JPS63170093A - Screen for solder printing - Google Patents
Screen for solder printingInfo
- Publication number
- JPS63170093A JPS63170093A JP36487A JP36487A JPS63170093A JP S63170093 A JPS63170093 A JP S63170093A JP 36487 A JP36487 A JP 36487A JP 36487 A JP36487 A JP 36487A JP S63170093 A JPS63170093 A JP S63170093A
- Authority
- JP
- Japan
- Prior art keywords
- screen
- pattern
- plate
- depth
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 25
- 238000007639 printing Methods 0.000 title claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 4
- 238000005516 engineering process Methods 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 abstract 3
- 229910000831 Steel Inorganic materials 0.000 abstract 1
- 239000003995 emulsifying agent Substances 0.000 abstract 1
- 238000005201 scrubbing Methods 0.000 abstract 1
- 239000010959 steel Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 239000000839 emulsion Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- IDCBOTIENDVCBQ-UHFFFAOYSA-N TEPP Chemical compound CCOP(=O)(OCC)OP(=O)(OCC)OCC IDCBOTIENDVCBQ-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/247—Meshes, gauzes, woven or similar screen materials; Preparation thereof, e.g. by plasma treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Textile Engineering (AREA)
- Printing Plates And Materials Therefor (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本考案は、セラミック基板またはプリント配線板上に回
路部品を表面実装するために、はんだペーストをスクリ
ーン印刷するのに用いる、はんだペースト供給位置精度
が高く、寿命が長く、信頼性の高いはんだ印刷用スクリ
ーンに関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to solder paste supply position accuracy used in screen printing of solder paste for surface mounting circuit components on ceramic substrates or printed wiring boards. This invention relates to a solder printing screen that has high durability, long life, and high reliability.
従来一般に、スクリーン印刷技術によって回路基板上に
配線パターンを印刷するスクリーンには、ポリエステル
繊維（例えば日本商品名テトロン）等の布またはステン
レス等の金網の上に、感光乳剤を塗布し、写真製版法に
よってマスク化したものや、第２図に示すように、エツ
チング等によりパターン部１を素抜は状に形成した金属
板２を、ポリエステル繊維布またはステンレスの金網３
の下に接着剤４で貼り付けた所謂サスペンドメタル方式
スクリーンがある。Conventionally, in order to print wiring patterns on circuit boards using screen printing technology, a photosensitive emulsion is coated on cloth such as polyester fiber (for example, Japanese product name Tetron) or wire mesh such as stainless steel, and photolithography is used. As shown in FIG.
There is a so-called suspended metal screen attached with adhesive 4 below.
配線パターンが印刷された回路基板上に、部品をはんだ
付は実装するのに必要なはんだペーストを供給するはん
だ印刷用スクリーンは、他の通常の印刷用スクリーンと
は違って、ペースト供給量を実装部品により対応し、且
つ安定な供給をしなければならない。Solder printing screens supply the necessary solder paste to solder and mount components on circuit boards printed with wiring patterns, and unlike other ordinary printing screens, the amount of paste supplied is Parts must be more compatible and have a stable supply.
ペースト供給量は、ペースト開口の大小およびスクリー
ンの厚さにより制御するが、一般にはスクリーンの厚さ
によって制御する。このため、はんだ印刷用スクリーン
は、他の配線パターン印刷用スクリーンの厚さの３〜５
倍の厚さが必要であり、従来は、乳剤スクリーンでは厚
さに限度があるため、金属板に単に素抜は状パターン部
を設けたものや、第２図に示したサスペンドメタル方式
のものが使用されて来た。The amount of paste supplied is controlled by the size of the paste openings and the thickness of the screen, and is generally controlled by the thickness of the screen. For this reason, the solder printing screen is 3 to 5 times thicker than other wiring pattern printing screens.
Conventionally, emulsion screens have a limit to their thickness, so they have been made by simply providing a bare striped pattern on a metal plate, or by using the suspended metal method shown in Figure 2. has been used.
なお、サスペンドメタル方式に関しては、例えば実開昭
４７−２６００２号公報、実開昭４８−４０４４号公報
等に記載されている。The suspended metal method is described in, for example, Japanese Utility Model Application Publication No. 47-26002 and Japanese Utility Model Application Publication No. 48-4044.
上記従来の技術によるはんだ印刷用スクリーンは、微細
パターンへのはんだペーストの安定供給手段やスクリー
ンの長寿命化についての配慮が不足しており、実装後の
回路基板の性能や信頼性にも問題が生じていた。The conventional solder printing screens described above lack consideration for the stable supply of solder paste to fine patterns and the long life of the screen, and there are also problems with the performance and reliability of the circuit board after mounting. was occurring.
本考案は、上記従来の技術によるはんだ印刷用スクリー
ンの問題点を解決し、微細なパターンを含め所望のパタ
ーン位置に正確に安定してはんだペーストを供給するこ
とができ、しかも長寿命なはんだ印刷用スクリーンを供
給することを目的とする。The present invention solves the problems of the solder printing screen with the conventional technology described above, can accurately and stably supply solder paste to the desired pattern position, including fine patterns, and has a long service life. The purpose is to supply screens for
上記問題点を解決するために本考案においては、サスペ
ンドメタル方式スクリーンを１枚の金属板のみで形成し
、このスクリーンのパターン部を、一方の面から板厚の
ほぼ半分の深さを素抜は状に、他方の面から板厚残余の
ほぼ半分の深さを網目状に形成することにした。In order to solve the above problems, in the present invention, a suspended metal screen is formed of only one metal plate, and the pattern part of this screen is cut out from one side to a depth of approximately half the thickness of the screen. It was decided to form a mesh shape from the other side to a depth of approximately half of the remaining plate thickness.
また、上記素抜は状に形成したパターン部の内部の一部
に、柱状に金属部分を残留させると、一層良好な結果が
得られる。Moreover, even better results can be obtained if a columnar metal portion is left in a part of the interior of the pattern portion formed in the blank shape.
上記のようにスクリーンを形成すれば、スクリーンの寿
命が長くなり、またパターンの素抜は状部内部の一部に
、柱状に金属部分を残すと、この残った金属部分が補強
材として作用し、印刷の際にスキージ圧が加わったとき
でも微細パターン部に変形が生ぜず、安定したペースト
供給作用が行える。If the screen is formed as described above, the life of the screen will be extended, and if the blank part of the pattern is left with a metal part in the shape of a column, this remaining metal part will act as a reinforcing material. Even when squeegee pressure is applied during printing, no deformation occurs in the fine pattern portion, and a stable paste supply action can be performed.
第１図（ａ）は本考案第１実施例の断面図で、図中、５
は本考案に係る１枚の金属板たとえば厚さ０．２〜０．
５ｎｙｎの銅板で形成されたスクリーン、６は下面（回
路基板に接する側の面）から板厚のほぼ半分の厚さまで
形成させた素抜は状パターン、７は上面（この上にはん
だペーストを載せ、スキージで擦ってはんだペーストを
押し出させる）から板厚残余のほぼ半分の厚さまで形成
させた網内（メツシュ）状パターンである。これらのパ
ターンは、感光乳剤を銅板表面に塗布し公知の手法を用
いてマスク化したのち、エツチング加工により形成する
。FIG. 1(a) is a sectional view of the first embodiment of the present invention.
is one metal plate according to the present invention, for example, with a thickness of 0.2 to 0.
The screen is made of a 5nyn copper plate, 6 is a blank strip pattern formed from the bottom surface (the side that contacts the circuit board) to approximately half the thickness of the board, and 7 is the top surface (on which the solder paste is placed) This is a mesh-like pattern formed by rubbing with a squeegee to extrude the solder paste to approximately half the thickness of the remaining board thickness. These patterns are formed by applying a photosensitive emulsion onto the surface of a copper plate and forming a mask using a known method, followed by etching.
また、第１図（ｂ）は本考案第２実施例の断面図で、５
は１枚の金属板よりなるスクリーン、６′は内部に柱状
に補強用金属部分８を残した素抜は状パターン、７は網
目状パターン、９はスキージ、１０は回路基板、１１は
印刷されたはんだランドである。FIG. 1(b) is a cross-sectional view of the second embodiment of the present invention.
1 is a screen made of a single metal plate, 6' is a plain strip pattern with pillar-shaped reinforcing metal parts 8 left inside, 7 is a mesh pattern, 9 is a squeegee, 10 is a circuit board, and 11 is a printed pattern. It is a solder land.
本考案を実施すると、素抜はパターンと網目パターンの
両方が、１枚の金属板で形成されているから、布や金網
に別に素抜はパターンを形成させた金属板を接着して作
成した従来のスクリーンに比べて、寿命が長くなる。When the present invention is implemented, since both the pattern and the mesh pattern are formed on a single metal plate, the pattern can be created by gluing a metal plate on which the pattern has been formed separately to cloth or wire mesh. Longer lifespan than traditional screens.
また、素抜はパターン６′に柱状に金属部分８を残して
おくと、印刷の際、スキージ９の圧力が加わってもパタ
ーン６′が変形せず、はんだペーストを回路基板１０上
のはんだランド１１に安定して供給することができ、パ
ターンの微細部分まで高い精度で印刷できる。In addition, by leaving a pillar-shaped metal part 8 on the pattern 6' during blanking, the pattern 6' will not be deformed even if pressure from the squeegee 9 is applied during printing, and the solder paste will be transferred to the solder land on the circuit board 10. 11, and it is possible to print even the minute parts of the pattern with high precision.
以上説明したように本考案によれば、セラミック基板ま
たはプリント配線板の回路基板に、回路構成や部品装着
に対応したはんだペーストを高い精度で供給することが
でき、部品実装した回路基板の性能向上、信頼性向上の
効果が得られ、更にスクリーン寿命が長くなって経済的
にも大きな効果が得られる。As explained above, according to the present invention, solder paste corresponding to the circuit configuration and component mounting can be supplied with high precision to a circuit board such as a ceramic board or a printed wiring board, thereby improving the performance of the circuit board on which components are mounted. , the effect of improving reliability can be obtained, and the life of the screen can also be extended, resulting in a large economical effect.
第１図（ａ）は本考案第１実施例の断面図、第１図（ｂ
）は本考案第２実施例の断面図、第２図は従来のサスペ
ンドメタル方式スクリーンの断面図である。
２・・・金属板、３・・・金網、４・・接着剤、５・・
・本考案に係るスクリーン、６・・・素抜はパターン、
７・・・網目状パターン、８・・・柱状金属部分、９・
・・スキージ、１０・・・回路基板、１１・・・はんだ
ランド。
躬 １ 目
（ｂ）
一／−
第 ２ｎ
ｒ７＾
２−金属板
３０．金網
４−＃１剤
５・・・２卜−レ埼５ｉミｌ＝ブ秀ミシトス７゛ノーン
乙・・−幸Ｊｔ１７Ｉぐ２−ツ
アー・−、ネジ目状ノマツーン
８−１０社伍菅ＡＯ分
９−・スキージ
１０、−・回跨基攻
／Ｉ・−＋Ｚんた“ランドFIG. 1(a) is a sectional view of the first embodiment of the present invention, FIG. 1(b)
) is a sectional view of the second embodiment of the present invention, and FIG. 2 is a sectional view of a conventional suspended metal screen. 2...Metal plate, 3...Wire mesh, 4...Adhesive, 5...
・Screen according to the present invention, 6...The blank is a pattern,
7...Mesh pattern, 8...Columnar metal part, 9.
... Squeegee, 10... Circuit board, 11... Solder land. Mistake 1st (b) 1/- 2nd n r7^ 2-Metal plate 30. Wire mesh 4-#1 agent 5...2 vol. 5i mil=buhide misitos 7゛none otsu...-sachi Jt17Igu2-tour--, screw-shaped nomatoon 8-10 Shago Suga AO minute 9-・Squeegee 10,-・Rotate base attack/I・-+Z-nta “land”
Claims (1)
、回路部品実装用はんだペーストを、スクリーン印刷技
術により塗布するためのはんだ印刷用スクリーンにおい
て、はんだ印刷用スクリーンとして公知のサスペンドメ
タル方式スクリーンを１枚の金属板のみで形成し、この
スクリーンのパターン部を、一方の面から板厚のほぼ半
分の深さを素抜け状に、他方の面から板厚残余のほぼ半
分の深さを網目状に形成したことを特徴とするはんだ印
刷用スクリーン。 ２、素抜け状に形成したパターン部の内部の一部に、柱
状に金属部分を残留させた実用新案登録請求の範囲第１
項記載のはんだ印刷用スクリーン。[Claims] 1. A solder printing screen for applying a solder paste for mounting circuit components to a circuit board of a ceramic substrate or a printed wiring board by screen printing technology, which is a suspended metal screen known as a solder printing screen. The screen is formed from only one metal plate, and the pattern part of this screen is formed in a transparent manner from one side to a depth of approximately half the plate thickness, and from the other side to a depth of approximately half the remaining plate thickness. A solder printing screen characterized by having a mesh-like structure. 2. Utility model registration claim No. 1 in which a column-shaped metal portion is left in a part of the interior of a pattern portion formed in a transparent shape
Screen for solder printing as described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36487A JPS63170093A (en) | 1987-01-07 | 1987-01-07 | Screen for solder printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36487A JPS63170093A (en) | 1987-01-07 | 1987-01-07 | Screen for solder printing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63170093A true JPS63170093A (en) | 1988-07-13 |
Family
ID=11471739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36487A Pending JPS63170093A (en) | 1987-01-07 | 1987-01-07 | Screen for solder printing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63170093A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998027797A1 (en) * | 1996-12-18 | 1998-06-25 | Micro Metallic Limited | Improved stencil and method of producing such |
| JP2001219529A (en) * | 2000-02-10 | 2001-08-14 | Murata Mfg Co Ltd | Screen printing plate and method of manufacturing the same |
-
1987
- 1987-01-07 JP JP36487A patent/JPS63170093A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998027797A1 (en) * | 1996-12-18 | 1998-06-25 | Micro Metallic Limited | Improved stencil and method of producing such |
| GB2320462B (en) * | 1996-12-18 | 1999-03-03 | Micro Metallic Ltd | Improved stencil and method of producing such |
| JP2001219529A (en) * | 2000-02-10 | 2001-08-14 | Murata Mfg Co Ltd | Screen printing plate and method of manufacturing the same |
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