JP2015185597A - Printed circuit board and printed circuit board manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed circuit board and a printed circuit board manufacturing method, which can achieve at least either of a decrease in impedance or improvement in heat dissipation performance.SOLUTION: A printed circuit board 1A of a multilayer structure where a plurality of insulation layers 2 are layered comprises a transmission pathway 4A which connects a DDC (DC/DC Converter) 10 through an IC 20 to a capacitor 30. The transmission pathway 4A is formed by overlapping two or more layers at least at a part of a horizontal communication region 41 which is formed by performing punching in the insulation layer 2 in the same layer so as to make neighboring holes overlap each other to make the holes be communicated with each other in a horizontal direction, and a conductor 42 for transmitting at least electricity is charged in the horizontal communication regions 41.

Description

  The present invention relates to a printed circuit board and a method for manufacturing the printed circuit board.

  In recent years, printed circuit boards having a multilayer structure in which an insulating layer and a conductive layer are repeatedly stacked have been proposed. Vias are formed in the printed circuit board. Vias connect different conductive layers. A via is a hole formed so as to penetrate from the front surface to the back surface of one insulating layer or from one surface to the other back surface of two insulating layers that are the outermost layers of two or more insulating layers. The plating film formed on the inner wall surface or the conductor filled in the hole is laminated on the front and back surfaces of one insulating layer, or on one surface and the other back surface of two insulating layers that are two or more outermost layers. The pattern wiring formed in the conductive layer is connected (see Patent Document 1).

JP 2006-351963 A

  By the way, in a printed circuit board having a multilayer structure, current consumption of driving components driven by electric power, such as an integrated circuit to be mounted, tends to increase, so that a power supply component having a large output is mounted. When a power supply component having a large output is mounted, as a noise countermeasure, it is required to reduce the impedance of a pattern wiring for supplying power from the power supply component to the drive component, for example, a power supply wiring and a GND wiring. The impedance can be reduced by increasing the cross-sectional areas of the power supply wiring and the GND wiring. Therefore, the power supply wiring and the GND wiring formed in one conductive layer are made thick (for example, 35 μm to 70 μm), the area of the power supply wiring and the GND wiring in one conductive layer is increased, It is also conceivable to increase the number of conductive layers in which the wiring for wiring and the wiring for GND are formed. However, if the thickness of one conductive layer is increased in order to increase the thickness of the power supply wiring and the GND wiring, the printed circuit board may be warped due to a difference from the thickness of the other conductive layer. Further, since not only the power supply wiring and the GND wiring but also the signal wiring becomes thick, it may be difficult to control the impedance of the signal wiring. Further, the increase in the area and the number of layers of the power supply wiring and the GND wiring may increase the size of the printed circuit board and increase the cost.

  In addition, in a multilayered printed circuit board, drive components and power supply components generate heat. Conventionally, various countermeasures have been taken, such as attaching a heat sink to a printed circuit board, air cooling with a fan, water cooling with a refrigerant, and the like. On the other hand, improvement in heat dissipation by a single printed circuit board is required.

  The present invention has been made in view of the above, and an object of the present invention is to propose a printed circuit board and a printed circuit board manufacturing method capable of at least either reducing impedance or improving heat dissipation.

  In order to solve the above-described problems and achieve the object, the present embodiment is a printed circuit board having a multilayer structure in which a plurality of insulating layers are stacked, from a transmission source component mounted on the printed circuit board to a transmission target. The transmission path is formed by drilling so that adjacent holes overlap each other in the insulating layer of the same layer, and the horizontal direction formed by communicating the holes in the horizontal direction. At least a part of the communication region is formed by overlapping two or more layers, and a transmission body that transmits at least one of heat and electricity is filled in the horizontal communication region.

  The printed circuit board and the printed circuit board manufacturing method according to the present invention have an effect that at least one of a reduction in impedance and an improvement in heat dissipation can be achieved.

FIG. 1 is a surface view of the printed circuit board according to the first embodiment. FIG. 2 is a cross-sectional view of the printed circuit board according to the first embodiment. FIG. 3 is a surface view of the printed circuit board when the printed circuit board is manufactured. FIG. 4 is a cross-sectional view of the printed circuit board when the printed circuit board is manufactured. FIG. 5 is an explanatory diagram of creating a transmission path when manufacturing a printed circuit board. FIG. 6 is a surface view of the printed circuit board at the time of manufacturing the printed circuit board. FIG. 7 is a cross-sectional view of the printed circuit board when the printed circuit board is manufactured. FIG. 8 is a back view of the printed circuit board at the time of manufacturing the printed circuit board. FIG. 9 is a surface view of the printed circuit board when the printed circuit board is manufactured. FIG. 10 is a cross-sectional view of the printed circuit board when the printed circuit board is manufactured. FIG. 11 is a surface view of the printed circuit board at the time of manufacturing the printed circuit board. FIG. 12 is a cross-sectional view of the printed circuit board when the printed circuit board is manufactured. FIG. 13 is a surface view of the printed circuit board at the time of manufacturing the printed circuit board. FIG. 14 is a cross-sectional view of the printed circuit board when the printed circuit board is manufactured. FIG. 15 is a surface view of the printed circuit board at the time of manufacturing the printed circuit board. FIG. 16 is a cross-sectional view of the printed circuit board when the printed circuit board is manufactured. FIG. 17 is a diagram illustrating a first modification of the printed circuit board according to the first embodiment. FIG. 18 is a diagram illustrating a second modification of the printed circuit board according to the first embodiment. FIG. 19 is a diagram illustrating a third modification of the printed circuit board according to the first embodiment. FIG. 20 is a diagram illustrating a fourth modification of the printed circuit board according to the first embodiment. FIG. 21 is a diagram illustrating a fifth modification of the printed circuit board according to the first embodiment. FIG. 22 is a diagram illustrating a sixth modification of the printed circuit board according to the first embodiment. FIG. 23 is a cross-sectional view of a printed circuit board according to the second embodiment. FIG. 24 is a diagram illustrating a modified example of the printed circuit board according to the second embodiment.

  Hereinafter, the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited by the following embodiment. In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art or those that are substantially the same.

Embodiment 1
FIG. 1 is a surface view of the printed circuit board according to the first embodiment. FIG. 2 is a cross-sectional view of the printed circuit board according to the first embodiment. 2 is a cross section taken along line A1-A1 of FIG.

  As shown in FIGS. 1 and 2, the printed circuit board 1A according to the embodiment includes a large number of electronic components (DDC (DC / DC converter) 10, IC (integrated circuit) 20, capacitor 30) and the like on the front surface 1a or the back surface 1b. The electronic circuit is configured by mounting by fixing to and mounting electrical wiring between the electronic components. The printed circuit board 1A has a multilayer structure, and electrical wiring is also provided between layers. The printed board 1A has a plurality of insulating layers 2 made of an insulating resin formed in a plate shape or a sheet shape, and the insulating layers 2 are laminated to form a multilayer structure.

  Each insulating layer 2 has a conductive layer 3 formed of a conductive metal material (for example, a material including at least one of copper, tin, lead, gold, etc.) on at least one of the front surface and the back surface. ing. In the printed circuit board 1 </ b> A, electrical wiring is applied to the conductive layer 3. The conductive layer 3 is formed as a wiring pattern capable of transmitting power, signals, etc. between electronic components. That is, the conductive layer 3 formed on at least one of the front surface and the back surface of each insulating layer 2 is desired not only on the front and back surfaces 1a and 1b of the printed board 1A but also between the plurality of stacked insulating layers 2. It is formed with a wiring pattern. As an example, the printed circuit board 1 </ b> A according to the present embodiment has 11 insulating layers stacked, and the conductive layer 3 (12 layers) is formed on all the front and back surfaces of each insulating layer 2. The multilayer structure of the printed circuit board 1A is not limited to this, and the number of stacked insulating layers 2 and the number of conductive layers 3 formed on the front and back surfaces of each insulating layer 2 are arbitrarily set.

  The printed circuit board 1A is formed with a transmission path 4A. The transmission path 4A is formed to transmit at least electricity from the power supply component to the drive component. As an example, the transmission path 4 </ b> A in the present embodiment connects the DDC 10 to the IC 20 and the capacitor 30 and supplies power from the DDC 10 to the IC 20 and the capacitor 30. That is, the transmission path 4A is used as a power supply wiring. The printed circuit board 1A is used as a GND wiring paired with the power supply wiring in a transmission path (not shown) different from the transmission path 4A used as the power supply wiring.

  Here, the DDC 10 is a power supply component among electronic components, and adjusts a DC voltage and supplies a current of the adjusted DC voltage to the IC 20 and the capacitor 30. That is, the DDC 10 is a power supply component that supplies power to the IC 20 and the capacitor 30, and is a transmission source component that generates (outputs) at least electricity. The IC 20 is a driving component among the electronic components, and is driven by being supplied with a direct current voltage adjusted by the DDC 10. That is, the IC 20 is a drive component that is driven by electric power, and is a transmission target to which at least electricity is transmitted from the DDC 10.

  The transmission path 4 </ b> A is formed by filling a conductor 42 in a horizontal direction communication region 41 formed in a plurality of insulating layers 2. The transmission path 4 </ b> A in the present embodiment is formed by overlapping at least two horizontal communication regions 41 (including 41 a to 41 k) formed in each insulating layer 2, and each horizontal communication region 41. Are filled with conductors 42 (including 42a to 42k). Thereby, the transmission path 4A is connected from the DDC 10 to the IC 20 and the capacitor 30, that is, the conductor 42 filled in the space formed in communication from the transmission source component to the transmission target.

  Each horizontal communication region 41 is formed by overlapping adjacent holes 5 in the same insulating layer 2. When the adjacent holes 5 are formed so as to overlap each other, the insulating layer 2 is not interposed between the adjacent holes 5 and the holes 5 communicate with each other. Therefore, each horizontal direction communication area | region 41 is formed because the holes 5 communicate in the horizontal direction. Each horizontal communication region 41 is formed by arranging a plurality of overlapping holes 5 in the same insulating layer 2. Here, the overlapping degree of the holes 5 is arbitrary. For example, when the outer periphery of the horizontal direction communication region 41 is flattened, the degree of overlap is increased and the number of holes 5 formed to form the horizontal direction communication region 41 is increased. The hole 5 is formed by drilling. As the drilling process, there are laser processing for forming a hole with a laser at a position corresponding to the horizontal direction communication region 41 of each insulating layer 2 and cutting processing for forming a hole with a drill. The drilling process may be performed on each insulating layer 2 or may be performed on a plurality of stacked insulating layers 2. When drilling a plurality of laminated insulating layers 2, all of the insulating layers 2 may be penetrated, or the intermediate layers may be penetrated without being penetrated. Furthermore, the diameter of the hole 5 formed by drilling is arbitrarily set. For example, the hole 5 is formed to be equal to or larger than the width of one wiring of the printed wiring.

  The conductor 42 is a transmission body and is made of a conductive metal material (for example, a material including at least one of copper, tin, lead, gold, and the like). The conductor 42 is filled in each horizontal communication area 41 and is interposed between the DDC 10, the IC 20 and the capacitor 30, and transmits at least electricity from the DDC 10 to the IC 20 and the capacitor 30.

  Next, a method for manufacturing the printed circuit board 1A according to the present embodiment will be described. 3, 6, 9, 11, 13, and 15 are surface views of the printed circuit board when the printed circuit board is manufactured. 4, FIG. 7, FIG. 10, FIG. 12, FIG. 14, and FIG. 16 are cross-sectional views of the printed circuit board when the printed circuit board is manufactured. FIG. 5 is an explanatory diagram of creating a transmission path when manufacturing a printed circuit board. FIG. 8 is a back view of the printed circuit board at the time of manufacturing the printed circuit board. 4, 7, 10, 12, 14, and 16 are cross sections taken along lines A <b> 2-A <b> 2 to A <b> 7-A <b> 7 in FIGS. 3, 6, 9, 11, 13, and 15, respectively. is there.

  In manufacturing the printed circuit board 1A, as shown in FIGS. 3 and 4, a base material 2a that becomes the insulating layer 2 when the printed circuit board 1A is completed is used. On the front and back surfaces of the substrate 2a, conductor foils (not shown) to be the conductive layers 3a and 3b are formed. First, a desired wiring pattern (not shown) is formed from the conductive foil to be the conductive layers 3a and 3b by etching. Next, the horizontal direction communication area | region 41a is formed in the base material 2a by drilling. Here, as shown in FIG. 5, the hole 5a is first formed in the base material 2a in the position which forms the horizontal direction communication area | region 41a. Next, the hole 5b is formed so as to overlap the hole 5a, and the hole 5a and the hole 5b are communicated. Next, the hole 5c is formed on the extension line connecting the hole 5a and the hole 5b so as to overlap the hole 5b, and the hole 5c is communicated with the hole 5c. Thereby, the holes 5a-5c adjacent to each other in one direction communicate with each other, and a horizontal direction communication region 41a extending in one direction is formed. Next, the horizontal communication region 41a is filled with the paste-like conductor 42a and cured. Here, the conductor 42a filled in the horizontal direction communication region 41a is not connected to the wiring pattern formed on the front and back surfaces of the substrate 2a.

Next, as shown in FIGS. 6, 7, and 8, base materials 2 b and 2 c that become the insulating layer 2 when completed are respectively laminated on the front and back surfaces of the base material 2 a. Conductive foils (not shown) to be the conductive layers 3c and 3d are formed on the front surface of the base material 2b and the back surface of the base material 2c, respectively. First, to form a horizontal communication area 41b ₁ overlap in the stacking direction and the horizontal direction communicating area 41a on the substrate 2b, and a horizontal communication area 41b _2. The horizontal direction communication region 41b ₁ has the same shape as the horizontal direction communication region 41a, and the horizontal direction communication region 41b ₂ is formed in a band shape by forming holes that overlap continuously in one direction and the other direction. Moreover, the horizontal direction communication area | region 41c which overlaps in the lamination direction with the horizontal direction communication area | region 41a is formed in the base material 2c. The horizontal direction communication area 41c has the same shape as the horizontal direction communication area 41a. Next, the base materials 2b and 2c are laminated on the base material 2a. Lamination of the substrates is performed by applying an insulating adhesive between the substrates, or by interposing an insulating resin between the substrates, and then heating and pressing the laminated substrates. There are things to do. Next, a desired wiring pattern (not shown) is formed from the conductive foil to be the conductive layers 3c and 3d by etching. Then, filling the horizontal communication area _41b 1, respectively pasty conductor _42b to 41b ₂ 1, 42b _2, cured (see FIG. 10). Further, the horizontal communication region 41c is filled with a paste-like conductor 42c and cured (see FIG. 10). Thus, the conductor 42a is connected to the conductor 42b ₁ and the conductor 42c. Here, the step of etching the conductive layer 3 and the step of filling and curing the conductor 42 with respect to the horizontal direction communication region 41 may be performed before and after. Further, the conductor 42b ₁ is not connected to the wiring pattern formed on the front and back surfaces of the base material 2b, and the conductor 42c is not connected to the wiring pattern formed on the front and back surfaces of the base material 2c. Therefore, the conductor 42a via a conductor 42b ₁ and the conductor 42c, not connected to the wiring patterns formed on the front and back surfaces of the substrate 2b and the substrate 2c. That is, the conductors 42 of the respective base materials 2 are not connected to the wiring patterns formed on the front and back surfaces of the other base materials 2 via the conductors 42 of the other base materials 2. The conductive layer 3 is not connected to the wiring pattern.

Next, as shown in FIGS. 9 and 10, base materials 2 d and 2 e that become the insulating layer 2 when completed are laminated on the front surface of the base material 2 b and the back surface of the base material 2 c, respectively. Conductive foils (not shown) to be the conductive layers 3e and 3f are formed on the front surface of the base material 2d and the back surface of the base material 2e, respectively. First, to form a horizontal direction communicating regions 41d ₁ overlap in the horizontal direction communicating region 41b ₁ to the stacking direction to the substrate 2d, and a horizontal communication region 41d ₂ overlapping in the horizontal direction communicating region 41b ₂ to the stacking direction. Horizontal communication region 41d ₁ is a horizontal communication area 41b ₁ and the same shape, the horizontal direction communicating region 41d ₂ is a horizontal communication area 41b ₂ the same shape. Moreover, the horizontal direction communication area | region 41e which overlaps in the lamination direction with the horizontal direction communication area | region 41c is formed in the base material 2e. The horizontal direction communication area 41e has the same shape as the horizontal direction communication area 41c. Next, the base materials 2d and 2e are laminated on the base materials 2b and 2c, respectively. Next, a desired wiring pattern (not shown) is formed from the conductive foil to be the conductive layers 3e and 3f by etching. Next, paste-like conductors 42d ₁ and 42d ₂ are filled in the horizontal direction communication regions 41d ₁ and 41d ₂ respectively and cured (see FIG. 12). Further, the horizontal communication region 41e is filled with a paste-like conductor 42e and cured (see FIG. 12). Thus, the conductor 42d ₁ and conductor 42b _1, conductor 42d ₂ and the conductor 42b _2, conductor 42e is connected to the conductor 42c.

Next, as shown in FIG. 11 and FIG. 12, base materials 2f and 2g, which become the insulating layer 2 when completed, are laminated on the front surface of the base material 2d and the back surface of the base material 2e, respectively. Conductive foils (not shown) to be the conductive layers 3g and 3h are formed on the front surface of the base material 2f and the back surface of the base material 2g, respectively. First, the horizontal communication region 41f ₁ overlap in the horizontal direction communicating regions 41d ₁ and horizontal communication region 41d ₂ to the stacking direction to the substrate 2f, the horizontal communication region 41f ₂ overlapping in the horizontal direction communicating region 41d ₂ to the stacking direction Form. The horizontal communication areas 41f ₁ and 41f ₂ are formed in a band shape. Moreover, the horizontal direction communication area | region 41g which overlaps in the lamination direction with the horizontal direction communication area | region 41e is formed in the base material 2g. The horizontal communication area 41g has the same shape as the horizontal communication area 41e. Next, the base materials 2f and 2g are laminated on the base materials 2d and 2e, respectively. Next, a desired wiring pattern (not shown) is formed from the conductive foil to be the conductive layers 3g and 3h by etching. Next, paste-like conductors 42f ₁ and 42f ₂ are filled in the horizontal direction communication regions 41f ₁ and 41f ₂ , respectively, and cured (see FIG. 14). Further, the horizontal communication region 41g is filled with a paste-like conductor 42g and cured (see FIG. 14). Thus, the conductor 42f ₁ and conductor _42d 1, 42d _2, the conductor 42f ₂ and conductor 42d _2, conductors 42g is connected to the conductor 42e.

Next, as shown in FIGS. 13 and 14, base materials 2 h and 2 i to be the insulating layer 2 when completed are laminated on the front surface of the base material 2 f and the back surface of the base material 2 g, respectively. Conductive foils (not shown) to be the conductive layers 3i and 3j are formed on the front surface of the substrate 2h and the back surface of the substrate 2i, respectively. First, to form a horizontal direction communicating area 41h ₁ overlap in the horizontal direction communicating region 41f ₁ to the stacking direction to the substrate 2h, and a horizontal communication area 41h ₂ overlapping in the horizontal direction communicating region 41f ₂ to the stacking direction. The horizontal direction communication areas 41h ₁ and 41h ₂ have the same shape as the horizontal direction communication areas 41f ₁ and 41f ₂ , respectively. Moreover, the horizontal direction communication area | region 41i which overlaps with the horizontal direction communication area | region 41g in a lamination direction is formed in the base material 2i. The horizontal direction communication area 41i has the same shape as the horizontal direction communication area 41g. Next, the base materials 2h and 2i are laminated on the base materials 2f and 2g, respectively. Next, a desired wiring pattern (not shown) is formed from the conductive foil to be the conductive layers 3i and 3j by etching. Next, paste-like conductors 42h ₁ and 42h ₂ are filled in the horizontal direction communication regions 41h ₁ and 41h ₂ respectively and are cured (see FIG. 16). Further, the horizontal communication region 41i is filled with a paste-like conductor 42i and cured (see FIG. 16). At this time, the conductor 42h ₁ and conductor 42f _1, conductor 42h ₂ The conductor 42f _2, the conductor 42i is connected to the conductor 42 g.

Next, as shown in FIGS. 15 and 16, base materials 2j and 2k that are to be the insulating layer 2 upon completion are laminated on the front surface of the base material 2h and the back surface of the base material 2i, respectively. Conductive foils (not shown) to be the conductive layers 3k and 3l are formed on the front surface of the substrate 2j and the back surface of the substrate 2k, respectively. First, to form a horizontal direction communicating area 41j ₁ overlap in the horizontal direction communicating area 41h ₁ the laminating direction to the substrate 2j, and a horizontal communication area 41j ₂ overlapping in the horizontal direction communicating area 41h ₂ the stacking direction. The horizontal direction communication areas 41j ₁ and 41j ₂ have the same shape as the horizontal direction communication areas 41h ₁ and 41h ₂ , respectively. Moreover, the horizontal direction communication area | region 41k which overlaps with the horizontal direction communication area | region 41i in a lamination direction is formed in the base material 2k. The horizontal communication area 41k has the same shape as the horizontal communication area 41i. Next, the base materials 2j and 2k are laminated on the base materials 2h and 2i, respectively. Next, a desired wiring pattern (not shown) is formed from the conductive foil to be the conductive layers 3k and 3l by etching treatment. Next, in a state of inserting the power supply terminal of the horizontal communication area 41j ₁ to IC 20, the pasty conductor 42j ₁ and filled to insert the power supply terminal (not shown) in the horizontal direction communicating area 41j ₂ to DDC10 In the state, the paste-like conductors 42j ₂ are filled and cured (see FIG. 2). Further, in a state where a power supply terminal (not shown) of the capacitor 30 is inserted into the horizontal communication region 41i, the paste-like conductor 42k is filled and cured (see FIG. 2). As a result, the DDC 10, the IC 20, and the capacitor 30 are connected to the conductor 42.

  As described above, the printed circuit board 1A according to the present embodiment has two or more horizontal communication areas 41 formed by communicating the holes 5 in the horizontal direction so as to overlap each horizontal communication area 41 with a conductor. The transmission path 4A filled with 42 connects from the DDC 10 to the IC 20 and the capacitor 30, that is, from the transmission source component to the transmission target. Accordingly, since the DDC 10 to the IC 20 and the capacitor 30 can be connected by the conductor 42 having at least the thickness of the insulating layer 2, the cross-sectional area of the conductor 42 is increased as compared with the case where they are connected by printed wiring or vias. be able to. Thereby, all the impedances from a transmission origin component to transmission object can be made small. In particular, the impedance can be reduced and noise can be reduced by using the transmission path 4A as a power supply wiring or a GND wiring from the power supply component to the drive component.

  In addition, since the cross-sectional area of the conductor 42 is increased in the stacking direction of the insulating layer 2, an increase in the horizontal area of the transmission path 4A is suppressed in order to ensure the cross-sectional area of the conductor 42. Accordingly, an increase in the area of the horizontal communication region 41 formed in the insulating layer 2 that becomes the front and back surfaces 1a and 1b of the printed circuit board 1A can be suppressed, so that the transmission path 4A is provided on the front and back surfaces 1a and 1b of the printed circuit board 1A. It is possible to suppress the influence on the arrangement of electronic components such as power supply components and drive components. Further, since the cross-sectional area of the conductor 42 is increased in the laminating direction of the insulating layer 2, the conductive layer is increased as in the case where the cross-sectional area of the power supply wiring and the GND wiring from the power supply component to the drive component is increased by the printed wiring. The cross-sectional area of the power supply wiring and the GND wiring can be increased without increasing the number of layers 3. As a result, an increase in the size of the printed circuit board 1A and an increase in cost can be suppressed.

  Moreover, since the conductor 42 has thermal conductivity as compared with the insulating layer 2, heat generated (output) by the power supply component and the drive component is transmitted. Therefore, the heat transferred to the conductor 42 is a gas that contacts the front and back surfaces 1a and 1b of the printed circuit board 1A from the conductor 42 filled in the horizontal communication area 41 exposed on the front and back surfaces 1a and 1b of the printed circuit board 1A. Is released into the air. Since the conductor 42 has a larger cross-sectional area than the printed wiring, more heat is transferred from the power supply component and the driving component than the printed wiring, and much heat is released to the air. It becomes. Thereby, the heat dissipation of 1 A of printed circuit boards can be improved.

  In addition, the arrangement position and the number of the printed circuit boards 1A of the power supply component and the driving component and the shape of the transmission path 4A in the present embodiment can be arbitrarily set. FIG. 17 is a diagram illustrating a first modification of the printed circuit board according to the first embodiment. FIG. 18 is a diagram illustrating a second modification of the printed circuit board according to the first embodiment. FIG. 19 is a diagram illustrating a third modification of the printed circuit board according to the first embodiment. FIG. 20 is a diagram illustrating a fourth modification of the printed circuit board according to the first embodiment. FIG. 21 is a diagram illustrating a fifth modification of the printed circuit board according to the first embodiment. FIG. 22 is a diagram illustrating a sixth modification of the printed circuit board according to the first embodiment.

  As shown in FIG. 17, most of the transmission path 4B of the printed circuit board 1B may be formed in the insulating layer 2 disposed inside the printed circuit board 1B. In this case, the area of the horizontal communication area 41 on the front and back surfaces 1a and 1b of the printed circuit board 1B can be reduced. Accordingly, it is possible to further suppress the influence on the arrangement of the electronic components.

  As shown in FIG. 18, the transmission path 4C of the printed circuit board 1C forms horizontal communication regions 41 that are separated from each other in the insulating layer 2 arranged inside the printed circuit board 1C. May be connected in parallel. Therefore, the cross-sectional area of the conductor 42 in the stacking direction of the entire printed circuit board 1C can be increased.

  Further, as shown in FIG. 19, the transmission path 4D of the printed circuit board 1D extends from the DDC 10 mounted on the back surface 1b of the printed circuit board 1D to the IC 20 mounted on the front surface 1a and the capacitor 30 mounted on the back surface 1b. You may connect.

  Further, as shown in FIG. 20, the transmission path 4E of the printed circuit board 1E may be connected from the DDC 10 to a plurality of ICs 20 mounted on the front surface 1a and a capacitor 30 mounted on the back surface 1b.

Further, as shown in FIG. 21, the DDC 10 to the IC 20 and the capacitor 30 of the printed circuit board 1F may be connected using _two transmission paths 4F ₁ and 4F ₂ . In this case, to form a transmission path 4F ₁ from DDC10 to IC20 in the horizontal direction communicating area 41 where the cross-sectional area of the conductor 42 is increased, the transmission path 4F ₂ from IC20 until the capacitor 30 has the cross-sectional area of the conductor 42 is reduced The horizontal communication area 43 is formed. In other words, transmission path 4F ₁ that connects the DDC10 which can supply a large current is required to IC20, from conductor 42 so as to be able to flow a large current, the cross-sectional area becomes large. On the other hand, in the transmission path 4F ₂ that connects the IC 20 to the capacitor 30 that is not required to pass a large current, the cross-sectional area of the conductor 42 is smaller than that of the transmission path 4F ₁ . The horizontal communication region 43 is preferably formed with a hole having a smaller diameter than the hole forming the horizontal communication region 41.

Further, as shown in FIG. 22, the DDC 10 to the IC 20 and the capacitor 30 of the printed circuit board 1G may be connected using _two transmission paths 4G ₁ and 4G ₂ . In this case, connects the DDC10 to transmission path 4G _1, a pad 44 having a different conductivity than the IC20 and connect a capacitor 30 in transmission path 4G _2, mounted pattern wiring conductor layer 3, transmission path 4G ₁ and 4G ₂ may be connected.

  The transmission path 4 in the first embodiment may be used as a signal wiring. In this case, transmission loss can be reduced.

[Embodiment 2]
Next, a printed circuit board according to the second embodiment will be described. FIG. 23 is a cross-sectional view of a printed circuit board according to the second embodiment. The printed circuit board 1H according to the second embodiment is different from the printed circuit board 1A according to the first embodiment in that what the transmission path 4H transmits is heat, not electricity. Since the basic configuration of the printed circuit board 1H according to the second embodiment is the same as that of the printed circuit board 1A according to the first embodiment, the description of the components having the same reference numerals is omitted or simplified.

  As shown in FIG. 23, the printed circuit board 1H according to the embodiment connects the heat generating component 40 to the surface 1a of the printed circuit board 1H through a transmission path 4H. The transmission path 4H is formed to transmit heat from the heat generating component 40 to air that is a gas that the printed circuit board 1H contacts. As an example, the transmission path 4H in the present embodiment connects the heat generating component 40 to the surface 1a of the printed circuit board 1H on which the end portions 4Ha and 4Hb of the transmission path 4H are formed, and the heat from the heat generating component 40 is the end portion. It transmits to the air which is a transmission object which 4Ha and 4Hb contact. That is, the transmission path 4H is used as a heat dissipation path.

  Here, the heat generating component 40 is an electronic component that generates heat, and includes power supply components and driving components such as the DDC 10, the IC 20, and the capacitor 30. That is, the heat generating component 40 is a transmission source component that generates (outputs) heat.

  The transmission path 4 </ b> H is formed by filling the horizontal communication region 41 formed in the plurality of insulating layers 2 with a heat radiator 45. In the present embodiment, the transmission path 4H is formed by overlapping at least two horizontal communication regions 41 formed in each of the insulating layers 2, and each horizontal communication region 41 is filled with a heat dissipation pair 45. Has been. Thereby, the transmission path 4H is connected by the heat dissipating body 45 filled in the space formed from the heat generating component 40 to the air, that is, from the transmission source component to the transmission target.

  The heat radiating body 45 is a transmission body, and is a material having thermal conductivity (a material having thermal conductivity at least as compared with the insulating layer 2, for example, silver, copper, gold, aluminum, brass, nickel, iron, platinum, Including at least one of stainless steel). The heat radiating body 45 is filled in each horizontal communication area 41 and is interposed between the heat generating component 40 and the air, and transfers heat from the heat generating component 40 to the air. Here, since the heat radiator 45 should just have thermal conductivity, it does not need to have electroconductivity.

  When the heat generating component 40 generates heat, the heat generated by the heat generating component 40 is transmitted to the heat radiating body 45 of the transmission path 4H, and the heat radiating body 45 is released to the air from the end portions 4Ha and 4Hb in contact with air. Unlike the transmission paths 4A to 4G and the printed wiring, the transmission path 4H is not for transmitting electricity but for transferring heat. Further, since the cross-sectional area is larger than that of the printed wiring, much heat is transmitted from the heat generating component 40 compared to the printed wiring, and much heat is released to the air. As a result, the heat dissipation of the printed circuit board 1A can be improved.

  In addition, the arrangement position and the number of the power supply components and the heat generating components 40 and the shape of the transmission path 4H in the present embodiment can be arbitrarily set. FIG. 24 is a diagram illustrating a modified example of the printed circuit board according to the second embodiment. As shown in FIG. 24, the transmission path 4I of the printed circuit board 1I may be connected from the heat generating component 40 to the air that contacts the front surface 1a by the end 4Ia and the air that contacts the back surface 1b by the end 4Ib.

  Moreover, in the said Embodiment 1, 2, and the modification, although transmission path 4A-4I is connected with the electronic component mounted in front and back 1a, 1b of printed circuit boards 1A-1I, it is limited to this Instead, it may be connected to electronic components mounted inside the printed boards 1A to 1I.

1A to 1I Printed circuit board 1a Front surface 1b Back surface 2, 2a to 2k Insulating layer 3, 3a to 3l Conductive layer 4A to 4I Transmission path 41, 41a to 41k, 43 Horizontal communication area 42, 42a to 42k Conductor 44 Pad 45 Heat radiator 5,5a ~ 5c hole 10 DDC
20 IC
30 Capacitor 40 Heating parts

Claims (4)

A printed circuit board having a multilayer structure in which a plurality of insulating layers are laminated,
A transmission path for connecting a transmission source component mounted on the printed circuit board to a transmission target;
The transmission path is
Drilling is performed so that adjacent holes overlap each other in the insulating layer of the same layer, and at least a part of the horizontal communication region formed by the holes communicating in the horizontal direction is overlapped by two or more layers. Formed,
A printed circuit board in which a transmission body for transmitting at least one of heat and electricity is filled in the horizontal communication region. The printed circuit board according to claim 1,
The transmission target is a driving component that is driven by power supplied from among electronic components,
The transmission source component is a power supply component that supplies power to the drive component among electronic components,
The transmission body is a conductor having at least conductivity,
Printed board. The printed circuit board according to claim 1,
The transmission source component is a heat generating component that generates heat among electronic components,
The transmission object is a gas that contacts the printed circuit board,
The transmission body is a thermal conductor having at least thermal conductivity.
Printed board. A method for producing a printed circuit board having a multilayer structure in which a plurality of insulating layers are laminated,
Forming a transmission path that connects a transmission source component mounted on the printed circuit board to a transmission target;
The step of forming the transmission path includes
Performing a drilling process so that adjacent holes overlap each other in the insulating layer of the same layer, forming the horizontal communication region in which the holes communicate with each other in the horizontal direction, and at least a portion overlaps with two or more layers;
Filling the horizontal communication region with at least one of heat and electricity,
including,
A method for manufacturing a printed circuit board.

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