JPH0682571B2 - Electronic component manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) Since the present invention has a small shape like a chip type electronic component, the display area surface of the component mark such as its type, characteristics and quality is small. The present invention relates to a method of manufacturing an electronic component in which the component mark is printed on the display area surface of the electronic component that is extremely limited by using a printing pad.

(Prior Art) FIGS. 5 and 6 are diagrams for explaining a conventional method for manufacturing an electronic component. In this conventional method of manufacturing an electronic component, first, as shown in FIG. 5, the printing plate 4 is set on the printing table 2. Grooves 6 corresponding to the print pattern of the part mark formed on the surface of the set printing plate 4 ...
Is filled with printing ink 8. Next, the transfer surface 12 of the printing pad 10 is pressed against the groove 6 on the surface of the printing plate 4 in the direction of the downward arrow in the drawing, and then the printing pad 10 is moved from the printing plate 4 in the direction of the upward arrow in the drawing. Let go. As a result, the printing ink 8 in the grooves 6 ... Is transferred to the transfer surface 12 of the printing pad 10.

In this way, the printing pad 10 on which the printing ink 8 is transferred to the transfer surface 12 is transferred to the surface of the electronic part 14 whose transfer surface 12 is placed on the printing table 2 as shown in FIG. Towards the display area surface 16 (down arrow direction in the figure)
Press down. As a result, the printing of the component mark on the component mark display area surface 16 on the surface of the electronic component 14 is completed.

By the way, the following problems are pointed out in the conventional manufacturing method. That is, according to this manufacturing method, the electronic component is not a relatively large one as shown in FIG. 6, but is a small-sized and lightweight chip-type electronic component such as a multilayer capacitor having external electrodes on both ends. Is
Since the area of the display area surface of the part mark becomes extremely small, it becomes easy for the printing ink or the oil component of the printing pad to adhere to the external electrode during the above-mentioned transfer. When soldering to the wiring pattern of the printed circuit board, a problem of soldering failure is likely to occur. Further, because of its light weight, there is a problem that the electronic component is likely to adhere to the transfer surface of the printing pad during the above transfer.

As another conventional technique for solving such a problem, as shown in FIG. 7 and FIG. 8 (enlarged sectional view of an essential part of FIG. 7), a plurality of chip types on which the printing table 2 is placed are mounted. A print cover mask 22 having a plurality of through holes 20 ... Corresponding to the number of the electronic components 14 ... Is arranged between the electronic components 14 ... And the printing pad 10, and the through holes 20. The transfer surface 12 of the print pad 10 and the component mark display area surface 16 on each surface of the electronic components 14 face each other.

Then, in the facing state, the printing pad 10 is formed in each through hole 20.
Printing on the transfer surface 12 is performed by inserting the transfer surface 12 from the entrance side opening 24 and exposing the transfer surface 12 from the exit side opening 26 and pressing the exposed transfer surface 12 against the part mark display area surface 16. The ink is retransferred to the part mark display area surface 16.

(Problems to be Solved by the Invention) However, in the related art shown in FIGS. 7 and 8, as the size of the chip-type electronic component 14 is further reduced, the following problems are newly added. Was pointed out.

That is, as the size of the electronic component 14 becomes smaller,
Although the area of the component mark display area surface 16 is also small, inevitably, the opening diameter of the through hole 20 of the print cover mask 22 also needs to be reduced in accordance with the display area surface 16. However, when the opening diameter of the through hole 20 becomes small, when the printing pad 10 is inserted from the inlet side opening 24 of the through hole 20, the transfer surface 12 cannot be sufficiently filled in as shown in FIG. As a result, the transfer surface 12 from the outlet side opening 26 toward the part mark display area surface 16 of the electronic component 14
Will not be exposed. In such an exposed state, as is apparent from FIG. 8, the transfer surface 12 is changed to the component mark display area surface.
Since it cannot be pressed against 16 enough, printing defects such as so-called print chips occur.

Therefore, in order to eliminate such a defect, the opening diameter of the through hole 20 may be increased or the thickness of the print cover mask 22 may be reduced, but the opening diameter of the through hole is the component of the electronic component 14. It is determined by the area of the mark display area surface 16 and cannot be arbitrarily increased. Further, reducing the thickness of the print cover mask 22 reduces the mechanical strength of the print cover mask 22. There is.

The present invention has been made in view of the above, in printing a required component mark on the component mark display area surface of a small and lightweight electronic component using the print cover mask, the mechanical strength of the print cover mask It is an object of the present invention to provide a method for manufacturing an electronic component that can be sufficiently held, but does not cause print defects such as print chips.

(Means for Solving the Problem) In order to solve such a problem, the present invention provides a through hole between a printing pad on which printing ink is transferred to a transfer surface and a part mark display area surface of an electronic part. Arranging the printing cover mask having, the printing pad in the arranged state from the inlet side opening of the through hole of the printing cover mask and exposing the transfer surface from the outlet side opening,
In the method of manufacturing an electronic component, wherein the exposed transfer surface is pressed against the component mark display area surface to retransfer the print ink on the transfer surface to the display area surface, the through hole serving as the print cover mask. The opening diameter of the inlet side opening is larger than the opening diameter of the outlet side opening.

(Operation) According to the above configuration, since the opening diameter of the entrance side opening of the through hole in the printing cover mask is larger than that of the exit side opening, the printing plate sufficiently enters the through hole of the printing cover mask. As a result, it is possible to print the component mark by pressing the transfer surface of the printing plate onto the component mark display area surface of the electronic component in a state where the transfer surface of the printing plate is exposed from the outlet side opening.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a sectional view for explaining a method for manufacturing an electronic component according to an embodiment of the present invention, and FIG. 2 is an enlarged sectional view of an essential part of the print cover mask of FIG. In these figures,
Unless otherwise specified, the same reference numerals as those shown in FIG. 5 to FIG.
The same or equivalent parts are shown.

First, the manufacturing method of this embodiment is basically the same as that of the conventional example except for the printing cover mask. That is, a printing cover mask having a through hole is arranged between the printing pad on which the printing ink on the surface of the printing plate is transferred to the transfer surface and the surface of the component mark display area of the electronic component, and in that arrangement state, By inserting the printing pad from the opening on the inlet side of the through hole and exposing the transfer surface from the opening on the exit side, and pressing the exposed transfer surface to the surface of the component mark display area, the transfer surface is formed. The process of retransferring the printing ink to the display area is the same as in the conventional example in this embodiment.

The present embodiment is different from the conventional example in the following points.

That is, in this embodiment, as the print cover mask 22, the opening shape of the through hole 20 is such that the opening diameter of the inlet side opening 24 is larger than that of the outlet side opening 26. That is, as is apparent from FIG. 2 which is an enlarged cross-sectional view of the main part of the print cover mask 22 of FIG. 1, the inlet side opening 24 of the through hole 20 extends from the inlet side of the through hole 20 to a midway portion. Is formed to have a uniform first opening diameter, and the outlet side opening portion 26 is formed to have a second opening diameter which is uniform from the middle portion to the outlet side and is larger than the first opening diameter. It was done.

Therefore, when the component mark is printed using the print cover mask 22 having the through hole 20 formed in such an opening shape, as shown in FIG.
It becomes possible to insert the transfer surface 12 into the through hole 20 of the print cover mask 22 with a sufficient depth, and as a result, the transfer surface 12 is pressed against the component mark display area surface 16 of the electronic component 14 with sufficient strength. And good component mark can be printed.

4 (a) and 4 (b) are diagrams showing respective modifications of the print cover mask 22. In the print cover mask 22 shown in FIG. 4A, the opening shape of the through hole 20 is formed in a linear taper shape from the entrance side opening 24 to the exit side opening 26. In the print cover mask 22 shown in FIG. 4B, the through hole 20 is formed in a curved taper shape from the entrance side opening 25 to the exit side opening 26.

The planar shape of the through hole 20 of the print cover mask 22 described in the above embodiment may be various shapes such as circle, ellipse, rectangle, and square. The point is that the diameter of the through-hole of the entrance-side opening is larger than that of the exit-side opening.

(Effects of the Invention) As is apparent from the above description, according to the present invention,
When printing the required part mark on the part mark display area surface of a small and lightweight electronic part using the print cover mask, the mechanical strength of the print cover mask can be sufficiently maintained, while printing such as print chips It is possible to provide a method for manufacturing an electronic component that does not cause a defect.

[Brief description of drawings]

1 to 4 are views for explaining a method for manufacturing an electronic component according to an embodiment of the present invention, FIG. 1 is a sectional view for explaining the whole manufacturing method, and FIG. FIG. 4A is an enlarged cross-sectional view of an essential part of the print cover mask shown in FIG. 3, and FIG. 3 is an enlarged cross-sectional view of an essential part showing a state in which a printing pad is inserted into a through hole of the print cover mask shown in FIG. And the fourth
FIG. 6B is an enlarged cross-sectional view of a main part showing another modification of the print cover mask. 5 to 8 relate to a method of manufacturing an electronic component according to a conventional example, and FIG. 5 is a cross-sectional view for explaining a case where a printing ink on the surface of a printing plate is transferred to a transfer surface of a printing pad. The figure is for explaining the case of re-transferring to the part mark display area surface of an electronic component by using a printing pad on which printing ink is transferred. FIG. 7 is the part mark display area surface of an electronic component using a printing cover mask. And FIG. 8 is an enlarged sectional view of an essential part of FIG. 4 ... printing plate, 8 ... printing ink, 10 ... printing pad,
12: Transfer surface, 14: Electronic component, 16: Component mark display area surface, 20: Through hole, 22: Printing cover mask, 24 ...
… Entrance side opening, 26 …… Exit side opening.

Claims (1)

[Claims] 1. A printing cover mask having a through hole is arranged between a printing pad on which printing ink is transferred to a transfer surface and a surface of a component mark display area of an electronic component, and the printing pad is placed in the above-mentioned arrangement state. By inserting the transfer cover from the opening on the entrance side of the through hole of the printing cover mask and exposing the transfer surface from the opening on the exit side, and pressing the exposed transfer surface to the surface of the component mark display area, In the method of manufacturing an electronic component in which a certain printing ink is retransferred to the display area surface, as the printing cover mask, an opening diameter of an entrance side opening of the through hole is larger than an opening diameter of the exit side opening. A method of manufacturing an electronic component, characterized by being used.