JPS6448491A - Manufacture of transcription membrane circuit - Google Patents

Manufacture of transcription membrane circuit

Info

Publication number
JPS6448491A
JPS6448491A JP20556087A JP20556087A JPS6448491A JP S6448491 A JPS6448491 A JP S6448491A JP 20556087 A JP20556087 A JP 20556087A JP 20556087 A JP20556087 A JP 20556087A JP S6448491 A JPS6448491 A JP S6448491A
Authority
JP
Japan
Prior art keywords
circuit pattern
transcription
adhesive layer
base
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20556087A
Other languages
Japanese (ja)
Inventor
Hideharu Yamagishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP20556087A priority Critical patent/JPS6448491A/en
Publication of JPS6448491A publication Critical patent/JPS6448491A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Of Switches (AREA)

Abstract

PURPOSE:To improve reliability of a circuit pattern and allow for fine patterning by fixing the circuit pattern on a base while forming an adhesive layer therebetween. CONSTITUTION:A release layer 2 is formed on a base film 1. On the release layer 2, a circuit pattern is formed by printing a resist ink 8, a silver ink 4A, and a carbon ink 4B in this sequence. On the circuit pattern thus formed, an adhesive layer 5 is formed, wherein a transcription sheet is formed by attaching a release paper 6 thereto. When using the this, the release paper 6 of the transcription sheet is removed, and the circuit pattern is attached to a base 7 through the adhesive layer 5. Then a transcription membrane circuit is formed by transcribing the circuit pattern after removing the base film 1. According to the constitution, the reliability of the circuit pattern is improved and it is possible to make fine patterns.
JP20556087A 1987-08-19 1987-08-19 Manufacture of transcription membrane circuit Pending JPS6448491A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20556087A JPS6448491A (en) 1987-08-19 1987-08-19 Manufacture of transcription membrane circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20556087A JPS6448491A (en) 1987-08-19 1987-08-19 Manufacture of transcription membrane circuit

Publications (1)

Publication Number Publication Date
JPS6448491A true JPS6448491A (en) 1989-02-22

Family

ID=16508916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20556087A Pending JPS6448491A (en) 1987-08-19 1987-08-19 Manufacture of transcription membrane circuit

Country Status (1)

Country Link
JP (1) JPS6448491A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002298107A (en) * 2001-03-30 2002-10-11 Toppan Forms Co Ltd Contactless ic medium and manufacturing method thereof
JP2002298108A (en) * 2001-03-30 2002-10-11 Toppan Forms Co Ltd Interposer for contactless ic medium and manufacturing method thereof
JP2002298109A (en) * 2001-03-30 2002-10-11 Toppan Forms Co Ltd Contactless ic medium and manufacturing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002298107A (en) * 2001-03-30 2002-10-11 Toppan Forms Co Ltd Contactless ic medium and manufacturing method thereof
JP2002298108A (en) * 2001-03-30 2002-10-11 Toppan Forms Co Ltd Interposer for contactless ic medium and manufacturing method thereof
JP2002298109A (en) * 2001-03-30 2002-10-11 Toppan Forms Co Ltd Contactless ic medium and manufacturing method thereof

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