JP2014192428A - Printed wiring board manufacturing method, substrate combination body and printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide: such a printed wiring board manufacturing method that a kind of paste to be prepared can be reduced in comparison with the case where a structure supporting bump is formed from an insulative material and further, a conductor plate forming a printed wiring board is prevented from being damaged by a distal end of the structure supporting bump; a substrate combination body; and a printed wiring board.SOLUTION: A structure supporting bump 13 which is formed from the same material as a conductor bump 12 and shaped not to penetrate a non-cured insulative material substrate 14 is formed in any other location than a location where the conductor bump 12 is disposed, on a first conductor plate 10. Thereafter, the non-cured insulative material substrate 14 is disposed at a side where the conductor bump 12 and the structure supporting bump 13 are formed, on the first conductor plate 10 in such a manner that the conductor bump 12 penetrates the non-cured insulative material substrate 14 and that the structure supporting bump 13 does not penetrate the non-cured insulative material substrate 14.

Description

  The present invention relates to a method for manufacturing a printed wiring board, a board combination as a material in the manufacturing process of the printed wiring board, and a printed wiring board.

  Conventionally, a plurality of substantially conical conductor bumps are formed on the surface of a conductor plate such as a flat copper foil, and such conductor plates with conductor bumps and insulating material substrates such as prepregs are alternately stacked. It is known to manufacture a printed wiring board which is a multilayer board. In such a printed wiring board, when the substantially conical conductor bump formed on the surface of the conductor plate with the conductor bumps penetrates the insulating material substrate, the conductor plates on both sides of the insulating material substrate are connected by the conductor bump. It is designed to be electrically connected. As a method for manufacturing such a printed wiring board, for example, one disclosed in Patent Document 1 is known.

  In the method for manufacturing a printed wiring board disclosed in Patent Document 1, a plurality of substantially conical conductor bumps are formed on a conductor plate, an uncured insulating material substrate is disposed on these conductor bumps, and then insulation is performed. The conductor plate and the insulating material substrate are pressurized at a temperature at which the material substrate does not harden so that the substantially conical conductor bumps penetrate the insulating material substrate. Thereafter, the conductive plate is patterned by etching or the like to form a predetermined wiring pattern to form a substrate unit, and a plurality of substrate units having uncured insulating material substrates are stacked to form a multilayer plate precursor. . And a printed wiring board is manufactured by heating such a multilayer board precursor under pressure, and hardening an insulating material board | substrate.

  However, in such a printed wiring board manufacturing method, since the board unit is pressed under a situation where there are a large number of insulating material boards that have not yet been cured (which constitute a multilayer), When the multilayer board precursor is formed by pressing, a part of the insulating material substrate (particularly, the portion where the conductor bumps are not disposed) escapes due to the applied pressing force and shifts in the horizontal and vertical directions. Sometimes. As a result, defects such as poor conduction and short circuit may occur in the completed printed wiring board.

  In order to solve such a problem, in Patent Document 2, a plurality of conductor plates are laminated by forming a structure support bump in a portion where a conductor bump is not disposed in an uncured insulating material substrate. A technique is disclosed that prevents a portion of an insulating material substrate that has not yet been cured (particularly, a portion where conductor bumps are not disposed) from being rubbed in the horizontal direction and the vertical direction during pressing. Yes.

  A conventional method for manufacturing a printed wiring board disclosed in Patent Document 2 will be described in more detail with reference to FIGS. 15 (a) to 15 (e) are explanatory views sequentially showing the manufacturing process of the two-layer board in the conventional printed wiring board manufacturing method, and FIG. 16 is a conventional print following the state shown in FIG. It is explanatory drawing which shows the manufacturing process of the multilayer substrate in order in a wiring board manufacturing method. FIG. 17 is a diagram showing a method of forming structure supporting bumps on the first conductor plate in the conventional printed wiring board manufacturing method.

  As described above, FIG. 15A to FIG. 15E are explanatory views sequentially showing the manufacturing process of the two-layer substrates 6 and 7 in the conventional printed wiring board manufacturing method. Here, in manufacturing the two-layer substrate 6 shown in FIG. 15A, first, a plurality of substantially conical conductor bumps 62 are formed on the first conductor plate 60, and uncured on these conductor bumps 62. After the insulating material substrate is disposed, the first conductor plate 60 and the insulating material substrate are pressurized at a temperature at which the insulating material substrate is not cured, so that the substantially conical conductor bumps 62 penetrate the insulating material substrate. Thereafter, the second conductor plate 61 is disposed on the conductor bump 62, and a pressing force is applied between the first conductor plate 60 and the second conductor plate 61 by an arrangement pressing portion provided with a heater therein. As a result, the insulating material substrate is cured by the heat provided by the heater. In FIG. 15A, the insulating material substrate after curing is indicated by reference numeral 64. Thereafter, as shown in FIG. 15A, a screen plate 72 made of a metal mask plate or the like is disposed above the second conductor plate 61 of the two-layer substrate 6, and placed on the screen plate 72 by a squeegee (not shown). The conductive paste 70 thus transferred is transferred onto the second conductor plate 61 through a through hole (not shown) provided in the screen plate 72. Thereafter, the conductive paste 70 applied on the second conductor plate 61 of the double-layer substrate 6 is dried, whereby a plurality of substantially conical conductors are formed on the second conductor plate 61 as shown in FIG. A bump 62 is formed.

  Further, as shown in FIG. 15 (c), a substantially conical structure support having the same shape as the conductor bump 62 is provided on the portion of the second layer board 6 where the conductor bump 62 is not disposed on the second conductor plate 61. A bump 67 is formed. A method of forming such a structure supporting bump 67 will be described with reference to FIG. As shown in FIG. 17, a paste 90 made of an insulating material is supplied onto the second conductor plate 61 by a dispenser 90 disposed above the second conductor plate 61, and then applied onto the second conductor plate 61. The obtained insulating material paste is dried. As a result, as shown in FIG. 15C, the structure supporting bump 67 made of an insulating material is formed on the second conductor plate 61.

  Thereafter, as shown in FIG. 15 (d), an uncured insulating material substrate 63 is disposed on the second conductor plate 61 of the two-layer substrate 6, and then this uncured material is pressed from above by the insulating material substrate pressing portion 65. By pressing the insulating material substrate 63, the uncured insulating material substrate 63 is positioned on the second conductor plate 61 as shown in FIG. At this time, the conductor bumps 62 and the structure support bumps 67 respectively penetrate the uncured insulating material substrate 63. In this way, the two-layer substrate 7 is formed in which the uncured insulating material substrate 63 is arranged at a place other than the place where the conductor bump 62 and the structure supporting bump 67 are arranged on the second conductor plate 61. .

  Next, as shown in FIG. 16A, after the plurality of two-layer substrates 7 are overlaid, each of the two-layer substrates 7 is pressed from above by the placement pressing portion 80 in which the heater 82 is provided. . At this time, heat is applied to the uncured insulating material substrate 63 in each of the two-layer substrates 7 by the heater 82, whereby the uncured insulating material substrate 63 is cured. In this way, the cured insulating material substrate 64 is sandwiched between the first conductor plate 60 and the second conductor plate 61 as shown in FIG. A printed wiring board 8 composed of a multilayer board is formed, in which the first conductor plate 60 and the second conductor plate 61 sandwiching the material substrate 64 are made conductive.

  According to the conventional method for manufacturing a printed wiring board as shown in FIGS. 15 to 17, when each of the two-layer boards 7 is pressed by the placement pressing portion 80, as shown in FIG. Since the structure support bumps 67 are arranged in the insulating material substrate 63, the structure support bumps 67 allow the second conductor plate 61 of the two-layer substrate 7 and the other two layers above the two-layer substrate 7 to be used. The space between the layer substrate 7 and the first conductor plate 60 can be supported. For this reason, when pressing the plurality of stacked two-layer substrates 7, a part of the uncured insulating material substrate 63 (particularly, a portion where the conductor bumps 62 are not arranged) is applied by the arrangement pressing unit 80. It is possible to prevent escape by the pressing force and displacement in the horizontal and vertical directions.

JP 2007-13208 A JP 2010-80543 A

  However, in the conventional method for manufacturing a printed wiring board as shown in FIGS. 15 to 17, when the structure supporting bump 67 is formed on the second conductor plate 61, the dispenser 90 causes the second conductor plate 61 to be formed on the second conductor plate 61. Since the paste made of the insulating material is supplied and then the insulating material paste applied on the second conductor plate 61 is dried, it is necessary to add a manufacturing process using the dispenser 90. There is a problem that the productivity of the substrate 8 is lowered. Further, in forming such a structure supporting bump 67, there is a problem that a paste of an insulating material must be prepared separately from the conductive paste 70 for forming the conductor bump 62. Further, since the structure support bump 67 penetrates the uncured insulating material substrate 63, the first conductor plate is pushed by the tip of the structure support bump 67 when the two-layer substrate 7 is pressed by the placement pressing portion 80. 60 may be damaged.

  The present invention has been made in consideration of such points, and can reduce the types of paste that must be prepared as compared with the case of forming the structure support bumps from an insulating material, It is an object of the present invention to provide a printed wiring board manufacturing method, a board combination, and a printed wiring board that do not damage a conductor plate that constitutes the printed wiring board by the tips of the structure supporting bumps.

  The printed wiring board manufacturing method of the present invention comprises a step of forming a conductor bump made of a conductive material and having a shape penetrating an uncured insulating material substrate on a conductor plate, and the same material as the conductor bump. Forming a structural support bump having a shape that does not penetrate the cured insulating material substrate at a location other than the location where the conductive bump is disposed on the conductive plate; and the conductive bump is the uncured insulating material. The uncured insulating material substrate on the side of the conductor plate on which the conductor bump and the structure supporting bump are formed so that the structure supporting bump does not penetrate the uncured insulating material substrate while penetrating the substrate. And a step of arranging.

  According to such a printed wiring board manufacturing method, the conductor bumps and the structure support bumps are formed from the same conductive material, and therefore must be prepared as compared with the case where the structure support bumps are formed from an insulating material. The type of paste that must be reduced can be reduced. In addition, since the structure support bumps do not penetrate the uncured insulating material substrate, the conductor plate constituting the printed wiring board is formed by the tips of the structure support bumps when pressing the combination of the substrates by the placement pressing portion. It won't hurt.

  In the printed wiring board manufacturing method of the present invention, the conductive bumps and the structure supporting bumps may be formed on the conductive plate by screen printing using a plurality of types of screen plates.

  According to such a printed wiring board manufacturing method, since the structural support bumps can also be formed by screen printing, the printed wiring board manufacturing process is compared with the case of forming the structural supporting bumps using a dispenser. The number can be reduced.

  In the printed wiring board manufacturing method of the present invention, the plurality of types of screen plates are first screen plates provided with through holes at positions corresponding to positions where the conductor bumps are to be formed on the conductor plate, and A second screen plate provided with a through hole at a position corresponding to a position on the conductor plate where the structure supporting bump is to be formed may be included.

  At this time, the second screen plate may be thinner than the first screen plate.

  The through hole of the second screen plate may have a larger cross-sectional area than the through hole of the first screen plate.

  Alternatively, the plurality of types of screen plates are a third screen plate in which through holes are provided at positions corresponding to positions where the conductor bumps and the structure support bumps are to be formed on the conductor plate, and A fourth screen plate may be included in which a through hole is provided at a position corresponding to a position where the conductive bump is to be formed on the conductive plate.

  At this time, the third screen plate may be thinner than the fourth screen plate.

  Further, the through hole of the third screen plate may have a larger cross-sectional area than the through hole of the fourth screen plate.

  The board combination of the present invention is a board combination that is a material in a manufacturing process of a printed wiring board, and includes a conductor plate, a conductor bump made of a conductive material formed on the conductor plate, and the conductor plate. The structure support bump formed of the same material as the conductor bump, the conductor bump on the conductor plate, and the structure support bump are formed at a place other than the place where the conductor bump is disposed. An uncured insulating material substrate provided on the side, wherein the conductor bump penetrates the uncured insulating material substrate and the structure supporting bump does not penetrate the uncured insulating material substrate. And an uncured insulating material substrate.

  According to such a substrate combination, since the conductor bump and the structure supporting bump are formed from the same conductive material, the structure supporting bump must be prepared as compared with the case where the structure supporting bump is formed from an insulating material. The type of paste can be reduced. In addition, since the structure support bumps do not penetrate the uncured insulating material substrate, the conductor plate constituting the printed circuit board is formed by the tips of the structure support bumps when pressing the substrate combination by the placement pressing portion. It won't hurt.

  The printed wiring board of the present invention includes a plurality of layers of conductive plates provided so that the cured insulating material substrate is sandwiched therebetween, and both sides of the cured insulating material substrate passing through the cured insulating material substrate The conductive bumps for electrically connecting the conductive plates, and the conductive bumps on the conductive plate are formed at locations other than the locations where the conductive bumps are disposed, and are made of the same material as the conductive bumps. And a structural support bump provided so as not to penetrate the insulating material substrate.

  According to such a printed wiring board, since the structure support bumps do not penetrate through the cured insulating material substrate, the printed circuit board is printed by the tip of the structure support bump when pressing the combination of the substrates by the placement pressing portion. The conductor plate constituting the wiring board is not damaged.

  According to the printed wiring board manufacturing method, the board combination, and the printed wiring board of the present invention, it is possible to reduce the types of paste that must be prepared as compared with the case of forming the structure support bumps from an insulating material, In addition, the conductive plate constituting the printed wiring board is not damaged by the tips of the structure supporting bumps.

(A)-(d) is explanatory drawing which shows in order the manufacturing process of the core board | substrate in the printed wiring board manufacturing method by embodiment of this invention. (A)-(c) is explanatory drawing which shows the manufacturing process of the additional board | substrate in the printed wiring board manufacturing method by embodiment of this invention in order. (A)-(b) is explanatory drawing which shows the manufacturing process of the multilayer board | substrate in the printed wiring board manufacturing method by embodiment of this invention in order. It is a side view which shows the flow of operation | movement which forms a conductor bump in the 1st conductor board. FIG. 5 is a side view showing a flow of an operation of forming a conductor bump on the first conductor plate following the state shown in FIG. 4. FIG. 6 is a side view showing a flow of an operation of forming a conductor bump on the first conductor plate following the state shown in FIG. 5. FIG. 7 is a side view showing a flow of an operation of forming a conductor bump on the first conductor plate following the state shown in FIG. 6. FIG. 8 is a side view showing a flow of an operation of forming a conductor bump on the first conductor plate following the state shown in FIG. 7. FIG. 9 is a side view showing a flow of an operation of forming a conductor bump on the first conductor plate following the state shown in FIG. 8. FIG. 7 is a partially enlarged side view of FIG. 6. It is a side view which shows the structure of the 1st conductor board with a conductor bump. (A)-(d) is a figure which shows the process in which a conductor bump is formed in a 1st conductor board, Comprising: (a) shows the shape of the conductor bump after the 1st screen printing process and a drying process, (B) shows the shape of the conductor bump after the second screen printing step and drying step, (c) shows the shape of the conductor bump after the third screen printing step and drying step, and (d) shows the fourth time. The shape of the conductor bump after the screen printing process and the drying process is shown. (A)-(c) is a side view for demonstrating the structure of the several types of screen plate used when manufacturing the additional board | substrate shown in FIG. (A)-(c) is a side view for demonstrating the other structure of the several kind of screen plate used when manufacturing the additional board | substrate shown in FIG. (A)-(e) is explanatory drawing which shows the manufacturing process of the two-layer board | substrate in order in the conventional printed wiring board manufacturing method. It is explanatory drawing which shows the manufacturing process of the multilayer board in order in the conventional printed wiring board manufacturing method following the state shown in FIG. It is a figure which shows the method of forming the bump for structure support in the 1st conductor board in the conventional printed wiring board manufacturing method.

  Embodiments of the present invention will be described below with reference to the drawings. 1 to 14 are views showing a printed wiring board manufacturing method according to the present embodiment. Among these, FIG. 1A to FIG. 1D are explanatory views sequentially showing the manufacturing process of the core substrate in the printed wiring board manufacturing method according to the present embodiment, and FIG. 2A to FIG. () Is explanatory drawing which shows the manufacturing process of the additional board | substrate in order in the printed wiring board manufacturing method by this Embodiment. FIG. 3A to FIG. 3B are explanatory views sequentially showing the manufacturing process of the multilayer board in the printed wiring board manufacturing method according to the present embodiment. 4 to 10 are side views showing a flow of operations for forming the conductor bumps on the first conductor plate. FIG. 11 is a side view showing the configuration of the first conductor plate with conductor bumps. FIGS. 12A to 12D are views showing a process in which conductor bumps are formed on the first conductor plate. FIG. 13 and FIG. 14 are side views for explaining various configurations of a plurality of types of screen plates used when manufacturing the additional substrate shown in FIG.

  In describing the printed wiring board manufacturing method according to the present embodiment, first, a method of manufacturing the core substrate 1 as shown in FIG. In manufacturing the core substrate 1, first, a first conductor plate 10 with conductor bumps 12 as shown in FIG. A method for manufacturing the first conductor plate 10 with the conductor bumps 12 will be described below with reference to FIGS.

  As shown in FIG. 4 to FIG. 9, the manufacturing apparatus for the conductor plate with conductor bumps used in the present embodiment has a printing constant for holding the first conductor plate 10 by suction force from a suction hole (not shown). A plate 30, a screen plate 40 such as a metal mask plate provided with a plurality of through holes (plate holes) 40 a having a predetermined pattern, and a holding member 34 for holding the screen plate 40 are provided. Here, each through hole 40 a is provided in the screen plate 40 so as to correspond to a position where the conductor bump 12 is to be formed on the first conductor plate 10.

  The conductive bump manufacturing apparatus used in the present embodiment is scanned on the screen plate 40, and a conductive paste 38 such as silver paste or solder paste placed on the screen plate 40 is used. A squeegee 36 for transferring the first squeegee plate 10 through the through hole 40a of the screen plate 40 and a squeegee driving unit 37 for moving the squeegee 36 are provided. The squeegee 36 is made of, for example, urethane resin, and the hardness of the squeegee rubber is, for example, 70 to 90 degrees. The squeegee driving unit 37 is provided with a support member 33 that supports the squeegee 36, and a guide member 31 that guides the support member 33 to move in the horizontal direction (left-right direction in FIG. 4 and the like). 33 is configured such that the squeegee 36 can be advanced downward or retracted upward in FIG. By such a squeegee driving unit 37, the squeegee 36 moves in the left-right direction in FIG. 4 and the like along the guide member 31, and moves forward and backward toward the screen plate 40 (up-down direction movement in FIG. 4 and the like). It has become.

  Further, the manufacturing apparatus of the conductor plate with conductor bumps is provided with an imaging unit 39 such as a CCD camera that images the surface of the first conductor plate 10 on the printing surface plate 30. Further, a guide member 30a is disposed below the printing surface plate 30, and the printing surface plate 30 is movable in the horizontal direction (left and right direction in FIG. 4 and the like) along the guide member 30a.

  Next, a series of operations for forming the conductor bumps 12 on the first conductor plate 10 will be specifically described. First, as shown in FIG. 4, the first conductor plate 10 is placed on the printing surface plate 30, and the first conductor plate 10 is placed on the printing surface plate 30 by a suction force from a suction hole (not shown). Hold. At this time, an alignment mark is formed in advance on the first conductor plate 10 so that the alignment mark is imaged by the imaging unit 39, and the printing surface plate 30 is based on the alignment mark in the captured image. By finely adjusting the position, it is possible to easily align the position where the conductor bump 12 is to be formed on the first conductor plate 10 and the position of the through hole 40a of the screen plate 40 in a subsequent process. .

  Then, as shown in FIG. 5, the printing surface plate 30 is moved in the horizontal direction (rightward in FIG. 5) along the guide member 30 a, and the printing surface plate 30 is positioned below the screen plate 40. At this time, the through holes 40a of the screen plate 40 are made to face the positions where the conductor bumps 12 in the first conductor plate 10 are to be formed.

  Then, as shown in FIG. 6, the squeegee 36 advances downward from the support member 33, and the squeegee 36 pushes the screen plate 40 downward so that the screen plate 40 is on the surface of the first conductor plate 10 on the printing surface plate 30. Abut. 6 and 7, the squeegee 36 is moved in the horizontal direction (left direction in FIG. 6) by moving the support member 33 along the guide member 31 in the horizontal direction (left direction in FIG. 6). At this time, the squeegee 36 continues to push the screen plate 40 downward. At this time, the conductive paste 38 passes through the through hole 40 a of the screen plate 40 and adheres to the surface of the first conductor plate 10.

  Here, the principle of applying the conductive paste 38 to the first conductor plate 10 by the squeegee 36 will be described in more detail. As shown in FIG. 10, the conductive paste 38 moves the surface of the screen plate 40 by the squeegee 36. However, the conductive paste 38 enters the through hole 40a at the portion where the through hole 40a is formed in the screen plate 40. Then, when the squeegee 36 presses the screen plate 40 toward the first conductor plate 10, a part of the conductive paste 38 that has entered the through hole 40 a adheres to the surface of the first conductor plate 10.

  When the application of the conductive paste 38 to the first conductor plate 10 by the squeegee 36 is completed as shown in FIG. 7, the squeegee 36 is retracted upward so as to be separated from the screen plate 40 as shown in FIG. The plate 40 is isolated from the first conductor plate 10. Then, as shown in FIG. 9, the printing surface plate 30 is moved in the horizontal direction (leftward in FIG. 9) along the guide member 30 a, and the printing surface plate 30 is retracted from the position below the screen plate 40. Then, the first conductor plate 10 with the conductive paste 38 is taken out from the printing surface plate 30.

  Thereafter, the first conductor plate 10 with the conductive paste 38 is dried. As a result, the conductive paste 38 attached to the surface of the first conductor plate 10 is thermally cured to form a substantially conical conductor bump 12 (see FIG. 11).

  Here, the conductor bumps 12 formed on the first conductor plate 10 penetrate the uncured insulating material substrate (prepreg) 14 in the thickness direction of the first conductor plate 10 (vertical direction in FIG. 11). Sufficient height is required. Specifically, since the thickness of the uncured insulating material substrate 14 is 60 to 80 μm, for example, the height of the conductor bumps 12 needs to be 185 ± 45 μm, for example. However, when forming the conductor bumps 12 on the first conductor plate 10, the amount of the conductive paste 38 adhering to the first conductor plate 10 per screen printing process depends on the size of the through hole 40a of the screen plate 40. Since the amount of the conductive paste 38 transferred to the first conductor plate 10 is not sufficient, the height of the conductor bump 12 penetrates the uncured insulating material substrate 14 in one screen printing process. In many cases, the height is not reached. For this reason, the height of the conductor bump 12 formed on the first conductor plate 10 is increased by repeating the screen printing process as shown in FIGS. 4 to 9 a plurality of times, specifically, for example, four times. doing. Here, FIG. 12A shows the shape of the conductor bump 12 after the first screen printing step and the drying step, and FIG. 12B shows the shape of the conductor bump 12 after the second screen printing step and the drying step. Is shown. FIG. 12C shows the shape of the conductor bump 12 after the third screen printing step and the drying step, and FIG. 12D shows the shape of the conductor bump 12 after the fourth screen printing step and the drying step. Show. Thus, by repeatedly performing the screen printing process a plurality of times, specifically, for example, four times, the conductor bumps 12 having a height sufficient to penetrate the uncured insulating material substrate 14 can be obtained. .

  After forming a plurality of substantially conical conductor bumps 12 on the first conductor plate 10 as shown in FIG. 1A by the manufacturing method as described above, the conductor bumps 12 are made of epoxy resin or the like. An uncured insulating material substrate 14 is disposed, and the first conductor plate 10 and the uncured insulating material substrate 14 are pressurized at a temperature at which the uncured insulating material substrate 14 is not cured, thereby FIG. As shown, the substantially conical conductor bumps 12 penetrate the uncured insulating material substrate 14. Thereafter, the second conductor plate 11 is disposed on the conductor bump 12, and a pressing force is applied between the first conductor plate 10 and the second conductor plate 11 by an arrangement pressing portion provided with a heater inside. As a result, the uncured insulating material substrate 14 is cured by the heat applied by the heater, and the cured insulating material substrate 15 is bonded to the first conductor plate 10 and the second conductor plate 11 as shown in FIG. Will be formed between. Thereafter, the first conductor plate 10 and the second conductor plate 11 are respectively patterned by etching or the like to form a predetermined wiring pattern, thereby forming the core substrate 1 as shown in FIG.

  Next, a method for manufacturing the additional substrate 2 as shown in FIG. When manufacturing the additional board | substrate 2, the 1st conductor board 10 with the conductor bump 12 as shown to Fig.2 (a) is prepared first. Since the manufacturing method of the first conductor plate 10 with the conductor bumps 12 is the same as the manufacturing method of the first conductor plate 10 with the conductor bumps 12 when the core substrate 1 is manufactured, the description thereof is omitted. . In the additional substrate 2, there is a portion where the conductor bump 12 is not disposed on the first conductor plate 10. In the printed wiring board manufacturing method of the present embodiment, the shape of the conductor bump 12 as shown in FIG. 2B is formed on the portion of the first conductor plate 10 where the conductor bump 12 is not disposed. Different structural support bumps 13 are formed. Here, the material of the structure support bump 13 is the same conductive material as that of the conductor bump 12. More specifically, the structure supporting bumps 13 are formed on the first conductor plate 10 by screen printing. When the structure supporting bumps 13 are formed on the first conductor plate 10 in this screen printing step, the structure supporting bumps 13 are formed. The conductive paste used in the above is the same as the conductive paste 38 used when the conductor bumps 12 are formed on the first conductor plate 10.

  A method of forming such a structural support bump 13 will be described with reference to FIGS. FIG. 13 and FIG. 14 are side views for explaining various configurations of a plurality of types of screen plates used when manufacturing the additional substrate 2 shown in FIG.

  When forming the structure support bumps 13 having a shape different from that of the conductor bumps 12 in the portions where the conductor bumps 12 are not disposed on the first conductor plate 10, the through holes 40a as shown in FIGS. A method similar to the screen printing step of transferring the conductive paste 38 from the screen plate 40 to the first conductor plate 10 via the screen plate is used, but at this time, a plurality of types of screen plates are used. Specifically, for example, as shown in FIG. 13A, a through hole 42a is provided at a position corresponding to a position (see FIG. 13C) where the conductor bump 12 is to be formed on the first conductor plate 10. The first screen plate 42 and the position corresponding to the position (see FIG. 13C) where the structure supporting bump 13 is to be formed on the first conductor plate 10 as shown in FIG. 13B. By using two types of screen plates called the second screen plate 44 provided with the through holes 44a, the conductor bumps 12 and the structure supporting bumps 13 are formed on the first conductor plate 10, respectively. More specifically, after the screen printing process as shown in FIGS. 4 to 9 is performed four times using the first screen plate 42 as shown in FIG. 13 (a), it is shown in FIG. 13 (b). Using the second screen plate 44, the screen bumps as shown in FIGS. 4 to 9 are performed once to form the conductor bumps 12 and the structure support bumps 13 on the first conductor plate 10, respectively. . At this time, since the screen printing process using the second screen plate 44 as shown in FIG. 13B is performed only once in forming the structure supporting bumps 13, the structure supporting bumps 13 are the conductor bumps 12. Its height is low compared to, and the tip is not sharp. For this reason, after forming the conductor bump 12 and the structure support bump 13 on the first conductor plate 10, respectively, an uncured insulating material substrate 14 is disposed on the conductor bump 12 and the structure support bump 13, When the first conductor plate 10 and the uncured insulating material substrate 14 are pressed at a temperature at which the uncured insulating material substrate 14 is not cured, as shown in FIG. Passes through the uncured insulating material substrate 14, but the structural support bump 13 whose tip is not sharp does not penetrate the uncured insulating material substrate 14, and the uncured insulation is formed on the structural support bump 13. The material substrate 14 is placed. In this way, the additional substrate 2 is formed in which the conductor bumps 12 penetrate the uncured insulating material substrate 14 but the structure supporting bumps 13 do not penetrate the uncured insulating material substrate 14.

  When the first screen plate 42 and the second screen plate 44 as shown in FIG. 13 are combined, the number of screen printing steps is one as compared with the case where only the conductor bumps 12 are formed on the first conductor plate 10. By simply increasing the number of turns, the conductor bumps 12 and the structure supporting bumps 13 can be formed on the first conductor plate 10, respectively.

  In the present embodiment, the second screen plate 44 may be thinner than the first screen plate 42. In this case, the ratio of the depth to the size of the cross-sectional area in the through hole 44a of the second screen plate 44 is the depth of the cross-sectional area in the through hole 42a of the first screen plate 42. Smaller than the proportion. For this reason, the shape of the conductive paste transferred onto the first conductor plate 10 when the structure support bumps 13 are formed becomes flatter. In comparison, its height is lower and the tip is less sharp.

  Further, the diameter of the through hole 44 a of the second screen plate 44 may be larger than the diameter of the through hole 42 a of the first screen plate 42. In this case, the through hole 44a of the second screen plate 44 has a larger cross-sectional area than the through hole 42a of the first screen plate 42. The ratio of the depth to the size of the area is smaller than the ratio of the depth to the size of the cross-sectional area in the through hole 42a of the first screen plate 42. For this reason, the shape of the conductive paste transferred onto the first conductor plate 10 when the structure support bumps 13 are formed becomes flatter. In comparison, its height is lower and the tip is less sharp.

  A plurality of types of screen plates used when forming the structural support bumps 13 on the first conductor plate 10 are the first screen plate 42 and the second screen as shown in FIGS. The combination of the plates 44 is not limited. As other combinations of a plurality of types of screen plates, positions where the conductor bumps 12 and the structure supporting bumps 13 are to be formed on the first conductor plate 10 as shown in FIG. 14A (FIG. 14C). And a position where the conductor bumps 12 on the first conductor plate 10 are to be formed as shown in FIG. 14B (FIG. 14). By using two types of screen plates called the fourth screen plate 48 provided with through holes 48a at positions corresponding to (c)), the conductor bumps 12 and the structure support bumps 13 are formed on the first conductor plate 10. Each may be formed. More specifically, after the screen printing process as shown in FIGS. 4 to 9 is performed once using the third screen plate 46 as shown in FIG. 14A, it is shown in FIG. 14B. Using the fourth screen plate 48 as described above, the screen printing process as shown in FIGS. 4 to 9 is performed three times to form the conductor bumps 12 and the structure support bumps 13 on the first conductor plate 10 respectively. . At this time, since the screen printing process using the third screen plate 46 as shown in FIG. 14A is performed only once in forming the structure supporting bumps 13, the structure supporting bumps 13 are the conductor bumps 12. Its height is low compared to, and the tip is not sharp.

  When the third screen plate 46 and the fourth screen plate 48 as shown in FIG. 14 are combined, the number of screen printing steps is increased as compared with the case where only the conductor bumps 12 are formed on the first conductor plate 10. Thus, the conductor bumps 12 and the structure supporting bumps 13 can be formed on the first conductor plate 10, respectively.

  In the present embodiment, the third screen plate 46 may be thinner than the fourth screen plate 48. In this case, the ratio of the depth to the size of the cross-sectional area in the through hole 46a of the third screen plate 46 is the depth of the cross-sectional area in the through hole 48a of the fourth screen plate 48. Smaller than the proportion. For this reason, the shape of the conductive paste transferred onto the first conductor plate 10 when the structure support bumps 13 are formed becomes flatter. In comparison, its height is lower and the tip is less sharp.

  Further, the diameter of the through hole 46 a of the third screen plate 46 may be larger than the diameter of the through hole 48 a of the fourth screen plate 48. In this case, the through hole 46a of the third screen plate 46 has a larger cross-sectional area than the through hole 48a of the fourth screen plate 48. The ratio of the depth to the size of the area is smaller than the ratio of the depth to the size of the cross-sectional area in the through hole 48a of the fourth screen plate 48. For this reason, the shape of the conductive paste transferred onto the first conductor plate 10 when the structure support bumps 13 are formed becomes flatter. In comparison, its height is lower and the tip is less sharp.

  Thereafter, as shown in FIG. 3A, the core substrate 1 manufactured by the manufacturing process as shown in FIG. 1 is sandwiched between the two additional substrates 2 from above and below. And the combination body of these core board | substrates 1 and two additional board | substrates 2 is pressed from upper direction by the arrangement | positioning press part (not shown) in which the heater was provided. At this time, heat is applied to the uncured insulating material substrate 14 of each additional substrate 2 by the heater, whereby the uncured insulating material substrate 14 is cured. In this way, as shown in FIG. 3 (b), insulation after curing is provided between the first conductor plate 10 and the second conductor plate 11 of the core substrate 1 and the first conductor plate 10 of each additional substrate 2. A printed wiring board 3 made of a multilayer board is formed in which the material substrate 15 is sandwiched and the first conductor plate 10 and the second conductor plate 11 sandwiching the cured insulating material substrate 15 are made conductive by the conductor bumps 12. Here, when pressing the combination of the core substrate 1 and the two additional substrates 2 by the arrangement pressing portion, as shown in FIG. 3A, a structure is formed in the uncured insulating material substrate 14 in each additional substrate 2. Since the support bumps 13 are arranged, the structure support bumps 13 provide a space between the first conductor plate 10 or the second conductor plate 11 of the core substrate 1 and the first conductor plate 10 of each double-layer substrate 2. Can be supported. For this reason, when pressing the combination of the core substrate 1 and the two additional substrates 2, a part of the uncured insulating material substrate 14 (particularly, the portion where the conductor bumps 12 are not disposed) It is possible to prevent escape due to the applied pressing force and displacement in the horizontal and vertical directions.

  As described above, according to the printed wiring board manufacturing method of the present embodiment, the uncured insulating material substrate 14 made of the same material as the conductor bump 12 is formed as shown in FIGS. A structure supporting bump 13 having a shape that does not penetrate is formed at a location on the first conductor plate 10 other than the location where the conductor bump 12 is disposed, and then the conductor bump 12 penetrates the uncured insulating material substrate 14. At the same time, an uncured insulating material substrate 14 is provided on the first conductor plate 10 on the side where the conductor bumps 12 and the structure supporting bumps 13 are formed so that the structure supporting bumps 13 do not penetrate the uncured insulating material substrate 14. It is arranged. Thus, since the conductor bumps 12 and the structure support bumps 13 are formed from the same conductive material, the types of paste that must be prepared compared to the case where the structure support bumps are formed from an insulating material are used. Can be reduced. Further, since the structural support bumps 13 do not penetrate the uncured insulating material substrate 14, when the combination of the core substrate 1 and the two additional substrates 2 is pressed by the placement pressing portion, the structural support bumps 13 The first conductor plate 10 such as the core substrate 1 is not damaged by the tip.

  In the printed wiring board manufacturing method of the present embodiment, as described above, the conductor bumps 12 and the structure supporting bumps 13 are screen-printed on the first conductor plate 10 using a plurality of types of screen plates. Forming. In this case, since the structure support bumps 13 can also be formed by screen printing, the number of printed wiring board manufacturing steps can be reduced as compared with the case of forming the structure support bumps using a dispenser.

  Moreover, the board | substrate combination body (addition board | substrate 2) used as the material in the manufacturing process of the printed wiring board 3 by this Embodiment is the 1st conductor board 10 and the 1st conductor board 10 as shown in FIG.2 (c). For structural support made of the same material as the conductor bumps 12 formed on the conductive bumps 12 made of a conductive material and on the first conductor plate 10 other than where the conductor bumps 12 are disposed. A bump 13 and an uncured insulating material substrate 14 provided on the side on which the conductor bump 12 and the structure supporting bump 13 are formed on the first conductor plate 10 are provided. The structure supporting bump 13 does not penetrate the uncured insulating material substrate 14 while penetrating the material substrate 14. When the printed wiring board 3 is manufactured using such a board combination (additional board 2), the conductor bump 12 and the structure support bump 13 are formed of the same conductive material. The number of types of paste that must be prepared can be reduced as compared with the case of forming an insulating material. Further, since the structural support bumps 13 do not penetrate the uncured insulating material substrate 14, when the substrate combination body (additional substrate 2) is pressed by the placement pressing portion, the core is formed by the tips of the structural support bumps 13. The first conductor plate 10 such as the substrate 1 is not damaged.

  Further, the printed wiring board 3 according to the present embodiment includes a plurality of layers of the first conductor plate 10 and the second conductor plate 11 provided so that the cured insulating material substrate 15 is sandwiched therebetween, and the cured insulating material. Conductive bumps 12 that pass through the substrate 15 and electrically connect the first conductive plate 10 and the second conductive plate 11 on both sides of the insulating material substrate 15 and the conductive bumps 12 on the first conductive plate 10 are disposed. The structure supporting bump 13 is formed at a place other than the place where the conductive bump 12 is formed, and is made of the same material as the conductor bump 12 and is provided so as not to penetrate the cured insulating material substrate 15. According to such a printed wiring board 3, the structure supporting bumps 13 do not penetrate the cured insulating material substrate 15, so that the first conductor plate 10 such as the core substrate 1 is held by the tips of the structure supporting bumps 13. It won't hurt.

  In addition, the printed wiring board manufacturing method, board | substrate combination body (addition board 2), and printed wiring board 3 by this Embodiment are not limited to the above aspects, A various change can be added.

  For example, in manufacturing a substrate combination (additional substrate 2) or printed wiring board 3 including the structure supporting bumps 13 as shown in FIG. 3B, a dispenser having the same configuration as the dispenser 90 as shown in FIG. The structure support bumps 13 may be formed by attaching a conductive paste on the first conductor plate 10 using the substrate and drying the conductive paste. Even in the board combination (addition board 2) and the printed wiring board 3 formed by such a manufacturing method, the structure supporting bumps 13 made of the same material as the conductor bumps 12 do not penetrate the cured insulating material board 15. Thus, the first conductor plate 10 such as the core substrate 1 is not damaged by the tips of the structure supporting bumps 13.

  A plurality of types of screen plates used in the printed wiring board manufacturing method according to the present embodiment is a combination of the first screen plate 42 and the second screen plate 44 as shown in FIG. 13, or shown in FIG. The third screen plate 46 and the fourth screen plate 48 are not limited to the combination. The conductor bumps 12 and the structure support bumps 13 may be formed on the first conductor plate 10 by combining a plurality of types of screen plates having other configurations. Alternatively, the conductor bumps 12 and the structure support bumps 13 may be formed on the first conductor plate 10 by combining three or more types of screen plates.

DESCRIPTION OF SYMBOLS 1 Core board | substrate 2 Additional board | substrate 3 Printed wiring board 6 Two-layer board 7 Two-layer board 8 Printed wiring board 10 First conductor board 11 Second conductor board 12 Conductor bump 13 Structure support bump 14 Uncured insulating material board 15 After curing Insulating material substrate 30 Printing surface plate 30a Guide member 31 Guide member 33 Support member 34 Holding member 36 Squeegee 37 Squeegee drive unit 38 Conductive paste 39 Imaging unit 40 Screen plate 40a Through hole 42 First screen plate 42a Through hole 44 Second Screen plate 44a Through hole 46 Third screen plate 46a Through hole 48 Fourth screen plate 48a Through hole 60 First conductor plate 61 Second conductor plate 62 Conductor bump 63 Uncured insulating material substrate 64 Cured insulating material substrate 65 Insulation Material substrate pressing part 67 Bump 70 for structure support Conductive paste 72 Screen plate 80 Presser 82 heater 90 dispenser

Claims (10)

Forming a conductive bump on the conductive plate that is formed of a conductive material and penetrates the uncured insulating material substrate;
A step of forming a structure supporting bump made of the same material as the conductor bump and having a shape not penetrating the uncured insulating material substrate at a place other than the place where the conductor bump is disposed on the conductor plate;
The conductive bumps and the structural support bumps are formed on the conductive plate so that the conductive bumps penetrate the uncured insulating material substrate and the structural support bumps do not penetrate the uncured insulating material substrate. Placing the uncured insulating material substrate on the opposite side;
A printed wiring board manufacturing method comprising:   The printed wiring board manufacturing method according to claim 1, wherein the conductor bump and the structure supporting bump are formed on the conductor plate by screen printing using a plurality of types of screen plates.   The plurality of types of screen plates include a first screen plate in which through holes are provided at positions corresponding to positions where the conductor bumps are to be formed on the conductor plate, and the structure support bumps on the conductor plate. The printed wiring board manufacturing method of Claim 2 including the 2nd screen plate by which the through-hole was provided in the position corresponding to the position which should be formed.   The printed wiring board manufacturing method according to claim 3, wherein the second screen plate has a smaller thickness than the first screen plate.   The printed wiring board manufacturing method according to claim 3 or 4, wherein the through hole of the second screen plate has a larger cross-sectional area than the through hole of the first screen plate.   The plurality of types of screen plates include a third screen plate in which through holes are provided at positions corresponding to positions where the conductor bumps and the structure support bumps are to be formed on the conductor plate, and the conductor plates. The printed wiring board manufacturing method of Claim 2 including the 4th screen plate by which the through-hole was provided in the position corresponding to the position in which the said conductor bump should be formed in.   The printed wiring board manufacturing method according to claim 6, wherein the third screen plate has a thickness smaller than that of the fourth screen plate.   The printed wiring board manufacturing method according to claim 6 or 7, wherein the through hole of the third screen plate has a larger cross-sectional area than the through hole of the fourth screen plate. A board combination that becomes a material in a manufacturing process of a printed wiring board,
A conductor plate;
Conductor bumps made of a conductive material formed on the conductor plate;
A bump for supporting a structure formed at a location other than the location where the conductive bump is disposed on the conductive plate, and made of the same material as the conductive bump,
An uncured insulating material substrate provided on a side of the conductor plate on which the conductor bump and the structure supporting bump are formed, the conductor bump penetrating the uncured insulating material substrate and the structure An uncured insulating material substrate provided so that support bumps do not penetrate the uncured insulating material substrate;
A substrate combination comprising: A plurality of conductive plates provided so that the cured insulating material substrate is sandwiched therebetween;
Conductor bumps that penetrate through the cured insulating material substrate and electrically connect the conductive plates on both sides of the cured insulating material substrate;
A structure support bump formed on a portion of the conductor plate other than where the conductor bump is disposed, made of the same material as the conductor bump, and provided not to penetrate the insulating material substrate after curing,
A printed wiring board comprising: