JP2009037413A - Radio ic device - Google Patents

Radio ic device Download PDF

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Publication number
JP2009037413A
JP2009037413A JP2007201082A JP2007201082A JP2009037413A JP 2009037413 A JP2009037413 A JP 2009037413A JP 2007201082 A JP2007201082 A JP 2007201082A JP 2007201082 A JP2007201082 A JP 2007201082A JP 2009037413 A JP2009037413 A JP 2009037413A
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JP
Japan
Prior art keywords
wireless ic
radiation plate
circuit board
ic chip
ic device
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007201082A
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Japanese (ja)
Inventor
Yukio Yamamoto
幸男 山本
Original Assignee
Murata Mfg Co Ltd
株式会社村田製作所
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Publication date
Application filed by Murata Mfg Co Ltd, 株式会社村田製作所 filed Critical Murata Mfg Co Ltd
Priority to JP2007201082A priority Critical patent/JP2009037413A/en
Publication of JP2009037413A publication Critical patent/JP2009037413A/en
Application status is Pending legal-status Critical

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Abstract

Provided is a wireless IC device configured so that an external impact or the like is not directly applied to the wireless IC chip.
A wireless IC device includes (a) a radiation plate, (b) a power feeding circuit board including an inductance element, and (c) a spacing between the radiation board and the power feeding circuit board facing each other at a distance of 21. A projecting bonded body 20 provided and bonded, and (d) a wireless IC chip 22 mounted on the power feeding circuit board 12 and facing the radiation plate 30 with a gap 23 provided between the radiation plate 30 and the radiation IC 30.
[Selection] Figure 1

Description

  The present invention relates to a wireless IC device, and more particularly, to a wireless IC device such as a non-contact wireless IC medium or a non-contact wireless IC tag used for an RF-ID (Radio Frequency Identification) system.

  Conventionally, various wireless IC devices on which a wireless IC chip is mounted have been proposed.

For example, in Patent Document 1, as shown in the cross-sectional view of FIG. After mounting the chip 109, the adhesive sheet 111 is brought into close contact as shown in the sectional view of FIG. 5B, and the release sheet 101 is peeled off as shown in the sectional view of FIG. 5C. Non-contact type wireless IC media are disclosed.
JP 2002-298109 A

  In this non-contact type wireless IC medium, an adhesive sheet 111 is attached to an article. At this time, since the IC chip 109 is only mounted on the adhesive sheet 111, the IC chip 109 is used in a state where it protrudes to the outside and is exposed. Therefore, when an article to which a non-contact type wireless IC media is attached comes into contact with another article, an impact is directly applied to the IC chip 109 from another article, the IC chip 109 is damaged, and functions as a wireless IC medium. There is a risk of disappearing.

  In view of such circumstances, the present invention intends to provide a wireless IC device configured so that external impact or the like is not directly applied to the wireless IC chip.

  In order to solve the above-described problems, the present invention provides a wireless IC device configured as follows.

  The wireless IC device includes (a) a radiation plate, (b) a power feeding circuit board including an inductance element, a resonance circuit and / or a matching circuit, and (c) a gap between the radiation board and the power feeding circuit board facing each other. And (d) a wireless IC chip mounted on the power supply circuit board and facing the radiation plate with a space between the radiation plate.

  In the above configuration, the wireless IC chip is disposed between the radiation plate and the power supply circuit board, and is covered with the radiation plate and the power supply circuit board, so that an external impact is not directly applied to the wireless IC chip. Since the wireless IC chip is not in contact with the radiation plate, the impact on the radiation plate side is not directly applied to the wireless IC chip. Therefore, it is possible to prevent the wireless IC chip from being damaged or broken due to an impact such as dropping.

  Further, since the wireless IC chip is not in contact with the radiation plate, the deformation of the radiation plate is not directly applied to the wireless IC chip, so that the possibility that the wireless IC chip is destroyed due to the deformation of the radiation plate is reduced.

  Preferably, the height of the protruding joined body is larger than the thickness of the wireless IC chip.

  In this case, the gap between the wireless IC device mounted on the power supply circuit board and the radiation plate joined to the power supply circuit board can be provided without forming a recess or the like for mounting the wireless IC chip on the power supply circuit board. Can be provided, and the configuration can be simplified.

  Preferably, the protruding joined body is formed around the wireless IC chip.

  In this case, it is possible to improve the reliability of the wireless IC device by protecting the wireless IC chip with the protruding joint so that the side surface of the wireless IC chip is not exposed to the outside.

  Preferably, the protruding joined body is formed in a dot shape.

  In this case, the protrusion-like bonded body can be easily formed using a dispenser or the like.

  Preferably, the protruding joined body is formed in a linear shape.

  In this case, the exposure to the side surface of the wireless IC chip is almost eliminated, and the environmental resistance can be improved as compared with the case where the protruding joined body is formed in a dot shape.

  Preferably, the protrusion-like joined body is formed in a frame shape.

  In this case, the environment resistance can be improved as compared with the case where the side surface of the wireless IC chip is not exposed and the protrusion-like bonded body is formed in a dot shape or a line shape.

  Preferably, the protruding joined body is formed of a conductor.

  In this case, for example, the circuit on the power feeding circuit board side can be grounded by connecting the circuit on the power feeding circuit board side and the electrode of the radiation plate. Further, when an auxiliary matching circuit is provided on the radiation plate side separately from the power feeding circuit on the power feeding circuit board side, the matching circuit and the power feeding circuit can be electrically connected.

  Preferably, the protruding joined body is formed of an insulator.

  In this case, the electrode of the radiation plate and the feeder circuit board can be electromagnetically coupled, and the radiation plate and the feeder circuit board can be coupled to each other rather than electrically connecting the electrode of the radiation plate and the feeder circuit board with a conductor. Since the positioning accuracy can be relaxed, the radiation plate and the feeder circuit board can be easily joined, and mass production is easy. Further, since the wireless IC chip is insulated from the radiation plate, it is possible to prevent the wireless IC chip from being broken by static electricity from the radiation plate.

  Preferably, a resin is disposed between the wireless IC chip and the power supply circuit board.

  In this case, retention of electrical connection between the wireless IC chip and the power supply circuit board can be strengthened.

  Preferably, the base material of the radiation plate is formed of a flexible substrate.

  When the base plate of the radiation plate is formed of a flexible substrate such as a PET film, the wireless IC device can be attached to an article having irregularities and undulations on the surface.

  According to the present invention, since an external impact or the like is not directly applied to the wireless IC chip, the wireless IC chip can be prevented from being damaged or malfunctioning, and the reliability of the wireless IC device can be improved.

  Examples of the present invention will be described below with reference to FIGS.

  First Embodiment A wireless IC device 10 according to a first embodiment will be described with reference to FIG. FIG. 1A is a cross-sectional view of the wireless IC device 10. FIG.1 (b) is sectional drawing cut | disconnected along line BB of Fig.1 (a).

  As illustrated in FIG. 1A, the wireless IC device 10 includes a power supply circuit board 12 on which a wireless IC chip 22 is mounted and a radiation plate 30 joined together via a protruding joint 20. A space 21 is formed between the radiating plate 30. The wireless IC chip 22 is disposed in the space 21, a gap 23 is provided between the wireless IC chip 22 and the radiation plate 30, and the wireless IC chip 22 is separated from the radiation plate 30. For example, in the RF-ID system, the radiation plate 30 is attached to an article, and the data stored in the wireless IC chip 22 is read out in a non-contact manner using a reader / writer (not shown).

  The power supply circuit board 12 is, for example, a multilayer board made of ceramic or resin, and a power supply circuit including an inductance element is formed therein by an in-plane conductor 14 and an interlayer connection conductor 15, and a lower surface 12b of the power supply circuit board 12 is The connection electrode 16 of the power feeding circuit is exposed. The power feeding circuit may include a resonance circuit having a resonance frequency corresponding to the operating frequency at which the wireless IC chip 22 operates, and may include a matching circuit that matches the characteristic impedance between the radiation plate 30 and the wireless IC chip 22.

  Note that the power supply circuit board may be a single-layer substrate, or the power supply circuit may be formed only on the surface of the power supply circuit board.

  The wireless IC chip 22 is mounted on the power supply circuit board 12 via the bumps 24 by flip chip bonding or Ag nano bonding using Au bumps, Ag bumps, solder bumps, or the like. The bonding may be performed using die bonding or wire bonding, or by combining these bondings. In order to further strengthen the bonding reliability of the wireless IC chip 22, an underfill resin is filled between the wireless IC chip 22 and the power supply circuit board 12, and electrical connection between the wireless IC chip 22 and the power supply circuit board 12 is performed. You may strengthen holding of.

  The radiation plate 30 has a radiation electrode 26 formed of a conductive material on a sheet-like base material 28. For the base material 28, for example, an insulating material such as paper, PET film, or flexible resin is used. When the base material 28 is formed of a flexible substrate such as a PET film, the wireless IC device 10 can be attached to an article having irregularities and undulations on the surface, which is preferable. The radiation electrode 26 is formed by fine wiring by ink jet or photolithography, printing using a mask, or the like.

  The radiation plate 30 radiates, for example, a UHF band transmission signal supplied from the power supply circuit of the power supply circuit board 12 via electromagnetic field coupling into the air, and receives the received signal through the electromagnetic field coupling. The power is supplied to the power supply circuit of the substrate 12.

  As shown in FIG. 1B, a plurality of protrusion-like bonded bodies 20 are formed in a dot shape around the wireless IC chip 22. The protrusion-like bonded body 20 can be easily formed by applying it in a dot shape using a dispenser. The protruding bonded body 20 may be formed by other methods such as a metal mask or screen printing.

  The side surface 22a of the wireless IC chip 22 is surrounded by the protruding joined body 20, and is less exposed to the outside. Thus, by protecting the wireless IC chip 22 with the protruding joined body 20, the reliability of the wireless IC device 10 can be improved.

  The projecting bonded body 20 is formed using, for example, an adhesive, and mechanically connects the radiation plate 30 and the feeder circuit board 12.

  The protrusion-like bonded body 20 is sufficient if at least the bonding surface bonded to the radiation plate 30 and the power supply circuit board 12 has adhesiveness. For example, an adhesive thin film is applied to the power supply circuit board 12 or the radiation plate 30. It is also possible to form a protruding bonding member consisting of an adhesive thin film or an adhesive and a main body member by forming or applying an adhesive and bonding the main body member of the protruding bonding body to them. It is.

  The protruding joined body 20 is preferably an insulator. In this case, the connection electrode 16 exposed to the outside of the feeder circuit board 12 is coupled to the radiation electrode 26 of the radiation plate 30 by an electromagnetic field, and the feeder circuit board 12 and the radiation electrode 26 of the radiation plate 30 are not electrically connected. Like that. When the radiation electrode 26 of the radiation plate 30 and the connection electrode 16 of the feeder circuit board 12 and the feeder circuit inside the substrate are coupled by an electromagnetic field, the radiation electrode 26 of the radiation plate 30 and the connection electrode 16 of the feeder circuit board 12 are connected by a conductor. Compared to the case of electrical connection, the accuracy of alignment between the feeder circuit board 12 and the radiation plate 30 can be relaxed, so that the manufacture becomes easy and mass production is easy. Further, since the wireless IC chip 22 is insulated from the radiation plate 30, it is possible to prevent the wireless IC chip 22 from being destroyed by static electricity from the radiation plate 30 or the like.

  In order to stabilize the electromagnetic coupling between the connection electrode 16 of the feeder circuit board 12 and the radiation electrode 26 of the radiation plate 30, the radiation electrode 26 of the radiation plate 30 is formed on the upper surface 28 a of the base material 28. It is preferable to face 12 and the protrusion-like bonded body 20. However, even if the radiation electrode is formed not on the upper surface 28a of the base material but on the lower surface 28b, it can be electromagnetically coupled, so that it can operate as a wireless IC device.

  The projecting bonded body 20 can be a conductor. In this case, for example, the circuit on the power feeding circuit board 12 side can be grounded by connecting the circuit on the power feeding circuit board 12 side and the electrode of the radiation plate 30. Further, when an auxiliary matching circuit is provided on the radiation plate 30 side separately from the power feeding circuit on the power feeding circuit board 12 side, the matching circuit and the power feeding circuit can be electrically connected.

  The distance between the radiation plate 30 and the feeder circuit board 12 is determined by the height of the protrusion-like bonded body 20. As shown in FIG. 1A, the height of the protrusion-like bonded body 20 is larger than the thickness of the wireless IC chip 22. Therefore, even if the feeder circuit board 12 is a flat plate, the gap 23 can be provided between the wireless IC chip 22 and the radiation plate 30. Since it is not necessary to form a cavity (concave portion) or the like for mounting the wireless IC chip 22 on the power supply circuit board 12, the configuration is simplified.

  In the wireless IC device 10, the wireless IC chip 22 is disposed between the radiation plate 30 and the power feeding circuit board 12 and is covered with the radiation plate 30 and the power feeding circuit board 12. Do not join chip 22 directly. Since the wireless IC chip 22 is not in contact with the radiation plate 30, the impact from the radiation plate 30 side is not directly applied to the wireless IC chip 22. Therefore, it is possible to prevent the wireless IC chip 22 from being damaged or broken due to an impact such as dropping.

  Further, since the wireless IC chip 22 is not in contact with the radiation plate 30, the deformation of the base 28 of the radiation plate 30 is not directly applied to the wireless IC chip 22, so that the deformation of the radiation plate 30 may destroy the wireless IC chip. The sex becomes smaller.

  Therefore, the bonding reliability of the wireless IC chip 22 is high.

  Further, the wireless IC chip 22 is spaced apart from the radiation plate 30 with a gap 23, and even if the radiation plate 30 is attached to an uneven surface or curved surface of an article and the radiation plate 30 is deformed, the wireless IC chip is 22 does not need to follow the deformation of the radiation plate 30. Therefore, the wireless IC chip 22 can be attached to various places in a state where the possibility that the wireless IC chip 22 is destroyed by deformation of the radiation plate 30 is low, and is highly versatile.

  Example 2 As shown in FIG. 2, which is a cross-sectional view similar to FIG. 1A, the wireless IC device 10 a of Example 2 is configured substantially in the same manner as Example 1. Below, it demonstrates centering around difference with Example 1, and uses the same code | symbol for the same component as Example 1. FIG.

  As shown in FIG. 2, the wireless IC device 10a differs from the first embodiment in that the connection electrode 16a of the power supply circuit is disposed inside the power supply circuit board 12x, and the connection electrode 16a is not exposed to the outside. The connection electrode 16a and the radiation electrode 26 of the radiation plate 30 are electromagnetically coupled. The protruding joined body 20a may be a conductor or an insulator.

  <Embodiment 3> As shown in FIG. 3 which is a cross-sectional view similar to FIG. 1B, the wireless IC device 10b of Embodiment 3 is linearly formed around the wireless IC chip 22 by a dispenser or printing. Projecting joints 20s and 20t are formed.

  The wireless IC device 10b increases the bonding reliability by increasing the bonding area as compared to the case where the protrusion-like bonded body is formed in a dot shape, and eliminates the exposure of the side surface 22a of the wireless IC chip 22, thereby improving the environmental resistance. It can be improved.

  <Embodiment 4> As shown in FIG. 4 which is a cross-sectional view similar to FIG. 1B, the wireless IC device 10c of Embodiment 4 dispenser, printing, etc. so as to surround the entire periphery of the wireless IC chip 22. As a result, a frame-like protruding joined body 20c is formed.

  The wireless IC device 10c can increase the bonding area as compared with the case where the protrusion-like bonded body is formed in a dot shape or a line shape, eliminates the exposure of the side surface 22a of the wireless IC chip 22, and further improves environmental resistance. It can be improved.

  <Summary> As described above, the wireless IC chip is disposed between the power feeding circuit board and the radiation plate and is separated from the radiation plate, so that an external impact or the like is not directly applied. Therefore, damage and malfunction of the wireless IC chip can be prevented, and the reliability of the wireless IC device can be improved.

  In addition, when the radiation plate and the power supply circuit board are electromagnetically coupled, the wireless IC chip and the radiation plate are not electrically connected, so that the wireless IC chip is destroyed by static electricity on the radiation plate side. There is no, and the countermeasures against static electricity can be strengthened.

  The present invention is not limited to the above-described embodiment, and can be implemented with various modifications.

  For example, the radiation plate and the feeder circuit board may be electromagnetically coupled using not only electromagnetic waves but only electric fields or magnetic fields.

It is sectional drawing of a wireless IC device. (Example 1) It is sectional drawing of a wireless IC device. (Example 2) It is sectional drawing of a wireless IC device. (Example 3) It is sectional drawing of a wireless IC device. (Example 4) It is sectional drawing which shows the manufacturing process of a wireless IC device. (Conventional example)

Explanation of symbols

10, 10a, 10b, 10c Wireless IC device 12 Power supply circuit board 20, 20a, 20c, 20s, 20t Protruding joint 22 Wireless IC chip 30 Radiation plate

Claims (11)

  1. A radiation plate,
    A power supply circuit board including an inductance element;
    A protruding joined body for joining the radiation plate and the feeder circuit board facing each other with a gap therebetween;
    A wireless IC chip mounted on the power supply circuit board and facing the radiation plate with a gap between the radiation plate,
    A wireless IC device comprising:
  2.   The wireless IC device according to claim 1, wherein the power supply circuit board includes a resonance circuit and / or a matching circuit.
  3.   3. The wireless IC device according to claim 1, wherein a height of the protruding joint is greater than a thickness of the wireless IC chip.
  4.   4. The wireless IC device according to claim 1, wherein the protruding joint is formed around the wireless IC chip. 5.
  5.   The wireless IC device according to any one of claims 1 to 4, wherein the protruding joined body is formed in a dot shape.
  6.   The wireless IC device according to any one of claims 1 to 4, wherein the protruding joint is formed in a linear shape.
  7.   The wireless IC device according to any one of claims 1 to 4, wherein the protruding joined body is formed in a frame shape.
  8.   The wireless IC device according to any one of claims 1 to 7, wherein the protruding joined body is formed of a conductor.
  9.   The wireless IC device according to claim 1, wherein the protrusion-like bonded body is formed of an insulator.
  10.   The wireless IC device according to claim 1, wherein a resin is disposed between the wireless IC chip and the power supply circuit board.
  11.   The wireless IC device according to any one of claims 1 to 10, wherein the base of the radiation plate is formed of a flexible substrate.
JP2007201082A 2007-08-01 2007-08-01 Radio ic device Pending JP2009037413A (en)

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WO2011108340A1 (en) * 2010-03-03 2011-09-09 株式会社村田製作所 Wireless communication module and wireless communication device
US8528829B2 (en) 2010-03-12 2013-09-10 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US8544759B2 (en) 2009-01-09 2013-10-01 Murata Manufacturing., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
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US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
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US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8917211B2 (en) 2008-11-17 2014-12-23 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
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US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
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US8876010B2 (en) 2009-04-14 2014-11-04 Murata Manufacturing Co., Ltd Wireless IC device component and wireless IC device
US8690070B2 (en) 2009-04-14 2014-04-08 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US9564678B2 (en) 2009-04-21 2017-02-07 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US9203157B2 (en) 2009-04-21 2015-12-01 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US9117157B2 (en) 2009-10-02 2015-08-25 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US9024725B2 (en) 2009-11-04 2015-05-05 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US8704716B2 (en) 2009-11-20 2014-04-22 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device
WO2011108340A1 (en) * 2010-03-03 2011-09-09 株式会社村田製作所 Wireless communication module and wireless communication device
US8528829B2 (en) 2010-03-12 2013-09-10 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
US9558384B2 (en) 2010-07-28 2017-01-31 Murata Manufacturing Co., Ltd. Antenna apparatus and communication terminal instrument
US8981906B2 (en) 2010-08-10 2015-03-17 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
US9166291B2 (en) 2010-10-12 2015-10-20 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
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