JPH01300589A - Printing machine - Google Patents
Printing machineInfo
- Publication number
- JPH01300589A JPH01300589A JP13062388A JP13062388A JPH01300589A JP H01300589 A JPH01300589 A JP H01300589A JP 13062388 A JP13062388 A JP 13062388A JP 13062388 A JP13062388 A JP 13062388A JP H01300589 A JPH01300589 A JP H01300589A
- Authority
- JP
- Japan
- Prior art keywords
- printing
- mask plate
- printing paste
- metal mask
- squeegee
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007639 printing Methods 0.000 title claims abstract description 68
- 239000002184 metal Substances 0.000 claims abstract description 46
- 238000005096 rolling process Methods 0.000 abstract description 8
- 238000007790 scraping Methods 0.000 abstract description 8
- 230000000087 stabilizing effect Effects 0.000 abstract description 3
- 239000011888 foil Substances 0.000 abstract 5
- 239000006071 cream Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 241000190020 Zelkova serrata Species 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は印刷配線板に印刷用ペーストのクリームはんだ
等を印刷する印刷機に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a printing machine for printing printing paste cream solder or the like on printed wiring boards.
従来の技術
近年、半導体フラットパッケージ、チップ等を印刷配線
板へ表面実装する技術において、半導体フラットパッケ
ージのリードのファインピッチ化の傾向は目ざましいも
のがあり、印刷配線板へのクリームはんだの印刷状態の
精度向上の技術は増々重要になってきた。Conventional technology In recent years, in the technology for surface mounting semiconductor flat packages, chips, etc. onto printed wiring boards, there has been a remarkable trend toward finer pitch leads for semiconductor flat packages. Techniques for improving accuracy are becoming increasingly important.
従来この欅の印刷機は第6図に示す構造であった。Conventionally, this Keyaki printing press had the structure shown in Figure 6.
1は印刷配線板2に印刷される印刷用ペーストのクリー
ムはんだ、3は印刷配線板2に印刷する部位に抜き穴パ
ターン部4を設けたメタルマスク版、6はメタルマスク
版3の上方に位置しであるゴムスキージである。6はゴ
ムスキージ5を保持する保持具、7は印刷配線板を保持
している印刷配線仮受は具である。1 is cream solder of the printing paste to be printed on the printed wiring board 2; 3 is a metal mask plate with hole pattern parts 4 provided in the areas to be printed on the printed wiring board 2; 6 is located above the metal mask plate 3. This is a rubber squeegee. Reference numeral 6 denotes a holder for holding the rubber squeegee 5, and 7 is a printed wiring temporary holder for holding the printed wiring board.
以下、この印刷機の動作を説明する。The operation of this printing press will be explained below.
ゴムスキージ6をメタルマスク版上に所定の圧力Fで押
圧し、メタルマスク版の上に乗っているクリームはんだ
1をメタルマスク版の抜き穴パターン部4に第6図の1
aに示すように押し込み、押し込まれないクリームはん
だ1bはそのままかきとってしまう。その後、印刷配線
仮受は具7を矢印B方向に第7図のH寸法下降すること
によシ印刷配線板にクリームはんだが接する部分が抜き
穴パターン部4より厚擦系数が大きいので第7図に示す
ように印刷配線板上にメタルマスク版から離されて印刷
される。Press the rubber squeegee 6 onto the metal mask plate with a predetermined pressure F, and apply the cream solder 1 on the metal mask plate to the hole pattern portion 4 of the metal mask plate as shown in Fig. 6.
Push it in as shown in a, and scrape off the cream solder 1b that is not pushed in. After that, the printed wiring temporary holder is made by lowering the tool 7 in the direction of arrow B by the H dimension in FIG. As shown in the figure, it is printed on a printed wiring board separated from the metal mask plate.
発明が解決しようとする課題
このような従来の構成ではかきとり圧力Fがゴムスキー
ジ−の弾性に依存する要素が大きく印刷の際、圧接する
ために、印刷回数が多くなるにつれて摩耗で初期のかき
とシ圧力が得られなくなる。Problems to be Solved by the Invention In such a conventional configuration, the scraping pressure F is largely dependent on the elasticity of the rubber squeegee, which is in pressure contact with the rubber squeegee during printing. No pressure can be obtained.
したがって印刷のでき映えが第8図に示すように印刷形
状の01が大きくなってT2が小さくなる印刷だれを起
こし易くなる欠点があった。Therefore, as shown in FIG. 8, there is a drawback in that the print quality is likely to cause printing sag, in which the 01 of the print shape becomes large and the T2 becomes small.
その為に近年、半導体パッケージの表面実装技術におい
て第9図に示す印刷のパターンのS寸法は非常に小さく
なっていく煩向があシ、このような印刷だれはパターン
のファインピッチ化が進むなかで製造上のネックとなる
。また、第10図に示すようにゴムスキージのゴムの弾
性の方向性に自由度がありクリームはんだをかきとる際
、印刷パターン部にゴムスキージのW部が侵入し、第8
図のT1だけ印刷されたクリームはんだのパターン部の
中央部が少なくなった。もう一つの問題点として、クリ
ームはんだの印刷はクリームはんだがスキージでかきと
られる際に可能な限シ流動的にローリングする方が印刷
性が良いがそのローリング性もよくなかった。For this reason, in recent years, in surface mounting technology for semiconductor packages, the S dimension of the printed pattern shown in Figure 9 has tended to become extremely small. This becomes a manufacturing bottleneck. Furthermore, as shown in Fig. 10, there is a degree of freedom in the elastic direction of the rubber of the rubber squeegee.
The central part of the cream solder pattern part printed by T1 in the figure has become smaller. Another problem is that printing with cream solder is better if the cream solder is rolled as fluidly as possible when scraped off with a squeegee, but the rolling properties are not good either.
本発明は上記従来の印刷機の欠点を解消するものであシ
、初期設定したかきとシ圧力を印刷回数の多少にかかわ
らず安定して持続できて、再現性の高い印刷状態を保つ
とともに印刷用ペーストのかきとシ時のローリングを活
発化する印刷機を提供するものである。The present invention solves the above-mentioned drawbacks of the conventional printing presses, and is capable of stably maintaining the initially set scraping pressure regardless of the number of printings, maintaining a highly reproducible printing condition, and printing. To provide a printing machine that activates the rolling of the paste during scraping and printing.
課題を解決するための手段
本発明の印刷機は抜き穴パターン部を有するメタルマス
ク版と前記メタルマスク版と所定の角度で圧接し、前記
メタルマスク版上の印刷用ペーストをかきとってメタル
マスク版の下方に位置した印刷配線板に印刷する前記印
刷用ペーストに接する片面に所定の深さの凹凸を設けた
バネ性のある金属薄板スキージとを備えたものである。Means for Solving the Problems The printing machine of the present invention presses a metal mask plate having a hole pattern portion against the metal mask plate at a predetermined angle, scrapes off the printing paste on the metal mask plate, and prints the metal mask. It is equipped with a thin metal plate squeegee having spring properties and having unevenness of a predetermined depth on one side that contacts the printing paste to be printed on the printed wiring board located below the plate.
金属薄板スキージのバネ性だよシ初期のかきとり圧力が
常に一定して再現性の高い印刷状態が容易に得られる。Due to the springiness of the thin metal sheet squeegee, the initial scraping pressure is always constant, making it easy to obtain highly reproducible printing conditions.
また、印刷用ペーストに接する金属薄板の表面に凹凸を
設けることによシ印刷状態の安定化の重要な要因である
印刷用ペーストのローリングを活発化することができる
。Furthermore, by providing irregularities on the surface of the thin metal plate that is in contact with the printing paste, it is possible to activate the rolling of the printing paste, which is an important factor in stabilizing the printing state.
実施例
本発明の印刷機の一実施例を第1図〜第4図を参照して
説明する。Embodiment An embodiment of the printing press of the present invention will be described with reference to FIGS. 1 to 4.
第1図において8は金属薄板スキージ、9は金属薄板ス
キージを保持する金属薄板スキージ保持具である。In FIG. 1, 8 is a metal thin plate squeegee, and 9 is a metal thin plate squeegee holder for holding the metal thin plate squeegee.
なお1は印刷用ペーストであるクリームはんだ、2は印
刷配線板、3はメタルマスク版、4はメタルマスク版の
抜き穴パターン部、7は印刷配線仮受は具でこれらは従
来例の構成と同じものである。Note that 1 is a cream solder which is a printing paste, 2 is a printed wiring board, 3 is a metal mask plate, 4 is a hole pattern part of the metal mask plate, and 7 is a printed wiring temporary holding tool, which is the same as the conventional structure. It's the same thing.
以上のように構成された本実施例の印刷機について以下
にその動作を説明する。The operation of the printing machine of this embodiment configured as described above will be described below.
金属薄板スキージ8をメタルマスク版3上で所定の角度
αで接触し、所定の圧力Fを押圧することによシ金属薄
板のバネ圧力をかけて、前記バネ圧力を保ちつつ入方向
に移動することでメタルマスク版3上にある印刷ペース
ト1を矢印Hに示す方向にローリングさせる。The metal thin plate squeegee 8 is brought into contact with the metal mask plate 3 at a predetermined angle α, and a predetermined pressure F is applied to apply the spring pressure of the metal thin plate, and the metal mask plate 3 is moved in the entry direction while maintaining the spring pressure. This causes the printing paste 1 on the metal mask plate 3 to be rolled in the direction shown by the arrow H.
このO−リングは第3図に示すように金属薄板スキージ
の表面に深さLの凹凸模様を設けることにより印刷用ペ
ーストのかきとシの際に活発化する。それを第4図a、
bに示す。矢印Eは金属薄板スキージ表面に凹凸を設け
て印刷用ペーストのローリングを活発化した状態で、矢
印Gは金属薄板スキージ表面に凹凸を設けない場合であ
る。As shown in FIG. 3, this O-ring becomes active when the printing paste is scraped by providing an uneven pattern with a depth L on the surface of the thin metal squeegee. Figure 4a,
Shown in b. Arrow E shows a state in which unevenness is provided on the surface of the thin metal plate squeegee to activate the rolling of the printing paste, and arrow G shows a state in which unevenness is not provided on the surface of the thin metal plate squeegee.
こうした、ローリングを活発化した状態で、従来と同様
にメタルマスク版の抜キ穴パターン部4にメタルマスク
版3上にある印刷用ペースト1を押し込む。With this active rolling, the printing paste 1 on the metal mask plate 3 is pushed into the punch hole pattern portion 4 of the metal mask plate as in the conventional case.
以下の動作は従来例と同様である。The following operation is similar to the conventional example.
このようにして印刷された状態を第2図に示す。FIG. 2 shows the state printed in this manner.
第2図のT3は第8図のT1よシ小さく印刷量が確保で
き、第2図の02は第6図の01よシ非常に小さくその
為に第2図のT4は第6図のT2よシ大きくなシ印刷だ
れの小さい印刷ができる。T3 in Fig. 2 is smaller than T1 in Fig. 8 and can ensure a printing amount, and 02 in Fig. 2 is much smaller than 01 in Fig. 6. Therefore, T4 in Fig. 2 is smaller than T1 in Fig. 6. You can print both large and small prints.
発明の効果
このように本発明の印刷機によれば金属薄板のバネ性に
よるかき取シ圧力の安定化と、金属薄板が印刷用ペース
トに接する部分に凹凸を設けるこトニよシ、印刷用ペー
ストのローリングを活発化することができ、きわめて容
易に、安定した精度の高い印刷状態を得ることができる
。したがって表面実装技術における印刷パターンのファ
インピッチ化にも対応が可能になるもので実用的にきわ
めて有用である。Effects of the Invention As described above, according to the printing machine of the present invention, the scraping pressure is stabilized due to the springiness of the thin metal plate, and the unevenness is provided in the area where the thin metal plate contacts the printing paste. The rolling of the paper can be activated, and a stable and highly accurate printing condition can be obtained very easily. Therefore, it is possible to cope with finer pitch printing patterns in surface mounting technology, and is extremely useful in practice.
第1図は本発明の一実施例における印刷機の側面図、第
2図は本発明の印刷機により印刷された印刷ペーストの
印刷状態図、第3図は第1図にPの表面状態図、第4図
aは第3図に示す表面状態がある場合の印刷ペーストの
流動状態図、第4図すは第3図に示す表面状態がない場
合の印刷ペーストの流動状態図、第6図は従来の印刷機
の側面図、第6図、第7図は、第6図の印刷機を動作さ
せて印刷配線板2に印刷用ペースト1を印刷する過程を
示した図、第8図は従来の印刷機により印刷された印刷
ペーストの印刷状態図、第9図は印刷のパターン図、第
10図は従来の印刷機におけるゴムスキージとメタルマ
スク版の接触状態図である。
1・・・・・印刷用ペースト、2・・・・・・印刷配線
板、3・・・・・・メタルマスク版、4・・・・・・抜
き穴パターン部、5・・・・・・ゴムスキージ、6・・
・・・・保持具、7・・・・・・印刷配線仮受は具。
代理人の氏名 弁理士 中 尾 敏 男 ほか1名!−
印刷用ペースト
第 5rIlFIG. 1 is a side view of a printing press according to an embodiment of the present invention, FIG. 2 is a diagram of the printing state of the printing paste printed by the printing machine of the present invention, and FIG. 3 is a diagram of the surface state of P in FIG. 1. , Fig. 4a is a flow diagram of the printing paste when the surface condition shown in Fig. 3 is present, Fig. 4a is a flow diagram of the printing paste when the surface condition shown in Fig. 3 is not present, and Fig. 6 is a flow diagram of the printing paste when the surface condition shown in Fig. 3 is not present. 6 is a side view of a conventional printing press, FIGS. 6 and 7 are diagrams showing the process of printing the printing paste 1 on a printed wiring board 2 by operating the printing press of FIG. 6, and FIG. 8 is a side view of a conventional printing press. FIG. 9 is a printing pattern diagram of a printing paste printed by a conventional printing machine, and FIG. 10 is a diagram of a contact state between a rubber squeegee and a metal mask plate in a conventional printing machine. 1... Printing paste, 2... Printed wiring board, 3... Metal mask plate, 4... Hole pattern section, 5...・Rubber squeegee, 6...
...Holder, 7... Printed wiring temporary holder is a tool. Name of agent: Patent attorney Toshio Nakao and 1 other person! −
Printing paste No. 5rIl
Claims (1)
ルマスク版と所定の角度で圧接し、前記印刷用ペースト
に接する片面に所定の深さの凹凸を設けたバネ性のある
金属薄板スキージとを備え、前記メタルマスク版上の印
刷用ペーストをかきとってメタルマスク版の下方に位置
した印刷配線板に印刷することを特徴とする印刷機。A metal mask plate having a hole pattern portion, and a thin metal plate squeegee with spring properties that presses against the metal mask plate at a predetermined angle and has irregularities of a predetermined depth on one side in contact with the printing paste. A printing machine characterized in that the printing paste on the metal mask plate is scraped off and printed on a printed wiring board located below the metal mask plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63130623A JP2674092B2 (en) | 1988-05-27 | 1988-05-27 | Printer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63130623A JP2674092B2 (en) | 1988-05-27 | 1988-05-27 | Printer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01300589A true JPH01300589A (en) | 1989-12-05 |
JP2674092B2 JP2674092B2 (en) | 1997-11-05 |
Family
ID=15038662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63130623A Expired - Lifetime JP2674092B2 (en) | 1988-05-27 | 1988-05-27 | Printer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2674092B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016055468A (en) * | 2014-09-08 | 2016-04-21 | 日本電気株式会社 | Device for printing paste material, mask, squeegee, and method for printing paste material |
JP2020044744A (en) * | 2018-09-20 | 2020-03-26 | パナソニックIpマネジメント株式会社 | Squeegee blade and screen printer |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60137683A (en) * | 1983-12-26 | 1985-07-22 | Hitachi Ltd | Paste printing method |
JPS6153548A (en) * | 1984-08-24 | 1986-03-17 | Hitachi Ltd | Method for evaluating printability of solder paste |
JPS61168997A (en) * | 1985-01-23 | 1986-07-30 | 株式会社日立製作所 | Solder paste processing mechanism |
JPS6376395A (en) * | 1986-09-15 | 1988-04-06 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | Method of applying solder paste |
-
1988
- 1988-05-27 JP JP63130623A patent/JP2674092B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60137683A (en) * | 1983-12-26 | 1985-07-22 | Hitachi Ltd | Paste printing method |
JPS6153548A (en) * | 1984-08-24 | 1986-03-17 | Hitachi Ltd | Method for evaluating printability of solder paste |
JPS61168997A (en) * | 1985-01-23 | 1986-07-30 | 株式会社日立製作所 | Solder paste processing mechanism |
JPS6376395A (en) * | 1986-09-15 | 1988-04-06 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | Method of applying solder paste |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016055468A (en) * | 2014-09-08 | 2016-04-21 | 日本電気株式会社 | Device for printing paste material, mask, squeegee, and method for printing paste material |
JP2020044744A (en) * | 2018-09-20 | 2020-03-26 | パナソニックIpマネジメント株式会社 | Squeegee blade and screen printer |
Also Published As
Publication number | Publication date |
---|---|
JP2674092B2 (en) | 1997-11-05 |
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