CN116033670A - Novel manufacturing process of solder resist insulating layer of circuit board - Google Patents
Novel manufacturing process of solder resist insulating layer of circuit board Download PDFInfo
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- CN116033670A CN116033670A CN202111244077.XA CN202111244077A CN116033670A CN 116033670 A CN116033670 A CN 116033670A CN 202111244077 A CN202111244077 A CN 202111244077A CN 116033670 A CN116033670 A CN 116033670A
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- circuit board
- solder resist
- insulating layer
- carrier film
- transparent carrier
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Abstract
The invention discloses a novel manufacturing process of a solder resist insulating layer of a circuit board, which comprises the following steps: step one: coating the prepared solder resist ink on a transparent carrier film; step two: carrying out surface drying on the solder resist ink on the transparent carrier film after the step one; step three: attaching the solder resist ink on the transparent carrier film which is subjected to the second step to a circuit board; step four: exposing the circuit board completed in the third step; step five: tearing off the transparent carrier film on the circuit board with the step four completed; step six: developing the circuit board finished in the step five; step seven: and (3) performing heat curing treatment on the circuit board subjected to the step (six) so as to obtain the complete manufacture of the solder resist insulating layer of the circuit board. The novel manufacturing process of the solder resist insulating layer of the circuit board has more uniform components of the solder resist layer and smaller thickness tolerance, greatly improves the yield of products of the manufacturing process, reduces the cost of the products and can be suitable for various bonding pad sizes.
Description
Technical Field
The invention relates to the technical field of manufacturing of a solder resist insulating layer, in particular to a novel manufacturing process of a solder resist insulating layer of a circuit board.
Background
The solder resist insulating layer is an insulating material and plays a role in resisting soldering, and the printed circuit board basically comprises a bonding pad, a via hole, a solder resist layer, a silk screen layer, a copper wire, various elements and the like.
The original manufacturing process of the circuit board solder resist insulating layer comprises two steps, namely, manufacturing a solder resist insulating material into an exposure film, coating a photosensitive adhesive layer on a screen printing plate, coating the film on the screen printing plate for exposure to obtain a circuit solder resist pattern screen printing plate, directly screen printing solder resist insulating ink on the circuit board, and finally thermally curing to complete the whole manufacturing process. The second method is to coat a layer of photosensitive solder resist insulating ink on the circuit board, make the material of the solder resist insulating layer into an exposure film, screen-print the exposure film on the circuit board for exposure and development, and then thermally cure the film.
Both of these two manufacturing processes have limitations, the first manufacturing process has low precision and is limited to the screen printing process, the bonding pad is rough, the applied surface is narrower and narrower along with the higher wiring density of the circuit board, and the second manufacturing process is the most commonly used manufacturing process at present, but when the bonding pad size is smaller than phi 0.15mm, poor development is easy to occur, especially on the circuit board with large size and high value, and the low yield increases the product cost.
Disclosure of Invention
The invention mainly aims to provide a novel manufacturing process of a circuit board solder resist insulating layer, which aims to solve the technical problems of poor development, low yield and excessive product cost of the existing manufacturing process.
In order to solve the technical problems, the invention provides a novel manufacturing process of a solder resist insulating layer of a circuit board, which comprises the following steps:
step one: coating the prepared solder resist ink on a transparent carrier film;
step two: carrying out surface drying on the solder resist ink on the transparent carrier film after the step one;
step three: attaching the solder resist ink on the transparent carrier film which is subjected to the second step to a circuit board;
step four: exposing the circuit board completed in the third step;
step five: tearing off the transparent carrier film on the circuit board with the step four completed;
step six: developing the circuit board finished in the step five;
step seven: and (3) performing heat curing treatment on the circuit board subjected to the step (six) so as to obtain the complete manufacture of the solder resist insulating layer of the circuit board.
Preferably, the coating in the first step is roller coating, silk screen printing, dip coating or the like.
Preferably, the surface-dried form of the second step may be a penetration-dried form, a volatilization-dried form or an oxidation film-forming form.
Preferably, the solder resist ink in the third step is attached to the circuit board in a covering type.
Preferably, the exposure in the fourth step is exposure processing according to a pattern of the solder resist layer.
Preferably, the temperature used for the heat curing treatment in the seventh step is 120 to 180 ℃, and the time for heat curing is 45 to 90 minutes.
The embodiment of the invention has the beneficial effects that: according to the novel manufacturing process of the circuit board solder resist insulating layer, the photosensitive solder resist ink is coated on the plane carrier film and then is transferred to the circuit board, so that the components of the solder resist layer are more uniform, the thickness tolerance is smaller, the yield of manufacturing process products is greatly improved, the cost of the products is reduced, and the novel manufacturing process is applicable to various bonding pad sizes.
Drawings
FIG. 1 is a flow chart of a novel process for manufacturing a solder resist insulating layer of a circuit board.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below are exemplary and intended to illustrate the present invention and should not be construed as limiting the invention, and all other embodiments, based on the embodiments of the present invention, which may be obtained by persons of ordinary skill in the art without inventive effort, are within the scope of the present invention.
Example 1
Referring to fig. 1, a new process for manufacturing a solder resist insulating layer of a circuit board includes the following steps:
step one: coating the prepared solder resist ink on a transparent carrier film;
step two: carrying out surface drying on the solder resist ink on the transparent carrier film after the step one;
step three: attaching the solder resist ink on the transparent carrier film which is subjected to the second step to a circuit board;
step four: exposing the circuit board completed in the third step;
step five: tearing off the transparent carrier film on the circuit board with the step four completed;
step six: developing the circuit board finished in the step five;
step seven: and (3) performing heat curing treatment on the circuit board subjected to the step (six) so as to obtain the complete manufacture of the solder resist insulating layer of the circuit board.
The coating in the first step is a roller coating mode.
The surface drying form of the second step is a penetration drying type.
And step three, the solder resist ink is attached to the circuit board in a covering type attaching mode.
The exposure in the fourth step is exposure treatment according to the pattern of the solder mask layer.
The temperature used for the heat curing treatment in the seventh step was 120℃and the time for heat curing was 45 minutes.
Example 2
Step one: coating the prepared solder resist ink on a transparent carrier film;
step two: carrying out surface drying on the solder resist ink on the transparent carrier film after the step one;
step three: attaching the solder resist ink on the transparent carrier film which is subjected to the second step to a circuit board;
step four: exposing the circuit board completed in the third step;
step five: tearing off the transparent carrier film on the circuit board with the step four completed;
step six: developing the circuit board finished in the step five;
step seven: and (3) performing heat curing treatment on the circuit board subjected to the step (six) so as to obtain the complete manufacture of the solder resist insulating layer of the circuit board.
The coating in the first step is a silk screen printing mode.
The surface drying mode of the second step is a volatile drying mode.
And step three, the solder resist ink is attached to the circuit board in a covering type attaching mode.
The exposure in the fourth step is exposure treatment according to the pattern of the solder mask layer.
The temperature used for the heat curing treatment in the seventh step was 150℃and the time for heat curing was 60 minutes.
Example 3
Step one: coating the prepared solder resist ink on a transparent carrier film;
step two: carrying out surface drying on the solder resist ink on the transparent carrier film after the step one;
step three: attaching the solder resist ink on the transparent carrier film which is subjected to the second step to a circuit board;
step four: exposing the circuit board completed in the third step;
step five: tearing off the transparent carrier film on the circuit board with the step four completed;
step six: developing the circuit board finished in the step five;
step seven: and (3) performing heat curing treatment on the circuit board subjected to the step (six) so as to obtain the complete manufacture of the solder resist insulating layer of the circuit board.
The coating in the first step is a dip coating mode.
The surface drying mode of the second step is a volatile drying mode.
And step three, the solder resist ink is attached to the circuit board in a covering type attaching mode.
The exposure in the fourth step is exposure treatment according to the pattern of the solder mask layer.
The temperature used for the heat curing treatment in the seventh step was 150℃and the time for heat curing was 90 minutes.
Example 4
Step one: coating the prepared solder resist ink on a transparent carrier film;
step two: carrying out surface drying on the solder resist ink on the transparent carrier film after the step one;
step three: attaching the solder resist ink on the transparent carrier film which is subjected to the second step to a circuit board;
step four: exposing the circuit board completed in the third step;
step five: tearing off the transparent carrier film on the circuit board with the step four completed;
step six: developing the circuit board finished in the step five;
step seven: and (3) performing heat curing treatment on the circuit board subjected to the step (six) so as to obtain the complete manufacture of the solder resist insulating layer of the circuit board.
The coating in the first step is a roller coating mode.
The surface drying mode of the second step is a volatile drying mode.
And step three, the solder resist ink is attached to the circuit board in a covering type attaching mode.
The exposure in the fourth step is exposure treatment according to the pattern of the solder mask layer.
The temperature used for the heat curing treatment in the seventh step was 180℃and the time for heat curing was 90 minutes.
Comparative example 1
Step one: manufacturing a solder resist insulating material into an exposure film;
step two: coating a photosensitive adhesive layer on the screen printing plate;
step three: covering the film on a screen printing plate for exposure to prepare a circuit solder resist pattern screen printing plate;
step four: directly screen-printing solder resist insulating ink on a circuit board;
step five: and (5) thermally curing to complete the whole manufacturing process.
Comparative example 2
Step one: preparing photosensitive solder resist insulating ink;
step two: coating photosensitive solder resist insulating ink on a circuit board;
step three: manufacturing the material of the solder resist insulating layer into an exposure film;
step four: performing silk screen printing on an exposure film on a circuit board for exposure and development;
step five: and (5) thermally curing to complete the whole manufacturing process.
The four groups of examples are respectively compared with the comparative examples to obtain; the manufacturing process of comparative example 1 has low precision and is limited to a silk screen process, the bonding pads are rough, and the applied surfaces are narrower as the wiring density of the circuit board is higher and higher; the comparative example 2 is the most commonly used manufacturing process at present, but when the size of a welding plate is smaller than phi 0.15mm, development failure is easy to occur, especially on a circuit board with large size and high value, the low yield rate leads to the increase of the product cost, and the novel manufacturing process of the welding-resistant insulating layer of the circuit board, provided by the invention, is suitable for various welding plate sizes by coating photosensitive welding-resistant ink on a plane carrier film and then transferring the photosensitive welding-resistant ink to the circuit board, and the welding-resistant layer has more uniform components and smaller thickness tolerance, thereby greatly improving the yield rate of the manufactured product, reducing the cost of the product and being applicable to various welding plate sizes.
In a preferred embodiment, the solder resist ink is applied by roll coating, screen printing or dip coating, and the roll coating method (roll coating) is a method of applying a coating on the surface of the base fabric using various rotating rolls. Roll coating is similar to warp sizing. The following five methods are commonly used as roll coating methods. (1) a homodromous roller coating method: the upper and lower rolls are closely contacted, a part of the lower roll is immersed in the paint, and a certain amount of paint is attached to the surface of the lower roll due to the rotation, and when the base fabric passes between the two rolls, the upper and lower rolls pressurize the base fabric, so that the paint is attached to and permeated through the base fabric. The method is suitable for low viscosity coatings. (2) reverse roll coating process: the basic principle is that the roller picks up the coating from the coating tank and rubs the coating against the substrate against the surface of the roller. (3) gravure coating process: gravure coating is the same principle as gravure printing or intaglio printing by bringing the engraved gravure coating roll into contact with a paint tank, picking up paint, scraping off the excess paint on the roll with a doctor blade, and transferring the paint from the recess to the substrate as it passes through the pressure roll. (4) transfer roll coating process: the feed roller and the base fabric rotate at the same speed, the jaw roller and the distribution roller rotate slower than the feed roller, and the thickness of the coating is determined by the interval between the jaw rollers. (5) dip roll coating process: the dipping roller coating method is a coating method in which a coating material is dipped through the surface of a base fabric by passing through a coating tank in a state that the base fabric is in contact with a roller.
In a preferred embodiment, the surface drying mode of the solder mask ink on the transparent carrier film may be a penetration drying mode, a volatilization drying mode or an oxidation film forming mode, and in this embodiment, a volatilization drying mode is generally adopted, and the volatilization drying (evaporation drying) refers to a process that the solvent type ink is solidified into a solid film from a fluid state after the solvent is volatilized.
In a preferred embodiment, the solder mask ink is applied to the circuit board by a blanket type of application.
In a preferred embodiment, the exposure in the fourth step is an exposure process according to the pattern of the solder mask layer.
The above description of the preferred embodiments of the present invention should not be taken as limiting the scope of the invention, but rather should be understood to cover all modifications, variations and adaptations of the present invention using its general principles and the following detailed description and the accompanying drawings, or the direct/indirect application of the present invention to other relevant arts and technologies.
Claims (6)
1. A novel manufacturing process of a solder resist insulating layer of a circuit board is characterized by comprising the following steps:
step one: coating the prepared solder resist ink on a transparent carrier film;
step two: carrying out surface drying on the solder resist ink on the transparent carrier film after the step one;
step three: attaching the solder resist ink on the transparent carrier film which is subjected to the second step to a circuit board;
step four: exposing the circuit board completed in the third step;
step five: tearing off the transparent carrier film on the circuit board with the step four completed;
step six: developing the circuit board finished in the step five;
step seven: and (3) performing heat curing treatment on the circuit board subjected to the step (six) so as to obtain the complete manufacture of the solder resist insulating layer of the circuit board.
2. The process for preparing a solder resist insulating layer of a circuit board according to claim 1, wherein the coating in the first step is roll coating, silk screen printing or dip coating.
3. The process of claim 1, wherein the surface drying of the second step is a penetration drying type, a volatilization drying type or an oxidation film.
4. The process for preparing a solder mask insulating layer of a circuit board according to claim 1, wherein the solder mask ink in the third step is applied to the circuit board in a covering type.
5. The process of claim 1, wherein the exposing is performed according to a pattern of the solder mask.
6. The process for preparing a solder resist insulating layer for a circuit board according to claim 1, wherein the temperature used for the heat curing treatment in the seventh step is 120 to 180 ℃ and the heat curing time is 45 to 90 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111244077.XA CN116033670A (en) | 2021-10-25 | 2021-10-25 | Novel manufacturing process of solder resist insulating layer of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111244077.XA CN116033670A (en) | 2021-10-25 | 2021-10-25 | Novel manufacturing process of solder resist insulating layer of circuit board |
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| Publication Number | Publication Date |
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| CN116033670A true CN116033670A (en) | 2023-04-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111244077.XA Pending CN116033670A (en) | 2021-10-25 | 2021-10-25 | Novel manufacturing process of solder resist insulating layer of circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117395884A (en) * | 2023-10-18 | 2024-01-12 | 江苏博敏电子有限公司 | Manufacturing process for improving flatness of solder mask layer of carrier plate |
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2021
- 2021-10-25 CN CN202111244077.XA patent/CN116033670A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117395884A (en) * | 2023-10-18 | 2024-01-12 | 江苏博敏电子有限公司 | Manufacturing process for improving flatness of solder mask layer of carrier plate |
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