JPH1146055A - Printing method of conductor pattern - Google Patents

Abstract

PROBLEM TO BE SOLVED: To develop a printing method of conductor pattern for not slipping off the design position of the conductor pattern, as much as possible. SOLUTION: Within this printing method of exceeding one or two conductor patterns through the intermediary of a screen plate, the friction coefficient between this printed matters and the screen plate is specified to exceed 0.40. At this time, as the printed matter, a ceramic green sheet or alumina substrate may be adopted. Moreover, the conductor pattern includes not only the inner electrode of an electronic component but also a circuit wiring on a substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of printing a conductor pattern on a substrate such as a ceramic raw sheet or a ceramic substrate through a screen plate.

[0002]

2. Description of the Related Art Electronic components and circuit boards have conductor patterns on the inside or on the surface. This conductor pattern is formed by, for example, a screen printing method. The screen printing method is a method of printing and forming a pattern on an object to be printed through a screen plate having a large number of pores formed in a desired shape.

Here, the screen plate comprises, for example, a metal frame portion 10 and a screen portion 12 as shown in FIG. 1, and the screen portion 12 has an emulsion between the thin net-like wires 14 as shown in FIG. Emulsion (mask) filled with 16
The part 18 and the thin line 1
And four apertures 20 only.

As shown in FIG. 3, a screen plate is set on a print substrate with a slight clearance, a conductive paste is supplied on the screen plate, and the screen portion 12 is pushed down by the tip of the squeegee 22 as shown by arrows. To move. The conductive paste 24 moves in the direction shown by the arrow while being scraped off by the squeegee 22. At this time, a part of the conductive paste 24 is pushed into the aperture portion 20 of the screen portion 12 by the tip of the squeegee 22, and is applied in a conductive pattern shape on a printing material below.

[0005]

With the recent progress in miniaturization of electronic components and the like, the conductor pattern forming a part of the electronic component is required to be further miniaturized. There is also a demand for higher printing accuracy. And, in order to increase the printing accuracy of the conductor pattern, the fine lines 14 of the screen portion 12 of the screen plate of the screen printing machine are becoming finer.

However, if the fine line 14 of the screen portion 12 is made too fine, the screen portion 12 is easily pulled and stretched by the tip of the squeegee 22 at the time of printing, and as shown in FIG. Deviation from the design position (dotted line is the design position, solid line is the print position), the printed pattern deviates from the design value, and the dimensional error increases.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for printing a conductor pattern in which the printing position of the conductor pattern is kept as small as possible from the design position.

[0008]

According to the present invention, there is provided a method of printing a conductor pattern, comprising printing a plurality of conductor patterns on a substrate through a screen plate. The coefficient of friction with the plate was 0.40 or more.

[0009] Here, as the print substrate, for example, a ceramic raw sheet or an alumina substrate can be cited, but other substrates may be used.

[0010]

【Example】

Example 1 First, as shown in FIG. 5, the pattern size (a × b) was 2
mm × 5mm, printing area (C × D) 200mm × 22
A screen plate having 0 mm and a mesh roughness of 500 mesh was prepared.

Further, an alumina substrate was prepared as a printing material. An alumina substrate having a surface roughness Ra = 1.0 μm by sandblasting was used.

Next, a conductor pattern was printed on the alumina substrate under the following conditions using the screen plate. Squeegee hardness: 80 Squeegee speed: 300 mm / sec

Next, when the dimension in the horizontal direction (C direction) of the entire conductor pattern printed on this sheet was measured,
220.176 mm. When the coefficient of friction of the screen plate with respect to this sheet was determined, it was 0.5
It was 8.

Next, the obtained dimensions (220.176 m
m) and the difference ΔC between the original size (220 mm) and the distortion rate from the following equation (1) were 0.08%. Strain rate (%) = (ΔC / C) × 100 (1)

Example 2 Surface Roughness Ra of Alumina Substrate Used as Printed Material
A similar experiment was performed under the same conditions as in Example 1 except that the thickness was 0.46 μm. As a result, the dimension of the entire conductor pattern in the horizontal direction (C direction) was 220.286 mm, and the friction coefficient of the screen plate against the alumina substrate was 0.2. It was 40. When the distortion rate was calculated from the above equation (1), it was 0.13%
Met.

Example 3 A similar experiment was performed under the same conditions as in Example 1 except that an alumina substrate having a surface roughness Ra of 0.64 μm was used as a printing material. The dimensions were 220.242 mm, and the friction coefficient of the screen plate against the stainless steel plate was 0.43. Then, the distortion rate was calculated from the above equation (1) and found to be 0.11%.

Example 4 A similar experiment was conducted under the same conditions as in Example 1 except that an alumina substrate having a surface roughness Ra of 0.78 μm was used as a printing material. The size was 220.22 mm, and the friction coefficient of the screen plate against the alumina substrate was 0.48. Then, the distortion rate was calculated from the above equation (1) and found to be 0.10%.

Comparative Example 1 Surface Roughness Ra of Alumina Substrate Used as Printed Material
A similar experiment was performed under the same conditions as in Example 1 except that the thickness was set to 0.20 μm. As a result, the horizontal dimension (C direction) of the entire conductor pattern was 220.44 mm, and the friction coefficient of the screen plate against the alumina substrate was 0.2. 36. And
When the distortion rate was calculated from the above equation (1), it was 0.20%.

According to Examples 1 to 4 and Comparative Example 1,
When the friction coefficient between the alumina substrate and the screen plate is 0.40 or more, the distortion rate of the screen portion is relatively small at 0.13% or less, but when the friction coefficient between the alumina substrate and the screen plate is 0.36, It can be seen that the distortion rate of the screen part is as large as 0.20%.

[0020]

According to the present invention, since a conductor pattern can be printed on a printing substrate with high accuracy, a ceramic electronic component having good characteristics and a circuit board having high circuit accuracy can be provided.

[Brief description of the drawings]

FIG. 1 is a plan view of a screen plate.

FIG. 2 is a sectional view of a screen plate.

FIG. 3 is an explanatory diagram illustrating the principle of screen printing.

FIG. 4 is an explanatory diagram showing a relationship between a design position of screen printing and an actual printing position.

FIG. 5 is a design diagram of a screen plate used in Examples 1 to 4 and Comparative Example 1.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Metal frame part 12 Screen part 14 Fine line 16 Emulsion 18 Emulsion (mask) part 20 Opening part 22 Squeegee 24 Conductive paste

Claims (3)

[Claims] 1. A method for printing one or more conductor patterns on a substrate through a screen plate, wherein the coefficient of friction between the substrate and the screen plate is 0.40 or more. A method for printing a conductor pattern, comprising: 2. The method according to claim 1, wherein the substrate is a raw ceramic sheet or an alumina substrate. 3. The method according to claim 1, wherein the conductor pattern is a circuit wiring.