JP2003188620A - Antenna integral with module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an antenna integral with a module whose size can be reduced. <P>SOLUTION: An antenna 10 integral with a module comprises a multilayer substrate 11. A BBIC 14, a memory IC 16, and a quartz oscillator 18 of a high frequency module 12, as well as a surface mounting component 20 and a matching circuit chip component 52 for a matching circuit 50, are mounted on the upper surface of the multilayer substrate 11. A cap-like metal case 22 is so fitted as to cover them. Six band-like legs 22a-22f are formed at the metal case 22. The metal cap 22 is used as an antenna 40, with one leg 22a used as a feeder terminal 41. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a module-integrated antenna, and more particularly to a module-integrated antenna used in a wireless communication device represented by Bluetooth or wireless LAN.

[0002]

2. Description of the Related Art FIG. 17 is a plan view showing an example of a conventional antenna device. In the antenna device 1 shown in FIG. 17, the transmission / reception module 2 and the antenna 3 are connected via a coaxial cable 5 with a connector on the motherboard 4. FIG. 18 is a plan view showing another example of the conventional antenna device. In the antenna device 1a shown in FIG. 18, the transmission / reception module 2 and the antenna 3 are connected via the strip line 6 on the motherboard 4.

[0003]

In the antenna device shown in FIGS. 17 and 18, the antenna gain is deteriorated due to the loss of the coaxial cable and the strip line. Also, FIG.
In the antenna device shown in FIG. 7, there is a problem that the characteristic changes due to the positional displacement of the coaxial cable. Further, in the antenna device shown in FIGS. 17 and 18, a transceiver module, an antenna, a transmission line,
Since it is necessary to provide a matching circuit and the like, there is a problem that the overall size becomes large. Further, FIG. 17 and FIG.
In the antenna device shown in FIG. 8, since the input impedance of the antenna and the output impedance of the transmission / reception module are both designed to be 50 ohms, matching elements are required for each, and the number of parts increases.

Therefore, a main object of the present invention is to provide a module-integrated antenna which can be miniaturized.

[0005]

A module-integrated antenna according to the present invention includes a ceramic substrate, a transceiver module formed on the ceramic substrate, and a cap formed on the ceramic substrate and made of a conductive material for transmitting and receiving radio waves. It is a module-integrated antenna including a rectangular antenna. The module-integrated antenna according to the present invention may further include a matching circuit formed on the ceramics substrate and adapted for impedance matching between the transmission / reception module and the antenna. In the module integrated antenna according to the present invention, the antenna is, for example,
A metal case is disposed on the ceramic substrate so as to cover the transmission / reception module and has a power supply terminal. Also,
In the module-integrated antenna according to the present invention, the antenna includes, for example, a metal plate which is arranged on a ceramics substrate in a region different from that of the transmission / reception module and on which a power supply terminal is formed. Further, in the module-integrated antenna according to the present invention, the antenna may be, for example, an inverted L antenna that is not grounded, an inverted F antenna in which an end portion on the feed terminal side is grounded, or an end portion on the opposite side of the feed terminal. It is a grounded loop antenna. Further, in the module integrated antenna according to the present invention, the ceramic substrate is, for example, a multilayer substrate. Further, in the module integrated antenna according to the present invention, the matching circuit includes, for example, a chip component mounted on the ceramics substrate. Further, in the module integrated antenna according to the present invention, the matching circuit includes, for example, a pattern formed on at least one of the surface of the ceramics substrate and the inside of the ceramics substrate. Further, in the module integrated antenna according to the present invention, the matching circuit includes, for example, a resistor. Further, in the module integrated antenna according to the present invention, a trimming electrode pattern for adjusting the resonance frequency of the antenna may be formed on the ceramics substrate.

In the module-integrated antenna according to the present invention, since the transmission / reception module and the antenna are integrated on the ceramic substrate, a plurality of functional parts are separately formed on the motherboard as compared with the conventional antenna device. No need. Therefore, miniaturization can be achieved. Furthermore, in the module-integrated antenna according to the present invention, when a transmission / reception module and a matching circuit for impedance matching of the antenna are included,
Compared with the conventional antenna device, it is not necessary to provide a matching element and the like in each of the transmission / reception module and the antenna and design their impedance to, for example, 50 ohms, so that the number of parts can be reduced. In the module-integrated antenna according to the present invention, when the antenna includes a metal case arranged on the ceramics substrate so as to cover the transmission / reception module, the number of parts constituting the antenna can be reduced, and the size can be further reduced. be able to. Further, in the module integrated antenna according to the present invention, since the antenna is formed on the ceramics substrate in a region different from that of the transmission / reception module,
It is possible to reduce the influence of the transmitting / receiving module, for example, the shielding ground electrode pattern or the metal case on the antenna. Therefore, the performance of the antenna can be improved. Further, since the module-integrated antenna according to the present invention uses the cap-shaped antenna, even when the module-integrated antenna according to the present invention is arranged on the ground electrode of the motherboard, the antenna between the antenna and the ground electrode of the motherboard is Can be separated. Therefore, the antenna can be arranged on the ground electrode of the mother board, and the degree of freedom in design is increased. However, when the antenna is designed to be formed on the ceramic substrate in a region different from that of the transceiver module, and the ground electrode is not provided below the region where the antenna is formed, the antenna performance is improved. . Further, in the module integrated antenna according to the present invention, when the matching circuit includes a chip component mounted on the ceramics substrate, the characteristic of the matching circuit is adjusted by changing the electrical characteristic of the chip component. Is possible. In the module-integrated antenna according to the present invention, even when the matching circuit includes a pattern formed on the surface of the ceramic substrate, the matching circuit can be changed by changing the electrical characteristics related to the pattern. It is possible to adjust the characteristics. Also,
In the module integrated antenna according to the present invention,
When the matching circuit includes a pattern formed inside the ceramic substrate, the effect of the matching circuit on the antenna is reduced, and the antenna performance is improved. Further, in the module-integrated antenna according to the present invention, when the matching circuit includes a resistor, the input impedance of the antenna can be increased by inserting the resistor into the feeding terminal side of the antenna, and the antenna resonance Can be broadened. In the module integrated antenna according to the present invention, when a trimming electrode pattern for adjusting the resonance frequency of the antenna is formed on the ceramics substrate, the resonance frequency of the antenna is trimmed by trimming the trimming electrode pattern. Can be adjusted.

The above objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of the embodiments of the invention with reference to the drawings.

[0008]

1 is a perspective view showing an example of a module-integrated antenna according to the present invention, FIG. 2 is a front view solution view of the module-integrated antenna, and FIG.
Is a circuit diagram of the module-integrated antenna, and FIG.
FIG. 4 is an equivalent circuit diagram showing the antenna of the module-integrated antenna. Module integrated antenna 1 shown in FIG.
0 includes a multi-layer substrate 11 made of a ceramic substrate.

A high frequency module 12 as a transmitting / receiving module is formed on the multilayer substrate 11. The high frequency module 12 includes a BB (base band) IC 14 and a memory I.
Includes C16, crystal oscillator 18 and surface mount component 20. The BBIC 14, the memory IC 16, the crystal oscillator 18, and the surface mount component 20 are mounted on the upper surface of the multilayer substrate 11. The BBIC 14 is for controlling the entire high frequency module 12. As the memory IC 16, a flash memory is used, for example, and control software is incorporated. The crystal oscillator 18 is used as a reference oscillator. The surface mount component 20 includes, for example, electronic components such as an inductor, a capacitor, a resistor, a transistor and a diode.

A matching circuit 50 for impedance matching between the high frequency module 12 and an antenna 40 described later is formed on the multilayer substrate 11. The matching circuit 50 is, for example, a T-type circuit or a π-type circuit including a matching circuit chip component 52 such as an inductor, a capacitor, and a resistor. The matching circuit chip component 52 includes the multilayer substrate 11
Mounted on the top surface of.

Further, on the upper surface of the multilayer substrate 11, BBI
A cap-shaped metal case 22 is attached so as to cover the C 14, the memory IC 16, the crystal oscillator 18, the surface mount component 20, and the matching circuit chip component 52. Six legs 22 a to 22 f are formed on the metal case 22. In this case, the metal case 22 has three leg portions 22a to 22c formed at one end side thereof at intervals and other three leg portions 22d to 22f formed at the other end side thereof at intervals. It This metal case 22 is used for the antenna 40
Used as. Further, one leg portion 22a of the metal case 22 is used as the power supply terminal 41. Therefore, the leg portion 22 a of the metal case 22 is connected to the high frequency module 12 via the matching circuit 50.

A cavity 24 is formed at the center of the lower surface of the multi-layer substrate 11. In the cavity 24,
The first RFIC 26 and the second RFIC 26 of the high-frequency module 12
The RFIC 28 of is embedded. In this case, the first RFI
As the C26 and the second RFIC 28, for example,
Bare chips are used. Further, the metal cap 30 is fixed to the multilayer substrate 11 so as to seal the cavity 24. Instead of forming the metal cap 30, the cavity 24 may be filled with resin so as to cover the first RFIC 26 and the second RFIC 28.

Inside the multi-layer substrate 11, a wiring pattern 32 and a via hole 34 necessary for connection between the BBIC 14 and the memory IC 16 and a matching circuit 50, and R
F passive component 36 and shielding ground electrode pattern 38
And are formed. The RF passive component 36 includes, for example, an inductor, a capacitor, a distributed constant line, a resonator, a filter and a balun. Further, the shielding ground electrode pattern 38 is formed between the BBIC 14 and the memory IC 16 and the RF passive component 36.

This module-integrated antenna 10 has, for example, the circuit shown in FIG. 3, and the high-frequency module 12 of the module-integrated antenna 10 has, for example, the circuit of the full device 1 shown in FIG. Further, the antenna 40 of the module-integrated antenna 10 has, for example, an equivalent circuit of an inverted L antenna shown in FIG. In FIG.
C represents stray capacitance, Lr represents an inductive reactance component of the radiation conductor, Rr represents radiation resistance, RI represents resistance relating to conductor loss and dielectric loss, and a matching circuit 50 or the like is provided below the feeding mark. Connected. The antenna 40 of the module-integrated antenna 10 has a wavelength of λ / 4 or λ / 2.
Operate in resonance mode.

In this module-integrated antenna 10,
The high frequency module 12 and the antenna 40 are provided on the multilayer substrate 11.
Also, since the matching circuit 50 for impedance matching between them is integrated, it is not necessary to separately form a plurality of functional components on the motherboard as compared with the conventional antenna device. Therefore, miniaturization can be achieved.

Further, the module-integrated antenna 1
In 0, since the matching circuit 50 for performing impedance matching of the high frequency module 12 and the antenna 40 is included, compared with the conventional antenna device, a matching element or the like is provided in each of the high frequency module and the antenna and their impedances are set to, for example. Since it is not necessary to design for 50 ohms or the like, the number of parts can be reduced.

Further, the module-integrated antenna 10
Since the antenna 40 includes the metal case 22 arranged on the multilayer substrate 11 so as to cover the high frequency module 12, the number of parts constituting the antenna is reduced as compared with the case where the antenna is composed of a part other than the metal case. Can
Further size reduction can be achieved.

The module-integrated antenna 10
Since the wiring pattern 32, the via hole 34, the RF passive component 36, and the shielding ground electrode pattern 38 are built in the multilayer substrate 11, the size is smaller than that of the conventional antenna device, such as a mobile phone. Can be implemented in.

Further, the module-integrated antenna 10
Then, since the wiring pattern formed between the components on the surface of the multilayer substrate 11 can be reduced, the RF characteristics can be improved.

Further, the module-integrated antenna 1
In No. 0, the characteristics are improved by using a dielectric material made of ceramics as the material of the multilayer substrate 11 and using a material having good conductivity such as Cu or Ag as the material of the wiring pattern and the electrode pattern inside the multilayer substrate 11. be able to.

Further, the module-integrated antenna 10
Then, the control system components such as the BBIC 14 and the memory IC 16 are mounted on the upper surface of the multilayer substrate 11, and the first RFI
RF components such as C26 and the second RFIC 28 are mounted on the lower surface of the multilayer substrate 11 and are
Since it is mounted on both sides, the surface area is small.

Furthermore, this module-integrated antenna 1
0, control system components such as the BBIC 14 and the memory IC 16 and the first RFIC 26 and the second RFIC 2
Since RF components such as 8 are mounted on both surfaces of the multilayer substrate 11, the wiring pattern up to the control terminals of the control system and the RF
The length with the wiring pattern to the control terminal of the system becomes short,
It becomes small.

Further, the module-integrated antenna 10
Then, the components of the control system are formed on the upper layer of the multilayer substrate 11,
Since the RF system component is formed in the lower layer of the multilayer substrate 11 and the shielding ground electrode pattern 38 is formed between them, both the control system and the RF system are isolated by the shielding ground electrode pattern 38. It Therefore, BBI
There is no signal interference between the C14 and the memory IC 16 and the first RFIC 26 and the second RFIC 28,
Stable operation of each block of the control system and the RF system can be obtained.

Further, the module-integrated antenna 10
Then, the cavity 24 is formed in the lower surface of the multilayer substrate 11, and the first RFIC 26 and the second RFIC 28 are formed in the cavity 24.
Since it is formed, the flatness of the lower surface can be secured,
It is possible to adopt a normal I / O electrode. Therefore, the module-integrated antenna 10 can be surface-mounted even on a double-sided board.

Further, the module-integrated antenna 1
0, the first RFIC 26 and the second RFIC 28
Since a bare chip is used as each, the first RFIC 26 and the second RFIC 26 into the cavity 24
28 is easy to mount and can be downsized.

FIG. 5 is a perspective view showing another example of the module-integrated antenna according to the present invention, and FIG. 6 is an equivalent circuit diagram showing the antenna of the module-integrated antenna shown in FIG. Module integrated antenna 10a shown in FIG.
In comparison with the module-integrated antenna 10 shown in FIG. 1, the legs 22b and 22c of the metal case 22 corresponding to the ends of the antenna 40a on the side of the power supply terminal 41a are used as the ground terminals 43a, respectively. Therefore, the antenna 40a of the module-integrated antenna 10a has, for example, an equivalent circuit of an inverted F antenna shown in FIG. Figure 6
, C represents stray capacitance, Lr represents the inductive reactance component of the radiation conductor, Ls represents the inductive reactance component of the short-circuit conductor, Rr represents the radiation resistance, RI represents resistance related to conductor loss and dielectric loss. The matching circuit 50 and the like are connected below the power supply mark. The antenna 40a of the module-integrated antenna 10a is also operated in the resonance mode of λ / 4 or λ / 2.

FIG. 7 is a perspective view showing still another example of the module integrated antenna according to the present invention, and FIG. 8 is an equivalent circuit diagram showing the antenna of the module integrated antenna shown in FIG. The module-integrated antenna 10b shown in FIG. 7 is different from the module-integrated antenna 10 shown in FIG. 1 in that the legs 22d to 22f of the metal case 22 corresponding to the ends of the antenna 40b on the opposite side to the power supply terminals 41b are respectively formed. It is used as the ground terminal 43b. Therefore, the antenna 40b of the module-integrated antenna 10b
Has an equivalent circuit of the loop antenna shown in FIG. 8, for example. In FIG. 8, C represents a matching capacitance, Lr represents an inductive reactance component of the radiation conductor, Rr represents radiation resistance, RI represents resistance related to conductor loss and dielectric loss, and below the feeding mark. The matching circuit 50 and the like are connected. Antenna 4 of this module-integrated antenna 10b
0b also operates in a λ / 4 or λ / 2 resonance mode.

The module-integrated antennas 10a and 10b shown in FIGS. 5 and 7 have the same effects as those of the module-integrated antenna 10 shown in FIG. 1 except that they are inverted F antennas or loop antennas that are not inverted L antennas. Play.

FIG. 9 is a perspective view showing still another example of the module-integrated antenna according to the present invention. The module-integrated antenna 10c shown in FIG. 9 has a matching circuit 50c as compared with the module-integrated antenna 10 shown in FIG.
Includes a capacitor formed between two pattern electrodes 54 built in the multilayer substrate 11c with a space therebetween. The matching circuit 50c may include an inductor made of a pattern electrode such as a spiral line or a meander line built in the multilayer substrate 11c. In the module integrated antennas 10a and 10b shown in FIGS. 5 and 7, the matching circuit also includes a capacitor formed between the pattern electrodes built in the multilayer substrate and an inductor made of the pattern electrodes built in the multilayer substrate. But it's okay.

The module integrated antenna 10 shown in FIG.
In FIG. 7c, the pattern electrode 54 of the matching circuit 50c is built in the multilayer substrate 11c as compared with the module integrated antennas 10, 10a and 10b shown in FIGS. 22, the influence of the matching circuit 50c on the antenna 40c is reduced, and the performance of the antenna 40c is improved.

FIG. 10 is a perspective view showing still another example of the module integrated antenna according to the present invention.
FIG. 11 is a front view solution view of the module integrated antenna shown in FIG. 10. Module integrated antenna 10d shown in FIG.
Then, as compared with the module-integrated antenna 10 shown in FIG. 1, the multilayer substrate 11d is formed slightly larger. Further, next to the high frequency module 12, the matching circuit chip component 52 of the matching circuit 50 is mounted on the upper surface of the multilayer substrate 11d. Further, the matching circuit 5 is provided on the upper surface of the multilayer substrate 11d.
A cap-shaped metal plate 60 is attached to the side of the matching circuit chip component 52 of 0. The metal plate 60 may be attached to the upper surface of the multilayer substrate 11d so as to cover the matching circuit chip component 52. This metal plate 60 has 4
One leg 60a-60d is formed. In this case, the metal plate 60 has two leg portions 60a and 6 on one end side thereof.
0b is formed with a space, and two other leg portions 60c and 60d are formed with a space on the other end side.
The metal plate 60 is used as the antenna 40d.
Further, one leg portion 60a of the metal plate 60 is used as the power supply terminal 41d. Therefore, the leg portion 60 a of the metal plate 60 is connected to the high frequency module 1 via the matching circuit 50.
Connected to 2. In this case, the wiring patterns and via holes formed on the multilayer substrate 11d are used. The metal case 22 is not connected to the matching circuit 50 and is not used as an antenna. However, the metal case 22 may also be connected to the matching circuit 50 and used as an antenna.

Module integrated antenna 1 shown in FIG.
0d has a circuit similar to the circuit shown in FIG. 3,
High frequency module 1 of module integrated antenna 10d
2 has the same circuit as the full device 1 shown in FIG. 3, for example. The antenna 40d of the module integrated antenna 10d has an equivalent circuit of an inverted L antenna.
Antenna 40d of this module integrated antenna 10d
Also operates in a resonance mode of λ / 4 or λ / 2.

Module integrated antenna 1 shown in FIG.
Even at 0d, since the high frequency module 12, the antenna 40d and the matching circuit 50 are integrated on the multilayer substrate 11, it is not necessary to separately form a plurality of functional components on the motherboard as compared with the conventional antenna device. Therefore, miniaturization can be achieved.

Further, since the module-integrated antenna 10d shown in FIG. 10 includes the matching circuit 50 for the high-frequency module 12 and the antenna 40d, matching elements and the like are provided in each of the transmitting / receiving module and the antenna as compared with the conventional antenna device. Since it is not necessary to provide them and design their impedance to, for example, 50 ohms, the number of parts can be reduced.

In the module-integrated antenna 10d shown in FIG. 10, the antenna 40d is the high frequency module 1a.
Since it is formed on the multilayer substrate 11d in a region different from that of 2, the influence on the antenna 40d from the ground electrode pattern 38 for shielding, the metal case 22, etc. of the high frequency module 12 can be reduced. Therefore, the performance of the antenna 40d can be improved. In addition, the module integrated antenna 10 shown in FIG.
Since the cap-shaped antenna 40d is used in FIG. 8d, even when the module-integrated antenna 10d is arranged on the ground electrode of the motherboard, the antenna 40d
The distance between d and the ground electrode of the motherboard can be increased. Therefore, it becomes possible to dispose the antenna 40d also on the ground electrode of the motherboard, which increases the degree of freedom in design. However, when the antenna 40d is designed to be formed on the multilayer substrate 11 in a region different from the high frequency module 12 and the ground electrode is not provided below the region where the antenna 40d is formed, the antenna 40d Performance will be better. In the module integrated antenna 10d as well, the matching circuit 50 may include a capacitor and an inductor.

Further, in the module integrated antenna 10d shown in FIG. 10, since the matching circuit 50 includes the matching circuit chip component 52 mounted on the multilayer substrate 11d, the electrical characteristics of the matching circuit chip component 52 are shown. The characteristics of the matching circuit 50 can be adjusted by changing the characteristics.
In addition, in this module integrated antenna 10d,
The matching circuit chip component 52 of the matching circuit 50 may be mounted on the multilayer substrate 11d in the metal case 22.

FIG. 12 is a perspective view showing still another example of the module-integrated antenna according to the present invention. 12
The module-integrated antenna 10e shown in Fig. 10 is different from the module-integrated antenna 10d shown in Fig. 10 in that a metal plate 60 corresponding to the end portion of the antenna 40e on the side of the power supply terminal 41e is provided.
Leg portion 60b is used as the ground terminal 43e. Therefore, the antenna 40e of the module-integrated antenna 10e has an equivalent circuit of an inverted F antenna. The antenna 40e of the module-integrated antenna 10e also has a λ /
It operates in a resonance mode of 4 or λ / 2.

FIG. 13 is a perspective view showing still another example of the module-integrated antenna according to the present invention. FIG.
Compared with the module-integrated antenna 10d shown in FIG. 10, in the module-integrated antenna 10f shown in FIG. 10, the leg portions 60c and 60d of the metal plate 60 corresponding to the ends on the opposite side of the feeding terminal 41f of the antenna 40f are ground terminals. Four
It is used as 3f. Therefore, the antenna 40f of the module integrated antenna 10f has an equivalent circuit of a loop antenna. This module integrated antenna 1
The 0f antenna 40f is also operated in the resonance mode of λ / 4 or λ / 2.

The module-integrated antennas 10e and 10f shown in FIGS. 12 and 13 have the same effects as the module-integrated antenna 10d shown in FIG. 10 except that the antenna is an inverted F antenna or a loop antenna that is not an inverted L antenna. Play.

FIG. 14 is a perspective view showing still another example of the module-integrated antenna according to the present invention. 14
Compared to the module-integrated antenna 10e illustrated in FIG. 12, the module-integrated antenna 10g illustrated in FIG. 12 has a matching circuit 50g built in the multilayer substrate 11g with a space therebetween.
It includes a capacitor formed between the pattern electrodes 54. The matching circuit 50g may include an inductor formed of pattern electrodes such as spiral lines and meander lines built in the multilayer substrate 11g. In the module integrated antennas 10d and 10f shown in FIGS. 10 and 13, the matching circuit also includes a capacitor formed between the pattern electrodes built in the multilayer substrate and an inductor made of the pattern electrodes built in the multilayer substrate. But it's okay.

Module integrated antenna 1 shown in FIG.
At 0 g, compared with the module integrated antennas 10d, 10e and 10f shown in FIGS. 10, 12 and 13, the pattern electrode 54 of the matching circuit 50g has the multi-layer substrate 11.
Since the pattern electrode 54 is incorporated in the metal plate 6
The effect of the matching circuit 50g on the antenna 40g is reduced, and the performance of the antenna 40g is improved.

FIG. 15 is a perspective view showing still another example of the module integrated antenna according to the present invention. Figure 15
In the module integrated antenna 10h shown in FIG. 12, the matching circuit 50h includes a resistor 52h formed of a chip resistor mounted on the upper surface of the multilayer substrate 11h, as compared with the module integrated antenna 10e shown in FIG. A printing resistor formed by printing silver, silver-palladium, or the like may be used as the resistor 52h. This resistor 52h is inserted on the side of the power feeding terminal 41h of the antenna 40h,
0h is connected in series. As a result, in this module-integrated antenna 10h, the input impedance of the antenna 40h can be increased and the resonance of the antenna 40h can be broadened. The resistor 52h
May be formed inside the multilayer substrate 11h.

FIG. 16 is a perspective view showing still another example of the module-integrated antenna according to the present invention. FIG.
The module-integrated antenna 10i shown in FIG.
A trimming electrode pattern 56 for adjusting the resonance frequency of the antenna 40i is formed on the upper surface of the multilayer substrate 11i. The trimming electrode pattern 56 is connected to the leg portions 60c and 60d of the metal plate 60. In this module-integrated antenna 10i, the antenna 40 is formed by trimming the trimming electrode pattern 56.
The resonance frequency of the antenna 40i can be adjusted by adjusting the capacitance related to i. Therefore, the antenna 4
It is effective for reducing the variation of the resonance frequency of 0i. Note that, as shown in FIG. 16, the resonance frequency of the antenna 40i may be adjusted by trimming the metal plate 60. The trimming electrode pattern 56 may be formed inside the multilayer substrate 11i.

In the above module integrated antennas, the antenna includes a cap-shaped metal case or a cap-shaped metal plate, but in the present invention, the antenna may be formed of a conductive material other than metal in a cap shape. Further, in the present invention, the antenna is preferably made of a low loss conductive material.

In each of the module-integrated antennas described above, six strip-shaped legs are formed at both ends of the metal case, or four strip-shaped legs are formed at both ends of the metal plate. The number of legs, the shape of the legs, and the positions at which the legs are formed may be changed arbitrarily.

Furthermore, in each of the above-described module-integrated antennas, a matching circuit composed of another circuit may be formed on the multilayer substrate instead of the matching circuit of the T-type circuit or the π-type circuit.

Further, in the module-integrated antenna according to the present invention, the matching circuit may include a capacitor, an inductor, or the like formed of pattern electrodes formed on the surface of the multilayer substrate, or formed on the surface and inside the multilayer substrate. It may include a capacitor or an inductor formed of the patterned electrodes.

In each of the module-integrated antennas described above, the high-frequency module having a special structure is formed on the multilayer substrate, but in the present invention, the high-frequency module having another structure may be formed on the multilayer substrate.

Although all the module-integrated antennas according to the present invention are provided with a matching circuit for impedance matching the high frequency module and the antenna, the high frequency module and the antenna are originally matched. In some cases, a matching circuit may not be necessary.

[0050]

According to the present invention, it is possible to obtain a module-integrated antenna which can be miniaturized.

[Brief description of drawings]

FIG. 1 is a perspective view showing an example of a module-integrated antenna according to the present invention.

2 is a front view solution view of the module-integrated antenna shown in FIG. 1. FIG.

FIG. 3 is a circuit diagram of the module-integrated antenna shown in FIG.

FIG. 4 is an equivalent circuit diagram showing an antenna of the module-integrated antenna shown in FIG.

FIG. 5 is a perspective view showing another example of the module integrated antenna according to the present invention.

6 is an equivalent circuit diagram showing an antenna of the module-integrated antenna shown in FIG.

FIG. 7 is a perspective view showing still another example of the module-integrated antenna according to the present invention.

8 is an equivalent circuit diagram showing an antenna of the module-integrated antenna shown in FIG.

FIG. 9 is a perspective view showing still another example of the module-integrated antenna according to the present invention.

FIG. 10 is a perspective view showing still another example of the module-integrated antenna according to the present invention.

11 is a front view solution view of the module-integrated antenna shown in FIG.

FIG. 12 is a perspective view showing still another example of the module-integrated antenna according to the present invention.

FIG. 13 is a perspective view showing still another example of the module integrated antenna according to the present invention.

FIG. 14 is a perspective view showing still another example of the module-integrated antenna according to the present invention.

FIG. 15 is a perspective view showing still another example of the module-integrated antenna according to the present invention.

FIG. 16 is a perspective view showing still another example of the module-integrated antenna according to the present invention.

FIG. 17 is a plan view showing an example of a conventional antenna device.

FIG. 18 is a plan view showing another example of the conventional antenna device.

[Explanation of symbols]

10, 10a to 10i Module integrated antenna 11, 11c, 11d, 11g, 11h, 11i Multilayer substrate 12 High frequency module 14 BBIC 16 Memory IC 18 Crystal oscillator 20 Surface mount component 22 Metal case 22a to 22f Leg 24 Cavity 26 1 RFIC 28 2nd RFIC 30 Metal cap 32 Wiring pattern 34 Via hole 36 RF passive component 38 Shielding ground electrode pattern 40, 40a-40i Antenna 41, 41a-41i Power supply terminals 43a, 43b, 43e, 43f, 43g, 43h, 4
3i Ground terminal 50, 50c, 50g, 50h Matching circuit 52 Matching circuit chip component 52h Resistor 54 Pattern electrode 56 Trimming electrode pattern 60 Metal plates 60a to 60d Legs

Claims (12)

[Claims] 1. A module-integrated antenna including a ceramic substrate, a transceiver module formed on the ceramic substrate, and a cap-shaped antenna formed on the ceramic substrate and made of a conductive material for transmitting and receiving radio waves. 2. The module-integrated antenna according to claim 1, wherein the antenna includes a metal case which is disposed on the ceramic substrate so as to cover the transmission / reception module and has a power supply terminal. 3. The module-integrated antenna according to claim 1, wherein the antenna includes a metal plate that is disposed on the ceramics substrate in a region different from that of the transmission / reception module and has a power supply terminal formed thereon. 4. The antenna is an inverted L which is not grounded.
The module integrated antenna according to claim 2 or 3, which is an antenna. 5. The module-integrated antenna according to claim 2, wherein the antenna is an inverted F antenna in which an end portion on the power feeding terminal side is grounded. 6. The module integrated antenna according to claim 2, wherein the antenna is a loop antenna in which an end portion on the opposite side of the power supply terminal is grounded. 7. The ceramic substrate is a multi-layer substrate,
The module integrated antenna according to any one of claims 1 to 6. 8. The circuit according to claim 1, further comprising a matching circuit formed on the ceramic substrate for impedance matching of the transmitting / receiving module and the antenna.
The module-integrated antenna according to claim 7. 9. The module-integrated antenna according to claim 8, wherein the matching circuit includes a chip component mounted on the ceramics substrate. 10. The matching circuit includes a pattern formed on at least one of the surface of the ceramics substrate and the inside of the ceramics substrate.
Alternatively, the module-integrated antenna according to claim 9. 11. The matching circuit includes a resistor.
The module-integrated antenna according to any one of claims 1 to 10. 12. The module integrated antenna according to claim 1, wherein a trimming electrode pattern for adjusting a resonance frequency of the antenna is formed on the ceramics substrate.