JP2010052223A - Method for producing substrate sheet with conductive bump - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To keep a screen version to be used for a long period of time and to easily materialize transfer of a conductive paste while the screen version and a substrate are separated slightly from each other. <P>SOLUTION: A method for producing a substrate sheet with a conductive bump includes a base material holding process for holding a base material 60 including a tabular member 62 having a plurality of plate projections 62a and a substrate sheet 61 having a plurality of substrate projections 61a by a printing surface plate 30, a first positioning process for positioning the screen version 27 having a plurality of through-holes 27a on the base material 60, and a base material transfer process for transferring the conductive paste 70 from the through-holes 27a of the screen version 27 between the substrate projections 61a of the substrate sheet 61. In the first positioning process, the apexes of the substrate projections 61a of the substrate sheet 61 are positioned at the same positions as the peripheral edge parts of the through-holes 27a of the screen version 27 or the insides of the peripheral edge parts. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a substrate sheet with conductive bumps used when manufacturing a multilayer printed wiring board.

  Conventionally, a flexible screen mask (screen plate) having a hole (through hole) for holding a conductive paste at a predetermined position is stretched on the surface of a substrate to be printed (surface of a base material). The conductive paste placed on the screen mask is filled in the space defined by the holding holes and the surface of the printing medium by moving the squeegee member that presses the surface of the printing body along the surface of the printing body. A method of forming a paste bump in which a conductive paste filled in a space with a tensile force when the screen mask is separated from the surface of the printing body is formed into a substantially conical shape, between the screen mask and the printing body. There is known a method of moving a squeegee member in a state where a hole lower surface and a printing medium are slightly separated from each other by interposing a spacer (see Patent Document 1 and Patent Document 2).

  According to such a method, a conductive bump having a desired height can be formed with a small number of printings, and the manufacturing time of the substrate with conductive bumps can be shortened.

Further, when the number of screen printing process executions is a, and the rate of occurrence of defects in one screen printing process is b, the yield rate is (1−b) ^a ≈1−a × b, and the screen printing process is executed. As the number of times increases, the yield rate in the production of the substrate sheet with conductive bumps decreases. However, according to the method described above, the number of executions of the screen printing process can be reduced, so the yield rate is increased. can do.
Japanese Patent Laid-Open No. 2004-6577 JP 2003-320640 A

  However, in the conventional method described above, a spacer is interposed between the screen mask and the printing medium in order to move the squeegee member in a state where the hole lower surface and the printing medium are slightly separated from each other. For this reason, the spacer may be peeled off when cleaning the screen mask, and it is difficult to continue using the screen mask for a long time. In the first place, it is difficult to manufacture a screen mask with spacers in this way.

  In addition, when a spacer is interposed between the screen mask and the printing body, when the conductive paste is discharged from the screen mask, the discharge amount of the conductive paste to the surface of the printing body increases. There is a problem that bleeding of the conductive paste occurs, resulting in an increase in the diameter of the bottom surface of the conductive bump (bump diameter).

  The present invention has been made in consideration of such points, and can reduce the number of steps of applying a conductive paste to the surface of a substrate sheet, and can use a screen plate for a long period of time. In addition, it is possible to easily transfer the conductive paste with the screen plate and the base material slightly separated from each other, and the conductive paste is transferred from the screen plate to the substrate sheet. It is an object of the present invention to provide a method for manufacturing a substrate sheet with conductive bumps that can prevent the conductive paste from spreading when transferred and the diameter of the bottom surface of the conductive bumps from increasing.

The method for producing a substrate sheet with conductive bumps according to the present invention comprises:
A base for holding a base material including a flat plate member having a plurality of flat plate convex portions and a substrate sheet placed on the flat plate member and having a substrate convex portion corresponding to the flat plate convex portion by a printing surface plate. A material holding process;
A first positioning step of positioning a screen plate having a plurality of through holes on the substrate;
A base material transfer step of transferring a conductive paste from the through hole of the screen plate to the substrate convex portion of the substrate sheet;
With
In the first positioning step, the vertex of the substrate convex portion of the substrate sheet is positioned at the same position as the peripheral portion of the through hole of the screen plate or inside the peripheral portion.

In the method for producing a conductive bumped substrate sheet according to the present invention,
The distance between the apexes of the pair of substrate protrusions sandwiching the conductive paste in the substrate sheet is preferably smaller than the through hole of the screen plate.

In the method for producing a conductive bumped substrate sheet according to the present invention,
It is preferable to further include a base material positioning step for positioning the base material with respect to the printing surface plate so that a conductive paste is placed between the substrate convex portions.

In the method for producing a conductive bumped substrate sheet according to the present invention,
The base material positioning step includes a base material image acquisition step of acquiring an image of a base material held on the printing surface plate by an image acquisition device, and a base for displaying an image acquired by the image acquisition device by an image display device. It is preferable to include a material image display step and a base material position adjustment step of adjusting the position of the base material with respect to the printing surface plate based on an image displayed by the image display device.

In the method for producing a conductive bumped substrate sheet according to the present invention,
The screen plate is preferably used when forming the flat projections of the flat plate member.

In such a method of manufacturing a substrate sheet with conductive bumps,
A prepared body holding step for holding a flat plate-shaped member prepared body by the printing surface plate,
A second positioning step of positioning a screen plate having a plurality of through holes on the flat plate-shaped member preparation;
A preparation body transfer step of transferring a conductive paste from the through hole of the screen plate to a flat member preparation body,
It is preferable that the position of the conductive paste transferred to the flat plate member preparation corresponds to a position surrounding the position of the conductive paste transferred in the base material transfer step.

  According to the present invention, a state in which the screen plate and the base material are slightly separated is realized by the substrate convex portion of the substrate sheet, and the conductive paste is transferred between the substrate convex portions. For this reason, the number of steps of applying the conductive paste to the surface of the substrate sheet can be reduced, and the screen plate can be used for a long time, and the space between the screen plate and the base material can be reduced. It is possible to easily transfer the conductive paste in a slightly spaced state. In addition, when the screen plate is positioned on the base material, the top of the substrate convex portion of the substrate sheet is positioned at the same position as the peripheral portion of the through hole of the screen plate or inside the peripheral portion. When the conductive paste is transferred to the substrate sheet, the conductive paste is blocked by the substrate convex portion of the substrate sheet, and the conductive paste transferred to the substrate sheet is prevented from bleeding. it can. This can prevent the bottom diameter of the conductive bump from becoming large.

BEST MODE FOR CARRYING OUT THE INVENTION

DESCRIPTION OF EMBODIMENTS Embodiments of a method for manufacturing a substrate sheet with conductive bumps according to the present invention will be described below with reference to the drawings. Here, FIG. 1 to FIG. 8 are diagrams showing an embodiment of the present invention.

  In the present embodiment, the substrate sheet manufacturing system with conductive bumps includes a substrate protrusion generating device (see FIGS. 1A and 1B) that forms a substrate protrusion 61a on a substrate, and a substrate protrusion of the substrate sheet 61. And a printing device (see FIG. 2) for transferring the conductive paste 70 between the layers 61a.

  As shown in FIGS. 1 (a) and 1 (b), the substrate convex portion generating apparatus includes a holding portion 1 that holds and holds a flat plate member 62 having a plurality of flat plate convex portions 62a by a suction force from the suction holes 1a. Then, pressure is applied to the substrate sheet 61 (for example, metal foil) placed on the flat plate protrusion 62 a of the flat plate member 62, and the substrate protrusion corresponding to the flat plate protrusion 62 a of the flat plate member 62 is applied to the substrate sheet 61. And a pressure roller (pressure part) 10 that forms the part 61a. Note that the flat plate member 62 is provided with an opening (not shown), and the substrate sheet 61 is held by an adsorption force through the opening.

  By the way, as the flat member 62, metal sheets, such as copper, SUS, and aluminum, films and resin sheets, such as PET, PP, and PE, can be used. Moreover, as the pressure roller 10, a rubber roll, a metal roll, a resin roll, etc. can be used.

  In the present embodiment, the pressure roller 10 is used as a pressure portion for forming the substrate convex portion 61a corresponding to the flat plate convex portion 62a of the flat plate member 62 on the substrate sheet 61 (FIG. 1A). ) (See (b)), without being limited thereto, for example, a flat press may be used.

  As shown in FIG. 2, the printing apparatus includes a printing platen 30 that holds the base 60, a screen plate 27 such as a metal mask provided with a plurality of through holes 27 a having a predetermined pattern, and the screen. A holding portion 26 for holding the plate 27 and a conductive paste 70 (see FIG. 5) such as a silver paste or a solder paste, which is scanned on the screen plate 27 and is placed on the screen plate 27, is formed through the through hole 27a. And a squeegee 22 to be transferred onto the substrate sheet 61 of the material 60. The squeegee mechanism 20 includes the squeegee 22 described above and the guide member 21 that guides the squeegee 22. Here, the base material 60 includes a flat plate member 62 having a plurality of flat plate protrusions 62a, and a substrate sheet 61 mounted on the flat plate member 62 and having a substrate protrusion 61a corresponding to the flat plate protrusions 62a. It is made up of.

  As shown in FIG. 2, a CCD camera (image acquisition device) 11 that acquires an image of the substrate 60 held on the printing surface plate 30 is disposed on the upstream side of the squeegee mechanism 20. The CCD camera 11 is connected to a display screen (image display device) 12 for displaying an image acquired by the CCD camera 11.

  As shown in FIG. 2, the printing surface plate 30 includes a position adjusting device 35 that adjusts the position of the base material 60 with respect to the printing surface plate 30. The position adjustment unit 35 is connected to a position instruction unit 16 that transmits an instruction input by an operator. The base material 60 is provided with an alignment mark (not shown), and the position of the base material 60 relative to the printing surface plate 30 is positioned by photographing the alignment mark with the CCD camera 11.

  In the present embodiment, a positioning mechanism that is positioned from the CCD camera 11, the display screen 12, the position adjustment device 35, and the position instruction unit 16 is configured. A guide member 31 for guiding the printing surface plate 30 extends in the horizontal direction below the printing surface plate 30.

  As shown in FIGS. 3A and 3B, the position adjusting device 35 is provided with a suction hole 35a, and the base member 60 is held by the suction force from the suction hole 35a. . In the present embodiment, a description will be given using a mode in which the base material 60 is adsorbed and held by the suction holes 35a of the position adjusting device 35 as described above. However, the present invention is not limited to this. A suction plate may be provided on the position adjustment device 35, and the base member 60 may be sucked and held by the suction force from the suction plate.

  Next, the operation of the present embodiment having such a configuration will be described.

(Generation of Substrate Sheet 61 Having Substrate Convex 61a)
Initially, the process of producing | generating the board | substrate sheet | seat 61 which has the board | substrate convex part 61a is demonstrated.

  First, the flat plate member 62 having a plurality of flat plate protrusions 62a is sucked and held by the suction force from the suction hole 1a of the holding portion 1 (see FIG. 1A). Next, the plurality of flat plate protrusions 62a of the flat plate member 62 are brought into contact with the substrate sheet 61 (contact step). More specifically, the substrate sheet 61 is placed on the flat plate member 62 (see FIG. 1A).

  Next, the pressure roller 10 is moved in the horizontal direction with the substrate sheet 61 pressed against the flat plate member 62 (see FIG. 1A). At this time, pressure is applied to the substrate sheet 61 by the pressure roller 10, and the substrate convex portions 61 a corresponding to the plurality of flat plate convex portions 62 a of the flat plate member 62 are formed on the substrate sheet 61 (substrate convex portion formation). Step) (see FIG. 1B).

(Generation of substrate sheet with conductive bumps)
Next, a process of generating a substrate sheet with conductive bumps will be described.

  First, by the position adjusting device 35 of the printing surface plate 30, a base material 60 comprising a flat plate member 62 having a plurality of flat plate convex portions 62a and a substrate sheet 61 having a substrate convex portion 61a corresponding to the flat plate convex portions 62a. And adsorbed and held (base material holding step) (see FIG. 2). The base material 60 is placed on the printing surface plate 30 such that the flat plate member 62 is located below and the substrate sheet 61 is located above.

  Next, the base material 60 is positioned with respect to the printing surface plate 30 so that the conductive paste 70 transferred by the squeegee mechanism 20 is placed between the substrate convex portions 61a of the substrate sheet 61 (base material). Positioning step) (see FIG. 2).

  Specifically, first, an image of the substrate 60 held on the printing surface plate 30 is taken by the CCD camera 11 (substrate image acquisition step). Next, the image of the base material 60 thus captured by the CCD camera 11 is displayed on the display screen 12 (base material image display step).

  Next, the operator inputs an instruction to the position instruction unit 16 so as to move the printing surface plate 30 to a predetermined position based on the image displayed on the display screen 12. Then, according to this instruction, the position adjusting device 35 is driven, and the position of the substrate 60 with respect to the printing surface plate 30 is adjusted. For example, the operator inputs an instruction to the position instruction unit 16 so that the alignment mark on the base material 60 is photographed at the center position of the CCD camera 11. Then, in accordance with this instruction, the position adjusting device 35 is driven, and the position of the substrate 60 relative to the printing surface plate 30 is adjusted so that the alignment mark is at the center position of the CCD camera 11 (substrate position adjusting step).

  Next, the printing surface plate 30 is moved in the horizontal direction (right side in FIG. 4) along the guide member 31 by a driving force applied from a driving unit (not shown) (see FIG. 4). As a result, the screen plate 27 having a plurality of through holes 27a is positioned on the substrate 60 (first positioning step) (see FIG. 3A). At this time, as shown in FIG. 3A, the vertex of the substrate convex portion 61a of the substrate sheet 61 is the same position as the peripheral portion of the through hole 27a of the screen plate 27 or slightly inside the peripheral portion. The screen plate 27 is positioned on the base material 60 so as to be positioned. More specifically, with reference to FIG. 3A, the apex of the left substrate convex portion 61 a of the pair of substrate convex portions 61 a is substantially the same position as the peripheral portion of the through hole 27 a of the screen plate 27. On the other hand, the apex of the right substrate convex portion 61a of the two substrate convex portions 61a shown in FIG. 3A is slightly inside the peripheral edge portion of the through hole 27a of the screen plate 27 (in FIG. 3A). (Left side) A pair of conductive pastes 70 is sandwiched so that the apex of the substrate convex portion 61a of the substrate sheet 61 is at the same position as the peripheral portion of the through hole 27a of the screen plate 27 or a position slightly inside the peripheral portion. The distance B between the vertices of the substrate convex portion 61a is smaller than the diameter A of the through hole 27a.

  Next, the squeegee 22 is scanned on the screen plate 27 along the guide member 21, and the conductive paste 70 placed on the screen plate 27 is transferred onto the substrate sheet 61 of the substrate 60 through the through hole 27a. (Base material transfer step) (see FIG. 3B and FIG. 5).

  Here, according to the present embodiment, as described above, the printing surface plate 30 can be moved to a predetermined position based on the image displayed on the display screen 12 before the substrate transfer step. For this reason, in this base material transfer process, the conductive paste 70 transferred through the through hole 27a of the screen plate 27 by the squeegee 22 of the squeegee mechanism 20 is reliably transferred between the substrate convex portions 61a of the substrate sheet 61. Can be transferred.

  For this reason, the height of the conductive bumps can be made sufficient by transferring the conductive paste 70 onto the substrate sheet 61 once by the squeegee 22 of the squeegee mechanism 20. As a result, the number of steps of applying the conductive paste 70 to the surface of the substrate sheet 61 can be reduced, and as a result, the manufacturing time of the substrate with conductive bumps can be shortened. Moreover, the yield rate in manufacture of a board | substrate sheet | seat with an electroconductive bump can also be made high.

  Moreover, since the vertex of the board | substrate convex part 61a of the board | substrate sheet | seat 61 is provided in the same position as the peripheral part of the through-hole 27a of the screen plate 27, or the position slightly inside the said peripheral part, it shows in FIG.3 (b). As described above, when the conductive paste 70 is transferred from the screen plate 27 to the substrate sheet 61, the conductive paste 70 is blocked by the substrate convex portions 61 a of the substrate sheet 61, and the conductive paste transferred to the substrate sheet 61 is thus obtained. The conductive paste 70 does not bleed.

  As described above, when the conductive paste 70 is placed between the substrate convex portions 61a of the substrate sheet 61, the printing surface plate 30 moves in the horizontal direction (left side in FIG. 6) and returns to the initial position. (See FIG. 6). At this time, the squeegee mechanism 20 also returns to the initial position (see FIG. 6).

  Next, the substrate sheet 61 is peeled from the flat plate member 62. Thereafter, the conductive paste 70 provided between the substrate convex portions 61a of the substrate sheet 61 is dried and cured (base material curing step). As a result, substantially conical conductive bumps are formed on the substrate sheet 61, and a substrate sheet with conductive bumps is generated. In the case where the conductive paste 70 is made of an ultraviolet curable material, instead of drying the conductive paste 70, the conductive paste 70 may be cured by irradiating with ultraviolet rays.

  When the substrate sheet with conductive bumps is generated as described above, an uncured insulating sheet (not shown) is placed on the substrate sheet with conductive bumps and pressed. As a result, the conductive bump penetrates the insulating sheet, and the insulating sheet is positioned on the substrate sheet with the conductive bump.

  Next, another (with conductive bumps) substrate sheet (the uppermost substrate sheet 61 has no conductive bumps) is placed on the uncured insulating sheet and then pressed. As a result, the conductive bumps of the substrate sheet with conductive bumps positioned below penetrate into the back surface of the substrate sheet positioned with the conductive bumps (with the conductive bumps). Next, the insulating sheet is cured, and then a circuit is formed on the substrate sheet (with conductive bumps).

  A multilayer printed wiring board will be manufactured by repeating such a process.

  By the way, according to the present embodiment, as shown in FIGS. 3A and 3B, the screen projection 27 and the base material 60 can be slightly separated by the substrate convex portion 61a (gap). Since G is provided), it is not necessary to use a spacer as in the prior art to increase the transfer amount of the conductive paste 70 from the screen plate 27 to the substrate sheet 61. For this reason, the spacer is not peeled off when the screen plate 27 is washed, and the screen plate 27 can be used for a long time.

  Further, as described above, the apex of the substrate convex portion 61a of the substrate sheet 61 is provided at the same position as the peripheral portion of the through hole 27a of the screen plate 27 or at a position inside the peripheral portion. When the conductive paste 70 is transferred to the substrate sheet 61, the conductive paste 70 is blocked by the substrate convex portion 61a of the substrate sheet 61 (see FIG. 3B) and transferred to the substrate sheet 61. It is possible to prevent the conductive paste 70 from bleeding. This can prevent the bottom diameter of the conductive bump from becoming large.

  As a method for forming such a substrate convex portion 61 a, it is preferable to use a screen plate 27 that is used when the conductive paste 70 is transferred between the substrate convex portions 61 a of the substrate sheet 61.

  Specifically, first, the flat plate member preparation body 62b is held by the printing surface plate 30 (preparation body holding step) (see FIG. 7). Next, the flat member preparation body 62b is positioned with respect to the printing surface plate 30 (preparation body positioning step) (see FIG. 2). At this time, the plate-shaped member preparation body 62b is shifted by a half pitch compared to the alignment (base material positioning step) when transferring the conductive paste 70 between the substrate convex portions 61a. In addition, the CCD camera 11, the display screen 12, and the position instruction | indication part 16 are used for the alignment at this time similarly to the base material positioning process mentioned above.

  Next, the printing surface plate 30 is moved in the horizontal direction (right side in FIG. 8) along the guide member 31 by a driving force applied from a driving unit (not shown) (see FIG. 8). As a result, the screen plate 27 having the plurality of through holes 27a is positioned on the flat plate-like member preparation body 62b (second positioning step).

  Next, the squeegee 22 is scanned on the screen plate 27 along the guide member 21, and the conductive paste 70 placed on the screen plate 27 is transferred onto the plate-like member preparation body 62b through the through hole 27a. (Preparator transfer step) (see FIG. 8).

  Here, as described above, the plate-shaped member preparation body 62b is compared to the alignment (base material positioning step) when the conductive paste 70 is transferred between the substrate convex portions 61a with respect to the printing surface plate 30. Since the position is shifted by a half pitch, the conductive paste 70 can be transferred to the flat plate-like member preparation body 62b corresponding to the position surrounding the conductive paste 70 transferred in the base material transfer step described above. .

  In addition, when transferring the conductive paste 70 to the flat plate member preparation body 62 b, it is preferable that the distance between the apexes of the pair of conductive pastes 70 be smaller than the diameter of the through hole 27 a of the screen plate 27. As a result, in the step of generating the substrate sheet with the conductive bumps, as shown in FIG. 3A, the distance B between the apexes of the pair of substrate protrusions 61a sandwiching the conductive paste 70 is set to the through hole 27a. It can be made smaller than the diameter A. In this case, as described above, the vertex of the substrate convex portion 61a of the substrate sheet 61 can be located at the same position as the peripheral edge portion of the through hole 27a of the screen plate 27 or a position inside the peripheral edge portion.

  After that, the conductive paste 70 transferred in this way is cured to form the flat plate protrusion 62a. Then, as described above, the substrate sheet 61 is placed on the flat plate-like member 62 having the flat plate convex portion 62a, and the substrate sheet 61 is pressed by the pressure roller 10 to thereby have the substrate sheet 61 having the substrate convex portion 61a. 61 can be obtained (see FIG. 1).

  Thus, according to the present embodiment, it is possible to manufacture the flat plate member 62 having the flat plate protrusions 62a by using the same screen plate 27 as the screen plate 27 used in the base material transfer step. For this reason, the board | substrate convex part 61a which spaces apart the screen plate 27 and the base material 60 can be manufactured easily. As a result, the conductive paste 70 can be easily formed in a state where the screen plate 27 and the substrate 60 are slightly separated without using a screen mask with a spacer (screen plate) that is difficult to manufacture as in the prior art. Transferring can be realized. Thereby, the amount of the conductive paste 70 transferred from the screen plate 27 to the substrate sheet 61 can be increased.

The schematic side view which shows the structure of the board | substrate convex part production | generation apparatus by embodiment of this invention. 1 is a schematic side view of a printing apparatus according to an embodiment of the present invention as viewed from the side. The expanded side view which showed the 1st positioning process and the base-material transfer process in the squeegee mechanism by embodiment of this invention. FIG. 3 is a schematic side view showing one driving state of the printing apparatus according to the embodiment of the present invention. FIG. 5 is a schematic side view showing the printing apparatus in a state advanced from the state shown in FIG. 4. FIG. 6 is a schematic side view showing the printing apparatus in a state advanced from the state shown in FIG. 5. The schematic side view which showed the one drive state of the printing apparatus at the time of forming a flat plate convex part using the printing apparatus by embodiment of this invention. The schematic side view which showed the printing apparatus in the state advanced from the state shown in FIG.

Explanation of symbols

1 Holding part 10 Pressure roller (Pressure part)
11 CCD camera (image acquisition device)
DESCRIPTION OF SYMBOLS 12 Image display apparatus 22 Squeegee 27 Screen plate 27a Through-hole 30 Printing surface plate 35 Position adjustment apparatus 60 Base material 61 Substrate sheet 61a Substrate convex part 62 Flat plate member 62a Flat plate convex part 62b Flat plate member preparation 70 Conductive paste

Claims (6)

A base for holding a base material including a flat plate member having a plurality of flat plate convex portions and a substrate sheet placed on the flat plate member and having a substrate convex portion corresponding to the flat plate convex portion by a printing surface plate. A material holding process;
A first positioning step of positioning a screen plate having a plurality of through holes on the substrate;
A base material transfer step of transferring a conductive paste from the through hole of the screen plate to the substrate convex portion of the substrate sheet;
With
With said 1st positioning process, the vertex of the said board | substrate convex part of the said board | substrate sheet | seat is located in the same position as the peripheral part of the said through-hole of the said screen plate, or the inner side of the said peripheral part. Substrate sheet manufacturing method.   2. The substrate sheet with conductive bumps according to claim 1, wherein a distance between the apexes of the pair of substrate protrusions sandwiching the conductive paste in the substrate sheet is smaller than the through hole of the screen plate. Method.   The base material positioning process of positioning the said base material with respect to the said printing surface plate so that an electrically conductive paste may be mounted between the said board | substrate convex parts, The further characterized by the above-mentioned. A method for producing a substrate sheet with conductive bumps.   The base material positioning step includes a base material image acquisition step of acquiring an image of a base material held on the printing surface plate by an image acquisition device, and a base for displaying an image acquired by the image acquisition device by an image display device. The material image display step and a substrate position adjustment step of adjusting a position of the substrate with respect to the printing surface plate based on an image displayed by the image display device. A method for producing a substrate sheet with conductive bumps.   The method for manufacturing a substrate sheet with conductive bumps according to claim 1, wherein the screen plate is used when forming the flat plate protrusions of the flat plate member. A prepared body holding step for holding a flat plate-shaped member prepared body by the printing surface plate,
A second positioning step of positioning a screen plate having a plurality of through holes on the flat plate-shaped member preparation;
A preparation body transfer step of transferring a conductive paste from the through hole of the screen plate to a flat member preparation body,
The conductive bump according to claim 5, wherein a position of the conductive paste transferred to the flat member preparation corresponds to a position surrounding the position of the conductive paste transferred in the base material transfer step. A method for manufacturing a substrate sheet with a substrate.

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