KR100643860B1 - Device and method for continuous manufacturing flexible printed circuit board - Google Patents

Abstract

An apparatus and a method for continuously manufacturing flexible printed circuit boards are provided to readily control a thickness of a printed circuit by controlling pressure of a pickup roller for pressing an ink transferring roller. An ink pickup process is performed to draw ink through a pickup roller dipped into an ink pan(S100). An ink transferring process is performed to transfer the ink of the pickup roller to the ink transferring roller by controlling pressure applied through the pickup roller to the ink transferring roller(S200). A printing process is performed to execute a printing process on a surface of a substrate by supplying the ink supplied to the ink transferring roller to a printing roller(S300).

Description

Device and method for continuous manufacturing flexible printed circuit board

1 is a schematic diagram showing a printing method of a printed circuit board according to the prior art;

2 is a block diagram sequentially listing a manufacturing method of a printed circuit board according to the present invention;

3 is a side view showing an embodiment of an apparatus for manufacturing a printed circuit board according to the present invention;

4 is a perspective view illustrating an apparatus for manufacturing a printed circuit board of FIG. 3;

5 is a side view showing another embodiment of the apparatus for manufacturing a printed circuit board according to the present invention;

6 is a perspective view illustrating a manufacturing apparatus of the printed circuit board of FIG. 5;

* Description of Major Symbols in Drawings *

100: substrate 110: ink fan

120: pickup roller 130: ink transfer roller

140: printing roller 150: backup roller

S100: Ink pickup step S200: Ink delivery step

S300: Printing Step

The present invention relates to a printed circuit board, and more particularly, to a flexible printed circuit board to secure a high quality printed circuit board by adjusting the thickness of a printed layer according to a pressure force between two rollers contacted for supplying ink. A continuous manufacturing method of a circuit board and an apparatus therefor.

In general, a printed circuit board refers to a thin plate on which electrical components such as integrated circuits, resistors, or switches are soldered, and a circuit used in most computers is installed on the printed circuit board.

Such a printed circuit board is manufactured by attaching copper foil to one or both surfaces of a thin substrate made of epoxy resin or bakelite resin, which is usually an insulator.

At this time, in order to leave the copper foil in a desired form on the substrate, after the polishing (or washing) of the copper plating layer, a PSR dry film is laminated, and the copper plating layer is melted through an exposure, development, and etching process to complete a circuit. Then, the part where the part should be inserted is drilled and the resist is printed where lead is not to be found.

In such a substrate manufacturing method, a printing method includes pattern printing, solder resist printing, marking printing, and the like. The above printing processes are generally made by silk screen printing.

The silkscreen printing method described above is simply called screen printing. After applying a paste or ink coating to a screen plate, the surface of the silkscreen is squeeged to be squeezed to print the printed object. This is how to do it.

In other words, the cloth of silk or chemical fiber is tense to make a screen, and the portion that becomes the non-wire part is covered with paper or glue, and then the ink is applied to the screen. It prints only on the caustics. At this time, by pushing the ink using a squeegee, it is possible to perform the print job manually or automatically.

However, the silk-screen printing method as described above has been widely used because of its simple structure, but it is fundamentally impossible to continuously print, bubbles are generated at the bottom of the trial plate, and it is difficult to print with uniform thickness. there was.

In particular, a phenomenon in which the shape of the image to be printed on the substrate is locally deformed due to the pressure of the squeegee occurs, and there is a closed end that cannot be used in parts requiring high quality and high performance.

Furthermore, the conventional printed circuit board is manufactured through a lamination process of a circuit film, an exposure process, a developing process, an etching process, and the like, which causes a complicated process of manufacturing a printed circuit board.

1 is for a conventional "manufacturing method of a printed circuit board" (Patent Publication No. 1998-35264) for solving the above problems, the printing roller 12 and the ink supply unit 14 Is configured through.

Briefly, to form a design image on the surface of the printing roller 12 to perform printing on the surface of the substrate 10, the printing roller 12 is in contact with the surface of the substrate 10, the printing roller ( 12) One side is provided with an ink supply unit 14 made of a sponge soaked with ink.

Therefore, the printing roller 12 is in contact with the sponge containing the ink and the substrate 10 at the same time, it is possible to print on the surface of the substrate 10.

However, the conventional method of manufacturing a printed circuit board has a shorter working time than a silk screen printing method, but by supplying ink to a printing roller using a sponge containing ink, a sponge cushion is provided. Difficult to control, it was impossible to apply ink only to precision embossed circuits of several microns thick.

Moreover, since ink is supplied to the printing roller while the sponge is wet with the ink as described above, there is a problem that it is difficult to control the amount of ink printed on the substrate because it is impossible to control the content of the ink, and in particular, the surface of the substrate is uniform. There were also closures that made it impossible to secure print thickness.

The present invention has been made to solve the conventional problems as described above, by adjusting the thickness of the print layer in accordance with the pressing force between the two rollers for supplying ink to ensure a good quality printed circuit board A continuous manufacturing method of a flexible printed circuit board and an apparatus thereof are provided.

Another object of the present invention is to print the etching resist directly using a pattern on the roller that is responsible for printing on the printed circuit board, a continuous manufacturing method of a flexible printed circuit board to minimize the process for manufacturing a printed circuit board and its To provide a device.

The continuous manufacturing method of the flexible printed circuit board of the present invention for achieving the above object is a method for manufacturing a printed circuit board through a printing means for performing printing by contacting the printing roller in the state of supplying ink to the substrate. An ink pickup step of pulling up ink through the pickup roller immersed in the ink fan; An ink delivery step of supplying ink of the pickup roller to the ink delivery roller by adjusting the pressure applied to the ink delivery roller through the pickup roller; And a printing step of printing the substrate surface by supplying the ink supplied to the ink transfer roller to the printing roller.

In addition, the configuration of the continuous manufacturing apparatus of the flexible printed circuit board of the present invention, the printing roller having a circuit pattern designed on the outer circumferential surface of the contact with the substrate to print, supplying ink to the printing roller through the printing means to produce a printed circuit board In the apparatus, the printing means, the pickup roller 120 is installed in a state in which a part is immersed in the ink fan 110, the ink is stored, between the pickup roller 120 and the printing roller 140 Install the ink delivery roller 130, and to adjust the pressure applied to the ink delivery roller 130 through the pickup roller 120 to adjust the thickness of the printed layer printed on the substrate 100 It is characterized by.

When described in detail with reference to the accompanying drawings a preferred embodiment of the present invention.

2 to 6 illustrate a method and a device for continuously manufacturing a flexible printed circuit board of the present invention. The method for continuously manufacturing a flexible printed circuit board includes an ink pickup step S100 and an ink delivery step as shown in FIG. S200 and the printing step (S300).

First, in the ink pickup step S100, as shown in FIGS. 3 to 6, ink in the ink fan 110 is supplied to the pickup roller 120, and a part of the pickup roller 120 is the ink fan 110. By rotating in the state immersed in, it is possible to pull the ink through the pickup roller 120.

Subsequently, in the ink transfer step S200, the ink supplied to the pickup roller 120 is supplied to the ink transfer roller 130 by adjusting the pressing force applied to the ink delivery roller 130 through the pickup roller 120. In this case, the pressing force of the pickup roller 120 applied to the ink transfer roller 130 is an ink transfer roller whose thickness is four times the thickness in consideration of the thickness of the printing layer to be printed on the substrate 100. It is adjusted to be supplied to (130).

Next, in the printing step (S300) by supplying the ink supplied to the ink delivery roller 130 to the printing roller 140 to perform a printing on the surface of the substrate 100, the printing with the ink delivery roller 130 As the roller 140 is rotated in contact, the ink having a thickness of 1/2 of the ink thickness supplied to the ink delivery roller 130 is supplied to the printing roller 140.

Then, the ink having 1/2 thickness of the ink thickness supplied to the printing roller 140 is supplied to the surface of the substrate 100 to perform a printing operation.

Such a printing operation may simultaneously perform a printing operation on one side of the substrate 100 or on the lower surface of the substrate 100 or on the lower portion of the substrate 100, and simultaneously prints on the lower surface of the substrate 100. In this case, by adjusting the pressing force of the pickup roller 120 to be applied to the lower ink transfer roller 120 on the substrate 100, the same or different, the thickness of the printed layer on both sides of the substrate 100 are formed to be the same. Or differently.

Meanwhile, as illustrated in FIGS. 3 to 6, the continuous manufacturing apparatus of the flexible printed circuit board includes a pickup means 120, an ink transfer roller 130, a printing means made of a printing roller 140, and the substrate 100. It is configured by.

Among the printing means, the pick-up roller 120 serves to pull up the ink stored in the ink pan 110, and is rotatably installed in a state in which a part thereof is immersed in the ink pan 110.

Then, the ink delivery roller 130 serves to supply the ink embedded in the pickup roller 120 to the printing roller 140, rotatably installed between the pickup roller 120 and the printing roller 140. do.

Such, the ink transfer roller 130 is installed in contact with the pickup roller 120 to be rotatable, by installing to enable the adjustment of the pressure applied to the ink transfer roller 130 through the pickup roller 120, The thickness of the final printed layer printed on the substrate 100 can be adjusted. The ink delivery roller 130 and the printing roller 140 are also installed to be in contact with each other so that the ink delivery roller 130 and the printing roller 140 can rotate together.

Subsequently, the printing roller 140 receives ink from the ink delivery roller 130 and performs printing on the surface of the substrate 100. The printing roller 140 is provided on one surface of the substrate 100 and the ink delivery roller 130. Install in contact with each other.

The printing roller 140 is bonded to a metal plate (zinc plate, copper plate, etc.), a synthetic resin plate, or a high strength urethane, the circuit pattern of which is designed on the outer peripheral surface, the circuit pattern is in contact with the substrate 100 and rotated, thereby the substrate ( The circuit pattern is printed at 100).

The above-described metal plate is briefly described, and is manufactured by a conventional exposure, development, and etching method. A thin and flexible metal plate is coated with a photosensitive agent, and a film made of a printed circuit raw material is superimposed on the metal plate to emit light. . Then, the metal plate is corroded with a corrosion solution to obtain a convex plate, thereby ensuring a precise circuit pattern.

On the other hand, the printing means including the pickup roller 120, the ink transfer roller 130, the printing roller 140, etc. as described above is installed on any one of the upper or lower portion of the substrate 100, as shown in Figs. It is possible to print only on one surface of the substrate 100, or as shown in the upper and lower portions of the substrate 100, respectively, as shown in Figs. 5 and 6, to simultaneously print the upper and lower portions of the substrate 100 You can also

At this time, in the case where the printing means is installed on one of the upper and lower portions of the substrate 100, as shown in Figs. 3 and 4, the backup roller at a position symmetrical with the printing roller 140 with respect to the substrate 100. 150 was installed to support the substrate 100 in contact with the printing roller 140.

Referring to the operation and effect of the present invention configured as described in detail as follows.

In order to manufacture the flexible printed circuit board of the present invention, as shown in FIGS. 3 and 5, when the pickup roller 120 is rotated to draw up the ink in the ink fan 110, the ink supplied to the pickup roller 120 is The ink delivery roller 130 is rotatably installed in contact with each other.

At this time, the pick-up roller 120 and the ink transfer roller 130 is installed so that the pressing force of the contact portion is adjustable, which can be adjusted on both axes of the pick-up roller 120. That is, by adjusting the pressure applied to the ink transfer roller through the pickup roller 120, the thickness of the ink layer buried in the ink transfer roller 130 is controlled, and finally the thickness of the printed layer printed on the surface of the substrate 100 Can be adjusted.

For example, when the printed layer of the substrate 100 is to be printed with a thickness of 4 μm, the pressing force of the pickup roller 120 that presses the ink transfer roller 130 is adjusted to the surface of the ink transfer roller 130. 16 μm thick ink is supplied.

As such, the ink supplied to the ink delivery roller 130 is supplied to the printing roller 140 by 1/2 thickness, and the ink supplied to the printing roller 140 is again 1/2 the thickness of the substrate 100. As it is supplied to the substrate 100 is printed on the surface.

That is, the ink thickness of 16 μm supplied to the ink transfer roller 130 is supplied to the printing roller 140 with the ink thickness of 8 μm, and the ink thickness of 8 μm supplied to the printing roller 140 is the substrate ( By supplying an ink thickness of 4 µm to 100), a circuit having a thickness of 4 µm can be finally printed on the surface of the substrate 100. Here, the thickness of the print layer and the ink is merely an example for a preferred embodiment of the present invention, the pickup for pressing the ink transfer roller 130 according to the thickness of the print layer to be printed on the substrate 100 Obviously, the pressing force of the roller 120 can be adjusted.

Accordingly, the method and the apparatus for continuously manufacturing the flexible printed circuit board of the present invention control the thickness of the printed circuit layer printed on the substrate 100 by adjusting the pressing force of the pickup roller 120 for pressing the ink transfer roller 130. Thus, it is easy to adjust the thickness of the final printed circuit, it is possible to control the amount of ink to be supplied and applied, and precise ink supply to form a circuit printed layer having a constant thickness on the substrate 100, finally, the printing of excellent quality The circuit board can be secured.

Moreover, the continuous manufacturing method and apparatus of the flexible printed circuit board of the present invention, the printing means including the pickup roller 120, the ink transfer roller 130, the printing roller 140 on the substrate 100, the lower portion, respectively By being able to install, printing can be performed more quickly by simultaneously printing on both sides of the substrate 100, and also by adjusting the pressing force between the pickup roller 120 and the ink transfer roller 130. The upper and lower printed layers may have the same or different thicknesses.

In addition, the method and the apparatus for continuously manufacturing the flexible printed circuit board of the present invention prints an etching resist directly on the surface of the substrate 100 through a circuit pattern formed on the printing roller 140, so that processes such as exposure and development processes are performed. Omitted to minimize the process for manufacturing a printed circuit board, and also to insert a component can be printed directly in a desired pattern of the solder resist printing to prevent the lead from buried in the substrate 100.

On the other hand, the present invention has been described in detail only with respect to the specific examples described above it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, it is natural that such variations and modifications belong to the appended claims. .

As described above, according to the present invention, the thickness of the circuit printed layer printed on the substrate is adjusted by adjusting the pressing force of the pickup roller pressurizing the ink transfer roller, so that the thickness of the final printed circuit can be easily adjusted, and the supply and By controlling the amount of ink to be applied and supplying precise ink, a circuit printed layer having a constant thickness is formed on a substrate, thereby finally securing a printed circuit board having excellent quality.

In addition, printing means including a pickup roller, an ink transfer roller, and a printing roller can be installed on the substrate and the lower portion, respectively, so that printing can be performed on both sides of the substrate at the same time, so that printing can be performed more quickly. Through the adjustment of the pressing force between the pickup roller and the ink transfer roller, there is also an effect that the thicknesses of the printed layers on the lower surface of the substrate may be the same or different.

Claims (9)

In a method of manufacturing a printed circuit board by printing a printed roller having a circuit pattern designed on an outer circumferential surface thereof in contact with a substrate, and supplying ink to the printed roller through a printing means, An ink pick-up step (S100) of pulling up ink through the pickup roller 120 immersed in the ink fan 110; An ink delivery step (S200) of supplying ink of the pickup roller 120 to the ink delivery roller 130 by adjusting the pressure applied to the ink delivery roller 130 through the pickup roller 120; And a printing step (S300) for supplying the ink supplied to the ink transfer roller 130 to the printing roller 140 to perform printing on the surface of the substrate 100. . The backup roller 150 of claim 1, wherein the backup roller 150 is symmetrical with the printing roller 140 to support the substrate 100 at any one of the lower portions of the substrate 100 on which the printing roller 140 is not installed. Continuous manufacturing method of a flexible printed circuit board, characterized in that the installation. According to claim 1, wherein the printing means including the pickup roller 120, the ink transfer roller 130 and the printing roller 140 is provided on the substrate 100, the lower portion, respectively, on the substrate 100, A continuous manufacturing method of a flexible printed circuit board, characterized in that to perform a print operation at the bottom at the same time. 4. The method of claim 3, wherein the printed layers printed on the lower surface of the substrate 100 are formed to have the same thickness. The method of claim 3, wherein the thickness of the printed layer printed on the lower surface of the substrate 100 is different from each other. The method of claim 1 or 3, wherein in the printing step (S300), Ink having a thickness of 1/2 of the ink thickness supplied to the ink transfer roller 130 is supplied to the printing roller 140, and ink having a thickness of 1/2 of the ink thickness supplied to the printing roller 140 is supplied to the substrate ( 100) A continuous manufacturing method of a flexible printed circuit board, which is supplied by printing on the surface. An apparatus for manufacturing a printed circuit board by printing a printed roller having a circuit pattern designed on an outer circumferential surface thereof in contact with a substrate, and supplying ink to the printed roller through a printing means. The printing means, The pickup roller 120 is installed in a state where a part of the ink is stored in the ink fan 110 stored therein, Installing an ink transfer roller 130 between the pickup roller 120 and the printing roller 140, Continuous of the flexible printed circuit board, characterized in that the pressure applied to the ink delivery roller 130 through the pickup roller 120 to adjust the thickness of the printed layer printed on the substrate 100 is adjustable Manufacturing equipment. The method of claim 7, wherein the backup roller 150 is symmetrical with the printing roller 140 to support the substrate 100 at any one of the lower portion of the substrate 100, the printing roller 140 is not installed. Continuous manufacturing apparatus of a flexible printed circuit board, characterized in that the installation. The method of claim 7, wherein the printing means including the pickup roller 120, the ink transfer roller 130 and the printing roller 140 is provided on the substrate 100, the lower portion, respectively, on the substrate 100, Continuous manufacturing apparatus of a flexible printed circuit board, characterized in that for simultaneously performing the printing operation on the lower portion.

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