JPH11219420A - Ic card module, ic card and their manufacture - Google Patents

Ic card module, ic card and their manufacture

Info

Publication number
JPH11219420A
JPH11219420A JP3804298A JP3804298A JPH11219420A JP H11219420 A JPH11219420 A JP H11219420A JP 3804298 A JP3804298 A JP 3804298A JP 3804298 A JP3804298 A JP 3804298A JP H11219420 A JPH11219420 A JP H11219420A
Authority
JP
Japan
Prior art keywords
ic card
ic
antenna
card module
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3804298A
Other languages
Japanese (ja)
Inventor
Seiichi Nishino
誠一 西野
Original Assignee
Tokin Corp
株式会社トーキン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Corp, 株式会社トーキン filed Critical Tokin Corp
Priority to JP3804298A priority Critical patent/JPH11219420A/en
Publication of JPH11219420A publication Critical patent/JPH11219420A/en
Application status is Pending legal-status Critical

Links

Abstract

PROBLEM TO BE SOLVED: To provide an IC card module and an IC card capable of being made thin, easily holding and connecting an antenna line to a bump on a pad and improving the reliability of connection between the pad and the antenna line, and a manufacturing method therefor.
SOLUTION: This IC card module having an IC chip 1, pads 2 to be electrodes formed on the IC chip 1, Au bumps 4 formed on respective pads 2, and antenna lines 3 connected to the bumps 4 is stored in a core material 5 having the same dimension as the thickness of the chip 1 and a hot melt material 6 is stuck to the outsides of the module and the core material 5 so that the thickness of the chip 1 is the same as that of the module.
COPYRIGHT: (C)1999,JPO

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、ICカードモジュール、ICカード及びそれらの製造方法に関し、特に、 The present invention relates to the, IC card module relates IC card and a process for their preparation, in particular,
非接触型のICカードに用いられるICカードモジュールのICチップとアンテナ線(アンテナコイル)の接続構造と接続方法、及びこのICカードモジュールを用いたICカードとその製造方法に関する。 Connection structure and connection method of the IC chip and the antenna wire of the IC card module used in a non-contact type IC card (antenna coil) and an IC card and its manufacturing method using the IC card module.

【0002】 [0002]

【従来の技術】従来、この分野で、技術的に確立され、 Conventionally, in this field, it is established in the art,
最も多く用いられる方法は、プリント基板(配線基板) Most used method, a printed circuit board (wiring board)
にICチップをマウントし、ボンディング線にてプリント基板上へ接続するCOB法である。 The IC chip mounted on a COB method for connecting to a printed circuit board by a bonding wire. このプリント基板上の配線を経由し、アンテナ線接続用の、電極となるパッドとアンテナ線を半田材で接続している。 Via wiring on the printed board, it is connected to an antenna line connected to the pad and the antenna line to be an electrode with a solder material.

【0003】一方、別の方法では、ボンディング線によらず、ICチップのパッド上に金(Au)バンプを形成し、フリップチップ技術でプリント基板に接続する方法が用いられる。 On the other hand, in the alternative, regardless of the bonding wire, a gold (Au) bump formed on the IC chip pad, the method of connecting the printed circuit board by flip-chip technology is used.

【0004】 [0004]

【発明が解決しようとする課題】しかし、COB法は、 The object of the invention is to be Solved However, COB method,
ループ高さが200μmあり、モジュールを薄くできないという欠点があった。 Loop height is there 200μm, there has been a drawback that can not be thin module.

【0005】一方、Auバンプを用いる方法は、バンプ上面の引きちぎり部分の形状が安定せず、また、上面形状が突起状になっていることから、アンテナ線を半田で接続する場合に安定しない欠点があった。 On the other hand, a method using a Au bump, not the shape of the tearing portion of the bump top is stable, also, since the upper surfaces have become protruding, not stable when connecting antenna wires with solder there is a drawback.

【0006】従って、本発明は、薄型化でき、その上、 [0006] Accordingly, the present invention can be thinner, on the,
パッド上のバンプに、アンテナ線を容易に保持、接続でき、パッドとアンテナ線の接続信頼性を高めた、安価なICカードモジュール、ICカード及びそれらの製造方法を提供することにある。 The bumps on the pads, easily hold the antenna wire, can be connected, enhanced connection reliability between the pad and the antenna line is to provide an inexpensive IC card module, an IC card and a process for their preparation.

【0007】 [0007]

【課題を解決するための手段】本発明は、ICチップと、該ICチップ上に形成された電極となるパッドと、 The present invention SUMMARY OF] has an IC chip and a pad as an electrode formed on the IC chip,
該パッド上に形成された金バンプと、該バンプに接続されるアンテナ線とを有するICモジュールにおいて、前記バンプは、前記アンテナ線を接続する溝を有するIC IC having gold bumps formed on the pads, the IC module having an antenna line connected to the bumps, the bumps, grooves connecting the antenna wire
カードモジュールである。 A card module.

【0008】また、本発明は、ICチップの電極となるパッド上にボンディング法により金バンプを形成し、該バンプを平坦にした後、該バンプ上に、接続されるアンテナ線の線径と同一で、該アンテナ線の取り付け方向と一致した角度を有する溝を形成し、前記アンテナ線を該溝に、平坦に、前記ICチップから所定の高さにそろえて接続し、その後、前記アンテナと前記バンプに半田を供給し、前記ICチップの下面から加熱して接続するI Further, the present invention is a gold bump is formed by bonding method on a pad as an electrode of the IC chip, after flattened the bumps, on the bump, identical to the wire diameter of the antenna line connected in, a groove having an angle that matches the mounting direction of the antenna beam, the antenna line the groove, flat, connect aligned from the IC chip to a predetermined height, then the said antenna supplying solder bump, to connect by heating from the lower surface of the IC chip I
Cカードモジュールの製造方法である。 A method for producing C-card module.

【0009】また、本発明は、上記のICカードモジュールと、該ICカードモジュールを入れるコア材と、前記ICカードモジュールと該コア材の外側に設けられたホットメルト材とを有するICカードであって、前記I Further, the present invention is a an IC card having the above-described IC card modules, and the core to put the IC card module, and a hot melt material provided on the outside of the IC card module and the core material Te, the I
Cチップの厚さは、前記コア材と同一で、前記ICカードモジュールの厚さは、前記コア材と前記ホットメルト材と同一であるICカードである。 The thickness of the C chips, the same as the core material, the thickness of the IC card module is an IC card is the same as the hot melt material and the core material.

【0010】また、本発明は、上記のICカードモジュールを、前記ICチップの厚さと同一寸法のコア材に収め、前記ICチップとの厚さが前記ICカードモジュールの厚さと同一寸法となるようにホットメルト材を、前記ICカードモジュールと前記コア材の外側に張り合わせたICカードの製造方法である。 Further, the present invention is the IC card module, contained in the core material thickness and the same size of the IC chip, so that the thickness of the IC chip becomes thick and the same size of the IC card module a hot melt material, an IC card manufacturing method of the laminated outside of the core member and the IC card module.

【0011】本発明は、ICパッドにアンテナ線を金属結合で接続でき、プリント基板や導電接着剤を使用しないので安価にできる効果がある。 The present invention is an antenna line can be connected in metal bonding to the IC pad, there is an effect that can be inexpensively because without using a printed board or a conductive adhesive. また、実装高さが安定することからICカードの厚さを制御でき、薄型のカードの製法に有利である。 Also, mounting height can be controlled thickness of the IC card to be stably, it is advantageous to production method of a thin card. また、アンテナ線は、仮固定されるので、自動化しやすい。 The antenna line, because it is temporarily fixed, easy to automate. また、アルミニウム(A In addition, aluminum (A
l)パッドにSn等の材料が接触しないので、接続信頼性は高い。 Since the material of Sn or the like l) pad is not in contact, connection reliability is high. 加えて、ICチップは、コア材に収まるので、外圧に強く、さらに、ICカードの平坦性が良好でカードデザイン等の自由度が高くなりその効果は大きい。 In addition, IC chips, because fit into the core material, resistant to external pressure, further, the effect flatness of the IC card becomes high degree of freedom in such good card design is large.

【0012】 [0012]

【発明の実施の形態】以下に、本発明の実施の形態を図面を参照して具体的に説明する。 DETAILED DESCRIPTION OF THE INVENTION Hereinafter, detailed explanation of the embodiments of the present invention with reference to the drawings.

【0013】図1に示すように、まず、ICチップ1 [0013] As shown in FIG. 1, first, IC chip 1
に、蒸着等でAlやAl合金からなるパッド2を形成した。 To, to form the pad 2 made of Al or Al alloy deposition or the like. 非接触型のICカードは、アンテナ線が必要であり、パッドとアンテナ線の接続方式で、信頼性とコストが大きく異なる。 Contactless IC card, it is necessary antenna wire, the connection scheme of the pad and the antenna line, different reliability and cost increases. そのため、ここでは、加工費が最も安価で、信頼性が高く、量産性の良いボンディングバンプ方式でパッド2面にAuバンプ4を形成した。 Therefore, here, processing cost is the most inexpensive, reliable, and forming an Au bump 4 on two sides pads good bonding bumps method of mass production. その後、 after that,
1バンプ当たり20g程度にて面押しして、平坦部分を形成した。 1 and press plane at about 20g per bump to form a flat portion. この平坦部分にアンテナ線3に使用する線径と同程度のU形状の治具で再度面押しし、溝を形成した。 Pressed again surface by a jig having a diameter of about the same U-shaped for use in an antenna line 3 to the flat portion, to form a groove. このU形状の面押しは、チップに対するアンテナ線3の取り付け角度と同一にした。 Surface pressing of the U-shaped material was prepared in the same manner as the mounting angle of the antenna beam 3 to the chip. この際、U形状の治具は、V形状等でも良い。 In this case, the jig of the U shape may be a V shape.

【0014】一方、アンテナ線3には、仕様に応じて、 [0014] On the other hand, the antenna wire 3, in accordance with the specifications,
30〜150μmのCu線が使用できる。 Cu line of 30~150μm can be used. このCu線の表面には、あらかじめSnもしくはSn合金のめっきを施している。 On the surface of the Cu wire, and plated in advance Sn or Sn alloy. めっき厚は、3〜5μmが良い。 Plating thickness is, 3~5μm is good. また、C In addition, C
u線は、純Cu線でも良い。 u line, may be pure Cu lines. ここでは、ホイスカー防止のため、Sn−Biめっき線とし、線間絶縁のため、ポリウレタンの薄いコーティングを施したものを使用した。 Here, since the whiskers prevent the Sn-Bi plated wire, for wire insulating, it was used after subjected to thin coating of polyurethane. このように薄いコーティングの場合、接続部分は、 For such a thin coating, the connection portion,
電気トーチ等で、簡単に除去できる。 An electric torch or the like, can be easily removed.

【0015】次に、次工程で使用するホットメルト材からなるシート等は、一般に、25μm刻みに材料があることから、ICチップ1上のアンテナ線3の取り付け高さを50μmになるようにバンプ4上のアンテナ線3をゆっくりと押し込んだ。 Next, the sheet or the like made of hot-melt material for use in the next step, generally, as the fact that there is material to 25μm increments, comprising a mounting height of the antenna wire 3 on the IC chip 1 to 50μm bump pushed slowly antenna line 3 on the 4. バンプ4、アンテナ線3は、それぞれAu、Cuで、どちらも柔らかく、1バンプ当たりの押し込み加重は25g程度であり、容易に上記の寸法にできた。 Bumps 4, the antenna line 3, Au respectively, with Cu, both soft and pushing weight per bump is about 25 g, it was easily the above dimensions.

【0016】アンテナ線3とバンプ4は、機械的に付着している状態のため、この上面にゴム板等による転写法でPbフリーのSn−Agの半田ペーストを少量付けた後、ICチップ1の下面から250℃で、5〜10秒程度加熱することにより金属接合して、本発明のICモジュールを得た。 The antenna wire 3 and the bumps 4 because of the condition being mechanically attached, after putting a small amount of solder paste Pb-free Sn-Ag in the transfer method using a rubber plate or the like to the upper surface, IC chip 1 at 250 ° C. from the lower surface, and a metal bonding by heating about 5 to 10 seconds, to obtain an IC module of the present invention.

【0017】次に、このICモジュールから、図2のI [0017] Next, from the IC module, as shown in FIG. 2 I
Cカード11を製作した。 It was manufactured C card 11. 図2に示すように、コア材5 As shown in FIG. 2, the core material 5
は、ICチップ1の厚さと同一にした。 Was the same as the thickness of the IC chip 1. ホットメルト材6は、アンテナ線3の取り付け高さと同じく、50μm Hot melt material 6, as well as the mounting height of the antenna line 3, 50 [mu] m
とした。 And the. アンテナ線の実装部は、ホットメルト材6からなる層で吸収させた。 Mounting portion of the antenna line was absorbed by a layer consisting of a hot melt material 6. 即ち、この寸法構成で表面層をプラスチックからなるカバー材7で積層するとき、ICチップ1に応力が加わらず、かつ、無駄な空洞もできないため、ICチップ1の割れ、カバー材7の凹みを防止でき、平坦性も良好になる。 That is, when laminating the surface layer at this dimensioned with the cover member 7 made of plastic, not applied stress to the IC chip 1 is, and can not be wasted cavities, cracking of the IC chip 1, the recess of the cover material 7 prevention can also become good flatness.

【0018】 [0018]

【発明の効果】本発明によれば、薄型化でき、その上、 According to the present invention, it can be thinner, on the,
パッド上のバンプに、アンテナ線を容易に保持、接続でき、パッドとアンテナ線の接続信頼性を高めた、安価なICカードモジュール、ICカード及びそれらの製造方法を提供することができた。 The bumps on the pads, easily hold the antenna wire, can be connected, enhanced connection reliability between the pad and the antenna line, it was possible to provide an inexpensive IC card module, an IC card and a process for their preparation.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の実施の形態におけるICモジュールの説明図。 Illustration of the IC module in the embodiment of the present invention; FIG. 図1(a)は、斜視図。 1 (a) is a perspective view. 図1(b)は、断面図。 1 (b) is a cross-sectional view.

【図2】本発明の実施の形態におけるICカードの説明図。 Illustration of an IC card according to an embodiment of the present invention; FIG. 図2(a)は、平面図。 2 (a) is a plan view. 図2(b)は、図2(a) FIG. 2 (b), FIGS. 2 (a)
のx−x断面図。 x-x sectional view of.

【符号の説明】 DESCRIPTION OF SYMBOLS

1 ICチップ 2 パッド 3 アンテナ線 4 (Au)バンプ 5 コア材 6 ホットメルト材 7 カバー材 11 ICカード 1 IC chip 2 pads 3 antenna wire 4 (Au) bump 5 core material 6 hot melt material 7 covering member 11 IC card

Claims (4)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 ICチップと、該ICチップ上に形成された電極となるパッドと、該パッド上に形成された金バンプと、該バンプに接続されるアンテナ線とを有するI And 1. A IC chip, I have a pad to serve as an electrode formed on the IC chip, and gold bumps formed on the pads, and an antenna line connected to the bumps
    Cモジュールにおいて、前記バンプは、前記アンテナ線を接続する溝を有することを特徴とするICカードモジュール。 In C module, the bumps, IC card module characterized by having a groove for connecting the antenna lines.
  2. 【請求項2】 ICチップの電極となるパッド上にボンディング法により金バンプを形成し、該バンプを平坦にした後、該バンプ上に、接続されるアンテナ線の線径と同一で、該アンテナ線の取り付け方向と一致した角度を有する溝を形成し、前記アンテナ線を該溝に、平坦に、 2. A gold bump is formed by bonding method on pads in the IC chip of the electrodes, after flattening the said bumps, onto the bump, the same as the wire diameter of the antenna wire being connected, the antenna forming a groove having a matching angle with the mounting direction of the line, the antenna line the groove, flat,
    前記ICチップから所定の高さにそろえて接続し、その後、前記アンテナと前記バンプに半田を供給し、前記I Connect aligned from the IC chip to a predetermined height, then supplying solder to the antenna and the bumps, the I
    Cチップの下面から加熱して接続することを特徴とするICカードモジュールの製造方法。 Method of manufacturing an IC card module, which comprises connecting by heating from the lower surface of the C chips.
  3. 【請求項3】 請求項1記載のICカードモジュールと、該ICカードモジュールを入れるコア材と、前記I 3. A IC card module according to claim 1, wherein the core material put the IC card module, the I
    Cカードモジュールと該コア材の外側に設けられたホットメルト材とを有するICカードであって、前記ICチップの厚さは、前記コア材と同一で、前記ICカードモジュールの厚さは、前記コア材と前記ホットメルト材と同一であることを特徴とするICカード。 An IC card having a hot melt material provided on the outside of the C card module and the core material, the thickness of the IC chip, the same as the core material, the thickness of the IC card module, the IC card, characterized in that the core material wherein the same as the hot melt material.
  4. 【請求項4】 請求項1記載のICカードモジュールを、前記ICチップの厚さと同一寸法のコア材に収め、 The 4. IC card module according to claim 1, accommodated in the core material thickness and the same size of the IC chip,
    前記ICチップとの厚さが前記ICカードモジュールの厚さと同一寸法となるようにホットメルト材を、前記I The hot melt material so that the thickness of the IC chip becomes thick and the same size of the IC card module, the I
    Cカードモジュールと前記コア材の外側に張り合わせたことを特徴とするICカードの製造方法。 IC card manufacturing method being characterized in that laminated to the outside of the C-card module the core material.
JP3804298A 1998-02-03 1998-02-03 Ic card module, ic card and their manufacture Pending JPH11219420A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3804298A JPH11219420A (en) 1998-02-03 1998-02-03 Ic card module, ic card and their manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3804298A JPH11219420A (en) 1998-02-03 1998-02-03 Ic card module, ic card and their manufacture

Publications (1)

Publication Number Publication Date
JPH11219420A true JPH11219420A (en) 1999-08-10

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Family Applications (1)

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Country Status (1)

Country Link
JP (1) JPH11219420A (en)

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