JP2006042097A - Antenna wiring board - Google Patents

Antenna wiring board Download PDF

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JP2006042097A
JP2006042097A JP2004221182A JP2004221182A JP2006042097A JP 2006042097 A JP2006042097 A JP 2006042097A JP 2004221182 A JP2004221182 A JP 2004221182A JP 2004221182 A JP2004221182 A JP 2004221182A JP 2006042097 A JP2006042097 A JP 2006042097A
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wiring
formed
insulating layer
conductor
antenna
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Koichi Hirayama
Kenji Yagimura
浩一 平山
健次 柳村
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Kyocera Corp
京セラ株式会社
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<P>PROBLEM TO BE SOLVED: To provide an antenna wiring board which is small in planar area and superior in accuracy of signal transfer. <P>SOLUTION: The antenna wiring board comprises an insulation base body 1 with a plurality of insulation layers 2 laminated therein; first and second electrode pads 3, 4 formed on the upper surface of the most upper insulation layer 2; whirl-like wiring conductors 5, which are respectively formed on the upper surface of the insulation layers other than the most upper insulation layer 2 and connected mutually, electrically, and serially; a first through-conductor 6 for electrically and serially connecting the first electrode pad 3 to the wiring conductor 5 formed on the insulation layer 2a, which is directly under the most upper insulation layer 2; and a second through-conductor 4 for electrically and serially connecting the second electrode pad 4 to the wiring conductor 5a which is formed on the most lower insulation layer 2b. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、ICカードやICタグ等に使用される、非接触で信号の授受を行なうためのアンテナを形成したアンテナ配線基板に関する。 The present invention is used in an IC card or an IC tag or the like, an antenna wiring substrate formed with an antenna for transmitting and receiving signals in a non-contact manner.

近年、ICカードやICタグ等の、非接触で信号の授受を行なう情報媒体が注目され、急速に普及し始めている。 Recently, an IC card or IC tag, a contactless information medium for transmitting and receiving signals are focused by, is rapidly becoming popular. このような情報媒体は、非接触での信号の授受を可能にするために、アンテナ配線基板を用いて形成されている。 Such information medium, in order to allow the exchange of signals in a non-contact, are formed by using an antenna wiring substrate. アンテナ配線基板は、例えば、樹脂で形成した平板状の絶縁基体と、絶縁基体の主面に形成された渦巻き状の配線導体とを具備した構造である。 Antenna wiring board, for example, a flat insulating substrate formed of a resin, a structure in which and a main surface formed spiral wire conductor of the insulating substrate.

このアンテナ配線基板において、渦巻状の配線導体がアンテナとして機能し、例えば、防犯用や商品の管理用等の商品タグ、プリペイド式の鉄道,バス等の料金支払い用カードに組み込まれて、旅券,各種施設の入場券等として利用され、対応する情報の読み取り装置と対になって使用される。 In the antenna circuit board, a spiral-shaped wiring conductors functions as an antenna, for example, product tags such as for the management of a security or product, railway prepaid, incorporated into the payment card such as a bus, passports, is used as admission tickets of various facilities, it is used in read device paired with corresponding information. 情報の読み取り装置にもアンテナの機構が内蔵されていて、これに情報媒体の配線導体部分を接近させることにより、渦巻状の配線導体と外部の読取装置との間で電波を介して信号が授受される。 It is built antenna mechanism in the reading device of information, by approaching the wiring conductor of the information medium in this signal exchange via radio waves between the spiral wiring conductor and an external reader It is. 信号は、読み取り装置と連動する記憶装置,演算装置等により処理され、商品の売買記録、利用料金の計算、旅券等の真贋判定等の各種の処理が実行される。 Signal, a storage device in conjunction with reading devices, are processed by the arithmetic unit or the like, trading record of goods, the calculation of the usage fee, various processes authentication judgment such as passports are executed. また、アンテナ配線基板に記憶装置や演算装置として半導体素子が搭載される場合もある。 In some cases, the semiconductor element is mounted as a storage device or computing device to the antenna wiring board.

このようなアンテナ配線基板において、渦巻状の配線導体は、その渦巻きの巻き数が多いほど信号の授受の感度に優れているため、情報をより短時間でかつ正確に授受させる上では、配線導体の巻き数を多くすることが求められる。 In such an antenna wiring board, spiral wiring conductor is excellent in the sensitivity of reception of the signal the greater the number of turns of the spiral, on which exchange information and accurately in a short time, the wiring conductor it is required to increase the number of turns.
特開2002−312233号公報 JP 2002-312233 JP 特開2002−312234号公報 JP 2002-312234 JP

しかしながら、上記の従来のアンテナ配線基板においては、平板状の樹脂から成る絶縁基板の主面に渦巻状の配線導体が形成されているため、巻き数を多くするためには配線導体が形成されている面積を大きくする必要があり、外形寸法の小型化が難しいという問題があった。 However, in the conventional antenna wiring board described above, since the spiral wiring conductor on the main surface of the insulating substrate formed of a flat resin is formed, the wiring conductor in order to increase the number of turns is formed it is necessary to increase the area you are, it is difficult miniaturization of the external dimensions. また、外形寸法を小さくしようとすると、信号の授受の精度を向上させることが難しい。 Further, in order to reduce the external dimensions, it is difficult to improve the accuracy of the signal transfer.

本発明は、このような従来の問題点を解決するために完成されたものであり、その目的は、平面面積が小型で、かつ信号の授受の精度に優れたアンテナ配線基板を提供することにある。 The present invention, such has been completed in order to solve the conventional problems, and its object is a small planar area, and to provide an excellent antenna wiring board on the accuracy of the signal transfer is there.

本発明のアンテナ配線基板は、複数の絶縁層が積層されて成る絶縁基体と、最上層の絶縁層の上面に形成された第1および第2の電極パッドと、前記最上層の絶縁層以外の前記絶縁層の上面にそれぞれ形成されるとともに互いに電気的に直列接続された渦巻き状の配線導体と、前記第1の電極パッドおよび前記最上層の絶縁層直下の前記絶縁層に形成された前記配線導体を電気的に直列接続する第1の貫通導体と、前記第2の電極パッドおよび最下層の前記絶縁層に形成された前記配線導体を電気的に直列接続する第2の貫通導体とを具備していることを特徴とするものである。 Antenna wiring board of the present invention includes an insulating substrate in which a plurality of insulating layers are laminated, the first and second electrode pads formed on the top surface of the uppermost insulating layer, the top layer of non-insulating layer wherein a spiral wire conductors electrically connected in series to each other while being formed respectively on the upper surface of the insulating layer, the first electrode pad and the formed the wiring on the insulating layer immediately below the uppermost insulating layer comprising: a first through-conductors electrically connected in series to conductor, and a second through-conductors electrically connected in series to the second electrode pad and the wiring conductor formed on the insulating layer of the lowermost layer and it is characterized in that it is.

本発明のアンテナ配線基板において好ましくは、前記第1および第2の電極パッドは、前記絶縁基体の上面に搭載される半導体素子に電気的に接続されており、前記配線導体は、それらの全てが平面視で前記半導体素子の外形で囲まれる領域内に形成されていることを特徴とするものである。 Preferably, in the antenna wiring board of the present invention, the first and second electrode pads, said being electrically connected to the semiconductor element mounted on the upper surface of the insulating substrate, the wiring conductors, all of which and it is characterized in that it is formed in a region surrounded by a plan view in outline of the semiconductor device.

本発明のアンテナ配線基板によれば、上記の構成により、配線導体を複数の絶縁層に形成し、これら絶縁層を上下に積層することにより巻き数を増やすことができるため、アンテナ配線基板の外形寸法を小型に維持しながら、配線導体により信号の授受の精度を優れたものとすることができ、小型かつ高精度のアンテナ配線基板を提供することができる。 According to the antenna wiring board of the present invention, the above structure, forming a wiring conductor to a plurality of insulating layers, it is possible to increase the number of turns by stacking these insulating layers above and below, the antenna wiring board outline while maintaining the size small, the wiring conductor makes it possible to improve the accuracy of the signal transfer, it is possible to provide an antenna circuit board of a small and highly accurate.

また、半導体素子が、配線導体が形成されている絶縁層とは異なる最上層の絶縁層に搭載されるため、最上層の絶縁層により配線導体と半導体素子との間を従来よりも有効に電磁的に遮断することができ、半導体素子の誤動作や信号へのノイズの混入等の不具合の発生をより確実に防止することができ、より精度の高い信号の授受および処理を行なうことが可能なアンテナ配線基板とすることができる。 Further, the semiconductor element is to be mounted in different uppermost insulating layer and the insulating layer wiring conductor is formed, effectively electromagnetic than conventional between the wiring conductor and the semiconductor element by the uppermost insulating layer can be blocked to, it is possible to more reliably prevent occurrence of trouble such as contamination of noise on the malfunction or the signal of the semiconductor device, capable of transmitting and receiving and processing of higher accuracy signal antenna it can be a wiring board.

本発明のアンテナ配線基板において好ましくは、第1および第2の電極パッドは、絶縁基体の上面に搭載される半導体素子に電気的に接続されており、配線導体は、それらの全てが平面視で半導体素子の外形で囲まれる領域内に形成されていることから、半導体素子が接続されて一体的に信号の授受および情報の処理を行なうことができるとともに、アンテナ配線基板の外形寸法を半導体素子と同程度に小さく抑えることができ、より実用性に優れるとともに、小型化がより確実なアンテナ配線基板とすることができる。 Preferably, in the antenna wiring board of the present invention, first and second electrode pads is electrically connected to the semiconductor element mounted on the upper surface of the insulating substrate, wiring conductors, all of which in plan view since it was formed in the region surrounded by the outer shape of the semiconductor element, a semiconductor element is connected it is possible to perform processing of exchange and information integrally signal, the semiconductor device the external dimensions of the antenna wiring board it can be reduced to the same degree, excellent in more practical, can be downsized to a more reliable antenna wiring board.

本発明の配線基板について図面に基づき説明する。 It will be described with reference to drawings wiring board of the present invention. 図1は、本発明のアンテナ配線基板の実施の形態の一例を示し、各絶縁層ごとに分解して示した分解斜視図である。 Figure 1 shows an example of an embodiment of the antenna wiring board of the present invention, is an exploded perspective view showing an exploded in each dielectric layer. 図1において、1は複数の絶縁層2が積層されて成る絶縁基体、3は第1電極パッド、4は第2の電極パッド、5は配線導体、6は第1の貫通導体、7は第2の貫通導体である。 In Figure 1, 1 is a plurality of insulating layers 2 are laminated insulating base, the first electrode pad 3, 4 the second electrode pad, 5 wiring conductor, first through conductor 6, 7 the first a second through conductor. これらの、絶縁基体1、第1の電極パッド3、第2の電極パッド4、配線導体5、第1の貫通導体6および第2の貫通導体7により本発明のアンテナ配線基板9が主に構成される。 These, the insulating base 1, a first electrode pad 3, a second electrode pad 4, the wiring conductor 5, the antenna wiring board 9 of the present invention by first penetrating conductors 6 and a second feed-through conductors 7 mainly constituted It is.

絶縁層2は、平面視形状が四角形状,円形状等の形状であり、酸化アルミニウム質焼結体(アルミナセラミックス),窒化アルミニウム質焼結体,ムライト質焼結体,窒化珪素質焼結体,炭化珪素質焼結体,ガラスセラミックス焼結体等の電気絶縁材料により形成される。 Insulating layer 2 is a plan view shape is a square shape, a shape such as a circular shape, an aluminum oxide sintered body (alumina ceramics), aluminum sintered body nitride, mullite sintered body, silicon nitride sintered material silicon carbide sintered body, is formed by an electrically insulating material such as glass ceramic sintered body. この絶縁層2が複数積層されることにより絶縁基体1が形成されている。 The insulating layer 2 is an insulating substrate 1 is formed by being stacked.

絶縁基体1の側面に不要な凹凸が生じないようにする上では、各絶縁層2は最上層から最下層まで同じ外形形状、寸法であることが好ましい。 In order to avoid cause unwanted irregularities on the side surface of the insulating substrate 1, the insulating layer 2 is preferably the same outer shape, dimensions up to the lowermost layer from the uppermost layer.

絶縁基体1は、例えば、各絶縁層2が酸化アルミニウム質焼結体から成る場合、酸化アルミニウム,酸化珪素,酸化カルシウム,酸化マグネシウム等の原料粉末に適当な樹脂バインダ,溶剤を添加混合して泥漿状のセラミックスラリーとなし、このセラミックスラリーをドクターブレード法やカレンダーロール法等のシート成形技術を採用してシート状となすことによって複数のセラミックグリーンシート(セラミック生シートで、以下、グリーンシートともいう)を得て、しかる後、このグリーンシートを切断加工や打ち抜き加工により適当な形状とするとともに、これらのグリーンシートを積層して積層体とし、最後にこの積層体を還元雰囲気中で約1600℃の温度で焼成することによって製作される。 Insulating substrate 1, for example, if each dielectric layer 2 is made of sintered aluminum oxide, aluminum oxide, silicon oxide, calcium oxide, the raw material powder to a suitable resin binder such as magnesium oxide, solvent and admixed mud refers Jo ceramic slurry and without, a plurality of ceramic green sheets (ceramic green sheets by forming a ceramic slurry and a doctor blade method or employ sheet molding techniques calendar roll method or the like sheet, hereinafter also a green sheet ) was obtained, and thereafter, with a suitable shape by cutting or stamping the green sheet, these green sheets as a laminate stack, finally approximately 1600 ° C. the laminate in a reducing atmosphere It is produced by firing at the temperature.

複数の絶縁層2のうち、最上層のものの上面には第1の電極パッド3と第2の電極パッド4とが形成されている。 More of the insulating layer 2, the upper surface of one of the uppermost layer is formed with the first electrode pad 3 and the second electrode pad 4. また、複数の絶縁層2のうち最上層以外のものの上面には渦巻状の配線導体5が形成されている。 Further, the spiral wiring conductor 5 is formed on the upper surface of other than the uppermost layer of the plurality of insulating layers 2.

また、第1の電極パッド3および最上層の絶縁層2直下の絶縁層2aに形成された配線導体5の間は、第1の貫通導体6を介して電気的に直列接続され、第2の電極パッド4と最下層の絶縁層2に形成された配線導体5aとの間は、複数の絶縁層2を最下層から最上層まで貫通する第2の貫通導体7を介して電気的に直列接続されている。 Further, between the first electrode pad 3 and the uppermost insulating layer 2 directly beneath the insulating layer 2a which is formed on the wiring conductors 5 are electrically connected in series via a first feed-through conductors 6, the second between the electrode pad 4 and the wiring conductor 5a formed in the lowermost layer of the insulating layer 2 is electrically connected in series through the second via conductors 7 passing through the plurality of insulating layers 2 from the lowermost layer to the uppermost layer It is.

配線導体5と第1および第2の貫通導体6,7とにより、全体が電気的に相互接続されてアンテナとして機能する渦巻状の配線導体5が形成される。 The wiring conductor 5 and the first and second feed-through conductors 6 and 7, the whole spiral wiring conductor 5 serving as an antenna are electrically interconnected are formed. また、第1および第2の電極パッド3,4を、半導体集積回路素子等の半導体素子に電気的に接続することにより、アンテナと半導体素子とが電気的に接続される。 Further, the first and second electrode pads 3 and 4, by electrically connecting the semiconductor element such as a semiconductor integrated circuit device, the antenna and the semiconductor element are electrically connected. これにより、アンテナで受信された信号が半導体素子に送信されて処理され、また半導体素子から送られてきた信号がアンテナから外部に発信される。 Thus, the signal received by the antenna is sent and processed in the semiconductor element, and the signal sent from the semiconductor element is transmitted to the outside from the antenna.

なお、上下の絶縁層2の配線導体5同士の間の電気的接続は、各絶縁層2に、上下の配線導体5同士の間を接続するようにして厚み方向に貫通する層間導体(貫通導体)8を形成しておくことにより行なわせることができる。 Incidentally, the electrical connection between the adjacent wiring conductors 5 of the upper and lower insulating layer 2, the respective insulating layers 2, interlayer conductors (through conductors so as to connect between the upper and lower wiring conductors 5 each other through the thickness direction ) 8 can be made by forming a. この場合、配線導体5の巻き数を有効に増やすために、上下の絶縁層2間で、配線導体5に流れる信号の向きが同じ向きになるようにしておく必要がある。 In this case, in order to increase the effective number of turns of the wire conductors 5, between the upper and lower insulating layer 2, the orientation of the signal flowing through the wiring conductor 5 is required to be set to be in the same direction. すなわち、渦巻き状の配線導体5の右巻き方向、左巻き方向のいずれか一方の向きに信号が流れるようにする。 That is, the right-turn direction of the spiral of the wiring conductor 5, so that the signal flows in one direction in the left-handed direction. 上下の絶縁層2間で、配線導体5に流れる信号の向きが逆になると、配線導体5間に生じる電磁誘導による誘導成分の向きが、配線導体5を伝送する信号の向きと逆になり、信号が配線導体5で正常に伝送されなくなり、アンテナとしての機能をなさない。 In between the upper and lower insulating layer 2, if the direction of the signal flowing through the wiring conductor 5 is reversed, the direction of the inductive component by electromagnetic induction generated between the wiring conductors 5 is made in the direction opposite to the signal transmitted through the wiring conductor 5, signal is not successfully transmitted by the wiring conductor 5 does not form functions as an antenna.

また、上下の配線導体5間で渦巻きの方向が異なるようにすることが好ましい。 Further, it is preferable that the direction of the spiral is made different between the upper and lower wiring conductors 5. もし、上下の配線導体5間で、渦巻きの方向が同じであると、上下の配線導体5間で流れる信号の向きが逆になり電磁誘導が打ち消し合い、信号(高周波信号)が正確に流れ難くなる。 If, between the upper and lower wiring conductor 5, the direction of the spiral are the same, the direction of the signal flowing between upper and lower wiring conductor 5 cancel electromagnetic induction is reversed, the signal (high frequency signal) hardly flows accurately Become.

配線導体5、第1および第2の電極パッド3,4、第1および第2の貫通導体6,7および層間導体8は、タングステン,モリブデン,マンガン,銅,銀,金,パラジウム,白金等の金属材料から成る。 Wiring conductors 5, the first and second electrode pads 3 and 4, first and second feed-through conductors 6, 7 and the interlayer conductors 8, tungsten, molybdenum, manganese, copper, silver, gold, palladium, platinum, etc. made of a metal material.

配線導体5、第1および第2の電極パッド3,4、第1および第2の貫通導体6,7および層間導体8は、例えば、全部がタングステンからなる場合、タングステン粉末に適当な有機バインダ,溶剤を添加混合して得た金属ペーストを、各絶縁層2となるグリーンシートの上面に印刷塗布するとともに、各絶縁層2に予め打抜き加工等で形成しておいた貫通孔の内部に印刷塗布し充填することにより形成される。 Wiring conductors 5, the first and second electrode pads 3 and 4, first and second feed-through conductors 6, 7 and the interlayer conductor 8, for example, if the total is made of tungsten, a suitable organic binder tungsten powder, a metal paste obtained by adding and mixing solvent, as well as printed and applied to the upper surface of the green sheet serving as the insulating layer 2, the print applied to the inside of the through hole had been formed in such pre-punched in the insulating layers 2 It is formed by filling. 生産性を考慮すれば、これらを全部、同種の材料で形成することが好ましい。 Considering the productivity, it all is preferably formed of the same material. なお、金属ペーストとグリーンシートとの間で焼成時の収縮の割合を合わせて、絶縁基体1に対する被着の強度を確保すること等を目的として、金属ペーストにセラミック粉末やガラス粉末等のフィラー粉末を添加したり、添加する割合を各部位ごとに異ならせたりしてもよい。 Incidentally, the combined percentage of shrinkage during firing between the metal paste and the green sheet for the purpose of such to ensure the strength of the deposition for the insulating substrate 1, a filler powder such as ceramic powder and glass powder in the metal paste or added, the rate of addition may be or different for each site.

本発明のアンテナ配線基板9によれば、配線導体5は絶縁層2の上面に形成されているため、絶縁層2の上面における巻き数を多くすることに加えて、絶縁層2の層数を増やすことによっても巻き数を多くすることができる。 According to the antenna wiring board 9 of the present invention, since the wiring conductor 5 is formed on the upper surface of the insulating layer 2, in addition to increasing the number of turns in the upper surface of the insulating layer 2, the number of layers of the insulating layer 2 it is possible to increase the number of turns by increasing. そのため、アンテナ配線基板9の外形寸法を小型に維持しながら、配線導体5により信号の授受の精度を優れたものとすることができ、小型かつ高精度のアンテナ配線基板9を提供することができる。 Therefore, while maintaining the external dimensions of the antenna wiring board 9 in a small, wiring conductors 5 makes it possible to improve the accuracy of the signal transfer, it is possible to provide an antenna circuit board 9 of the compact and high-precision . この場合、アンテナ配線基板9の厚さを薄く抑えるために、各絶縁層2の厚さを薄くすることが好ましい。 In this case, in order to suppress the thickness of the antenna circuit board 9, it is preferable to reduce the thickness of the insulating layer 2. 例えば、ICカードの用途では、絶縁基体1の厚さは0.5mm以下であることが好ましく、アンテナの送受信の感度を確保しながら、上記厚さを満たすためには、各絶縁層2の厚さは0.1mm以下とすることが好ましい。 For example, in applications of the IC card, it is preferable that the thickness of the insulating base 1 is 0.5mm or less, while ensuring the sensitivity of the transmission and reception antennas, in order to satisfy the above thickness, the thickness of the insulating layers 2 is is preferably set to 0.1mm or less.

また、渦巻状の配線導体5の巻き数は、信号の授受の感度をより確実に確保するために、各絶縁層2の上面において3重以上の巻き数であることが好ましい。 Further, the number of turns of the spiral wire conductor 5, in order to more reliably ensure the sensitivity of the signal transfer, it is preferable that the number of turns of the above triple the upper surface of each of the insulating layer 2.

絶縁層2の厚さを薄くする場合、上下の配線導体5の間の電気絶縁性の劣化を防ぐために、上下に隣り合う配線導体5について、平面視で重ならないように形成すること、つまり上層の渦巻状の配線導体5の間の渦巻状の空隙部分に、下層の渦巻状の配線導体5が位置するようにして形成することが好ましい。 If the thickness of the insulating layer 2, in order to prevent the upper and lower electrically insulating degradation between the wiring conductors 5, the wiring conductor 5 adjacent vertically, to form so as not to overlap in plan view, that is the upper layer of the spiral gap portion between the spiral wiring conductor 5, it is preferable that the lower layer of the spiral wiring conductor 5 is formed so as to be positioned. またこの場合、配線導体5が形成されている部分を上下の絶縁層2の間でずらすことができるので、配線導体5の厚さに起因して絶縁基体1の上面や下面に凹凸が生じることを有効に防止することができる。 Also in this case, since the portion where the wiring conductor 5 is formed can be shifted between the upper and lower insulating layer 2, the irregularities caused by the thickness of the wiring conductor 5 to the upper surface and the lower surface of the insulating substrate 1 it can be effectively prevented. これにより、第1および第2の電極パッド3,4が形成されている面の平坦度を良好とし、例えば、アンテナ配線基板9を、外部の電気回路基板に対して容易かつ強固に電気的接続させて搭載することができる。 Thus, the flatness of the surface on which the first and second electrode pads 3 and 4 are formed as well, for example, an antenna circuit board 9, easily and firmly electrically connected to an external electric circuit board is not it can be mounted.

第1および第2の電極パッド3,4が接続される外部の電気回路(図示せず)は、例えば、半導体素子の集積回路、増幅回路、フィルター回路等であり、外部の電気回路の所定位置に半田等の導電性接続材を介して電気的に接続される。 External electric circuit in which the first and second electrode pads 3 and 4 are connected (not shown), for example, an integrated circuit of the semiconductor device, an amplifier circuit, a filter circuit or the like, a predetermined position of the external electric circuit It is electrically connected through a conductive connecting material such as solder. 第1および第2の電極パッド3,4は、例えば、円形状や楕円形状、四角形状等の形状に形成され、外部の電気回路に対する接続を容易かつ強固なものとする上では、互いの電気絶縁性を確保できる範囲で大きいほど好ましい。 First and second electrode pads 3 and 4, for example, a circular shape or elliptical shape, is formed in the shape of a square shape or the like, in order to connect the intended easy and robust against external electric circuit, mutual electrical It preferred larger within the range that can ensure insulation. また、第1および第2の電極パッド3,4は、識別のために、異なる形状や寸法としてもよい。 The first and second electrode pads 3 and 4, for identification, may have different shapes and dimensions. また、識別用のマークを絶縁基体1の上面に形成してもよい。 It is also possible to form a mark for identification on the upper surface of the insulating substrate 1.

また、第1および第2の電極パッド3,4は、露出面にニッケルや金,銅,銀,白金,パラジウム,錫,半田等から成るめっき層を被着させて、酸化腐食の防止や接触抵抗の低減、半田等の接続材の濡れ性の向上等を行なうようにしてもよい。 The first and second electrode pads 3 and 4, nickel and gold on the exposed surface, copper, silver, platinum, palladium, tin, a plating layer made of solder or the like are adhered to, the prevention of oxidation corrosion or contact reduction of resistance, may be performed improvement of wettability of the connecting material such as solder.

また、本発明のアンテナ配線基板9において、第1および第2の電極パッド3,4は、絶縁基体1の上面に搭載される半導体素子(図示せず)に電気的に接続されており、配線導体5は、それらの全てが平面視で半導体素子の外形で囲まれる領域内に形成されていることが好ましい。 Further, in the antenna circuit board 9 of the present invention, first and second electrode pads 3 and 4 are electrically connected to the semiconductor element (not shown) mounted on the upper surface of the insulating substrate 1, wiring conductor 5 preferably all of them are formed in the region surrounded by the outer shape of the semiconductor element in plan view. これにより、半導体素子が接続されて一体的に信号の授受および情報の処理を行なうことができるとともに、アンテナ配線基板9の外形寸法を半導体素子と同程度に小さく抑えることができ、より実用性に優れるとともに、小型化がより確実なアンテナ配線基板9とすることができる。 This makes it possible to the semiconductor element is connected performs processing of exchange and information integrally signal, external dimensions of the antenna wiring board 9 can be reduced to the same extent as the semiconductor element, the more practical excellent, it can be downsized to a more reliable antenna wiring board 9.

また、半導体素子が、配線導体5が形成されている絶縁層2とは異なる最上層の絶縁層2に搭載されるため、最上層の絶縁層2により配線導体5と半導体素子との間を従来よりも有効に電磁的に遮断することができ、半導体素子の誤動作や信号へのノイズの混入等の不具合の発生をより確実に防止することができ、より精度の高い信号の授受および処理を行なうことが可能なアンテナ配線基板9とすることができる。 Further, the semiconductor element, the wiring conductors 5 is mounted on the insulating layer 2 of the different top layer and the insulating layer 2 formed, conventional between the wiring conductors 5 and the semiconductor element by the uppermost insulating layer 2 effectively it can be blocked electromagnetically than, it is possible to reliably prevent the occurrence of defects such as contamination of noise on the malfunction or the signal of the semiconductor device, for exchanging and processing of higher accuracy signal the antenna may have the wiring substrate 9 capable. この場合、最上層の絶縁層2の厚さを、他の絶縁層2,2aの厚さよりも厚くしておくとよく、電磁遮蔽をより効果的に行なわせることができる。 In this case, the thickness of the top layer of the insulating layer 2 may idea to thicker than the thickness of other insulating layers 2, 2a, it is possible to more effectively perform the electromagnetic shielding.

また、最上層の絶縁層2の下面にフェライト等の電磁遮蔽材料からなる電磁遮蔽層(シールド層:図示せず)を形成しておいてもよい。 The electromagnetic shielding layer made of electromagnetic shielding material such as ferrite to the lower surface of the uppermost insulating layer 2 (shield layer: not shown) may be formed to. なお、電磁遮蔽層は、その下層側の渦巻状の配線導体5との電気的短絡を避けるために、電磁遮蔽層の下面をセラミック層等の絶縁層で被覆する必要がある。 The electromagnetic shielding layer to avoid electrical shorting between the spiral wiring conductors 5 of the lower layer side, it is necessary to coat the underside of the electromagnetic shielding layer with an insulating layer of ceramic layer.

また、最上層の絶縁層2に凹部(図示せず)を形成し、凹部内に半導体素子を収納するようにしてもよい。 Further, a recess (not shown) in the insulating layer 2 uppermost, may be receiving the semiconductor element in the recess. また、凹部の内面に上述のような電磁遮蔽層を被着させて、凹部に収容された半導体素子に対する電磁的な遮蔽をさらに向上させるようにしてもよい。 Further, an electromagnetic shielding layer as described above on the inner surface of the recess are adhered, may further improve the electromagnetic shielding for the semiconductor element housed in the recess.

なお、半導体素子は、アンテナ配線基板9において記憶装置や演算装置として機能する。 The semiconductor device functions as a storage device or computing device in the antenna circuit board 9. 例えば、外部から受信した信号を記憶したデータと比較し、演算処理して料金の計算、真贋判定等の所定の処理、処理結果の送信等を行なう。 For example, compared with the data stored the signal received from the outside, performs calculations prices processing, predetermined processing authentication judgment such as a transmission or the like of the processing result.

半導体素子は、1個に限らず、アンテナ配線基板9の使用目的や機能等に応じて複数個搭載してもよい。 The semiconductor device is not limited to one, it may be plural mounted according to the intended use and functions of the antenna wiring board 9. また、半導体素子に加えて、容量素子や抵抗器等の電子部品を搭載してもよい。 In addition to the semiconductor element may be mounted electronic components such as a capacitor, resistor.

なお、本発明は上記の実施の形態の例に限定されるものではなく、本発明の要旨を逸脱しない範囲で種々の変更、改良を施すことは何ら差し支えない。 The present invention is not limited to the examples of embodiment described above, and various modifications without departing from the scope of the present invention, applying the improved no problem. 例えば、絶縁基体1は、図1の例では四角板状であるが、角部を丸く面取りして角部で機械的な破壊が生じることを防止するようにしてもよく、または円板状でもよい。 For example, the insulating substrate 1, in the example of FIG. 1 is a rectangular plate, may be prevent mechanical breakdown occurs with rounded corners at the corners, or even disk-shaped good. また、絶縁基体1の側面等の外面に樹脂等からなる緩衝材層を形成してもよい。 It is also possible to form a buffer material layer made of a resin or the like to the outer surface of the side surface or the like of the insulating substrate 1.

本発明のアンテナ配線基板の実施の形態の一例を示し、各絶縁層ごとに分解して示した分解斜視図である。 It shows an example of an embodiment of an antenna circuit board of the present invention, is an exploded perspective view showing an exploded in each dielectric layer.

符号の説明 DESCRIPTION OF SYMBOLS

1・・・絶縁基体2・・・絶縁層3・・・第1の電極パッド4・・・第2の電極パッド5・・・配線導体6・・・第1の貫通導体7・・・第2の貫通導体8・・・層間導体9・・・アンテナ配線基板 1 ... insulating substrate 2 ... insulating layer 3 ... first electrode pad 4 ... second electrode pads 5 ... wiring conductor 6 ... first through conductor 7 ... first 2 through conductors 8 ... interlayer conductor 9 ... antenna wiring board

Claims (2)

  1. 複数の絶縁層が積層されて成る絶縁基体と、最上層の絶縁層の上面に形成された第1および第2の電極パッドと、前記最上層の絶縁層以外の前記絶縁層の上面にそれぞれ形成されるとともに互いに電気的に直列接続された渦巻き状の配線導体と、前記第1の電極パッドおよび前記最上層の絶縁層直下の前記絶縁層に形成された前記配線導体を電気的に直列接続する第1の貫通導体と、前記第2の電極パッドおよび最下層の前記絶縁層に形成された前記配線導体を電気的に直列接続する第2の貫通導体とを具備していることを特徴とするアンテナ配線基板。 Each form a plurality of insulating layers are laminated insulating substrate, a first and second electrode pads formed on the top surface of the uppermost insulating layer, the upper surface of the insulating layer other than the uppermost insulating layer electrically connected in series with a spiral-shaped wiring conductors are electrically connected to each other in series, the said wiring conductor formed in the insulating layer directly under the first electrode pad and the uppermost insulating layer while being a first through conductor, characterized in that it comprises a second through-conductors electrically connected in series to the second electrode pad and the wiring conductor formed on the insulating layer of the lowermost layer antenna wiring board.
  2. 前記第1および第2の電極パッドは、前記絶縁基体の上面に搭載される半導体素子に電気的に接続されており、前記配線導体は、それらの全てが平面視で前記半導体素子の外形で囲まれる領域内に形成されていることを特徴とする請求項1記載のアンテナ配線基板。 Wherein the first and second electrode pads, said being electrically connected to the semiconductor element mounted on the upper surface of the insulating substrate, the wiring conductors, all of which are surrounded by the outer shape of the semiconductor element in plan view antenna wiring board according to claim 1, characterized in that it is formed in the region.
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