JPH04197685A - Solder printing metal mask - Google Patents
Solder printing metal maskInfo
- Publication number
- JPH04197685A JPH04197685A JP33540990A JP33540990A JPH04197685A JP H04197685 A JPH04197685 A JP H04197685A JP 33540990 A JP33540990 A JP 33540990A JP 33540990 A JP33540990 A JP 33540990A JP H04197685 A JPH04197685 A JP H04197685A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- metal mask
- thickness
- board
- opening parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title claims abstract description 27
- 229910000679 solder Inorganic materials 0.000 title abstract description 41
- 239000004020 conductor Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Printing Plates And Materials Therefor (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、混成集積回路基板に接続部を形成するハン
ダ印刷メタルマスクに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a solder printing metal mask for forming connections on a hybrid integrated circuit board.
第５図は、混成集積回路基板に、ハンダペーストを印刷
する時に用いる従来のメタルマスクの平面図である。図
に於いて、（１，）はマスクの枠、（２）はメタルマス
クで、通常ステンレスか用いられている。（３）は全開
口部で、エツチングにより施される。FIG. 5 is a plan view of a conventional metal mask used when printing solder paste on a hybrid integrated circuit board. In the figure, (1,) is a mask frame, and (2) is a metal mask, which is usually made of stainless steel. (3) is a full opening and is applied by etching.
第６図は第５図の断面図である。第７図はスキージ−（
４）により、ハンダペースト（６）を基板（５）に印刷
される状態を示す。第８図は印刷後の状態、第９図は部
品（７）及び（８）を搭載した状態を示す図である。FIG. 6 is a sectional view of FIG. 5. Figure 7 shows the squeegee (
4) shows the state in which the solder paste (6) is printed on the substrate (5). FIG. 8 shows the state after printing, and FIG. 9 shows the state with parts (7) and (8) mounted.
次に動作について説明する。第９図に示すように、部品
（７）、（８）か搭載された基板（５）は、ハンダ（６
）をリフロー（溶融）し、部品（７）、（８）か固着さ
れるか、その位置決め傾きは、溶融ハンダの表面張力に
左右される場合か多い。つまり、溶融ハンダの表面張力
は、印刷されたハンダペースト（６）の量に依存し、第
９図の部品（７）の場合は、ハンダ量か少ない程、傾き
は小さくなる傾向にある。又、第９図の部品（８）の場
合は、ノ＼ンダの量か多い程表面張力か大きく、セルフ
アライメント効果か働き、位置めに於いて有利に作用す
る。Next, the operation will be explained. As shown in Figure 9, the board (5) on which the components (7) and (8) are mounted is soldered
) is reflowed (melted), and whether parts (7) and (8) are fixed or not, and their positioning inclination often depends on the surface tension of the molten solder. That is, the surface tension of the molten solder depends on the amount of printed solder paste (6), and in the case of the component (7) in FIG. 9, the smaller the amount of solder, the smaller the slope tends to be. In the case of the part (8) in FIG. 9, the larger the number of nozzles, the greater the surface tension, which acts as a self-alignment effect and is advantageous in positioning.
以上の様に、同一基板（５）上で部品の種類により、ハ
ンダ量か多い方か有利な場合と、その逆な場合か混在す
る。しかし、メタルマスク（２）によるノλンダ印刷は
、同一基板上ではメタルマスク（２）の開口（３）面積
にハンダ印刷面積は依存するものの、ノ＼ンダ厚はほぼ
一定である。As described above, depending on the type of components on the same board (5), there are cases where it is advantageous to have a large amount of solder, and cases where the opposite is true. However, in the solder printing using the metal mask (2), although the solder printing area depends on the area of the opening (3) of the metal mask (2) on the same substrate, the solder thickness is almost constant.
従来のメタルマスクは、以上の様に構成されているので
、同一基板上では一定の厚さのハンダ印刷しか出来ず、
部品の種類によるハンダ量のコントロールは困難であっ
た。つまり、メタルマスクの開口面積を拡げて、ハンダ
量を増そうとすると、隣接導体と短絡する恐れを生し、
開口面積を小さくしてハンダ量を減少しようとすると、
ハンダ広がり不足によりハンダなしみ不良か発生する等
の問題点かあった。Conventional metal masks are constructed as described above, so they can only print solder to a certain thickness on the same board.
It was difficult to control the amount of solder depending on the type of parts. In other words, if you try to increase the amount of solder by expanding the opening area of the metal mask, there is a risk of shorting with adjacent conductors.
If you try to reduce the amount of solder by reducing the opening area,
There were problems such as poor solder stains due to insufficient solder spread.
この発明は、上記の様な問題点を解決するためになされ
たもので、同一基板上で一回のハンダ印刷で部品の種類
により、必要に応したノ１ンダ厚さを得ることかできる
ハンダ印刷メタルマスクを得ることを目的とする。This invention was made in order to solve the above-mentioned problems, and it is possible to obtain a desired solder thickness depending on the type of parts by one solder printing on the same board. Aiming to obtain printed metal masks.
この発明に係るハンダ印刷メタルマスクは、同一メタル
マスク内で、従来同様の全開口部と、新たにメソシュ開
口部を部品の種類に応してパターニング行い、エツチン
グによって形成したものである。The solder printing metal mask according to the present invention is formed by patterning and etching all the openings similar to the conventional one and a new mesh opening according to the type of component in the same metal mask.
この発明におけるハンダ印刷メタルマスクは、常に一定
条件でハンダ印刷することかでき、品種毎又はパターン
形状により調整の必要か無い。The solder printing metal mask according to the present invention allows solder printing to be performed under constant conditions at all times, and there is no need for adjustment depending on the product type or pattern shape.
以下、この発明の一実施例を図について説明する。第１
図において、（１）はマスク枠、（２）はメタルマスク
で、ステンレス等で構成されている。（３）は全開口部
、（９）はメツシュ開口部である。第２図は第１図のＡ
−Ａ線による断面図である。第３図は第２図の（Ｂ）部
の拡大断面図である。第４図は拡大平面図である。ここ
で、第３図及び第４図における全開口部（３）と、メノ
ンユ開口部（９）とのパターンは、写真製版され、両面
よりエツチングされる。００）は両面よりエツチングさ
れたサイトエッチ形状を示す。An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, (1) is a mask frame, and (2) is a metal mask, which is made of stainless steel or the like. (3) is the full opening, and (9) is the mesh opening. Figure 2 is A of Figure 1.
- It is a sectional view taken along the A line. FIG. 3 is an enlarged sectional view of part (B) in FIG. 2. FIG. 4 is an enlarged plan view. Here, the patterns of the full opening (3) and the menonille opening (9) in FIGS. 3 and 4 are photoengraved and etched from both sides. 00) indicates a site etched shape etched from both sides.
次に動作について説明する。メタルマスク（２）の厚さ
は、通常、５０μｍ〜１００μｍであり、基板上に必要
な最大ハンダ厚に合わせ、メタルマスク（２）の厚さか
選定され、所望の基板導体パターンに合わせて、開口部
（３）をパターニングする。次に基板の他の導体パター
ンについて、必要なハンダ厚に応しメツシュサイズ（例
えは、２００〜３００メツンユ）を決定し、メツシュ開
口部（９）をパターニングする。Next, the operation will be explained. The thickness of the metal mask (2) is usually 50 μm to 100 μm, and the thickness of the metal mask (2) is selected according to the maximum solder thickness required on the board, and the openings are formed according to the desired board conductor pattern. Pattern part (3). Next, for the other conductor patterns on the board, the mesh size (for example, 200 to 300 mesh) is determined according to the required solder thickness, and the mesh openings (9) are patterned.
上記により製版したメタルマスクを用いて、ハンダ印刷
する時、メツシュ開口部（９）を抜出るノ１ンダ量はメ
ツシュサイズか密になる程（開口率か低下する程）少な
くなりハンダ厚は薄くなる。When performing solder printing using the metal mask made as a plate as described above, the amount of solder extracted from the mesh opening (9) decreases as the mesh size becomes denser (as the aperture ratio decreases), and the solder thickness becomes thinner. .
以上の様にこの発明によれは、同一基板上で搭載部品の
種類により、必要に応したハンダ厚に対応したメタルマ
スクを製作、ハンダ印刷することにより、精度の高い搭
載部品のハンダ付か可能となる効果かある。As described above, according to the present invention, it is possible to solder the mounted components with high precision by manufacturing a metal mask corresponding to the required solder thickness depending on the type of mounted components on the same board and printing the solder. There is some effect.
第１図はこの発明の一実施例によるメタルマスクの平面
図、第２図は第１図のＡ−Ａ線による断面図、第３図は
第２図（Ｂ）部拡大図、第４図は第３図の平面図、第５
図は従来のメタルマスクの平面図、第６図は第５図のＡ
−Ａ線による断面図、第７図はメタルマスクを用いたハ
ンダ印刷状況図、第８図は基板にハンダ印刷した後の状
態図、第９図は基板に部品搭載した状態図である。
図において、（１）はメタルマスク枠、（２）はメタル
マスク、（３）は全開口部、（９）はメノンユ開口部、
００）はサイトエッチ形状である。
なお、図中、同一符号は同一、又は相当部分を示す。FIG. 1 is a plan view of a metal mask according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line A-A in FIG. 1, FIG. 3 is an enlarged view of the portion in FIG. 2 (B), and FIG. is the plan view of Figure 3,
The figure is a plan view of a conventional metal mask, and Figure 6 is A of Figure 5.
- A cross-sectional view taken along line A, FIG. 7 is a diagram of solder printing using a metal mask, FIG. 8 is a diagram of a state after solder printing is performed on a board, and FIG. 9 is a diagram of a state in which components are mounted on a board. In the figure, (1) is the metal mask frame, (2) is the metal mask, (3) is the full opening, (9) is the menonyu opening,
00) is a site-etched shape. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
クに於いて、全開口部とメッシュ開口部とを設けことを
特徴とするハンダ印刷メタルマスク。A solder-printed metal mask for solder-printing parts mounting parts on a circuit board, which is characterized by having a full opening and a mesh opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33540990A JPH04197685A (en) | 1990-11-28 | 1990-11-28 | Solder printing metal mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33540990A JPH04197685A (en) | 1990-11-28 | 1990-11-28 | Solder printing metal mask |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04197685A true JPH04197685A (en) | 1992-07-17 |
Family
ID=18288226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33540990A Pending JPH04197685A (en) | 1990-11-28 | 1990-11-28 | Solder printing metal mask |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04197685A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007059794A1 (en) * | 2007-12-11 | 2009-06-25 | Nb Technologies Gmbh | Stencil for screen printing method, has plane stencil body with stencil thickness, where individual carrier net is provided at scraper side and at opposite substrate side through layout recesses till specified depth |
| JP2010267679A (en) * | 2009-05-12 | 2010-11-25 | Shimada Phys & Chem Ind Co Ltd | Method of connecting printed circuit board with case |
| US9925759B2 (en) | 2009-09-21 | 2018-03-27 | Asm Assembly Systems Switzerland Gmbh | Multi-layer printing screen having a plurality of bridges at spaced intervals |
-
1990
- 1990-11-28 JP JP33540990A patent/JPH04197685A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007059794A1 (en) * | 2007-12-11 | 2009-06-25 | Nb Technologies Gmbh | Stencil for screen printing method, has plane stencil body with stencil thickness, where individual carrier net is provided at scraper side and at opposite substrate side through layout recesses till specified depth |
| JP2010267679A (en) * | 2009-05-12 | 2010-11-25 | Shimada Phys & Chem Ind Co Ltd | Method of connecting printed circuit board with case |
| US9925759B2 (en) | 2009-09-21 | 2018-03-27 | Asm Assembly Systems Switzerland Gmbh | Multi-layer printing screen having a plurality of bridges at spaced intervals |
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