JPH05152133A - Green sheet for inductance component and inductance component using thereof - Google Patents

Green sheet for inductance component and inductance component using thereof

Info

Publication number
JPH05152133A
JPH05152133A JP31053091A JP31053091A JPH05152133A JP H05152133 A JPH05152133 A JP H05152133A JP 31053091 A JP31053091 A JP 31053091A JP 31053091 A JP31053091 A JP 31053091A JP H05152133 A JPH05152133 A JP H05152133A
Authority
JP
Japan
Prior art keywords
conductor layer
inductance component
green sheet
layer
base film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31053091A
Other languages
Japanese (ja)
Inventor
Seiji Motojima
誠次 源島
Akihiko Ibata
昭彦 井端
Ryo Kimura
涼 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP31053091A priority Critical patent/JPH05152133A/en
Publication of JPH05152133A publication Critical patent/JPH05152133A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To realize small size and high integration of an inductance component wherein its heat-resistant property is excellent and it is small-sized and thin or having various kinds of modules using thereof. CONSTITUTION:A green sheet for inductance component is constituted as follows: a first conductor layer 2, a first insulator layer 3, a second conductor layer 4 and a second insulator layer 5 are laminated on a base film 1 by using printing operation; one end of an electrode of the first conductor layer 2 is connected with one end of an electrode of the second conductor layer 4; and a coil is formed. When the green sheet is laminated by a thermal transfer method and baked, it is possible to obtain a high-accuracy inductance component whose surface is flat and in which a printing pattern is not dislocated. Since the surface is flat, it is possible to realize a module in which other functional components can be laminated easily and which has been highly integrated.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、インダクタンス部品用
グリーンシートおよびそれを用いたインダクタンス部品
に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inductance component green sheet and an inductance component using the same.

【0002】[0002]

【従来の技術】近年、電子機器の小型化、高密度化の要
求からインダクタンス部品の小型化、薄型化および他の
機能部品との複合化による高集積化が進められている。
2. Description of the Related Art In recent years, the miniaturization and high density of electronic equipment have led to the miniaturization and thinning of inductance components and the combination with other functional components for higher integration.

【0003】従来、絶縁被覆された導線を巻回した巻線
型インダクタンス部品が種々知られているが、これらは
小型化、薄型化に対して限界があるため、最近では、絶
縁体層と導体層とを交互に印刷して多層に積層すること
により、絶縁体中に導体パターンを形成した印刷法によ
る積層型インダクタンス部品が提案されている。
Conventionally, various wound-type inductance components in which a conductive wire covered with an insulating coating is wound are known. However, since these have a limit to miniaturization and thinning, recently, an insulating layer and a conductor layer are used. There has been proposed a laminated inductance component by a printing method in which a conductor pattern is formed in an insulator by alternately printing and laminating in multiple layers.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、このよ
うな積層型インダクタンス部品においては、絶縁体層と
導体層とを交互に印刷して多層積み重ねていくと、導体
層の印刷パターンによる凹凸が蓄積されて次に印刷しよ
うとする表面の凹凸が大きくなり、印刷パターンにずれ
が発生するという問題点があった。また、特にセラミッ
ク基板上に厚膜抵抗器や厚膜コンデンサとともにインダ
クタンス部品を形成して複合化された各種モジュールを
作製しようとしたとき、上記のずれの発生のため、材質
の異なるものを精度よく印刷して多層積層することは極
めて困難であり、高集積化されたモジュールを実現する
ことは非常に難しいという問題点があった。
However, in such a laminated type inductance component, when the insulating layers and the conductor layers are alternately printed and stacked in layers, irregularities due to the printed pattern of the conductor layers are accumulated. As a result, the unevenness of the surface to be printed next becomes large, and there is a problem in that the print pattern shifts. In addition, especially when trying to manufacture various composite modules by forming inductance components together with thick film resistors and thick film capacitors on a ceramic substrate, it is possible to use different materials with high accuracy because of the above deviation. There is a problem that it is extremely difficult to print and laminate in multiple layers, and it is very difficult to realize a highly integrated module.

【0005】本発明は上記問題点を解決するもので、印
刷パターンのずれの発生を抑え、高精度のインダクタン
ス部品や高集積化されたモジュールが実現できるインダ
クタンス部品用グリーンシート(以下単にグリーンシー
トと記す)およびそれを用いたインダクタンス部品を提
供することを目的とする。
The present invention solves the above-mentioned problems, and prevents the deviation of the print pattern and realizes a high-precision inductance component or a highly integrated module green sheet for inductance components (hereinafter simply referred to as a green sheet). (Note) and an inductance component using the same.

【0006】[0006]

【課題を解決するための手段】上記の目的を達成するた
めに本発明は、ベースフィルムと、そのベースフィルム
上に印刷された第1の導体層およびその第1の導体層を
覆う第1の絶縁体層と、その第1の絶縁体層上に印刷さ
れた第2の導体層およびその第2の導体層を覆う第2の
絶縁体層とからなり、前記第1の導体層の電極の一端と
前記第2の導体層の電極の一端とが接続されてコイルを
なしている構成のグリーンシートである。
In order to achieve the above object, the present invention provides a base film, a first conductor layer printed on the base film, and a first conductor layer covering the first conductor layer. An insulator layer, a second conductor layer printed on the first insulator layer, and a second insulator layer covering the second conductor layer, and an electrode of the first conductor layer. The green sheet has a structure in which one end is connected to one end of the electrode of the second conductor layer to form a coil.

【0007】また、セラミック基板上に接着層を介して
前記グリーンシートを設置し、そのベースフィルム上か
ら加圧した後前記ベースフィルムを剥離し、さらに焼成
してインダクタンス部品としたものである。
Further, the green sheet is placed on a ceramic substrate via an adhesive layer, the base film is pressed, the base film is peeled off, and the green sheet is further fired to form an inductance component.

【0008】[0008]

【作用】この構成により、上記グリーンシートは4層構
造の薄い印刷積層体であるので表面が平坦であり、その
ベースフィルム上からの加圧およびベースフィルムの剥
離を繰り返して多層の積層体を作製し、その後焼成して
得られるインダクタンス部品においても、その表面が平
坦で印刷パターンのずれがほとんどない高精度のものと
なる。特に、ベースフィルムの周辺部の所定位置に穴等
を設け、この穴を利用して位置決めしながら積層を繰り
返した場合は、ずれのないより高精度のインダクタンス
部品が得られる。
With this structure, since the green sheet is a thin printed laminate having a four-layer structure, the surface is flat, and pressure and peeling of the base film from the base film are repeated to produce a multilayer laminate. However, even in the case of an inductance component obtained by subsequent firing, the surface thereof is flat and highly accurate with almost no deviation of the printing pattern. In particular, when a hole or the like is provided at a predetermined position in the peripheral portion of the base film and the lamination is repeated while positioning using the hole, it is possible to obtain a higher-precision inductance component having no deviation.

【0009】また、上記の多層の積層体の上に厚膜抵抗
器等を印刷してモジュールを作製する場合も、積層体の
表面が平坦であるため容易に複合化でき、高集積化され
たモジュールを得ることができる。
Also, when a module is manufactured by printing a thick film resistor or the like on the above-mentioned multi-layered laminate, the surface of the laminated body is flat so that it can be easily compounded and highly integrated. You can get the module.

【0010】[0010]

【実施例】【Example】

(実施例1)以下、本発明の第1の実施例について、図
面を参照しながら説明する。
(Embodiment 1) Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

【0011】図1(a)および(b)は本発明の第1の
実施例におけるグリーンシートの正面断面図および平面
図を示したものである。ここで、1は印刷支持体となる
ベースフィルム、2および4は第1および第2の導体
層、3および5は第1および第2の絶縁体層、6および
7は第2の導体層における端子電極およびコイル状電極
である。また、図2に印刷時に用いた各印刷パターンを
示す。図2において、(a)および(c)は第1の導体
層および第2の導体層の印刷パターン、(b)および
(d)は第1の絶縁体層および第2の絶縁体層の印刷パ
ターンである。
1 (a) and 1 (b) are a front sectional view and a plan view of a green sheet according to a first embodiment of the present invention. Here, 1 is a base film used as a printing support, 2 and 4 are first and second conductor layers, 3 and 5 are first and second insulator layers, and 6 and 7 are second conductor layers. A terminal electrode and a coil electrode. Further, FIG. 2 shows each printing pattern used at the time of printing. In FIG. 2, (a) and (c) are printing patterns of the first conductor layer and the second conductor layer, and (b) and (d) are printing of the first insulator layer and the second insulator layer. It is a pattern.

【0012】次に、本実施例におけるグリーンシートの
作製手順について説明する。まず、印刷支持体となるベ
ースフィルム1上に、銀を主成分とする電極ペーストを
図2(a)の印刷パターンを用いてスクリーン印刷法に
より厚さ15μmの第1の導体層2を形成した。次に、
アルミナとホウケイ酸鉛ガラスが重量比で6:4のガラ
ス粉末100重量部に対し、ブチラール樹脂8重量部、
ブチルカルビトール24重量部、ブチルベンジルフタレ
ート4重量部を配合し、これらを三本ロールを用いて混
練して絶縁体ペーストを作製した。このペーストを第1
の導体層2を覆うようにベースフィルム1上に図3
(b)の印刷パターンをスクリーン印刷して厚さ30μ
mの第1の絶縁体層3を形成した。次に、第1の絶縁体
層3上に第1の導体層2と同様の電極ペーストを図3
(c)の印刷パターンを用いてスクリーン印刷により厚
さ15μmの第2の導体層4を形成し、さらに第1の絶
縁体層3と同様のペーストを図3(d)の印刷パターン
を用いてスクリーン印刷により厚さ30μmの第2の絶
縁体層5を形成した。このようにして1シートあたり1
コイルを有するグリーンシートを作製した。なお、第1
の導体層2および第2の導体層4の両者のコイル状電極
間の電気的接続は、第1の導体層2を形成した後第1の
絶縁体層3を印刷するときに第1の導体層2のほぼ中心
部には絶縁体が印刷されないようにしておいて第2の導
体層4を印刷することで接続がなされる。本実施例で
は、このように、印刷パターンにより第1の導体層2お
よび第2の導体層4の接続を行っているが、パンチング
あるいはレーザーによる穿孔を行ってスルーホールによ
りこれらの導体層間の接続を行ってもかまわない。ま
た、これらの絶縁体層としては電気的絶縁性の高いも
の、電極材料としては銀、銀−パラジウム、銅、金など
電気抵抗の低い材料であればかまわない。
Next, the procedure for producing the green sheet in this embodiment will be described. First, a 15 μm-thick first conductor layer 2 was formed on a base film 1 serving as a printing support by a screen printing method using an electrode paste containing silver as a main component by using the printing pattern of FIG. .. next,
Alumina and lead borosilicate glass are 8 parts by weight of butyral resin to 100 parts by weight of glass powder with a weight ratio of 6: 4.
24 parts by weight of butyl carbitol and 4 parts by weight of butyl benzyl phthalate were mixed, and these were kneaded using a triple roll to prepare an insulating paste. This paste first
3 on the base film 1 so as to cover the conductor layer 2 of FIG.
Screen printing the print pattern of (b) to a thickness of 30μ
m of the first insulator layer 3 was formed. Next, an electrode paste similar to that for the first conductor layer 2 is formed on the first insulator layer 3 as shown in FIG.
A second conductor layer 4 having a thickness of 15 μm is formed by screen printing using the print pattern of (c), and a paste similar to that of the first insulator layer 3 is used using the print pattern of FIG. 3 (d). A second insulating layer 5 having a thickness of 30 μm was formed by screen printing. In this way, 1 per sheet
A green sheet having a coil was produced. The first
The electrical connection between the coil-shaped electrodes of both the conductor layer 2 and the second conductor layer 4 of the first conductor is formed when the first insulator layer 3 is printed after forming the first conductor layer 2. The connection is made by printing the second conductor layer 4 leaving the insulator unprinted approximately in the center of the layer 2. In this embodiment, the first conductor layer 2 and the second conductor layer 4 are connected by the print pattern as described above. However, punching or laser perforation is performed to connect these conductor layers by through holes. I don't mind if you go. Further, these insulator layers may have a high electric insulation property, and the electrode material may be a material having a low electric resistance such as silver, silver-palladium, copper or gold.

【0013】(実施例2)次に、本発明の第2の実施例
におけるインダクタンス部品について、図3の焼成前の
インダクタンス部品の断面図を用いて説明する。
(Embodiment 2) Next, an inductance component according to a second embodiment of the present invention will be described with reference to the sectional view of the inductance component before firing shown in FIG.

【0014】まず、アルミナ基板8上に、アルミナとホ
ウケイ酸鉛ガラスが重量比で6:4のガラス粉末100
重量部、ブチラール樹脂12重量部、ブチルカルビトー
ル24重量部、ブチルベンジルフタレート8重量部を配
合し、これらを三本ロールを用いて混練したペーストを
用いてスクリーン印刷により接着層9を形成した。次
に、接着層9上に前記のグリーンシートを熱転写法、す
なわち、加熱プレス機を用いて前記グリーンシートのベ
ースフィルムの上から金型表面の温度を150℃、圧力
120kg/cm2、加圧時間30秒の条件で熱プレスし、
その後ベースフィルムを剥離した。次に、これを大気中
でバインダ除去のため440℃で途中30分保持した
後、850℃で2時間保持して焼成を行いインダクタン
ス部品を作製した。
First, on an alumina substrate 8, a glass powder 100 in which alumina and lead borosilicate glass are in a weight ratio of 6: 4.
By weight, 12 parts by weight of butyral resin, 24 parts by weight of butyl carbitol, and 8 parts by weight of butyl benzyl phthalate were mixed, and an adhesive layer 9 was formed by screen printing using a paste obtained by kneading these with a triple roll. Next, the green sheet is heat-transferred onto the adhesive layer 9, that is, the temperature of the mold surface is 150 ° C., the pressure is 120 kg / cm 2 , and the pressure is applied from above the base film of the green sheet using a heating press. Heat press under the condition of time 30 seconds,
After that, the base film was peeled off. Next, this was held at 440 ° C. for 30 minutes in the air to remove the binder in the air, and then held at 850 ° C. for 2 hours to be fired to manufacture an inductance component.

【0015】上述の本実施例のインダクタンス部品は、
導体層と絶縁体層とが交互に合計4層積み重ねて形成さ
れているため薄型であり、その表面の凹凸もほとんどな
い。また、絶縁体層と導体層は焼成物で構成されている
ため耐熱性に優れたインダクタンス部品である。なお、
本実施例ではセラミック基板にグリーンシートを1枚の
み転写しているが、任意の枚数のグリーンシートを転写
することにより、コイルの並列接続あるいは直列接続も
可能であり、かつ表面が平坦で印刷パターンのずれのな
い多層積層のインダクタンス部品が得られる。
The inductance component of this embodiment described above is
Since the conductor layers and the insulator layers are alternately stacked and formed in total of four layers, the conductor layer and the insulator layer are thin and have almost no surface irregularities. Moreover, since the insulator layer and the conductor layer are made of a fired product, the inductance component is excellent in heat resistance. In addition,
In this embodiment, only one green sheet is transferred to the ceramic substrate, but by transferring an arbitrary number of green sheets, the coils can be connected in parallel or in series and the surface has a flat print pattern. A multilayer laminated inductance component having no deviation can be obtained.

【0016】[0016]

【発明の効果】以上の説明から明らかなように本発明
は、ベースフィルム上に導体層および絶縁体層を各2層
積層し、かつ導体層間を接続してコイルを形成したグリ
ーンシートを1枚以上用いてセラミック基板上に転写
し、焼成することにより、表面が平坦で小型、薄型のイ
ンダクタンス部品を実現したものである。さらに、本発
明のグリーンシートを用いた場合は、表面が平坦である
ため印刷パターンのずれが起り難く、厚膜抵抗器等との
複合化が容易で高集積化されたモジュールが容易に実現
できる。
As is apparent from the above description, the present invention is one green sheet in which a conductor layer and an insulator layer are laminated on a base film, and two conductor layers are connected to each other and a coil is formed by connecting the conductor layers. By using the above-mentioned method, it is transferred onto a ceramic substrate and fired to realize a small and thin inductance component having a flat surface. Furthermore, when the green sheet of the present invention is used, since the surface is flat, deviation of the printed pattern does not easily occur, and it can be easily combined with a thick film resistor or the like to easily realize a highly integrated module. ..

【図面の簡単な説明】[Brief description of drawings]

【図1】(a)は本発明の第1の実施例におけるグリー
ンシートの正面断面図 (b)は同グリーンシートの平面図
FIG. 1A is a front sectional view of a green sheet according to a first embodiment of the present invention, and FIG. 1B is a plan view of the green sheet.

【図2】(a)は本発明の第1の実施例における第1の
導体層の印刷パターン図 (b)は同第1の絶縁体層の印刷パターン図 (c)は同第2の導体層の印刷パターン図 (d)は同第2の絶縁体層の印刷パターン図
2A is a print pattern diagram of a first conductor layer in the first embodiment of the present invention, FIG. 2B is a print pattern diagram of the same first insulator layer, and FIG. 2C is a second conductor diagram thereof. Print pattern diagram of layer (d) is a print pattern diagram of the same second insulator layer

【図3】本発明の第2の実施例におけるインダクタンス
部品の焼成前の断面図
FIG. 3 is a sectional view of an inductance component according to a second embodiment of the present invention before firing.

【符号の説明】[Explanation of symbols]

1 ベースフィルム 2 第1の導体層 3 第1の絶縁体層 4 第2の導体層 5 第2の絶縁体層 6 端子電極 7 コイル状電極 8 セラミック基板 9 接着層 1 Base Film 2 1st Conductor Layer 3 1st Insulator Layer 4 2nd Conductor Layer 5 2nd Insulator Layer 6 Terminal Electrode 7 Coiled Electrode 8 Ceramic Substrate 9 Adhesive Layer

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】ベースフィルムと、そのベースフィルム上
に印刷された第1の導体層およびその第1の導体層を覆
う第1の絶縁体層と、その第1の絶縁体層上に印刷され
た第2の導体層およびその第2の導体層を覆う第2の絶
縁体層とからなり、前記第1の導体層の電極の一端と前
記第2の導体層の電極の一端とが接続されてコイルをな
しているインダクタンス部品用グリーンシート。
1. A base film, a first conductor layer printed on the base film, a first insulator layer covering the first conductor layer, and a first insulator layer printed on the first insulator layer. A second conductor layer and a second insulator layer covering the second conductor layer, and one end of the electrode of the first conductor layer and one end of the electrode of the second conductor layer are connected to each other. Green sheet for inductance parts that forms a coil.
【請求項2】セラミック基板上に接着層を介して請求項
1記載のインダクタンス部品用グリーンシートを設置
し、そのベースフィルム上から加圧した後前記ベースフ
ィルムを剥離し、さらに焼成してなるインダクタンス部
品。
2. An inductance obtained by placing the green sheet for an inductance component according to claim 1 on a ceramic substrate via an adhesive layer, pressing the base film, peeling off the base film, and further firing. parts.
JP31053091A 1991-11-26 1991-11-26 Green sheet for inductance component and inductance component using thereof Pending JPH05152133A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31053091A JPH05152133A (en) 1991-11-26 1991-11-26 Green sheet for inductance component and inductance component using thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31053091A JPH05152133A (en) 1991-11-26 1991-11-26 Green sheet for inductance component and inductance component using thereof

Publications (1)

Publication Number Publication Date
JPH05152133A true JPH05152133A (en) 1993-06-18

Family

ID=18006347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31053091A Pending JPH05152133A (en) 1991-11-26 1991-11-26 Green sheet for inductance component and inductance component using thereof

Country Status (1)

Country Link
JP (1) JPH05152133A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5783879A (en) * 1997-06-03 1998-07-21 Eastman Kodak Company Micromotor in a ceramic substrate
JP2007180428A (en) * 2005-12-28 2007-07-12 Murata Mfg Co Ltd Electronic component and method for manufacturing the same
CN111063659A (en) * 2019-11-28 2020-04-24 福建省福联集成电路有限公司 Passive device with double-layer structure and manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5783879A (en) * 1997-06-03 1998-07-21 Eastman Kodak Company Micromotor in a ceramic substrate
JP2007180428A (en) * 2005-12-28 2007-07-12 Murata Mfg Co Ltd Electronic component and method for manufacturing the same
CN111063659A (en) * 2019-11-28 2020-04-24 福建省福联集成电路有限公司 Passive device with double-layer structure and manufacturing method

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