JP2002362613A - Laminated packaging material having non-contact ic, packaging container using laminated packaging material and method for detecting opened seal of packaging container - Google Patents

Laminated packaging material having non-contact ic, packaging container using laminated packaging material and method for detecting opened seal of packaging container

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Publication number
JP2002362613A
JP2002362613A JP2001172424A JP2001172424A JP2002362613A JP 2002362613 A JP2002362613 A JP 2002362613A JP 2001172424 A JP2001172424 A JP 2001172424A JP 2001172424 A JP2001172424 A JP 2001172424A JP 2002362613 A JP2002362613 A JP 2002362613A
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Prior art keywords
laminated
packaging
opened
container
packaging material
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JP2001172424A
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Japanese (ja)
Inventor
Yoshihiro Nakagawa
Masayoshi Suzuta
善博 中川
昌由 鈴田
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Toppan Printing Co Ltd
凸版印刷株式会社
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Abstract

PROBLEM TO BE SOLVED: To perform a detection of more positive opened seal and revised state and reduce labour required for detecting a seal opened or revised item (goods) by a method wherein alarm sound and alarm display are made in response to information transmitted from a non-contact IC tag when the item or goods are passed through a cash register and the like. SOLUTION: This laminated packaging material is made such that a conductive layer 12 is formed on at least a packaging base material 1 in such a way that two independent antennas may be formed without having any contacted portions while being cut and separated, and an electrostatic coupling type non contact IC chip 13 capable of giving or receiving information to or from external equipment is stacked on a conductive layer acting as the antennas.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、物品(商品)が「いたずら」等によって包装材が破られような開封・改竄行為を防止することが可能な積層包装材、及びこの検出方法に関する。 The present invention relates to an article (product) can be to prevent the opening-tampering Do not try to be upset packaging material by such as "mischievous" a laminated packaging material, and for this detection method.

【0002】 [0002]

【従来の技術】各企業は、製造から購買まで安全を消費者に提供すること細心の注意を払っている。 BACKGROUND OF THE INVENTION each company, is paying close attention to providing consumers with safe to purchase from the manufacturer. しかし、時には「いたずら」等をする不心得者によって、包装容器が破られ開封・改竄するような不測の事態が発生することも起こり得る。 However, sometimes by unscrupulous who the "mischief" and the like, unforeseen circumstances, such as the packaging container is broken to open-tampering may also happen that occur. 特に、食品、化粧品、医薬等の直接、 In particular, food, cosmetics, direct pharmaceutical, etc.,
人体に影響を与える商品の包装容器は、安全・衛生の見地から流通過程において、故意に開封され内容物に改変が加えられることを絶対的に防止することが必要である。 Packaging containers of products affecting the human body, in the distribution process from the standpoint of safety and health, it is necessary to prevent the modification is applied absolutely the contents of the opened deliberately.

【0003】このことを防止する方法として、ポリプロピレン、ポリエチレン、ポリ塩化ビニル等のフィルムを用いたシュリンク包装やオーバーラッパーが、また、商品(物品)を取り出すためには、包装材料の紙、アルミニウム箔やフィルムを切り裂かねばならない容器形態に、瓶のキャップ等には、プラスチック製の保護片を帯状に一周剥ぎ取らないとキャップが取れない等の、目的、内容物、包装容器の形態に応じて各種の工夫が採用されている。 As a method for preventing this, polypropylene, polyethylene, films shrink wrapping or over wrappers with polyvinyl chloride and the like, also, in order to take out a product (article) is paper packaging materials, aluminum foil the or film must torn the container form, in such bottle cap, unless stripped around the plastic protective strip to strip such that the cap can not be taken, the purpose, content, depending on the form of packaging containers various contrivance is adopted.

【0004】しかし、これらの工夫を施しても、時には、巧妙に細工されることも予想される。 [0004] However, it is subjected to these ideas, at times, is also expected to be crafted. また、このような不測の事態が発生した場合、上記の防止手段は、いずれを人が、1個づつ物品(商品)を目視で確認しなければならなく、確認に要する労力は大きく、また、時には見落とす危険性がある。 Also, if such eventuality occurs, said prevention means are all the people, MUST verify one by one article (product) visually, labor required for confirmation is large, also, there is a risk that overlook sometimes.

【0005】 [0005]

【発明が解決しようとする課題】本発明が解決しようとする課題は、上記の開封防止手段と非接触ICタグを積層した包装材料とを複合的に用い、或いは非接触ICタグを積層した包装材料を単独に用いて、レジ等通過する際に非接触ICタグから送信された情報に基づき警報音、警報表示をさせることで、より確実に開封され改竄されたことを検出すると共に、開封・改竄された物品(商品)を検出する労力の軽減を図ることである。 An object of the present invention [0005] to be Solved have a packaging material obtained by laminating the opening prevention means and the non-contact IC tag used in a combined manner, or by laminating a non-contact IC tag packaging using the materials alone, the alarm sound on the basis of the information transmitted from the contactless IC tag as it passes through registration or the like, it is the alarm display, the detected more reliably be opened that has been tampered with, unopened it is possible to reduce the effort to detect tampering article (product).

【0006】 [0006]

【課題を解決するための手段】上記目的を達成するためになされた請求項1に記載の発明は、少なくとも包装基材上に、切断されて分離することで2個の互いに接触する箇所がなく独立したアンテナ部が形成されるように導電性層を形成し、このアンテナ部である導電性層上に外部機器と情報を授受することが可能な静電結合型の非接触ICチップが積層され埋め込まれていることを特徴とする積層包装材である。 SUMMARY OF THE INVENTION The invention described in claim 1 which has been made in order to achieve the above object, at least on the packaging substrate, there is no portion to contact two mutually by separating is disconnected forming a conductive layer as independent antenna portions are formed, the non-contact IC chip with an external device electrostatic capable of exchanging information linked to the conductive layer on an antenna portion are stacked that are embedded is laminated packaging material according to claim.

【0007】また、請求項2に記載の発明は、前記導電性層が、金属粉末、カーボン等の導電物質を主成分とする導電性インキで形成されていることを特徴とする請求項1に記載の積層包装材である。 Further, the invention according to claim 2, wherein the conductive layer is a metal powder, to claim 1, characterized in that it is formed of conductive material such as carbon with a conductive ink composed mainly a laminated packaging material according.

【0008】また、請求項3に記載の発明は、前記包装基材が紙を主体としたことを特徴とする請求項1、2に記載の積層包装材である。 Further, the invention according to claim 3, a laminated packaging material according to claim 1, wherein the packaging substrate mainly composed of paper.

【0009】また、請求項4に記載の発明は、請求項1 [0009] The invention of claim 4, claim 1
〜3のいずれか1項に記載の積層包装材を用いて形成されていることを特徴とする包装容器である。 A packaging container, characterized in that it is formed by using a laminated packaging material according to any one of to 3.

【0010】また、請求項5に記載の発明は、請求項1 [0010] The invention of claim 5, claim 1
〜3のいずれか1項に記載の積層包装材をラベル化し、 Labeled the laminated packaging material according to any one of to 3,
取り出し口に貼り付けてあることを特徴とする包装容器である。 A packaging container, characterized in that are affixed to the outlet.

【0011】また、請求項6に記載の発明は、 (1)ICチップに予め開封されたときに、リーダーである検出機に「開封された」ことを送信する情報を記録させておく。 [0011] Further, an invention according to claim 6, keep time to, to record the information to be transmitted that has been "opened" to the detector is a leader in advance unsealed (1) IC chips. (2)前記ICチップが積層された積層材料を破いて開封された場合、導電性層が切断・分離され2個の独立したアンテナ部が形成されることで、非接触ICタグとしての機能を持つようにさせる。 (2) when said IC chip has been opened by tearing the laminated material laminated, by two independent antenna portion conductive layer is cut and separated are formed, the function of the non-contact IC tag make so that it has. (3)破いて開封された包装容器がリーダーである検出機を通過すると、前記ICチップに記録された「開封されたことを示す情報」を受信して、これを表示、或いは警告を発する。 When (3) tearing in unwrapped packaging container passes a detection unit, a leader, receives the "information indicating that it has been opened" that has been recorded in the IC chip, display it, or issues a warning. 開封されていない包装容器は非接触IC Packaging containers that have not been opened in a non-contact IC
タグとして機能しないので、検出機を通過しても何の反応を示さない。 It does not function as a tag, do not show any reaction even through the detector. 以上の方法を用いることで、容器が開封され改竄されているか否かを検出することを特徴とする包装容器の開封検出方法である By using the above method is the opening detection method of the packaging container, characterized in that to detect whether the container has been unsealed tampered

【0012】 [0012]

【発明の実施の形態】以下、本発明を、図面を参照しながら詳細に説明する。 DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the drawings.

【0013】本発明に用いる非接触ICチップは、アンテナ部がループ状に形成されている電磁結合型でなく、 Contactless IC chip used in the [0013] present invention is not electromagnetically coupled to the antenna portion is formed in a loop shape,
互いにアンテナ部が接触する箇所が無く、独立した2個のアンテナ部が形成されている静電結合型の非接触IC No portion where the antenna unit with each other in contact, two independent electrostatic coupling type contactless IC of the antenna portion is formed
チップである。 It is a chip. 最も一般的な静電結合型の非接触ICタグは、図1に示すように、導電性層のパターンを蝶の羽のように形成し、中心部にICチップを設けた構成になっている。 The most common capacitive coupling type non-contact IC tag, as shown in FIG. 1, the pattern of the conductive layer formed as butterfly wings, has a structure in which an IC chip in the central portion . 紙、ポリエチレン、ポリプロピレン、ポリ塩化ビニル、ポリエチレンテレフタレート等のプラスチックの下基材(11)上に導電性層(12)のアンテナ部(12a、12b)が形成されている。 Paper, polyethylene, polypropylene, polyvinyl chloride, an antenna portion of the lower substrate of a plastic such as polyethylene terephthalate (11) conductive layer on (12) (12a, 12b) are formed. このアンテナ部(12a、12b)は、互いに接触している箇所は無く、分離し独立して形成されている。 The antenna unit (12a, 12b) are are portions are not formed separate independently in contact with each other. この導電性層(1 The conductive layer (1
2)上に静電結合型の非接触ICチップ(13)がアンテナ部(12a、12b)と接合されている。 Electrostatic coupling type contactless IC chip on 2) (13) is joined to the antenna unit (12a, 12b). この上に下基材と同様な紙、ポリエチレン、ポリプロピレン、ポリ塩化ビニル、ポリエチレンテレフタレート等のプラスチックで上基材(14)を積層した構成になっている。 Similar paper and the lower substrate thereon, polyethylene, polypropylene, polyvinyl chloride, and is formed by depositing on the substrate (14) with a plastic such as polyethylene terephthalate.
このように、上基材(11)と下基材(14)でICチップは挟み込み、各基材は物品の品名等の印刷を施すことが行われる。 Thus, IC chip sandwiched between Uemotozai (11) and Shitamotozai (14), each substrate is made be subjected to printing product name or the like of the article.

【0014】本発明は、図2(a)に示すように下基材(11)上にアンテナ部を形成する導電性層(12)を連結させて形成させて、この上に静電結合型の非接触I The present invention, by forming by connecting the Shitamotozai (11) conductive layer for forming the antenna unit on (12) as shown in FIG. 2 (a), electrostatically bonded thereon non-contact I of
Cチップ(13)を導電性層に設けておく。 C preferably provided a chip (13) to the conductive layer. この図2 FIG. 2
(a)の下基材(11)を切り裂き部(15)で破くことにより図2(b)のように2個の互いに分離独立したアンテナ部(12a、12b)が形成されることによって、初めてリーダーである外部機と情報の授受が出来るようになる。 By two mutually separate independent antenna unit as shown in FIG. 2 (b) by tearing under the base (11) the tear portion (15) of (a) (12a, 12b) are formed, the first time transmission and reception of the external device and the information is a leader is to be able to. なお、図2には、図示しないが上基材を設けて積層することは、当然である。 In FIG. 2, it is not shown to be laminated is provided on the substrate, of course. 本発明は、このことを応用して、静電結合型の非接触ICチップ(13)が埋め込まれ積層された包装材料を用いて、開封・改竄行為を防止し、これことを容易に検出ものである。 The present invention, by applying this, using a packaging material which capacitive coupling type contactless IC chip (13) are embedded laminated to prevent opening-tampering easily detectable ones this that it is.

【0015】図3(a)は、アンテナ部となる導電性層(12)のパターンを、下基材(11)の外周に沿って、形成した例を示す。 [0015] FIG. 3 (a), a conductive layer serving as the antenna portion patterns (12) shows an example in which along the outer periphery to form the Shitamotozai (11). この場合も、図3(a)の下基材(11)を切り裂き部(15)で破くことにより図3 Again, Figure 3 by tearing at the tear portion below the base (11) in FIG. 3 (a) (15)
(b)のように2個の互いに分離独立したアンテナ部(12a、12b)が形成されることによって、外部機と情報の授受が出来るようになる。 Two mutually separate independent antenna unit as (b) (12a, 12b) by is formed, it becomes possible to exchange the external device and information.

【0016】静電結合型の非接触ICチップが積層された包装材を、図5(a)のように4方をシールして袋状の包装容器を作製する場合に於ける包装材料の構成の1 [0016] The capacitive coupling type packaging material noncontact IC chips are stacked, the structure of the in the packaging material when sealing the four sides as shown in FIGS. 5 (a) making a bag-like packaging container of 1
例を、図4に示す。 Example, shown in FIG. この4方をシールした袋状の中身を取り出す、或いは改竄しようとする場合、袋状の包装容器の端部が必然的に切り裂かれるので、端部に導線性層(12)を設けた積層包装材の斜視図が図4(a)である。 Taking out the sealed bag-like contents of the 4-way, or when trying to tamper, since the end portion of bag-shaped packaging container is torn inevitably, the laminated packaging conductor layer (12) provided on the end portion perspective view of a timber is shown in FIG 4 (a). 図4(a)、図5(a)に於いて、端部の一端が切り裂かれると2個の独立したアンテナ部が形成されて、 FIG. 4 (a), In FIG 5 (a), 2 pieces of independent antenna portions are formed when the end of the end portion is torn up,
外部機器と非接触で情報の授受が可能となる。 Exchange with an external device without contact information can be. 図4 Figure 4
(b)は、図4(a)のx−x部の構成断面図であり、 (B) is a configuration sectional view of a x-x of FIG. 4 (a), the
紙やプラスチックフィルムの基材(11)に内容物を保護する無機酸化物を蒸着したナイロン、塩化ビニリデン等のバリア性フィルム(16)、この上に導電性インキで導電性層パターン(12)、静電結合型のICチップ(13)、更に上基材(14)、シール加工するためのシーラント層(17)を設けたものである。 Nylon with a deposit of an inorganic oxide which protects the contents in the base material of paper or plastic film (11), of vinylidene chloride barrier film (16), the conductive layer pattern with a conductive ink thereon (12), electrostatic coupling type IC chip (13), further on the substrate (14), in which the sealant layer for sealing processing (17) is provided.

【0017】これに使用される静電結合型の非接触IC The capacitive coupling type contactless IC that are used to
チップ(13)として、米モトローラ社が製造しているBIStatix(バイスタティックス)がある。 As the chip (13), there is a BIStatix ​​(bi-static scan) that Motorola has been manufactured. また、この積層包装材の層構成は、この図4の形態に限定されるものでは無く、包装する形態、内容物等を考慮して、適宜設計されるものである。 The layer structure of the laminated packaging material is not limited to the form of FIG. 4, the form of packaging, in consideration of the contents or the like, it is appropriately designed. また、廃棄処分された場合の環境問題に配慮すれば、基材に生分解性の紙を主体にすれば良い。 Moreover, that consideration is given to environmental problems when it is disposed of, may be a biodegradable paper mainly on the substrate.

【0018】図5(b)、(c)は、天部開閉式の容器、瓶等に、この静電結合型の非接触ICチップを積層した包装材料をラベル化して、取り出し口に貼り付けた例である。 [0018] FIG. 5 (b), (c), the container top part openable, the bottles or the like, a packaging material obtained by laminating a non-contact IC chip of the electrostatic coupling type and labeled, paste in outlet It was an example. この場合も、開封・改竄するには、このラベルを切り裂かねばならず、切り裂かれると上述した通り、外部機器と通信可能となる。 Also in this case, to be opened, tampered with, not must be torn up this label, as described above to be torn up, and can communicate with an external device.

【0019】物品(商品)が開封・改竄されているか否かを検出する1例として、物品(商品)を購入しレジで精算する際に、ICと情報を授受するリーダである外部機器(20)の間を通過させる。 [0019] As an example of an article (product) to detect whether it is opened, falsification, when payment by cash register to purchase goods (products), external devices (20 a reader for exchanging IC and information ) passing between. 開封されていた場合には、ICに「開封されている」旨の情報を表示、或いは警報を発する。 If that had been opening, IC to "unwrapped in which" displays the information to the effect that, or issue a warning. 開封・改竄されていない場合は、ICチップが非接触ICとして機能しないので何も表示、或いは警報も発しない。 If you have not been opened, tampered with, nothing displayed because the IC chip does not function as a non-contact IC, or not alarm is also issued.

【0020】本発明のICチップが積層された包装材を単独で用いて開封・改竄を防止してもよいが、他の改竄・防止手段と併用することで、より確実に開封・改竄を防止できる。 [0020] The packaging material IC chips are stacked in the present invention may prevent opening-falsification used alone, but by combination with other tamper-preventing means, prevented more reliably opened, tampered it can.

【0021】 [0021]

【発明の効果】以上述べたように、導電性層が切り裂かれて、分離・独立した2個の独立したアンテナ部が形成されることで外部機器と非接触で情報の交換ができるようにすることで、目視で開封・改竄する必要がなくなる。 As described above, according to the present invention, are electrically conductive layer is torn up, to allow exchange of information with an external device without contacting by two independent antenna portion separated and independent are formed that is, there is no need to be opened, tampered with the naked eye. また、他のの改竄・防止手段と併用することで、目視で見落としたものもバックアップでき、より確実に開封・改竄を防止できる。 Further, when used in combination with other of tampering-preventing means, which overlooked visually also be backed up can be prevented more reliably opened alteration.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】基本的な静電結合型の非接触ICタグの構成を説明するものであり、(a)はアンテナ部とICチップの位置関係を示す平面図、(b)は(a)のx−x部の断面図、(c)は(b)に上基材を積層したICタグの断面図、(d)は(c)の平面図、をそれぞれ示す。 [1] is intended to explain the configuration of the non-contact IC tag of the basic electrostatic coupling type, (a) is a plan view showing the positional relationship between the antenna unit and the IC chip, the (b) is (a) sectional view of the x-x section, showing cross-sectional view of IC tags formed by laminating on a substrate, a plan view of (d) are (c), respectively (c) is (b).

【図2】本発明の基本原理を説明するものであり、 [Figure 2] is intended to explain the basic principles of the present invention,
(a)は導電性層のパターンとICチップの位置関係を示す平面図、(b)は導電性層が切り裂かれて、2個のアンテナ部が形成された状態を示す平面図、をそれぞれ示す。 (A) is a plan view showing the positional relationship between the pattern and the IC chip of the conductive layer, (b) is a conductive layer is torn up, showing a plan view showing a state where the two antennas portions are formed, respectively .

【図3】他の本発明の導電性層のパターンを有するIC [Figure 3] IC having a pattern of conductive layer of the other of the present invention
タグを説明するものであり、(a)は導電性層のパターンとICチップの位置関係を示す平面図、(b)は導電性層が切り裂かれて、2個のアンテナ部が形成された状態を示す平面図、をそれぞれ示す。 Are intended to illustrate the tag, (a) state that plan view showing a positional relationship between the pattern and the IC chip of the conductive layer, (b) is a conductive layer is torn, two antennas portion is formed It is shown plan views, respectively showing.

【図4】4方シールの袋状包装容器に本発明のICチップを積層した積層材料の用いる場合の1例であり、 [Figure 4] is an example of a case of using the 4-way seal of the laminate material obtained by laminating an IC chip of the present invention a bag-like packaging containers,
(a)は、導電性層と静電結合型の非接触ICチップを基材に設けた状態を示す斜視図、(b)は(a)のx− (A) is a perspective view showing a state in which a contactless IC chip of the conductive layer and electrostatically bonded to a substrate, (b), is (a) x-
x部の構成断面図、をそれぞれ示す。 It shows configuration sectional view of x portion, respectively.

【図5】本発明の静電結合型の非接触ICチップを積層した包装材料を用いた包装容器の例であり、(a)は4 [Figure 5] is an example of a packaging container using a packaging material obtained by laminating a non-contact IC chip of the electrostatic coupling type of the present invention, (a) is 4
方シールの包装容器、(b)は天側に開閉部を有する包装容器(c)は瓶の包装容器、を示す。 Square sealing of the packaging container, illustrating a packaging container, bottle packaging container (c) is having an opening portion (b) a top side.

【図6】本発明の静電結合型の非接触ICチップを用いた包装容器の、開封・改竄を検出する装置の1例を示す。 [6] of the packaging container using the contactless IC chip of the electrostatic coupling type of the present invention, it shows an example of a device for detecting the opening-tampering.

【符号の説明】 DESCRIPTION OF SYMBOLS

10…非接触ICタグ 11…下基材 12…導電性層 12a…アンテナ部 12b…アンテナ部 13…非接触ICチップ 14…上基材 15…切り裂き部 16…バリア性フィルム 17…シーラント層 20…リーダー 10 ... non-contact IC tag 11 ... Shitamotozai 12 ... conductive layer 12a ... antenna unit 12b ... antenna section 13 ... non-contact IC chip 14 ... Uemotozai 15 ... tear portion 16 ... barrier film 17 ... sealant layer 20 ... leader

フロントページの続き (51)Int.Cl. 7識別記号 FI テーマコート゛(参考) G06K 19/07 B65D 33/00 C 5B035 // B65D 30/02 33/34 5C084 33/00 G08B 13/22 33/34 G06K 19/00 H G08B 13/22 Q Fターム(参考) 2C005 MA02 MA28 MB07 MB10 NA09 NA10 3E064 AA05 BA01 BA26 BA30 BA35 BA55 BA60 BB03 BC20 EA19 HA02 HA10 HM02 HN04 HN05 HQ02 3E067 BA03A BA05A BA12A BB01A BB15A BB16A BB25A BC03A BC06A CA21 EA04 EA09 EB40 EE04 FA01 FC01 GD10 3E084 AA04 AA12 BA01 KA15 3E086 AD01 AD02 AD04 AD24 BA04 BA14 BA15 BA35 BA40 BB35 5B035 AA13 BA05 BB09 BC00 CA23 5C084 AA03 AA06 AA15 BB02 CC34 DD07 EE01 EE07 HH01 HH10 Of the front page Continued (51) Int.Cl. 7 identification mark FI theme Court Bu (Reference) G06K 19/07 B65D 33/00 C 5B035 // B65D 30/02 33/34 5C084 33/00 G08B 13/22 33/34 G06K 19/00 H G08B 13/22 Q F-term (reference) 2C005 MA02 MA28 MB07 MB10 NA09 NA10 3E064 AA05 BA01 BA26 BA30 BA35 BA55 BA60 BB03 BC20 EA19 HA02 HA10 HM02 HN04 HN05 HQ02 3E067 BA03A BA05A BA12A BB01A BB15A BB16A BB25A BC03A BC06A CA21 EA04 EA09 EB40 EE04 FA01 FC01 GD10 3E084 AA04 AA12 BA01 KA15 3E086 AD01 AD02 AD04 AD24 BA04 BA14 BA15 BA35 BA40 BB35 5B035 AA13 BA05 BB09 BC00 CA23 5C084 AA03 AA06 AA15 BB02 CC34 DD07 EE01 EE07 HH01 HH10

Claims (6)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】少なくとも包装基材上に、切断されて分離することで接触する箇所が無く2個の互いに独立したアンテナ部が形成されるように導電性層を形成し、このアンテナ部である導電性層上に外部機器と情報を授受することが可能な静電結合型の非接触ICチップが積層されていることを特徴とする積層包装材。 To 1. A on at least the packaging substrate, forming a conductive layer so that the antenna unit locations are independent two mutually without contacting with the separation being cut is formed, is the antenna portion laminated packaging material contactless IC chip of the electrostatic coupling type capable of exchanging information with external equipment on a conductive layer is characterized in that it is laminated.
  2. 【請求項2】前記導電性層が、金属粉末、カーボン等の導電性物質を主成分とする導電性インキで形成されていることを特徴とする請求項1に記載の積層包装材。 Wherein said conductive layer is a metal powder, laminated packaging material according to claim 1, characterized in that it is formed of conductive material such as carbon with a conductive ink composed mainly.
  3. 【請求項3】前記包装基材が紙を主体としたことを特徴とする請求項1、2に記載の積層包装材。 3. A laminated packaging material according to claim 1, wherein the packaging substrate mainly composed of paper.
  4. 【請求項4】請求項1〜3のいずれか1項に記載の積層包装材を用いて形成されていることを特徴とする包装容器。 4. A packaging container, characterized by being formed by using a laminated packaging material according to any one of claims 1 to 3.
  5. 【請求項5】請求項1〜3のいずれか1項に記載の積層包装材をラベル化し、取り出し口に貼り付けてあることを特徴とする包装容器。 5. A labeled a laminated packaging material according to any one of claims 1 to 3, the packaging container, characterized in that are affixed to the outlet.
  6. 【請求項6】(1)ICチップに予め開封されたときに、リーダーである検出機器に「開封された」ことを送信する情報を記録させておく。 6. (1) when pre-opened to the IC chip and allowed to record the information to be transmitted that has been "opened" to the detection device is a reader. (2)前記ICチップが積層された積層材料を破いて開封された場合、導電性層が切断・分離され2個の独立したアンテナ部が形成されることで、非接触ICタグとしての機能を持つようにさせる。 (2) when said IC chip has been opened by tearing the laminated material laminated, by two independent antenna portion conductive layer is cut and separated are formed, the function of the non-contact IC tag make so that it has. (3)破いて開封された容器がリーダーである検出機器を通過すると、前記ICチップに記録された「開封されたことを示す情報」を受信して、これを表示、或いは警告を発する。 When (3) tearing in unwrapped container passes the detection device is a reader receives the "information indicating that it has been opened" that has been recorded in the IC chip, display it, or issues a warning. 開封されていない容器は非接触ICタグとして機能しないので、検出機器を通過しても何の反応を示さない。 Since the container has not been opened can not function as a contactless IC tag, it does not show any reaction even through the detection device. 以上の方法を用いることで、容器が開封・改竄されているか否かを検出することを特徴とする包装容器の開封検出方法。 The above method by using the unsealing detection method of the packaging container, characterized in that to detect whether the container has been opened, tampered.
JP2001172424A 2001-06-07 2001-06-07 Laminated packaging material having non-contact ic, packaging container using laminated packaging material and method for detecting opened seal of packaging container Pending JP2002362613A (en)

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