコイ
ル状のアンテナ部３を跨ぐように熱硬化性の絶縁インキ
をスクリーン印刷し、加熱して絶縁インキを硬化させ、
レジスト部６を形成する（ステップＳ２）。なお、レジ
スト部６の厚さは１５〜３０μｍ程度が好ましい。Next, as shown in FIG. 2C, a thermosetting insulating ink is applied so as to straddle the coiled antenna portion 3 between the land portion 2a of the antenna portion 3 and the independent land portion 5. Screen printing and heating to cure the insulating ink,
A resist section 6 is formed (Step S2). Note that the thickness of the resist portion 6 is preferably about 15 to 30 μm.

【００２９】次に、図２（ｄ）に示すように、レジスト
部６上を横切って、独立したランド部５と、アンテナ部
２の一端のランド部２ａとを繋ぐように熱硬化性の導電
インキをスクリーン印刷し、加熱して導電インキを硬化
させ、ジャンパー部８を形成する（ステップＳ３）。Next, as shown in FIG. 2D, a thermosetting conductive material is connected across the resist portion 6 so as to connect the independent land portion 5 and the land portion 2a at one end of the antenna portion 2. The ink is screen-printed and heated to cure the conductive ink to form the jumper 8 (step S3).

【００３０】このようにして、ジャンパー部８によりア
ンテナ部３の一端のランド部２ａと接続された独立した
ランド部５と、アンテナ部３の他端のランド部２ｂと
が、近接位置に配置されている。そこで、図２（ｅ）に
示すように、ＩＣチップ９を、接続端子（図示せず）が
ランド部２ａおよび独立したランド部５にそれぞれ接触
するように実装する（ステップＳ４）。In this manner, the independent land portion 5 connected to the land portion 2a at one end of the antenna portion 3 by the jumper portion 8 and the land portion 2b at the other end of the antenna portion 3 are arranged at close positions. ing. Therefore, as shown in FIG. 2E, the IC chip 9 is mounted such that the connection terminals (not shown) contact the land 2a and the independent land 5, respectively (step S4).

【００３１】以上の工程（ステップＳ１〜Ｓ４）によ
り、図３，４（ａ）に示すように、剥離シート１の剥離
面上に、アンテナ部３とランド部２ａ，２ｂ，５とレジ
スト部６とジャンパー部８とＩＣチップ９とからなるア
ンテナ回路が形成された状態となる。By the above steps (steps S1 to S4), as shown in FIGS. 3 and 4 (a), the antenna 3, the lands 2a, 2b, 5 and the resist 6 are formed on the release surface of the release sheet 1. Then, an antenna circuit including the jumper section 8 and the IC chip 9 is formed.

【００３２】そこで、図３，４（ｂ）に示すように、こ
の剥離シート１の、アンテナ回路が形成された剥離面
に、非接触型ＩＣメディアの基材となる接着シート１１
の接着面を密着させる。そして、図３，４（ｃ）に示す
ように、接着シート１１を剥離シート１から再び引き剥
がし、剥離シート１の剥離面の剥離性（非接着性）と、
接着シート１１の接着面の接着性とを利用して、アンテ
ナ回路を構成するアンテナ部３とランド部２ａ，２ｂ，
５とレジスト部６とジャンパー部８とＩＣチップ９を、
全て一体的に接着シート１１の接着面に転移させる（ス
テップＳ５）。このとき、アンテナ部３、ランド部２
ａ，２ｂ，５、レジスト部６、ジャンパー部８、および
ＩＣチップ９は、互いの相対位置関係や電気接続関係が
変化することなく、剥離シート１から接着シート１１へ
転移する。この結果、図１に示すように、基材である接
着シート１１上に、ＩＣチップ９、ジャンパー部８、レ
ジスト部６、ランド部２ａ，２ｂ，５、アンテナ部６
が、この順番に配設された状態となる。Therefore, as shown in FIGS. 3 and 4 (b), an adhesive sheet 11 serving as a base material of a non-contact type IC medium is provided on the release surface of the release sheet 1 where the antenna circuit is formed.
Adhere the adhesive surface of Then, as shown in FIGS. 3 and 4 (c), the adhesive sheet 11 is peeled off from the release sheet 1 again, and the release surface of the release sheet 1 (non-adhesive property)
By utilizing the adhesiveness of the adhesive surface of the adhesive sheet 11, the antenna portion 3 and the land portions 2a, 2b,
5, resist part 6, jumper part 8, and IC chip 9
All are transferred integrally to the adhesive surface of the adhesive sheet 11 (step S5). At this time, the antenna unit 3 and the land unit 2
The a, 2b, 5, the resist section 6, the jumper section 8, and the IC chip 9 transfer from the release sheet 1 to the adhesive sheet 11 without changing the relative positional relationship and the electrical connection relation. As a result, as shown in FIG. 1, the IC chip 9, the jumper 8, the resist 6, the lands 2a, 2b, 5, the antenna 6
Are arranged in this order.

【００３３】最後に、このアンテナ回路を保護するとと
もに、接着面を外部に露出させないように、合成樹脂か
らなる保護シート（図示せず）を、接着シート１１の接
着面に貼付する（ステップＳ６）。こうして、本実施形
態の非接触型ＩＣメディアが完成する。Finally, a protective sheet (not shown) made of a synthetic resin is attached to the adhesive surface of the adhesive sheet 11 so as to protect the antenna circuit and not expose the adhesive surface to the outside (step S6). . Thus, the non-contact type IC media of the present embodiment is completed.

【００３４】なお、図３に示すように接着シート１１が
連続紙である場合は、適宜の長さに切断して、カード、
タグ、ラベル、フォーム、葉書、封筒等として使用でき
るようにする。一方、剥離シート１は、形成されたアン
テナ部３、ランド部２ａ，２ｂ，５、レジスト部６、ジ
ャンパー部８、およびＩＣチップ９が全て接着シート１
１に転移して、剥離面には何も搭載されていない状態な
ので、続けて非接触型ＩＣメディアを製造するために再
度使用することができる。このように、剥離シート１は
繰り返し何度も使用することが好ましい。When the adhesive sheet 11 is a continuous paper as shown in FIG.
Make it usable as tags, labels, forms, postcards, envelopes, etc. On the other hand, the release sheet 1 has the formed antenna portion 3, lands 2a, 2b, 5, resist portion 6, jumper portion 8, and IC chip 9 all formed on the adhesive sheet 1.
The state changes to 1, and nothing is mounted on the peeling surface, so that it can be used again to continuously manufacture a non-contact type IC medium. Thus, it is preferable to use the release sheet 1 repeatedly and repeatedly.

【００３５】本実施形態によると、導電インキ等の固化
のために高温に加熱する工程は、剥離シート１上の各部
を対象として行われるため、剥離シート１は、例えばポ
リイミドや金属などの耐熱性や強度の高い材質により形
成される。この剥離シート１は、消耗品ではなく何度も
繰り返して使用されるため、多少高価であっても、製造
コストにあまり影響しない。一方、接着シート１１は、
高温に加熱されたりすることがないため、紙やＰＶＣや
ＰＥＴといった耐熱性の低い合成樹脂などの安価な材料
により形成して製造コストの著しい軽減が可能であった
り、耐熱性以外の様々な性質を重視して選択された任意
の材料を用いることができ、実用に適した非接触型ＩＣ
メディアが得られる。例えば、１５０℃程度までしか耐
熱性がないＰＥＴを基材（接着シート１１）とした非接
触型ＩＣメディアを製造する際に、加熱工程を、２００
〜２５０℃以上の耐熱性を有するポリイミド（剥離シー
ト１）を対象として行うことができ、熱硬化性インキの
十分な加熱固化が可能になる。According to the present embodiment, since the step of heating to a high temperature for solidifying the conductive ink and the like is performed on each part on the release sheet 1, the release sheet 1 is made of a heat-resistant material such as polyimide or metal. Or a material having high strength. Since the release sheet 1 is not a consumable but is used many times, even if it is somewhat expensive, it does not significantly affect the manufacturing cost. On the other hand, the adhesive sheet 11
Because it is not heated to a high temperature, it can be made of inexpensive materials such as paper, PVC, PET, and other low-heat-resistant synthetic resins to significantly reduce manufacturing costs and various properties other than heat resistance. Non-contact IC suitable for practical use, which can use any material selected with emphasis on
Media is obtained. For example, when manufacturing a non-contact type IC medium using PET having a heat resistance of only up to about 150 ° C. as a base material (adhesive sheet 11), a heating step is performed for 200 hours.
This can be performed on a polyimide (release sheet 1) having a heat resistance of ２５０250 ° C. or more, and the thermosetting ink can be sufficiently solidified by heating.

【００３６】以上説明した本実施形態のより具体的な工
程の実施例について、以下に簡単に説明する。An example of a more specific process of this embodiment described above will be briefly described below.

【００３７】［実施例１］剥離シート１として、紙であ
るリンテック製ＳＰ−８Ｋアオ（商品名）を用い、導電
インキとして、アサヒ化学研究所製ＬＳ４１５Ｃ−Ｍ
（商品名）を用いてアンテナ部３およびランド部２ａ，
２ｂ，５を印刷し、１５０℃で３０分の加熱を行った。
その後、詳述しないが、レジスト部６、ジャンパー部
８、およびＩＣチップ９を形成した。そして、接着シー
ト１１として感熱タック紙である王子製紙製Ｔ５−２Ｅ
Ｘ（商品名）を用い、これを剥離シート１に貼り合わ
せ、４０℃の温度でゴムローラー（図示せず）により２
ｋｇ／ｃｍ2の圧力を加えて、剥離シート１から接着シ
ート１１へのアンテナ回路の転移を行い、感熱タックで
ある非接触型ＩＣメディアを製造した。これを葉書やビ
ジネスフォームに貼付することにより、データの送受信
や記憶および消去が可能な製品を簡単に製造できる。[Example 1] As the release sheet 1, a paper made of Lintec SP-8K Blue (trade name) was used as the release sheet 1, and LS415C-M manufactured by Asahi Chemical Laboratory was used as the conductive ink.
The antenna part 3 and the land part 2a,
2b and 5 were printed and heated at 150 ° C. for 30 minutes.
Thereafter, although not described in detail, a resist portion 6, a jumper portion 8, and an IC chip 9 were formed. Then, as an adhesive sheet 11, T5-2E made by Oji Paper which is a heat-sensitive tack paper.
X (trade name), this was adhered to the release sheet 1, and a rubber roller (not shown) was used at a temperature of 40 ° C.
A pressure of kg / cm 2 was applied to transfer the antenna circuit from the release sheet 1 to the adhesive sheet 11, thereby producing a non-contact type IC medium which is a heat-sensitive tack. By sticking this on a postcard or business form, a product that can transmit, receive, store, and delete data can be easily manufactured.

【００３８】［実施例２］剥離シート１として、帝人・
デュポンフィルム製テトロンＡ−３１（商品名）を用
い、導電インキとして、藤倉化成製ＦＡ−３５３（商品
名）を用いてアンテナ部３およびランド部２ａ，２ｂ，
５を印刷し、１５０℃で３０分の加熱を行った。その
後、詳述しないが、レジスト部６、ジャンパー部８、お
よびＩＣチップ９を形成した。そして、接着シート１１
として生分解性プラスチックフィルムであるユニチカ製
ポリ乳酸フィルムおよびホットメルト接着剤（東亞合成
製ＰＥＳ１１１ＥＥ（商品名））を用い、１２０℃に加
熱しながら剥離シート１に貼り合わせ、剥離シート１か
ら接着シート１１へのアンテナ回路の転移を行った。さ
らに、この接着シート１１に、同じ生分解性フィルムを
保護シート（図示せず）として貼り合わせ、カードやタ
グとして使用される非接触型ＩＣメディアを製造した。Example 2 As the release sheet 1, Teijin
The antenna unit 3 and the lands 2a, 2b, and 4-2 are manufactured using Tetron A-31 (trade name) manufactured by DuPont Film and FA-353 (trade name) manufactured by Fujikura Kasei as conductive ink.
5 was printed and heated at 150 ° C. for 30 minutes. Thereafter, although not described in detail, a resist portion 6, a jumper portion 8, and an IC chip 9 were formed. Then, the adhesive sheet 11
As a biodegradable plastic film, a polylactic acid film made by Unitika and a hot melt adhesive (PES111EE (trade name) made by Toagosei Co., Ltd.), and bonded to the release sheet 1 while heating at 120 ° C. The transfer of the antenna circuit to 11 was performed. Further, the same biodegradable film was adhered to the adhesive sheet 11 as a protective sheet (not shown) to produce a non-contact type IC medium used as a card or a tag.

【００３９】［実施例３］剥離シート１としてポリイミ
ドフィルムを用い、導電インキとして、東洋紡績製ＤＷ
Ｐ−０２６（商品名）を用いてアンテナ部３およびラン
ド部２ａ，２ｂ，５を印刷し、２００℃で３０分の加熱
を行った。その後、詳述しないが、レジスト部６、ジャ
ンパー部８、およびＩＣチップ９を形成した。そして、
接着シート１１としてＰＥＴフィルムである東レ製Ｅ−
２０（商品名）およびホットメルト接着剤（東亞合成製
ＰＥＳ１１１ＥＥＷ（商品名））を用い、１２０℃に加
熱しながら剥離シート１に貼り合わせ、剥離シート１か
ら接着シート１１へのアンテナ回路の転移を行った。さ
らに、この接着シート１１に、同じＰＥＴフィルムを保
護シート（図示せず）として貼り合わせ、カードやタグ
として使用される非接触型ＩＣメディアを製造した。Example 3 A polyimide film was used as the release sheet 1, and DW manufactured by Toyobo Co., Ltd. was used as the conductive ink.
The antenna part 3 and the land parts 2a, 2b, 5 were printed using P-026 (trade name) and heated at 200 ° C. for 30 minutes. Thereafter, although not described in detail, a resist portion 6, a jumper portion 8, and an IC chip 9 were formed. And
The adhesive sheet 11 is a PET film, Toray E-
20 (trade name) and a hot-melt adhesive (PEA111EEW (trade name, manufactured by Toagosei Co., Ltd.)) and bonded to the release sheet 1 while heating to 120 ° C. to transfer the antenna circuit from the release sheet 1 to the adhesive sheet 11. went. Further, the same PET film was adhered to the adhesive sheet 11 as a protective sheet (not shown) to produce a non-contact type IC medium used as a card or a tag.

【００４０】［実施例４］剥離シート１としてポリイミ
ドフィルムを用い、導電インキとして、東洋紡績製ＤＷ
Ｐ−０２６（商品名）を用いてアンテナ部３およびラン
ド部２ａ，２ｂ，５を印刷し、２００℃で３０分の加熱
を行った。その後、詳述しないが、レジスト部６、ジャ
ンパー部８、およびＩＣチップ９を形成した。そして、
接着シート１１としてＰＶＣフィルムである三菱樹脂製
ビニホイル（商品名）からなる両面テープを用い、これ
を剥離シート１に貼り合わせ、４０℃の温度でゴムロー
ラー（図示せず）により２ｋｇ／ｃｍ2の圧力を加え
て、剥離シート１から接着シート１１へのアンテナ回路
の転移を行った。さらに、この接着シート１１に、同じ
ＰＶＣフィルムを保護シート（図示せず）として貼り合
わせ、カードやタグとして使用される非接触型ＩＣメデ
ィアを製造した。Example 4 A polyimide film was used as the release sheet 1, and DW manufactured by Toyobo Co., Ltd. was used as the conductive ink.
The antenna part 3 and the land parts 2a, 2b, 5 were printed using P-026 (trade name) and heated at 200 ° C. for 30 minutes. Thereafter, although not described in detail, a resist portion 6, a jumper portion 8, and an IC chip 9 were formed. And
A double-sided tape made of Mitsubishi Plastics Vinyl Foil (trade name), which is a PVC film, is used as the adhesive sheet 11, which is adhered to the release sheet 1, and is applied at a temperature of 40 ° C. with a rubber roller (not shown) at 2 kg / cm 2 . The antenna circuit was transferred from the release sheet 1 to the adhesive sheet 11 by applying pressure. Further, the same PVC film was adhered to the adhesive sheet 11 as a protective sheet (not shown) to produce a non-contact type IC medium used as a card or a tag.

【００４１】実施例２，３において、シート材に接着剤
層を形成したものを接着シート１１として用いている
が、本発明の接着シート１１は、このように予めシート
材に接着剤層が形成された構成のものに限られず、剥離
シート１との貼り合わせ時に両者の間に接着剤が介在さ
れるもの全てを含む。また、もともと接着性を有する材
料によってシート材を形成したものであってももちろん
よい。In Examples 2 and 3, a sheet material having an adhesive layer formed thereon is used as the adhesive sheet 11, but the adhesive sheet 11 of the present invention is thus formed with the adhesive layer previously formed on the sheet material. The present invention is not limited to the above-described configuration, and includes all configurations in which an adhesive is interposed between the two at the time of lamination with the release sheet 1. Further, the sheet material may be formed of a material having adhesiveness.

【００４２】前記した実施例においては、剥離シート１
と接着シート１１との貼り合わせ時に、多少の加熱が施
されているが、接着シート１１の材料の性質を考慮し
て、加熱温度を調整したり、加熱を伴わない貼り合わせ
工程を選択することができる。いずれにしても、貼り合
わせ工程以降の加熱工程は、導電インキ固化工程のよう
に極めて高い温度にする必要はなく、また、必要不可欠
ではなく代替処理工程が可能なものである。従って、前
記実施例よりももっと耐熱性が低かったり、強度の低い
材料を接着シート１１として用いることもできる。In the above embodiment, the release sheet 1
Some heat is applied when bonding the adhesive sheet 11 and the adhesive sheet 11, but in consideration of the properties of the material of the adhesive sheet 11, it is necessary to adjust the heating temperature or select a bonding step that does not involve heating. Can be. In any case, the heating step after the bonding step does not need to be performed at an extremely high temperature as in the conductive ink solidification step, and is not indispensable, and an alternative processing step is possible. Therefore, a material having lower heat resistance or lower strength than the above-described embodiment can be used as the adhesive sheet 11.

【００４３】［第２の実施形態］本発明の非接触型ＩＣ
メディアの製造方法の第２の実施形態について、図６〜
１０を参照して以下に説明する。なお、第１の実施形態
と同様の部分については、同一の符号を付与し、説明を
省略する。[Second Embodiment] Non-Contact IC of the Present Invention
Regarding the second embodiment of the method for manufacturing a medium, FIGS.
This will be described below with reference to FIG. Note that the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

【００４４】まず、図６（ａ）に示す剥離シート１の剥
離面に、図６（ｂ）に示すように、熱硬化性の導電イン
キをスクリーン印刷し、加熱して硬化させ、複数周のコ
イル状のアンテナ部３とランド部２ａ，２ｂ，５を形成
する（ステップＳ１）。First, as shown in FIG. 6B, a thermosetting conductive ink is screen-printed on the release surface of the release sheet 1 shown in FIG. The coiled antenna 3 and the lands 2a, 2b, 5 are formed (step S1).

【００４５】次に、図６（ｃ）に示すように、コイル状
のアンテナ部３を跨ぐように熱硬化性の絶縁インキをス
クリーン印刷し、加熱して硬化させ、レジスト部６を形
成する（ステップＳ２）。Next, as shown in FIG. 6C, a thermosetting insulating ink is screen-printed so as to straddle the coil-shaped antenna section 3 and is cured by heating to form a resist section 6 (FIG. 6C). Step S2).

【００４６】次に、図６（ｄ）に示すように、レジスト
部６上を横切って、独立したランド部５と、アンテナ部
の一端のランド部２ａとを繋ぐように熱硬化性の導電イ
ンキをスクリーン印刷し、加熱して硬化させ、ジャンパ
ー部８を形成する（ステップＳ３）。Next, as shown in FIG. 6D, a thermosetting conductive ink is laid across the resist section 6 so as to connect the independent land section 5 and the land section 2a at one end of the antenna section. Is printed, heated and cured to form a jumper 8 (step S3).

【００４７】そこで、図７（ｂ），９に示すようにこの
剥離シート１の剥離面に接着シート１１の接着面を密着
し、図７（ｃ），９に示すように再度引き剥がし、剥離
面のアンテナ部３とランド部２ａ，２ｂ，５とレジスト
部６とジャンパー部８とを接着面に転移させる（ステッ
プＳ７）。Then, as shown in FIGS. 7 (b) and 9, the adhesive surface of the adhesive sheet 11 is brought into close contact with the release surface of the release sheet 1, and then peeled off again as shown in FIGS. The antenna portion 3, the land portions 2a, 2b, 5, the resist portion 6, and the jumper portion 8 on the surface are transferred to the bonding surface (Step S7).

【００４８】その後で、図７（ｄ），８（ａ），８
（ｂ），９に示すように、ＩＣチップ１２を、接続端子
（図示せず）がランド部２ｂおよびランド部５にそれぞ
れ接触するように実装する（ステップＳ８）。このよう
にして、基材である接着シート１１上に、ジャンパー部
８、レジスト部６、ランド部２ａ，２ｂ，５、アンテナ
部３、ＩＣチップ９が、この順番に配設された状態とな
る。Thereafter, FIGS. 7 (d), 8 (a), 8
As shown in FIGS. 9B and 9, the IC chip 12 is mounted such that connection terminals (not shown) contact the land 2b and the land 5, respectively (step S8). In this way, the jumper 8, the resist 6, the lands 2a, 2b, 5, the antenna 3, and the IC chip 9 are arranged in this order on the adhesive sheet 11, which is the base material. .

【００４９】最後に、このアンテナ回路を保護するとと
もに、接着面を外部に露出させないように、合成樹脂か
らなる保護シート（図示せず）を、接着シート１１の接
着面に貼付する（ステップＳ６）。こうして、本実施形
態の非接触型ＩＣメディアが完成する。Finally, a protective sheet (not shown) made of synthetic resin is attached to the adhesive surface of the adhesive sheet 11 so as to protect the antenna circuit and not expose the adhesive surface to the outside (step S6). . Thus, the non-contact type IC media of the present embodiment is completed.

【００５０】本実施形態においても、第１の実施形態と
実質的に同じ効果が達成できる。さらに、転移が容易
な、インキの印刷および固化により形成された部分（ア
ンテナ部３、ランド部２ａ，２ｂ，５、レジスト部６、
ジャンパー部８）は転移により接着シートに搭載させ、
ソリッドなＩＣチップ１２は転移ではなく接着シート１
１に直接実装することによって取付精度をより高めるこ
とができる。その他の部分については、第１の実施形態
と同じなので、前記した第１の実施形態の実施例１〜４
と同様な材料および工程を採用することができる。In the present embodiment, substantially the same effects as in the first embodiment can be achieved. Further, the parts (the antenna part 3, the land parts 2a, 2b, 5, the resist part 6,
Jumper part 8) is mounted on the adhesive sheet by transfer,
The solid IC chip 12 is not a transfer but an adhesive sheet 1
The mounting accuracy can be further improved by directly mounting the mounting member 1. The other parts are the same as those of the first embodiment, so that Examples 1 to 4 of the first embodiment described above are used.
The same materials and processes as those described above can be employed.

【００５１】なお、以上の説明にて示した各部材の材料
は一例にすぎない。以下、その他の例について列記す
る。The materials of the members described in the above description are merely examples. Hereinafter, other examples will be listed.

【００５２】本発明の非接触型ＩＣメディアの接着シー
ト１１の基材としては、ガラス繊維、アルミナ繊維、ポ
リエステル繊維、ポリアミド繊維等の無機または有機繊
維からなる織布、不織布、マット、紙あるいはこれらを
組み合わせたもの、あるいはこれらに樹脂ワニスを含浸
させて成形した複合基材、ポリアミド系樹脂基材、ポリ
エステル系樹脂基材、ポリオレフィン系樹脂基材、ポリ
イミド系樹脂基材、エチレン・ビニルアルコール共重合
体基材、ポリビニルアルコール系樹脂基材、ポリ塩化ビ
ニル系樹脂基材、ポリ塩化ビニリデン系樹脂基材、ポリ
スチレン系樹脂基材、ポリカーボネート系樹脂基材、ア
クリロニトリルブタジエンスチレン共重合系樹脂基材、
ポリエーテルスルホン系樹脂基材などのプラスチック基
材、あるいはこれらにマット処理、コロナ放電処理、プ
ラズマ処理、紫外線照射処理、電子線照射処理、フレー
ムプラズマ処理およびオゾン処理、あるいは各種易接着
処理などの表面処理を施したものなどの公知のものから
選択して用いることができる。As the base material of the adhesive sheet 11 of the non-contact type IC media of the present invention, a woven fabric, a nonwoven fabric, a mat, a paper made of inorganic or organic fibers such as glass fiber, alumina fiber, polyester fiber, polyamide fiber, etc. Or a composite substrate formed by impregnating a resin varnish with them, a polyamide resin substrate, a polyester resin substrate, a polyolefin resin substrate, a polyimide resin substrate, ethylene / vinyl alcohol copolymer Coated substrate, polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate resin substrate, acrylonitrile butadiene styrene copolymer resin substrate,
Plastic substrates such as polyethersulfone resin substrates, or matte treatment, corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, flame plasma treatment and ozone treatment, or surfaces with various easy adhesion treatments A known one such as a treated one can be used.

【００５３】本発明の導電インキは、導電性粒子とバイ
ンダーを主成分とするものである。導電性粒子として
は、金属粉末、とりわけ銀粉末が好ましい。さらには抵
抗値やはんだとの相性のコントロールのため、銀以外の
導電性金属、たとえば金、白金、パラジウム、ロジウム
などの粉末を添加してもよい。ただし、バインダー自身
が導電性を有する場合は、導電性粒子は必須ではない。
また、バインダーは浸透乾燥型、溶剤揮発型、熱硬化
型、光硬化型など公知のいずれの材料も使用できる。光
硬化性樹脂をバインダーに含むと、硬化時間を短縮して
効率を向上させることができる。The conductive ink of the present invention contains conductive particles and a binder as main components. As the conductive particles, metal powder, especially silver powder is preferable. Further, a conductive metal other than silver, for example, a powder of gold, platinum, palladium, rhodium or the like may be added for controlling the resistance value and compatibility with the solder. However, when the binder itself has conductivity, the conductive particles are not essential.
As the binder, any of known materials such as a permeation drying type, a solvent volatilization type, a thermosetting type, and a photocuring type can be used. When the photocurable resin is contained in the binder, the curing time can be shortened and the efficiency can be improved.

【００５４】特に、アンテナ部３を構成する導電インキ
は、導電性、耐折り曲げ性、基材（接着シート）への接
着性あるいは速乾性が優れているものを用いることが望
ましい。例えば、接着シートとしてポリエステル系樹脂
を用いた場合には、導電性粒子を６０重量％以上含有
し、熱可塑性樹脂のみ、あるいは熱可塑性樹脂と架橋性
樹脂（特にポリエステルとイソシアネートによる架橋系
樹脂など）とのブレンド樹脂をバインダーとし、ポリエ
ステル樹脂を１０％以上含有するものが好ましい。すな
わち溶剤揮発型かあるいは架橋／熱可塑併用型（但し熱
可塑型が５０％以上である）が好ましい。接着シートと
して紙を用いた場合は、前記したインキにさらにポリビ
ニルアルキルエーテルやポリブタジエンなどの接着剤や
シリカ、タルクなどの無機充填材を加えたものが良い。In particular, it is desirable to use a conductive ink constituting the antenna section 3 having excellent conductivity, resistance to bending, adhesion to a base material (adhesive sheet) or quick drying property. For example, when a polyester-based resin is used as the adhesive sheet, it contains conductive particles in an amount of 60% by weight or more and contains only a thermoplastic resin or a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin made of polyester and isocyanate). And a binder resin containing 10% or more of a polyester resin is preferred. That is, a solvent volatile type or a combined crosslinking / thermoplastic type (however, the thermoplastic type is 50% or more) is preferable. When paper is used as the adhesive sheet, it is preferable to add an adhesive such as polyvinyl alkyl ether or polybutadiene or an inorganic filler such as silica or talc to the above-described ink.

【００５５】一方、ジャンパー部８やランド部２ａ，２
ｂ，５を構成する導電インキは、アンテナ部３を構成す
る導電インキとは異なるものであってもよい。この場
合、導電性の他に、実装時の熱や光や圧力への耐性、Ｉ
Ｃチップ９，１２の接続端子を固定できる形状安定性、
異方性導電フィルム、導電インキ、あるいは絶縁樹脂な
どを用いる場合にはそれらとの相性が必要である。例え
ば、接着シート１１としてポリエステル系樹脂を用い
て、エポキシ系のバインダーから成る導電インキや絶縁
樹脂を用いる場合には、導電性粒子を５０重量％以上含
有し、架橋性樹脂（エポキシ樹脂のフェノール硬化系、
あるいはエポキシ樹脂のスルホニウム塩硬化系など）の
み、あるいは熱可塑性樹脂と架橋性樹脂とのブレンド樹
脂をバインダーとしたものが好ましい。すなわち架橋型
かあるいは架橋／熱可塑併用型（但し架橋型が５０％以
上である）が好ましい。接着シート１１として紙を用い
た場合にも、この組成のインキは良い結果を与える。On the other hand, the jumper portion 8 and the land portions 2a, 2
The conductive ink forming b and 5 may be different from the conductive ink forming the antenna unit 3. In this case, in addition to conductivity, resistance to heat, light and pressure during mounting, I
Shape stability for fixing the connection terminals of the C chips 9 and 12,
When an anisotropic conductive film, conductive ink, insulating resin, or the like is used, compatibility with them is required. For example, when a polyester-based resin is used as the adhesive sheet 11 and a conductive ink or an insulating resin made of an epoxy-based binder is used, conductive particles are contained in an amount of 50% by weight or more, and a cross-linkable resin (phenol-cured epoxy resin system,
Alternatively, a binder using only a sulfonium salt-cured epoxy resin or a blend resin of a thermoplastic resin and a crosslinkable resin is preferable. That is, a cross-linked type or a cross-linked / thermoplastic combination type (however, the cross-linked type is 50% or more) is preferable. Even when paper is used as the adhesive sheet 11, an ink having this composition gives a good result.

【００５６】レジスト部６を形成するための絶縁インキ
は絶縁性粒子とバインダーを主成分とする。絶縁性粒子
としては、シリカ、アルミナ、タルクなどを挙げること
ができる。ただし絶縁性粒子がなくても絶縁性が確保さ
れる場合は、これは必須ではない。絶縁インキとして、
浸透乾燥型、溶剤揮発型、熱硬化型、光硬化型など公知
のいずれの材料も使用できるが、光硬化性樹脂をバイン
ダーに含むことで、硬化時間を短縮して効率を向上させ
ることができる。無溶剤のものが溶剤揮発によるマイク
ロクラックが防げるために好ましい。The insulating ink for forming the resist portion 6 contains insulating particles and a binder as main components. Examples of the insulating particles include silica, alumina, and talc. However, this is not essential if the insulating property is ensured without the insulating particles. As an insulating ink,
Any known materials such as a penetration drying type, a solvent volatilization type, a thermosetting type, and a photocuring type can be used, but by including a photocurable resin in a binder, the curing time can be shortened and the efficiency can be improved. . Solvent-free materials are preferred because microcracks due to solvent volatilization can be prevented.

【００５７】ここで光硬化性樹脂とは、光硬化触媒への
光照射により発生したフリーラジカル活性種あるいはカ
チオン活性種と反応する官能基を有する反応性樹脂であ
り、公知のものが使用できるが、フリーラジカル種で反
応するものとしては、アクリレート化合物およびメタク
リレート化合物が好ましく、カチオン活性種で反応する
ものとしては、脂環式エポキシ化合物、オキセタン化合
物、アルケンオキシド化合物、グリシジルエーテル化合
物、ビニルエーテル化合物が好ましい。Here, the photocurable resin is a reactive resin having a functional group that reacts with a free radical active species or a cationic active species generated by light irradiation on a photocuring catalyst, and known resins can be used. As those reacting with free radical species, acrylate compounds and methacrylate compounds are preferable, and those reacting with cationic active species, alicyclic epoxy compounds, oxetane compounds, alkene oxide compounds, glycidyl ether compounds, and vinyl ether compounds are preferable. .

【００５８】光硬化触媒とは、フリーラジカル活性種を
発生するものとしては、ベンゾフェノン誘導体、チオキ
サントン誘導体、アントラキノン誘導体、トリクロロメ
チルトリアジン誘導体、アシルホスフィンオキサイド誘
導体、α−ヒドロキシケトン誘導体、α−アミノケトン
誘導体、ベンゾイン誘導体、ベンジルケタール誘導体、
アクリジン誘導体、カルバゾール・フェノン誘導体、あ
るいはそれらの組み合わせが好ましく、カチオン活性種
を発生するものとしては、芳香族スルホニウム塩化合
物、芳香族ヨードニウム塩化合物あるいはそれらの組み
合わせが好ましい。The photo-curing catalyst includes those that generate free radical active species, such as benzophenone derivatives, thioxanthone derivatives, anthraquinone derivatives, trichloromethyltriazine derivatives, acylphosphine oxide derivatives, α-hydroxyketone derivatives, α-aminoketone derivatives, Benzoin derivatives, benzyl ketal derivatives,
An acridine derivative, a carbazole-phenone derivative, or a combination thereof is preferable, and an aromatic sulfonium salt compound, an aromatic iodonium salt compound, or a combination thereof is preferable as a compound generating a cationic active species.

【００５９】光硬化性樹脂と光硬化触媒については上述
の通り例示できるが、絶縁性に優れるエポキシ樹脂と光
カチオン硬化触媒との組合せが好ましい。特にエポキシ
樹脂と光カチオン硬化触媒との組合せに、平均粒径１μ
ｍ以下のシリカ微粒子を９７：３〜９２：８の比で添加
したものを必須成分とするインキは、１回の印刷で必要
な絶縁を得ることができる。The photo-curable resin and the photo-curing catalyst can be exemplified as described above, but a combination of an epoxy resin having excellent insulating properties and a photo-cationic curing catalyst is preferable. Particularly, a combination of an epoxy resin and a cationic photocuring catalyst has an average particle diameter of 1 μm.
An ink containing, as an essential component, an addition of silica fine particles of m or less in a ratio of 97: 3 to 92: 8 can provide necessary insulation in one printing.

【００６０】ただし、レジスト部６は、前記した絶縁イ
ンキの塗布に限られず、絶縁性の接着テープの貼付によ
って形成することもできる。この場合、レジスト部６を
形成するための固化工程は不要である。However, the resist section 6 is not limited to the above-described application of the insulating ink, but may be formed by applying an insulating adhesive tape. In this case, a solidification step for forming the resist portion 6 is unnecessary.

【００６１】また、以上の説明では、アンテナ部３の導
電インキ、レジスト部６の絶縁インキ、ジャンパー部８
の導電インキはそれぞれ別々に固化工程を設けていた
が、スクリーン印刷ではなくインクジェット装置による
インキ吐出によって印刷する場合などには、アンテナ部
３の導電インキ、レジスト部６の絶縁インキ、ジャンパ
ー部８の導電インキを全て印刷終了後に、一括して加熱
固化する工程も可能である。それによると製造工程が簡
単になる。In the above description, the conductive ink of the antenna section 3, the insulating ink of the resist section 6, the jumper section 8
The conductive inks were separately provided with a solidification process. However, when printing is performed by ink discharge using an ink jet device instead of screen printing, for example, the conductive ink of the antenna unit 3, the insulating ink of the resist unit 6, and the insulating ink of the jumper unit 8 are used. After printing all of the conductive ink, a process of heating and solidifying the conductive ink at once is also possible. This simplifies the manufacturing process.

【００６２】また、各インキとしては、熱硬化性、光硬
化性など様々な性質のものが使用可能なので、それぞれ
の性質に応じた固化工程を選択すればよい。As each ink, those having various properties such as thermosetting properties and photo-curing properties can be used. Therefore, a solidification step may be selected according to each property.

【００６３】ＩＣチップ９，１２としては、非接触型Ｉ
Ｃメディアに用いることのできる公知の任意なものを用
いることができ、それらに対応してアンテナ部３のパタ
ーンやランド部２ａ，２ｂ，５を任意に設計すれば良
い。ＩＣチップ９，１２の実装は、ワイヤーボンディン
グをはじめとして、異方性導電フィルム、導電インキ、
絶縁樹脂、クリーム半田ボールを用いたものなど、公知
の様々な方法で行える。必要であれば、公知のアンダー
フィル材あるいはグローブトップ材などによる接続部お
よびＩＣチップを含めた保護や補強を行っても良い。As the IC chips 9 and 12, a non-contact type
Any known known media that can be used for the C media can be used, and the pattern of the antenna unit 3 and the lands 2a, 2b, and 5 may be arbitrarily designed corresponding to them. The mounting of the IC chips 9 and 12 includes anisotropic conductive film, conductive ink,
It can be performed by various known methods such as those using an insulating resin and cream solder balls. If necessary, protection or reinforcement including the connection portion and the IC chip by a known underfill material or glove top material may be performed.

【００６４】接着シート１１にアンテナ回路が搭載され
た後は、前記したように保護シートを貼り付けたり、封
止剤を塗布して固化させたり、任意の形状に切断したり
型抜きしたり、様々な文字や図形等を印刷記録したり、
別部材を積層するなど、様々な後工程を行うことができ
る。After the antenna circuit is mounted on the adhesive sheet 11, as described above, a protective sheet is attached, a sealant is applied and solidified, or cut into arbitrary shapes or cut out. Print and record various characters and figures,
Various post-processes such as laminating another member can be performed.

【００６５】[0065]

【発明の効果】本発明によると、非接触型ＩＣメディア
の基材となる接着シート上で、アンテナ部をなす導電イ
ンキの固化工程が行われないので、紙やＰＶＣ、ＰＥＴ
といった合成樹脂などの耐熱性の低いシートを用いるこ
とができ、また、これらは一般的に安価であるため製造
コストの低減が図れる。さらに、耐熱性以外の性質を優
先して接着シートの材料を選択することにより、諸特性
の優れた非接触型ＩＣメディアを得ることができる。ま
た、これにより、非接触型ＩＣメディアの用途が従来よ
りも広がる可能性がある。According to the present invention, since the step of solidifying the conductive ink forming the antenna portion is not performed on the adhesive sheet serving as the base material of the non-contact type IC media, paper, PVC, PET or the like is not used.
Sheets having low heat resistance, such as synthetic resins, can be used, and since these are generally inexpensive, manufacturing costs can be reduced. Further, by selecting a material for the adhesive sheet with priority given to properties other than heat resistance, it is possible to obtain a non-contact type IC medium having excellent properties. As a result, applications of the non-contact type IC media may be wider than before.

【００６６】アンテナ部をなす導電インキの固化工程が
行われる剥離シートは、繰り返し使用可能であるので、
耐熱性や強度に優れた材料により形成すると、製造コス
トをさほど高めることなく、非接触型ＩＣメディアを安
定して大量生産できる。Since the release sheet in which the step of solidifying the conductive ink forming the antenna portion is performed can be used repeatedly,
When formed from a material having excellent heat resistance and strength, non-contact IC media can be stably mass-produced without significantly increasing the manufacturing cost.

【図面の簡単な説明】[Brief description of the drawings]

【図１】（ａ）は、本発明の第１の実施形態により製造
された非接触型ＩＣメディアの平面図、（ｂ）は、その
ＩＣチップ、レジスト部、およびジャンパー部を通る断
面図である。FIG. 1A is a plan view of a non-contact type IC medium manufactured according to a first embodiment of the present invention, and FIG. 1B is a cross-sectional view passing through the IC chip, a resist section, and a jumper section. is there.

【図２】第１の実施形態の非接触型ＩＣメディアの製造
方法の前半の工程を示す平面図である。FIG. 2 is a plan view showing the first half of a method of manufacturing the non-contact type IC medium according to the first embodiment.

【図３】第１の実施形態の非接触型ＩＣメディアの製造
方法を示す概略図である。FIG. 3 is a schematic view illustrating a method for manufacturing a non-contact type IC medium according to the first embodiment.

【図４】第１の実施形態の非接触型ＩＣメディアの製造
方法の後半の工程を示す、ＩＣチップおよびアンテナ部
を通る断面図である。FIG. 4 is a cross-sectional view passing through an IC chip and an antenna unit, illustrating a second half of a method of manufacturing the non-contact type IC medium according to the first embodiment.

【図５】第１の実施形態の非接触型ＩＣメディアの製造
方法を示すフローチャートである。FIG. 5 is a flowchart illustrating a method for manufacturing a non-contact type IC medium according to the first embodiment.

【図６】本発明の第２の実施形態の非接触型ＩＣメディ
アの製造方法の前半の工程を示す平面図である。FIG. 6 is a plan view showing a first half of a method of manufacturing a non-contact type IC medium according to a second embodiment of the present invention.

【図７】第２の実施形態の非接触型ＩＣメディアの製造
方法の後半の工程を示す、ＩＣチップおよびアンテナ部
を通る断面図である。FIG. 7 is a cross-sectional view passing through an IC chip and an antenna unit, showing a second half of a method of manufacturing the non-contact type IC medium according to the second embodiment.

【図８】（ａ）は、第２の実施形態により製造された非
接触型ＩＣメディアの平面図、（ｂ）は、そのＩＣチッ
プ、レジスト部、およびジャンパー部を通る断面図であ
る。FIG. 8A is a plan view of a non-contact type IC medium manufactured according to the second embodiment, and FIG. 8B is a cross-sectional view passing through an IC chip, a resist section, and a jumper section.

【図９】第２の実施形態の非接触型ＩＣメディアの製造
方法を示す概略図である。FIG. 9 is a schematic view illustrating a method for manufacturing a non-contact type IC medium according to a second embodiment.

【図１０】第２の実施形態の非接触型ＩＣメディアの製
造方法を示すフローチャートである。FIG. 10 is a flowchart illustrating a method for manufacturing a non-contact type IC medium according to a second embodiment.

【符号の説明】[Explanation of symbols]

１ 剥離シート ２ａ，２ｂ ランド部 ３ アンテナ部 ５ ランド部 ６ レジスト部 ８ ジャンパー部 ９ ＩＣチップ １１ 接着シート １２ ＩＣチップ DESCRIPTION OF SYMBOLS 1 Peeling sheet 2a, 2b Land part 3 Antenna part 5 Land part 6 Resist part 8 Jumper part 9 IC chip 11 Adhesive sheet 12 IC chip

───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 2C005 MA07 MA11 MA18 MA19 MA31 NA09 PA04 PA15 PA18 RA30 5B035 AA07 CA01  ──────────────────────────────────────────────────の Continued on the front page F term (reference) 2C005 MA07 MA11 MA18 MA19 MA31 NA09 PA04 PA15 PA18 RA30 5B035 AA07 CA01

Claims (13)

【特許請求の範囲】[Claims] 【請求項１】 剥離シートに導電インキを印刷してアン
テナ部を形成する工程と、 前記剥離シートに印刷された前記導電インキを固化させ
る工程と、 前記剥離シートの前記アンテナ部形成面と、接着シート
の接着面とを重ね合わせ、固化した前記アンテナ部を前
記接着シートの前記接着面に転移させる工程とを含む非
接触型ＩＣメディアの製造方法。1. a step of printing conductive ink on a release sheet to form an antenna portion; a step of solidifying the conductive ink printed on the release sheet; and bonding the antenna portion forming surface of the release sheet to the antenna portion Superposing an adhesive surface of a sheet and transferring the solidified antenna portion to the adhesive surface of the adhesive sheet. 【請求項２】 前記導電インキ固化工程は前記剥離シー
トの加熱を含む工程である、請求項１に記載の非接触型
ＩＣメディアの製造方法。2. The method for manufacturing a non-contact type IC medium according to claim 1, wherein the step of solidifying the conductive ink includes a step of heating the release sheet. 【請求項３】 前記導電インキ固化工程の後、前記剥離
シートの前記アンテナ部形成面にＩＣチップを実装する
工程をさらに含み、 前記転移工程において、前記ＩＣチップも、前記アンテ
ナ部と同時に前記剥離シートから前記接着シートの前記
接着面に転移させる、請求項１または２に記載の非接触
型ＩＣメディアの製造方法。3. The method according to claim 2, further comprising: after the step of solidifying the conductive ink, mounting an IC chip on the antenna section forming surface of the release sheet. In the transferring step, the IC chip is also peeled off simultaneously with the antenna section. The method for manufacturing a non-contact type IC medium according to claim 1, wherein the sheet is transferred from the sheet to the adhesive surface of the adhesive sheet. 【請求項４】 前記転移工程の後、前記接着シートの前
記接着面にＩＣチップを実装する工程をさらに含む、請
求項１または２に記載の非接触型ＩＣメディアの製造方
法。4. The method for manufacturing a non-contact type IC medium according to claim 1, further comprising a step of mounting an IC chip on the adhesive surface of the adhesive sheet after the transferring step. 【請求項５】 前記導電インキ固化工程の後、前記剥離
シートに、前記アンテナ部の一部を覆う絶縁性のレジス
ト部を形成する工程と、前記剥離シートの前記レジスト
部上を横切って前記アンテナ部に接続された導電性のジ
ャンパー部を形成する工程とをさらに含み、 前記転移工程において、前記レジスト部および前記ジャ
ンパー部も、前記アンテナ部と同時に前記剥離シートか
ら前記接着シートの前記接着面に転移させる、請求項１
〜４のいずれか１項に記載の非接触型ＩＣメディアの製
造方法。5. A step of forming an insulating resist portion covering a part of the antenna section on the release sheet after the step of solidifying the conductive ink, and forming the antenna across the resist section of the release sheet. Forming a conductive jumper portion connected to the portion, wherein in the transferring step, the resist portion and the jumper portion are also attached to the adhesive surface of the adhesive sheet from the release sheet at the same time as the antenna portion. 2. Transferring
5. The method for manufacturing a non-contact type IC medium according to any one of the above-mentioned items. 【請求項６】 前記アンテナ部が転移された前記接着面
を覆うように保護シートを積層する工程を含む請求項１
〜５のいずれか１項に記載の非接触型ＩＣメディアの製
造方法。6. The method according to claim 1, further comprising the step of laminating a protective sheet so as to cover the adhesive surface to which the antenna section has been transferred.
6. The method for producing a non-contact type IC medium according to any one of items 1 to 5. 【請求項７】 前記アンテナ部が転移された前記接着面
を覆うように封止材を塗布する工程を含む請求項１〜５
のいずれか１項に記載の非接触型ＩＣメディアの製造方
法。7. The method according to claim 1, further comprising the step of applying a sealing material so as to cover said adhesive surface to which said antenna portion has been transferred.
The method for producing a non-contact IC medium according to any one of the above items. 【請求項８】 前記接着シートは、可撓性を有するシー
ト基材に接着剤層が形成されたものである請求項１〜７
のいずれか１項に記載の非接触型ＩＣメディアの製造方
法。8. The adhesive sheet according to claim 1, wherein an adhesive layer is formed on a flexible sheet substrate.
The method for producing a non-contact IC medium according to any one of the above items. 【請求項９】 前記剥離シートは前記アンテナ部形成面
に剥離剤層が形成されたものである、請求項１〜８のい
ずれか１項に記載の非接触型ＩＣメディアの製造方法。9. The method for manufacturing a non-contact type IC medium according to claim 1, wherein the release sheet has a release agent layer formed on the antenna portion forming surface. 【請求項１０】 前記剥離シートは耐熱性を有してい
る、請求項１〜１０のいずれか１項に記載の非接触型Ｉ
Ｃメディアの製造方法。10. The non-contact type I according to claim 1, wherein the release sheet has heat resistance.
Manufacturing method of C media. 【請求項１１】 前記剥離シートを、前記アンテナ部を
前記接着シートに転移させた後で繰り返し使用する、請
求項１〜１１のいずれか１項に記載の非接触型ＩＣメデ
ィアの製造方法。11. The method for manufacturing a non-contact type IC medium according to claim 1, wherein the release sheet is repeatedly used after the antenna section is transferred to the adhesive sheet. 【請求項１２】 接着シートの接着面に、ＩＣチップ
と、導電性のジャンパー部と、部分的に前記ジャンパー
部上を覆っている絶縁性のレジスト部と、部分的に前記
レジスト部上に重なっており前記ジャンパー部および前
記ＩＣチップと接続されている、固化された導電インキ
からなるアンテナ部とが同時に転移された非接触型ＩＣ
メディア。12. An IC chip, a conductive jumper portion, an insulating resist portion partially covering the jumper portion, and partially overlapping the resist portion on an adhesive surface of the adhesive sheet. A non-contact type IC in which the jumper part and the antenna part made of solidified conductive ink connected to the IC chip are simultaneously transferred.
media. 【請求項１３】 接着シートの接着面に、導電性のジャ
ンパー部と、部分的に前記ジャンパー部上に重なってい
る絶縁性のレジスト部と、部分的に前記レジスト部上に
重なっており前記ジャンパー部と接続されている、固化
された導電インキからなるアンテナ部とが同時に転移さ
れ、 前記ジャンパー部、前記レジスト部、および前記アンテ
ナ部が転移された前記接着面上に、前記アンテナ部と接
続されるＩＣチップが実装された非接触型ＩＣメディ
ア。13. The jumper, wherein an electrically conductive jumper portion, an insulating resist portion partially overlapping the jumper portion, and a jumper portion partially overlapping the resist portion are provided on an adhesive surface of the adhesive sheet. And the antenna unit made of the solidified conductive ink, which is connected to the antenna unit, is simultaneously transferred to the antenna unit on the adhesive surface to which the jumper unit, the resist unit, and the antenna unit are transferred. Non-contact IC media on which an IC chip is mounted.
JP2001101129A 2001-03-30 2001-03-30 Contactless ic medium and manufacturing method thereof Pending JP2002298109A (en)

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