JPH02301479A - Pad printing method - Google Patents

Abstract

PURPOSE:To eliminate a non-printable place and to enhance printing quality, in a pad printing method wherein a character or mark are transferred to the surfaces of a large number of electronic parts at once using pads by using one pad per one electronic part to perform transfer. CONSTITUTION:A plate-shaped holding device 2 has electronic parts 1 mounted to the holes 2a provided to the upper surface thereof and ink storing recessed parts 3a are formed to the upper surface of an etching plate 3 in an E-shape and pads 5 are mounted on the under surface of a jig 4. After predetermined ink is applied to the upper surface of the etching plate 3, the excessive ink is wipen off to leave the ink in the recessed parts 3a. The jig 4 is allowed to fall on the etching plate 4 to bond ink to the respective pads 5 in the E-shape. The jig 4 is moved so as to be positioned above the holding device 2 to perform alignment and allowed to fall to press the respective pads 5 to the upper surfaces of the electronic parts 1 and the ink is bonded and transferred to the surfaces of the electronic parts 1. Printing can be applied to all of the electronic parts regardless of the arrangement state of the electronic parts and a non-printable place is eliminated and the enhancement of the treatment capacity of a printing press or cost reduction can be achieved.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a band printing method used, for example, when printing characters, symbols, etc. indicating a product name or characteristics on the surface of an electronic component.

This printing method is already known, as shown in FIG. 3 said recess 3
The ink 11 is applied to the pad 10, and the ink 11 is applied to the circumferential surface of the pad 10 by pressing the elastic pad 10 thereon.Then, the pad 10 is applied to a rectangular electronic component 1 such as a multilayer capacitor. In this method, the ink 11 is transferred onto the electronic component 1 by moving it onto the holder 2 arranged in a matrix and pressing it from above, thereby printing.

By the way, the shape of the pad 10 used in this method is approximately an inverted conical shape as shown in the figure, so when it is pressed against the etching plate or the upper surface of the holder and elastically deformed,
As characteristically shown in FIG. 6, the tip 10a of the pad 10
The area will be raised, making it difficult for ink to adhere to that area. Furthermore, if the ink does not float, the pressure concentrates and the ink collapses and spreads, making it difficult to distinguish characters, symbols, etc. As a result, the conventional pad printing method has the following drawbacks.

(2) As described above, since the tip 10a of the pad 10 cannot be used for printing, an unprintable area A occurs in the portion where the tip 10a of the etching plate 3 or the holder 2 comes into contact, as shown in FIG. In this case, in order to mechanize printing on electronic components, it is difficult to avoid mounting electronic components only in the A location, so normally the row B and column C that include the A location are
There are no electronic parts installed on the top. As a result, productivity was low.

■Also, since the pad is largely deformed in order to ensure a wide printing area at one time, the amount of deformation differs between the side closer to the tip 10a and the side farther from the tip 10a in the pad part that contributes to printing, resulting in the difference between printed characters and The shapes of symbols etc. are deformed, leading to variations in quality.

The present invention has been made to solve such problems,
It is an object of the present invention to provide a bad printing method that eliminates the above-mentioned unprintable areas and improves printing quality.

The present invention is a pad printing method in which characters, symbols, etc. are transferred and printed on the surfaces of many electronic components at once using a pad, and one pad is used for one electronic component. It is characterized in that it performs transcription.

In the present invention, one pad is used to print one electronic component, so if the pads are arranged according to the arrangement position of the electronic component, printing can be performed regardless of the arrangement state of the electronic component. All electronic components can be printed, and since the amount of deformation of each pad is the same and small, the printed state is uniform for each electronic component.

Tip - Shiichi± FIG. 1 is a schematic diagram showing an implementation state of the present invention.

2 is a plate-shaped holder in which an electronic component 1 such as a multilayer capacitor is mounted in a hole 2a provided on the top surface; 3 is an etching plate having an E-shaped ink storage recess 3a formed on the top surface; 4;
is a jig with a pad 5 attached to its lower surface.

The holes 2a, recesses 3a, and pads 5 are provided in the same number and in exactly the same positional relationship, and the pads 5 have the same shape as the conventional pad, as shown in FIG. 2 (rear view). is reduced to a size that can be printed for one electronic component 1.

The present invention uses such an apparatus to perform printing in the following manner.

First, a predetermined amount of ink is applied to the upper surface of the etching plate 3, and then excess ink is wiped off using a cloth or the like, leaving the ink in the recesses 3a.

On the etching plate 3 in this state, the jig 4 is lowered with the pad 5 facing downward, and the pad 5 is pressed against the upper surface, so that ink in an E shape is adhered to each pad 5, respectively.

Next, the jig 4 is moved onto the holder 2, and while aligned with the holder 2, the jig 4 is lowered to press each pad 5 onto the top surface of the electronic component 1, so that the ink is applied to the electronic component 1. It adheres to the surface and transfers it.

In the above embodiment, a pad having a substantially inverted conical shape is used, but the present invention is not limited to this, and any shape may be used. (h)
shows an example.

Further, in the present invention, it is not necessary to use such pads separated one by one, but the parts attached to the jig are integrated, and the pads are separated in the middle to correspond to each electronic component. A pad may also be used; in short, it is sufficient if there is a protrusion as shown in FIG. 3 on the lower surface side to which ink is attached.

Furthermore, in the above embodiment, the same number of pads 5 as the electronic components l held by the holder 2 are attached to the jig 4, but the present invention is not limited to this. It can also be carried out by attaching a smaller number of pads 5 than the number of electronic components 1 to the jig 4 and performing printing several times in a state where they are used at one rate.

Further, in the present invention, if the electronic components 1 are placed in a dense or dense state depending on the positional relationship of the electronic components 1 held by the holder 2, the pads may be arranged accordingly.

At this time, as shown in FIG. 4, adjacent pads 5 may be brought into contact with each other.

Optical plate Shigeki As detailed above, in the case of the present invention, one pad is used to print one electronic component, so if the pads are placed according to the placement position of the electronic component, the placement of the electronic component is easy. It becomes possible to print on all electronic components regardless of their condition, and there are no areas where printing is impossible as in the past, improving the throughput of the printing machine and reducing costs.

In addition, since the amount of deformation of each pad is the same, it is possible to make the printing condition uniform for each electronic component, which has the effect of eliminating the need to sort out products with printing defects and reducing costs. .

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing the implementation state of the present invention, and FIG.
3 is a schematic diagram showing multiple examples of pads used in the present invention, FIG. 4 is a perspective view showing examples of how to attach other pads to the jig, and FIG. FIG. 6 is a perspective view showing the printing state when using the pad printing method.
FIG. 1...Electronic component, 4...Jig, 5...Band.

Claims (1)

[Claims] (1) In the pad printing method, in which characters, symbols, etc. are transferred and printed on the surfaces of many electronic components at once using a pad, transfer is performed using one pad for each electronic component. A pad printing method featuring: