JPH0629651A - Printer structure for flexible circuit board - Google Patents
Printer structure for flexible circuit boardInfo
- Publication number
- JPH0629651A JPH0629651A JP18122492A JP18122492A JPH0629651A JP H0629651 A JPH0629651 A JP H0629651A JP 18122492 A JP18122492 A JP 18122492A JP 18122492 A JP18122492 A JP 18122492A JP H0629651 A JPH0629651 A JP H0629651A
- Authority
- JP
- Japan
- Prior art keywords
- vacuum suction
- suction plate
- flexible circuit
- circuit board
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Screen Printers (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、樹脂を基材とするフィ
ルム上にパターンを形成したフレキシブル回路基板用印
刷機構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible circuit board printer structure in which a pattern is formed on a resin-based film.
【０００２】[0002]
【従来の技術】従来のフレキシブル回路基板用印刷機の
真空吸着板構造は、図３に示す様に、印刷する基板との
接触面は、平らで凹凸のない構造であった。この真空吸
着板の上にパターニングした基板を載せ固定して、ソル
ダーレジストをスクリーン印刷し、その後メッキを行い
フレキシブル回路基板を供給していた。2. Description of the Related Art As shown in FIG. 3, the structure of a vacuum suction plate of a conventional printing machine for flexible circuit boards is such that the contact surface with the substrate to be printed is flat and has no unevenness. A patterned substrate is placed and fixed on the vacuum suction plate, a solder resist is screen-printed, and then plating is performed to supply a flexible circuit board.
【０００３】[0003]
【発明が解決しようとする課題】しかし、前述の従来構
造では、図４に示す様にパターン３が密集している部分
には、スクリーン印刷の際の圧力が十分伝わりにくく、
ソルダーレジスト４が塗布されない様な品質の不安定な
フレキシブル回路基板を供給せざるを得ないという課題
を有する。そこで、本発明はこの様な課題を解決するも
ので、その目的とするところは、レジストが塗布されに
くい部分にレジストを塗布し、品質の安定したフレキシ
ブル回路基板を供給するところにある。However, in the above-described conventional structure, as shown in FIG. 4, it is difficult for the pressure during screen printing to be sufficiently transmitted to the portion where the patterns 3 are densely formed.
There is a problem that it is unavoidable to supply a flexible circuit board of unstable quality such that the solder resist 4 is not applied. Therefore, the present invention solves such a problem, and an object of the present invention is to apply a resist to a portion where the resist is difficult to apply and supply a flexible circuit board of stable quality.
【０００４】[0004]
【課題を解決するための手段】本発明のフレキシブル回
路基板用印刷機の真空吸着板構造は、印刷時にソルダー
レジストが塗布されにくい部分の真空吸着板相当部に突
起を設ける事により、レジストが塗布されにくい部分に
かかる圧力を高くし、ソルダーレジストを確実に塗布
し、品質を安定させた事を特徴とする。According to the vacuum suction plate structure of a printer for a flexible circuit board of the present invention, a resist is applied by providing a protrusion on a portion corresponding to the vacuum suction plate which is difficult to apply the solder resist during printing. The feature is that the pressure applied to the part that is hard to be exposed is increased, and the solder resist is surely applied to stabilize the quality.
【０００５】[0005]
【実施例】以下に本発明の実施例を図面に基づいて説明
する。図１は本発明のフレキシブル回路基板用印刷機の
真空吸着板構造の要部を示す断面図。図２は本発明のフ
レキシブル回路基板用印刷機真空吸着板構造の実施例の
要部を示す断面図である。図３は従来のフレキシブル回
路基板用印刷機の真空吸着板構造の要部を示す断面図。
図４は従来のフレキシブル回路基板用印刷機の真空吸着
板構造の実施例の要部を示す断面図である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing a main part of a vacuum suction plate structure of a flexible circuit board printer according to the present invention. FIG. 2 is a sectional view showing a main part of an embodiment of a vacuum suction plate structure for a flexible circuit board printer according to the present invention. FIG. 3 is a cross-sectional view showing a main part of a vacuum suction plate structure of a conventional flexible circuit board printing machine.
FIG. 4 is a sectional view showing a main part of an embodiment of a vacuum suction plate structure of a conventional printing machine for flexible circuit boards.
【０００６】フレキシブル回路基板は、図４に示すよう
に５０μｍ〜１２５μｍの厚さのベースフィルム２上
に、２５μｍ〜３５μｍの厚さの銅箔パターン３により
形成される。この上に１０μｍ〜３５μｍの厚さで、回
路保護の目的でソルダーレジスト４をスクリーン印刷に
より塗布する。この時、ベースフィルム２上には、銅箔
パターン３により３５μｍの凹凸ができているので、銅
箔パターン３が密集している部分の凹部分のベースフィ
ルム２上には、スクリーン印刷の際にスクリーン印刷の
圧力が伝わりにくいため、スクリーンマスクが追従しに
くく、ソルダーレジストが塗布されない部分が発生す
る。この時の従来の真空吸着板１は、図３，図４に示す
ように平らな構造であった。真空吸着板の役割は、スク
リーン印刷の際にベースフィルム２を固定するためにベ
ースフィルム２と接する適当な部分に１mm〜２mmの穴を
あけ、ベースフィルム２を吸い付ける板であり、材質は
ステンレス、真鍮などの硬い材質が用いられる。As shown in FIG. 4, the flexible circuit board is formed by the copper foil pattern 3 having a thickness of 25 μm to 35 μm on the base film 2 having a thickness of 50 μm to 125 μm. A solder resist 4 having a thickness of 10 μm to 35 μm is applied by screen printing to protect the circuit. At this time, since the copper foil pattern 3 makes an unevenness of 35 μm on the base film 2, on the base film 2 in the concave portion of the portion where the copper foil pattern 3 is dense, it is possible to perform the screen printing. Since the pressure of screen printing is difficult to be transmitted, the screen mask is difficult to follow, and there is a portion where the solder resist is not applied. At this time, the conventional vacuum suction plate 1 had a flat structure as shown in FIGS. The role of the vacuum suction plate is a plate for adhering the base film 2 by making a hole of 1 mm to 2 mm in an appropriate portion in contact with the base film 2 for fixing the base film 2 at the time of screen printing, and the material is stainless steel. Hard materials such as brass are used.
【０００７】そこで本発明のフレキシブル回路基板用印
刷機の真空吸着板構造は、図１に示す様に、ソルダーレ
ジストが従来、塗布しにくかつた部分の真空吸着板相当
部に突起を設けた構造である。突起は、真空吸着板自体
を加工もしくは、真空吸着板１上に、突起の形状を粘着
テープを貼付けて形成する。この時の突起の厚さは、１
０μｍ〜３５μｍが適当である。この真空吸着板１上に
フレキシブル回路基板を載せ、スクリーン印刷を行なう
と、図２の様に従来ソルダーレジスト４が塗布されにく
い部分には、部分的にスクリーンマスクより伝わる圧力
が高くなりスクリーンマスクが、従来追従しなかつた部
分にも追従し、ソルダーレジストが塗布されるため、ソ
ルダーレジストを確実に塗布でき、品質の安定したフレ
キシブル回路基板を供給する事ができる。Therefore, in the vacuum suction plate structure of the flexible circuit board printing machine of the present invention, as shown in FIG. 1, a protrusion is provided on a portion corresponding to the vacuum suction plate which is difficult to apply the solder resist conventionally. It is a structure. The protrusion is formed by processing the vacuum suction plate itself or by sticking the adhesive tape on the vacuum suction plate 1 in the shape of the protrusion. The thickness of the protrusion at this time is 1
0 μm to 35 μm is suitable. When a flexible circuit board is placed on the vacuum suction plate 1 and screen printing is performed, the pressure transmitted from the screen mask is partially increased in a portion where the conventional solder resist 4 is hard to be coated, as shown in FIG. Since the solder resist is applied by following the part that has not been followed conventionally, the solder resist can be reliably applied, and a flexible circuit board of stable quality can be supplied.
【０００８】印刷する回路基板によって、ソルダーレジ
ストが塗布しにくい部分は、様々であるが、印刷機の真
空吸着板は、印刷する回路基板によって取り替えるため
一度真空吸着板上に突起を設けておけば以後、作り替え
る必要は無い。Depending on the circuit board to be printed, there are various portions where the solder resist is difficult to apply, but the vacuum suction plate of the printing machine has to be provided with a protrusion once on the vacuum suction plate for replacement by the printed circuit board. After that, there is no need to remake.
【０００９】[0009]
【発明の効果】以上に述べた様な発明によれば、樹脂を
基材とするフィルム上にパターンを形成したフレキシブ
ル回路基板製造において、従来の印刷において圧力が伝
わりにくくソルダーレジストを塗布しにくかった部分に
もソルダーレジストを塗布することができ、品質の安定
したフレキシブル回路基板を供給する事を可能にすると
いう効果を有する。According to the invention as described above, in the production of a flexible circuit board having a pattern formed on a film having a resin as a base material, it is difficult to apply a solder resist in the conventional printing because pressure is difficult to be transmitted. It is possible to apply the solder resist also to the portion, and it is possible to supply a flexible circuit board of stable quality.
【図１】本発明のフレキシブル回路基板用印刷機の真空
吸着板構造の要部を示す断面図である。FIG. 1 is a sectional view showing a main part of a vacuum suction plate structure of a flexible circuit board printer according to the present invention.
【図２】本発明のフレキシブル回路基板用印刷機の真空
吸着板構造の実施例の要部を示す断面図である。FIG. 2 is a cross-sectional view showing a main part of an embodiment of a vacuum suction plate structure of a flexible circuit board printing machine according to the present invention.
【図３】従来のフレキシブル回路基板用印刷機の真空吸
着板構造の要部を示す断面図である。FIG. 3 is a cross-sectional view showing a main part of a vacuum suction plate structure of a conventional printing machine for flexible circuit boards.
【図４】従来のフレキシブル回路基板用印刷機の真空吸
着板構造の実施例の要部を示す断面図である。FIG. 4 is a sectional view showing a main part of an embodiment of a vacuum suction plate structure of a conventional printing machine for flexible circuit boards.
１ 印刷機真空吸着板 ２ ベースフィルム ３ パターン ４ ソルダーレジスト 1 Printing machine Vacuum suction plate 2 Base film 3 Pattern 4 Solder resist
Claims (1)
形成したフレキシブル回路基板製造において、真空吸着
板に突起を設ける事を特徴とするフレキシブル回路基板
用印刷機構造。1. A printing machine structure for a flexible circuit board, wherein a protrusion is provided on a vacuum suction plate in the production of a flexible circuit board having a pattern formed on a resin-based film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18122492A JP3520375B2 (en) | 1992-07-08 | 1992-07-08 | Printing apparatus for flexible circuit board and method for manufacturing flexible circuit board using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18122492A JP3520375B2 (en) | 1992-07-08 | 1992-07-08 | Printing apparatus for flexible circuit board and method for manufacturing flexible circuit board using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0629651A true JPH0629651A (en) | 1994-02-04 |
| JP3520375B2 JP3520375B2 (en) | 2004-04-19 |
Family
ID=16096987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18122492A Expired - Fee Related JP3520375B2 (en) | 1992-07-08 | 1992-07-08 | Printing apparatus for flexible circuit board and method for manufacturing flexible circuit board using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3520375B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010052223A (en) * | 2008-08-27 | 2010-03-11 | Dainippon Printing Co Ltd | Method for producing substrate sheet with conductive bump |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102582222A (en) * | 2012-01-18 | 2012-07-18 | 肇庆市宏华电子科技有限公司 | Ceramic diaphragm printing pore filling machine |
-
1992
- 1992-07-08 JP JP18122492A patent/JP3520375B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010052223A (en) * | 2008-08-27 | 2010-03-11 | Dainippon Printing Co Ltd | Method for producing substrate sheet with conductive bump |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3520375B2 (en) | 2004-04-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DK0664016T3 (en) | Method for making and using a screen-edged template with raised edges | |
| EP0839439B1 (en) | Method for forming fiducial mark in resin stencil and stencil formed thereby | |
| JPH08258442A (en) | Mask for printing and manufacture thereof | |
| KR20200043796A (en) | Micro stencil and method for manufacturing the same | |
| JPH0629651A (en) | Printer structure for flexible circuit board | |
| GB2030779A (en) | Improvements in or relating to the manufacture of flexible printed circuits | |
| JP3017752B2 (en) | Printing metal mask and manufacturing method thereof | |
| KR100643860B1 (en) | Device and method for continuous manufacturing flexible printed circuit board | |
| EP0322997A3 (en) | Process for making printed circuit boards | |
| JPS61144898A (en) | Apparatus for manufacturing printed wiring board | |
| JPH05212852A (en) | Cream solder supplying mechanism | |
| JPS63170093A (en) | Screen for solder printing | |
| KR970032314A (en) | Circuit Board Manufacturing Method | |
| CN214627471U (en) | LED flexible circuit board | |
| TW280086B (en) | A manufacture method for integrated printing circuits | |
| JPH03175691A (en) | Manufacture of printed wiring board | |
| KR200229998Y1 (en) | Photo Solder Regist Printing Tool for Thin Type Printed Circuit Board | |
| JPH02107487A (en) | Metallic mask for printing use | |
| JP2001105563A (en) | Screen printing plate and method for munufacturing wiring substrate using screen printing plate | |
| JPH01300589A (en) | Printing machine | |
| JPS588600B2 (en) | Ryomen Print High Senban no Seizouhouhou | |
| JP2586790B2 (en) | Manufacturing method of printed wiring board | |
| JPH0596699A (en) | Structure of printing machine for flexible circuit board | |
| JPH02105597A (en) | Printed wiring board and its manufacture | |
| KR910001141Y1 (en) | Printed circuit board for magnetic head |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20040106 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20040119 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 4 Free format text: PAYMENT UNTIL: 20080213 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090213 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 5 Free format text: PAYMENT UNTIL: 20090213 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 6 Free format text: PAYMENT UNTIL: 20100213 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110213 Year of fee payment: 7 |
|
| LAPS | Cancellation because of no payment of annual fees |