JP2003188626A - Antenna integral with module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an antenna integral with a module whose size can be reduced. <P>SOLUTION: An antenna 10 integral with a module comprises a multilayer substrate 11. A BBIC 14, a memory IC 16, and a quartz oscillator 18, and a surface mounting component 20 of a high frequency module 12 are formed on the multilayer substrate 11, from one end side toward the central part. An antenna 40 of herical line is formed inside the other end part of the multilayer substrate 11. A matching circuit chip component 52 of a matching circuit 50 is mounted on the upper surface of the other end part of the multilayer substrate 11. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a module-integrated antenna, and more particularly to a module-integrated antenna used in a wireless communication device represented by Bluetooth or wireless LAN.

[0002]

2. Description of the Related Art FIG. 16 is a plan view showing an example of a conventional antenna device. In the antenna device 1 shown in FIG. 16, the transmission / reception module 2 and the antenna 3 are connected via a coaxial cable 5 with a connector on the motherboard 4. FIG. 17 is a plan view showing another example of the conventional antenna device. In the antenna device 1a shown in FIG. 17, the transmission / reception module 2 and the antenna 3 are connected via a stripline 6 on the motherboard 4.

[0003]

In the antenna device shown in FIGS. 16 and 17, the antenna gain is deteriorated due to the loss of the coaxial cable and the strip line. Also, FIG.
In the antenna device shown in FIG. 6, there is a problem that the characteristic changes due to the positional displacement of the coaxial cable. In addition, in the antenna device shown in FIGS. 16 and 17, a transmission / reception module, an antenna, a transmission line,
Since it is necessary to provide a matching circuit and the like, there is a problem that the overall size becomes large. Further, FIG. 16 and FIG.
In the antenna device shown in FIG. 7, since the input impedance of the antenna and the output impedance of the transmission / reception module are both designed to be 50 ohms, matching elements are required for each, and the number of parts increases.

Therefore, a main object of the present invention is to provide a module-integrated antenna which can be miniaturized.

[0005]

A module-integrated antenna according to the present invention includes a ceramics substrate, a transceiver module formed on the ceramics substrate, a ceramics substrate, and the antenna is arranged in a different area from the transceiver module. It is a module-integrated antenna including a linear antenna made of a conductive material for transmitting and receiving radio waves, and a transmission / reception module and a matching circuit for impedance matching of the antenna formed on a ceramics substrate. In the module integrated antenna according to the present invention,
The antenna includes, for example, a helical line or a meander line, and an inverted F antenna in which an end portion on the side of a power supply terminal is grounded, an inverted L antenna not grounded, or a loop in which an end portion on the opposite side of the power supply terminal is grounded. It is an antenna.
Further, in the module integrated antenna according to the present invention, the ceramic substrate is, for example, a multilayer substrate. Further, in the module integrated antenna according to the present invention,
The antenna is formed, for example, on at least one of the surface and the inside of the ceramics substrate. Further, in the module-integrated antenna according to the present invention, the matching circuit includes, for example, a chip component mounted on the ceramics substrate. Further, in the module-integrated antenna according to the present invention, the matching circuit includes, for example, a pattern formed on at least one of the surface of the ceramics substrate and the inside of the ceramics substrate. Further, in the module integrated antenna according to the present invention, the matching circuit includes, for example, a resistor. Furthermore, in the module-integrated antenna according to the present invention, a trimming electrode pattern for adjusting the resonance frequency of the antenna may be formed on the ceramics substrate.

In the module-integrated antenna according to the present invention, the transmission / reception module, the antenna, and the matching circuit for impedance matching between them are integrated in the ceramic substrate, so that a plurality of antennas can be provided as compared with the conventional antenna device. There is no need to separately form functional parts on the motherboard. Therefore, miniaturization can be achieved. Furthermore, the module-integrated antenna according to the present invention includes a matching circuit for impedance matching between the transmission / reception module and the antenna, and therefore a matching element or the like is provided in each of the transmission / reception module and the antenna as compared with the conventional antenna device. Since it is not necessary to design their impedance to be, for example, 50 ohms, the number of parts can be reduced. Further, in the module integrated antenna according to the present invention,
Since the antenna is formed on the ceramic substrate and adjacent to the transceiver module in a region different from each other, the influence of the transceiver ground electrode pattern or the metal case on the antenna is reduced. be able to. Therefore, the performance of the antenna can be improved. Further, even when the transmission / reception module portion of the module-integrated antenna is arranged on the ground electrode of the mother board, the antenna portion can be designed to be arranged on the portion where the ground electrode is not formed. Therefore, the distance between the antenna and the ground electrode of the motherboard can be increased, and the performance of the antenna can be improved. Further, in the module integrated antenna according to the present invention, when the antenna is formed inside the ceramic substrate, the surface of the ceramic substrate can be effectively used for purposes other than the antenna.
Further, in the module integrated antenna according to the present invention, when the matching circuit includes a chip component mounted on the ceramics substrate, the characteristic of the matching circuit is adjusted by changing the electrical characteristic of the chip component. Is possible. In the module-integrated antenna according to the present invention, even when the matching circuit includes a pattern formed on the surface of the ceramic substrate, the matching circuit can be changed by changing the electrical characteristics related to the pattern. It is possible to adjust the characteristics. Furthermore, in the module-integrated antenna according to the present invention, when the matching circuit includes a pattern formed inside the ceramics substrate, the effect of the matching circuit on the antenna is reduced, and the antenna performance is improved. Further, in the module-integrated antenna according to the present invention, when the matching circuit includes a resistor, the input impedance of the antenna can be increased by inserting the resistor into the feeding terminal side of the antenna, and the resonance of the antenna can be increased. Can be broadened. Further, in the module integrated antenna according to the present invention, when a trimming electrode pattern for adjusting the resonance frequency of the antenna is formed on the ceramic substrate, the resonance frequency of the antenna is trimmed by trimming the trimming electrode pattern. Can be adjusted.

The above objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of the embodiments of the invention with reference to the drawings.

[0008]

1 is a perspective view showing an example of a module-integrated antenna according to the present invention, FIG. 2 is a front view solution view of the module-integrated antenna, and FIG.
Is an exploded perspective view showing the antenna of the module integrated antenna, FIG. 4 is a circuit diagram of the module integrated antenna, and FIG. 5 is an equivalent circuit diagram showing the antenna of the module integrated antenna. The module-integrated antenna 10 shown in FIG. 1 includes a multilayer substrate 11 made of a ceramic substrate.

A high-frequency module 12 as a transmission / reception module is formed from the one end side portion to the central portion of the multilayer substrate 11. The high frequency module 12 includes a BB (base band) IC 14, a memory IC 16, a crystal oscillator 18, and a surface mount component 20. BBIC14, memory IC
16, the crystal oscillator 18 and the surface mount component 20 are mounted on the upper surface of the central portion from the one end side portion of the multilayer substrate 11. The BBIC 14 is for controlling the entire high frequency module 12. As the memory IC 16, a flash memory is used, for example, and control software is incorporated. The crystal oscillator 18 is used as a reference oscillator. The surface mount component 20 includes, for example, electronic components such as an inductor, a capacitor, a resistor, a transistor and a diode.

Further, a cap-shaped metal case 22 is attached so as to cover the BBIC 14, the memory IC 16, the crystal oscillator 18, and the surface mount component 20 from the one end side portion to the upper surface of the central portion of the multilayer substrate 11.

A cavity 24 is formed in the center of the lower surface of the central portion from the one end side portion of the multilayer substrate 11.
In the cavity 24, the first
RFIC 26 and second RFIC 28 are embedded. In this case, the first RFIC 26 and the second RFI
As C28, for example, a bare chip is used.
Further, the metal cap 30 is fixed to the multilayer substrate 11 so as to seal the cavity 24. Instead of forming the metal cap 30, the cavity 24 may be filled with resin so as to cover the first RFIC 26 and the second RFIC 28.

Further, the BBIC 14 and the memory IC 16 are provided inside the central portion from the one end side portion of the multilayer substrate 11.
A wiring pattern 32 and a via hole 34 required for connection between spaces, an RF passive component 36, and a shielding ground electrode pattern 38 are formed. The RF passive component 36 is
Examples include inductors, capacitors, distributed constant lines, resonators, filters and baluns. Further, the shielding ground electrode pattern 38 is formed between the BBIC 14 and the memory IC 16 and the RF passive component 36.

Inside the other end portion of the multi-layer substrate 11, a spiral antenna 40 made of a helical line is formed. This antenna 40 is made of a conductive material, and is particularly shown in FIG.
As shown in FIG. 4, the plurality of lines 42 formed between the substrates of the multilayer substrate 11 and the plurality of lines 44 formed between the other substrates of the multilayer substrate 11 are included. These lines 42 and 44 are the lines 42 and 44 in the multilayer substrate 11.
A plurality of via holes 46 penetrating the substrate in between are spirally connected. This antenna 40 has one end portion used as a power supply terminal 41.

A matching circuit 50 for impedance matching between the high frequency module 12 and the antenna 40 is formed on the other end portion of the multilayer substrate 11. The matching circuit 50 is, for example, a T-type circuit including a matching circuit chip component 52 such as an inductor, a capacitor, or a resistor, or π.
It consists of a mold circuit. The matching circuit chip component 52 is mounted on the upper surface of the multilayer substrate 11. The high frequency module 12 is connected to the power supply terminal 41 of the antenna 40 via the matching circuit 50.

This module-integrated antenna 10 has, for example, the circuit shown in FIG. 4, and the high-frequency module 12 of the module-integrated antenna 10 has, for example, the circuit of the full device 1 shown in FIG. The antenna 40 of the module-integrated antenna 10 has, for example, an equivalent circuit of an inverted L antenna shown in FIG. In FIG.
C represents stray capacitance, Lr represents an inductive reactance component of the radiation conductor, Rr represents radiation resistance, RI represents resistance relating to conductor loss and dielectric loss, and a matching circuit 50 or the like is provided below the feeding mark. Connected. The antenna 40 of the module-integrated antenna 10 has a wavelength of λ / 4 or λ / 2.
Operate in resonance mode.

In this module-integrated antenna 10,
The high frequency module 12 and the antenna 40 are provided on the multilayer substrate 11.
Also, since the matching circuit 50 for impedance matching between them is integrated, it is not necessary to separately form a plurality of functional components on the motherboard as compared with the conventional antenna device. Therefore, miniaturization can be achieved.

Further, this module-integrated antenna 1
In 0, since the high frequency module 12 and the matching circuit 50 for performing impedance matching of the antenna 40 are included, compared with the conventional antenna device, a matching element or the like is provided in each of the transmission / reception module and the antenna, and their impedances are set, for example. Since it is not necessary to design for 50 ohms or the like, the number of parts can be reduced.

Further, the module-integrated antenna 10
Then, the antenna 40 is formed on the multilayer substrate 11, and
Since the high frequency module 12 and the high frequency module 12 are formed so as to be adjacent to each other in different regions, for example, the shielding ground electrode pattern 38 and the metal case 22 of the high frequency module 12 are formed.
It is possible to reduce the influence on the antenna 40 from the above. Therefore, the performance of the antenna 40 can be improved. Further, even when the high-frequency module 12 part of the module-integrated antenna 10 is arranged on the ground electrode of the mother board, the antenna 40 part can be designed to be arranged on a part where the ground electrode is not formed. Therefore, the distance between the antenna 40 and the ground electrode of the motherboard can be increased, and the performance of the antenna 40 can be improved.

Further, the module-integrated antenna 1
In 0, since the antenna 40 is formed inside the multilayer substrate 11, the surface of the multilayer substrate 11 can be effectively used for purposes other than the antenna 40.

The module-integrated antenna 10
Since the wiring pattern 32, the via hole 34, the RF passive component 36, and the shielding ground electrode pattern 38 are built in the multilayer substrate 11, the size is smaller than that of the conventional antenna device, such as a mobile phone. Can be implemented in.

Further, the module-integrated antenna 10
Then, since the wiring pattern formed between the components on the surface of the multilayer substrate 11 can be reduced, the RF characteristics can be improved.

Furthermore, this module-integrated antenna 1
In No. 0, the characteristics are improved by using a dielectric material made of ceramics as the material of the multilayer substrate 11 and using a material having good conductivity such as Cu or Ag as the material of the wiring pattern and the electrode pattern inside the multilayer substrate 11. be able to.

Further, the module-integrated antenna 10
Then, the control system components such as the BBIC 14 and the memory IC 16 are mounted on the upper surface of the multilayer substrate 11, and the first RFI
RF components such as C26 and the second RFIC 28 are mounted on the lower surface of the multilayer substrate 11 and are
Since it is mounted on both sides, the surface area is small.

Furthermore, this module-integrated antenna 1
0, control system components such as the BBIC 14 and the memory IC 16 and the first RFIC 26 and the second RFIC 2
Since RF components such as 8 are mounted on both surfaces of the multilayer substrate 11, the wiring pattern up to the control terminals of the control system and the RF
The length with the wiring pattern to the control terminal of the system becomes short,
It becomes small.

Further, the module-integrated antenna 10
Then, the components of the control system are formed on the upper layer of the multilayer substrate 11,
Since the RF system component is formed in the lower layer of the multilayer substrate 11 and the shielding ground electrode pattern 38 is formed between them, both the control system and the RF system are isolated by the shielding ground electrode pattern 38. It Therefore, BBI
There is no signal interference between the C14 and the memory IC 16 and the first RFIC 26 and the second RFIC 28,
Stable operation of each block of the control system and the RF system can be obtained.

Further, the module-integrated antenna 10
Then, the cavity 24 is formed in the lower surface of the multilayer substrate 11, and the first RFIC 26 and the second RFIC 28 are formed in the cavity 24.
Since it is formed, the flatness of the lower surface can be secured,
It is possible to adopt a normal I / O electrode. Therefore, the module-integrated antenna 10 can be surface-mounted even on a double-sided board.

Further, the module-integrated antenna 1
0, the first RFIC 26 and the second RFIC 28
Since a bare chip is used as each, the first RFIC 26 and the second RFIC 26 into the cavity 24
28 is easy to mount and can be downsized.

FIG. 6 is a perspective view showing another example of the module integrated antenna according to the present invention, and FIG. 7 is an exploded perspective view showing the antenna of the module integrated antenna shown in FIG. Module integrated antenna 10a shown in FIG.
In comparison with the module integrated antenna 10 shown in FIG. 1, a linear antenna 40a made of a meander line is formed inside the other end portion of the multilayer substrate 11a. The antenna 40a is made of a conductive material and is formed between the substrates of the multilayer substrate 11a, as shown in FIG. One end of the antenna 40a is used as a power supply terminal 41a. Therefore, this module-integrated antenna 1
The antenna 40a of 0a has an equivalent circuit of an inverted L antenna. The antenna 40a of the module-integrated antenna 10a is also operated in the resonance mode of λ / 4 or λ / 2.

FIG. 8 is a perspective view showing still another example of the module integrated antenna according to the present invention, and FIG. 9 is an equivalent circuit diagram showing the antenna of the module integrated antenna shown in FIG. The module-integrated antenna 10b shown in FIG. 8 is different from the module-integrated antenna 10 shown in FIG. 1 in that a linear antenna 40b formed of an F-shaped line is formed inside the other end side portion of the multilayer substrate 11b. The antenna 40b is made of a conductive material and is formed between the substrates of the multilayer substrate 11b. This antenna 40b has one end portion used as a power supply terminal 41b.
The other end portion on the side is used as the ground terminal 43b. Therefore, the antenna 40b of the module-integrated antenna 10b has, for example, an equivalent circuit of an inverted F antenna shown in FIG. In FIG. 9, C indicates stray capacitance, and Lr
Represents the inductive reactance component of the radiation conductor, Ls represents the inductive reactance component of the short-circuit conductor, Rr represents the radiation resistance, RI represents the resistance related to conductor loss and dielectric loss, and is matched to the lower side of the feeding mark. The circuit 50 and the like are connected. Antenna 4 of this module-integrated antenna 10b
0b also operates in a λ / 4 or λ / 2 resonance mode.

FIG. 10 is a perspective view showing still another example of the module integrated antenna according to the present invention. Figure 10
The module-integrated antenna 10c shown in FIG. 1 is different from the module-integrated antenna 10 shown in FIG.
A linear antenna 40c formed of an L-shaped line is formed inside the other end portion of c. The antenna 40c is made of a conductive material and is formed between the substrates of the multilayer substrate 11c.
This antenna 40c has a power supply terminal 41c at one end thereof.
Used as. Therefore, the antenna 40c of the module-integrated antenna 10c has an equivalent circuit of an inverted L antenna. The antenna 40c of the module-integrated antenna 10c is also operated in the resonance mode of λ / 4 or λ / 2.

FIG. 11 is a perspective view showing still another example of the module integrated antenna according to the present invention, and FIG.
FIG. 12 is an equivalent circuit diagram showing an antenna of the module integrated antenna shown in FIG. 11. The module-integrated antenna 10d shown in FIG. 11 is different from the module-integrated antenna 10 shown in FIG. 1 in that an antenna 40d formed of a U-shaped line is formed inside the other end portion of the multilayer substrate 11d. The antenna 40d is made of a conductive material, one end of which is used as the power supply terminal 41d, and the other end of which is used as the ground terminal 43d. Therefore, the antenna 40d of the module-integrated antenna 10d has, for example, an equivalent circuit of the loop antenna shown in FIG. Figure 1
In 2, C represents a matching capacitance, Lr represents an inductive reactance component of the radiation conductor, Rr represents radiation resistance, RI represents resistance relating to conductor loss and dielectric loss,
The matching circuit 50 and the like are connected below the power feeding mark. Antenna 40d of this module integrated antenna 10d
Also operates in a resonance mode of λ / 4 or λ / 2.

In the module-integrated antennas 10a, 10b, 10c and 10d shown in FIGS. 6, 8, 10 and 11, an inverted L antenna, an inverted F antenna or a loop antenna which is not an inverted L antenna composed of helical lines is used. Except for the above, the same effect as that of the module-integrated antenna 10 shown in FIG. 1 is achieved.

FIG. 13 is a perspective view showing still another example of the module integrated antenna according to the present invention. FIG.
The module-integrated antenna 10e shown in FIG. 1 is compared with the module-integrated antenna 10 shown in FIG.
e includes a capacitor formed between two pattern electrodes 54 built in the multilayer substrate 11e with a space therebetween. The matching circuit 50e may include an inductor made of pattern electrodes such as spiral lines and meander lines built in the multilayer substrate 11e. The module-integrated antenna 10 shown in FIGS. 6, 8, 10, and 11.
Also in a, 10b, 10c and 10d, the matching circuit may include a capacitor formed between the pattern electrodes built in the multilayer substrate or an inductor made of the pattern electrodes built in the multilayer substrate.

Module integrated antenna 1 shown in FIG.
0e, the module-integrated antennas 10, 10a, 10b, 1 shown in FIGS. 1, 6, 8, 10 and 11 are shown.
Compared to 0c and 10d, since at least a part of the matching circuit 50e is built in the multilayer substrate 11e, the surface of the multilayer substrate 11e can be effectively used as a space for other mounting components, electrode patterns, and the like.

FIG. 14 is a perspective view showing still another example of the module integrated antenna according to the present invention. 14
In the module-integrated antenna 10f shown in FIG. 1, compared with the module-integrated antenna 10 shown in FIG.
0f includes a resistor 52f which is a chip resistor mounted on the upper surface of the multilayer substrate 11. A printing resistor formed by printing silver or silver-palladium may be used as the resistor 52f. This resistor 52f is used for the antenna 40
Of the antenna 40, and is connected in series with the antenna 40. As a result, in the module-integrated antenna 10f, the input impedance of the antenna 40 can be increased, and the resonance of the antenna 40 can be broadened. The resistor 52f may be formed inside the multilayer substrate 11. Also in this module-integrated antenna 10f, the matching circuit 50f may include a capacitor and an inductor.

FIG. 15 is a perspective view showing still another example of the module integrated antenna according to the present invention. Figure 15
In the module-integrated antenna 10g shown in FIG. 7, the trimming electrode pattern 56 for adjusting the resonance frequency of the antenna 40 is formed on the upper surface of the multilayer substrate 11 in particular. The trimming electrode pattern 56 is used for the antenna 4
Connected to 0. This module integrated antenna 10g
Then, by trimming the trimming electrode pattern 56, the capacitance related to the antenna 40 can be adjusted and the resonance frequency of the antenna 40 can be adjusted. Therefore, it is effective to reduce the variation in the resonance frequency of the antenna 40. The trimming electrode pattern 56 may be formed inside the multilayer substrate 11.

In each of the module-integrated antennas described above, the antenna is formed of a helical line made of a conductive material, but in the present invention, the antenna may be formed of other linear lines. Further, in the present invention, the antenna is preferably made of a low loss conductive material.

In each of the module-integrated antennas described above, the antenna is formed inside the ceramic substrate. However, in the present invention, the antenna may be formed on the surface of the ceramic substrate, or on the surface of the ceramic substrate. It may be formed so as to extend over both the inner region and the inner region.

Furthermore, in each of the above-described module-integrated antennas, a matching circuit composed of another circuit may be formed on the multilayer substrate instead of the matching circuit of the T-type circuit or the π-type circuit.

In each of the module-integrated antennas described above, the matching circuit chip component of the matching circuit and the resistance of the matching circuit may be formed on the upper surface of the multilayer substrate in the metal case.

Further, in the module-integrated antenna according to the present invention, the matching circuit may include a capacitor, an inductor, or the like formed of pattern electrodes formed on the surface of the multilayer substrate, or formed on the surface and inside of the multilayer substrate. It may include a capacitor or an inductor formed of the patterned electrodes.

In each of the module-integrated antennas described above, the high-frequency module having a special structure is formed on the multi-layer substrate, but in the present invention, the high-frequency module having another structure may be formed on the multi-layer substrate.

[0043]

According to the present invention, it is possible to obtain a module-integrated antenna which can be miniaturized.

[Brief description of drawings]

FIG. 1 is a perspective view showing an example of a module-integrated antenna according to the present invention.

2 is a front view solution view of the module-integrated antenna shown in FIG. 1. FIG.

3 is an exploded perspective view showing an antenna of the module integrated antenna shown in FIG. 1. FIG.

FIG. 4 is a circuit diagram of the module-integrated antenna shown in FIG.

5 is an equivalent circuit diagram showing an antenna of the module integrated antenna shown in FIG.

FIG. 6 is a perspective view showing another example of the module integrated antenna according to the present invention.

7 is an exploded perspective view showing an antenna of the module-integrated antenna shown in FIG.

FIG. 8 is a perspective view showing still another example of the module integrated antenna according to the present invention.

9 is an equivalent circuit diagram showing an antenna of the module integrated antenna shown in FIG.

FIG. 10 is a perspective view showing still another example of the module-integrated antenna according to the present invention.

FIG. 11 is a perspective view showing still another example of the module-integrated antenna according to the present invention.

12 is an equivalent circuit diagram showing an antenna of the module-integrated antenna shown in FIG.

FIG. 13 is a perspective view showing still another example of the module integrated antenna according to the present invention.

FIG. 14 is a perspective view showing still another example of the module-integrated antenna according to the present invention.

FIG. 15 is a perspective view showing still another example of the module-integrated antenna according to the present invention.

FIG. 16 is a plan view showing an example of a conventional antenna device.

FIG. 17 is a plan view showing another example of the conventional antenna device.

[Explanation of symbols]

10, 10a-10g module integrated antenna 11, 11a to 11e Multilayer substrate 12 High frequency module 14 BBIC 16 memory IC 18 Crystal oscillator 20 Surface mount components 22 metal case 24 cavities 26 First RFIC 28 Second RFIC 30 metal caps 32 wiring patterns 34 Beer hole 36 RF passive components 38 Shielding ground electrode pattern 40, 40a-40d antenna 41, 41a to 41d Power supply terminal 42, 44 lines 43b, 43d Ground terminal 46 beer hall 50, 50e, 50f Matching circuit 52 Matching circuit chip parts 52f resistance 54 pattern electrodes 56 Trimming electrode pattern

Claims (12)

[Claims] 1. A ceramics substrate, a transmission / reception module formed on the ceramics substrate, a linear wire formed on the ceramics substrate, arranged in a region different from the transmission / reception module, and made of a conductive material for transmitting and receiving radio waves. An antenna integrated with a module, comprising: an antenna; and a matching circuit formed on the ceramics substrate for impedance matching between the transceiver module and the antenna. 2. The antenna includes a helical line,
The module-integrated antenna according to claim 1. 3. The antenna includes a meander line,
The module-integrated antenna according to claim 1. 4. The module-integrated antenna according to claim 1, wherein the antenna is an inverted-F antenna in which an end portion on a power supply terminal side is grounded. 5. The antenna is an inverted L that is not grounded.
The module integrated antenna according to claim 1, which is an antenna. 6. The module-integrated antenna according to claim 1, wherein the antenna is a loop antenna in which an end portion on the opposite side of the power supply terminal is grounded. 7. The ceramic substrate is a multi-layer substrate,
The module integrated antenna according to any one of claims 1 to 6. 8. The module-integrated antenna according to claim 1, wherein the antenna is formed on at least one of the surface and the inside of the ceramics substrate. 9. The module-integrated antenna according to claim 1, wherein the matching circuit includes a chip component mounted on the ceramics substrate. 10. The matching circuit includes a pattern formed on at least one of the surface of the ceramics substrate and the inside of the ceramics substrate.
The module-integrated antenna according to claim 9. 11. The matching circuit includes a resistor.
The module-integrated antenna according to any one of claims 1 to 10. 12. The module integrated antenna according to claim 1, wherein a trimming electrode pattern for adjusting a resonance frequency of the antenna is formed on the ceramics substrate.