JPH0563373A - Structure of power hybrid ic - Google Patents
Structure of power hybrid icInfo
- Publication number
- JPH0563373A JPH0563373A JP22301391A JP22301391A JPH0563373A JP H0563373 A JPH0563373 A JP H0563373A JP 22301391 A JP22301391 A JP 22301391A JP 22301391 A JP22301391 A JP 22301391A JP H0563373 A JPH0563373 A JP H0563373A
- Authority
- JP
- Japan
- Prior art keywords
- large current
- current circuit
- conductor
- circuit
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、大電流回路を有する電
力用ハイブリッドＩＣの構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of a power hybrid IC having a large current circuit.
【０００２】[0002]
【従来の技術】電力用ハイブリッドＩＣでは、大電流を
流すための大電流回路として断面積の大きな導体回路を
形成する必要がある。そのため、従来は、基板面に大電
流回路用の回路パターンを形成する際に、厚膜ペースト
を塗布して導体の膜厚を厚くしたり、導体の幅を広げた
りして必要な断面積を確保するようにしていた。2. Description of the Related Art In a power hybrid IC, it is necessary to form a conductor circuit having a large cross section as a large current circuit for flowing a large current. Therefore, conventionally, when forming a circuit pattern for a large current circuit on the substrate surface, a thick film paste is applied to increase the film thickness of the conductor or to widen the width of the conductor to obtain a required cross-sectional area. I was trying to secure it.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、スクリ
ーン印刷法による厚膜ペーストの１回の印刷では、１０
〜１５μｍ程度の膜厚しか得られず、２度塗りを行って
も２５〜３０μｍ程度であり、これ以上の厚さに導体を
印刷塗布することは困難であった。従って、導体の断面
積を大きくするためには、導体の幅を広げる必要があ
り、必然的に基板面積が大きくなり、製品の小型化には
限界があった。However, in one printing of the thick film paste by the screen printing method, 10 times is required.
Only a film thickness of about -15 μm was obtained, and even if it was applied twice, it was about 25-30 μm, and it was difficult to print and apply the conductor to a thickness greater than this. Therefore, in order to increase the cross-sectional area of the conductor, it is necessary to widen the width of the conductor, which inevitably increases the area of the substrate, which limits the miniaturization of the product.
【０００４】そこで本発明は、大電流回路を形成する部
分の導体を厚くでき、導体回路の幅を狭くして小型化が
図れる電力用ハイブリッドＩＣの構造を提供することを
目的としている。Therefore, an object of the present invention is to provide a structure of a power hybrid IC in which a conductor of a portion forming a large current circuit can be thickened and a width of the conductor circuit can be narrowed to achieve miniaturization.
【０００５】[0005]
【課題を解決するための手段】上記した目的を達成する
ため、本発明の電力用ハイブリッドＩＣの構造は、所定
の印刷回路を設けた複数の基板を積層した電力用ハイブ
リッドＩＣにおいて、大電流回路を設けるべき基板面
に、該大電流回路に相当するスリットを形成したシート
を積層し、該スリット内に導電ペーストを充填して前記
大電流回路を形成したことを特徴としている。In order to achieve the above object, the structure of the power hybrid IC of the present invention is a high current circuit in a power hybrid IC in which a plurality of substrates provided with a predetermined printed circuit are stacked. It is characterized in that a sheet having slits corresponding to the large current circuit is laminated on the surface of the substrate to be provided with and a conductive paste is filled in the slits to form the large current circuit.
【０００６】[0006]
【作 用】上記構成によれば、スリットを形成した他の
基板の厚さに相当する厚さの導体回路を形成することが
できる。即ち、他の基板として厚さ１００μｍのものを
用いれば、厚さ１００μｍの導体回路を形成することが
できるので、厚さが増えた分幅を狭くすることができ
る。[Operation] According to the above configuration, it is possible to form a conductor circuit having a thickness corresponding to the thickness of another substrate in which the slit is formed. That is, if another substrate having a thickness of 100 μm is used, a conductor circuit having a thickness of 100 μm can be formed, and thus the width can be reduced by the increase in thickness.
【０００７】[0007]
【実施例】以下、本発明を、図面に示す一実施例に基づ
いて、さらに詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in more detail below based on an embodiment shown in the drawings.
【０００８】図１は、表面層に大電流回路を有する電力
用ハイブリッドＩＣの多層基板の斜視図であり、図２は
断面図である。FIG. 1 is a perspective view of a multilayer substrate of a power hybrid IC having a large current circuit on its surface layer, and FIG. 2 is a sectional view.
【０００９】多層基板１は、例えばセラミック粉末等の
無機材料粉末と有機バインダーとの混合物からなる、い
わゆるグリーンシートを基板材料として用い、それぞれ
の基板の表面に所定の印刷回路を設けた後、積層し圧着
焼成して形成されるものである。The multi-layer substrate 1 uses so-called green sheets, which are made of a mixture of an inorganic material powder such as ceramic powder and an organic binder, as a substrate material, and a predetermined printed circuit is provided on the surface of each substrate and then laminated. It is formed by pressure bonding and firing.
【００１０】上記多層基板１において、最上部の基板１
ａの表面に大電流回路を設けるため、まず、基板１ａの
表面に、前記大電流回路に相当するスリット２を形成し
たシート３を積層し、大電流回路形成用の凹部４を形成
する。次いで、前記凹部４内に導電ペーストを塗布充填
した後、圧着焼成を行い、基板１ａの表面に大電流用の
導体回路を形成する。In the above-mentioned multilayer substrate 1, the uppermost substrate 1
In order to provide the large current circuit on the surface of a, first, the sheet 3 having the slits 2 corresponding to the large current circuit is laminated on the surface of the substrate 1a to form the concave portion 4 for forming the large current circuit. Next, after the conductive paste is applied and filled in the concave portion 4, pressure bonding and firing are performed to form a conductor circuit for large current on the surface of the substrate 1a.
【００１１】これにより、前記シート３の厚さに応じた
厚さの導体回路を形成することができ、例えば、厚さ約
１００μｍの大電流用回路パターンを得ることができ
る。従って、従来に比べて厚さが３倍以上の厚膜導体回
路を形成できるので、従来と同一の導体断面積ならば、
導体幅を１／３程度にすることが可能となり、それに応
じて所要基板面積も小さくできる。As a result, a conductor circuit having a thickness corresponding to the thickness of the sheet 3 can be formed, and for example, a large current circuit pattern having a thickness of about 100 μm can be obtained. Therefore, it is possible to form a thick film conductor circuit having a thickness three times or more that of the conventional one.
The conductor width can be reduced to about 1/3, and the required substrate area can be reduced accordingly.
【００１２】なお、上記シート３には、基板材料と同じ
材料、例えば前記グリーンシートを用いることができ、
スリットは、精密プレスによる打抜きやレーザー加工機
を用いて形成することができる。また、凹部４内への導
電ペーストの塗布充填は、基板を圧着焼成した後に行っ
てもよい。また、スリットを形成した基板を複数枚重ね
て導体厚を増すこともできる。さらに、多層基板の上下
両面に厚膜導体を形成することもできる。The sheet 3 can be made of the same material as the substrate material, for example, the green sheet,
The slit can be formed by punching with a precision press or using a laser processing machine. The conductive paste may be applied and filled in the recesses 4 after the substrate is pressure-bonded and fired. Further, the conductor thickness can be increased by stacking a plurality of substrates having slits. Further, thick film conductors can be formed on both upper and lower surfaces of the multilayer substrate.
【００１３】[0013]
【発明の効果】以上説明したように、本発明の電力用ハ
イブリッドＩＣの構造は、大電流回路に相当するスリッ
トを形成したシートを積層し、該スリット内に導電ペー
ストを充填して前記大電流回路を形成したので、従来に
比べて数倍の厚さの導体回路を形成することができる。As described above, according to the structure of the power hybrid IC of the present invention, sheets having slits corresponding to a large current circuit are laminated, and a conductive paste is filled in the slits to form the large current circuit. Since the circuit is formed, it is possible to form a conductor circuit having a thickness several times that of the conventional one.
【００１４】従って、導体回路の幅を広くせずに大きな
断面積を有する導体回路を形成できるので、従来のもの
より小さな基板面積の中に、同じ大きさの電流を流せる
大電流回路を設けることができ、大電流回路を有する電
力用ハイブリッドＩＣの小型化を図ることができる。ま
た、厚膜ペーストの２度塗りを行わなくてよいので製造
工数の低減も図れる。Therefore, a conductor circuit having a large cross-sectional area can be formed without increasing the width of the conductor circuit. Therefore, a large current circuit capable of supplying the same amount of current can be provided in a substrate area smaller than the conventional one. Therefore, the power hybrid IC having a large current circuit can be downsized. Further, since it is not necessary to apply the thick film paste twice, the number of manufacturing steps can be reduced.
【図１】 本発明の一実施例を示す電力用ハイブリッド
ＩＣの多層基板の斜視図である。FIG. 1 is a perspective view of a multilayer substrate of a power hybrid IC showing an embodiment of the present invention.
【図２】 おなじく断面図である。FIG. 2 is a similar sectional view.
１…多層基板 ２…スリット ３…シート ４…
大電流回路形成用の凹部1 ... Multilayer substrate 2 ... Slit 3 ... Sheet 4 ...
Recess for forming large current circuit
Claims (1)
層した電力用ハイブリッドＩＣにおいて、大電流回路を
設けるべき基板面に、該大電流回路に相当するスリット
を形成したシートを積層し、前記スリット内に導電ペー
ストを充填して前記大電流回路を形成したことを特徴と
する電力用ハイブリッドＩＣの構造。1. In a power hybrid IC in which a plurality of substrates provided with a predetermined printed circuit are laminated, a sheet having slits corresponding to the large current circuit is laminated on the surface of the substrate on which the large current circuit is to be provided, A structure of a power hybrid IC, wherein the slit is filled with a conductive paste to form the large current circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22301391A JPH0563373A (en) | 1991-09-03 | 1991-09-03 | Structure of power hybrid ic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22301391A JPH0563373A (en) | 1991-09-03 | 1991-09-03 | Structure of power hybrid ic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0563373A true JPH0563373A (en) | 1993-03-12 |
Family
ID=16791471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22301391A Pending JPH0563373A (en) | 1991-09-03 | 1991-09-03 | Structure of power hybrid ic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0563373A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6231804B1 (en) | 1997-04-02 | 2001-05-15 | Chisso Corporation | Modified olefin (co)polymer composition, process for preparing the same, and modified olefin (co)polymer composition molding |
| US6683260B2 (en) | 2000-07-04 | 2004-01-27 | Matsushita Electric Industrial Co., Ltd. | Multilayer wiring board embedded with transmission line conductor |
| WO2014141492A1 (en) | 2013-03-11 | 2014-09-18 | 日本碍子株式会社 | Circuit substrate |
| JP2015185597A (en) * | 2014-03-20 | 2015-10-22 | 株式会社Pfu | Printed circuit board and printed circuit board manufacturing method |
-
1991
- 1991-09-03 JP JP22301391A patent/JPH0563373A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6231804B1 (en) | 1997-04-02 | 2001-05-15 | Chisso Corporation | Modified olefin (co)polymer composition, process for preparing the same, and modified olefin (co)polymer composition molding |
| US6683260B2 (en) | 2000-07-04 | 2004-01-27 | Matsushita Electric Industrial Co., Ltd. | Multilayer wiring board embedded with transmission line conductor |
| WO2014141492A1 (en) | 2013-03-11 | 2014-09-18 | 日本碍子株式会社 | Circuit substrate |
| JP2015185597A (en) * | 2014-03-20 | 2015-10-22 | 株式会社Pfu | Printed circuit board and printed circuit board manufacturing method |
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