JPH1185937A - Non-contact lsi card and method for inspecting the same - Google Patents

Non-contact lsi card and method for inspecting the same

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Publication number
JPH1185937A
JPH1185937A JP25424497A JP25424497A JPH1185937A JP H1185937 A JPH1185937 A JP H1185937A JP 25424497 A JP25424497 A JP 25424497A JP 25424497 A JP25424497 A JP 25424497A JP H1185937 A JPH1185937 A JP H1185937A
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JP
Japan
Prior art keywords
card
coil
portion
device
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25424497A
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Japanese (ja)
Inventor
Shinji Oki
信二 大木
Original Assignee
Nippon Lsi Card Kk
日本エルエスアイカード株式会社
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Publication date
Application filed by Nippon Lsi Card Kk, 日本エルエスアイカード株式会社 filed Critical Nippon Lsi Card Kk
Priority to JP25424497A priority Critical patent/JPH1185937A/en
Publication of JPH1185937A publication Critical patent/JPH1185937A/en
Application status is Pending legal-status Critical

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Abstract

PROBLEM TO BE SOLVED: To individually inspect a coil and a semiconductor integrated circuit element in a state in which a coil is sealed between two resin substrates in a non-contact LSI card. SOLUTION: A non-contact LSI card is constituted of a card main body 10 in which a coil 15 is sealed between two resin substrates 12 and 14, and a device 20 united with the card main body 10. The device 20 is provided with a substrate part interfit to an opening 14a provided at the resin substrate 14, and a semiconductor integrated circuit element 22 mounted on the inside surface of the substrate part. The device 20 is mounted on the card main body 10 so that contact parts 23 and 23 of the semiconductor integrated circuit element 22 can be brought into contact with contact parts 15b and 15b of a coil 15, and an electronic circuit can be completed. The card main body 10 and the device 20 can be individually inspected in a state they are separated before they are united with each other.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、非接触式のLSI BACKGROUND OF THE INVENTION The present invention relates to the use of non-contact LSI
カード及びその検査方法に関する。 Card and its inspection method.

【0002】 [0002]

【従来の技術】非接触式のLSIカードは、外部に露出する端子を必要としないため、積層された一対の樹脂基板の間に、コイル及びLSI素子等の半導体集積回路素子を封入したサンドイッチ構造になっている。 BACKGROUND OF THE INVENTION Non-contact type LSI card, because it does not require a terminal exposed to the outside, between a pair of resin substrates are laminated, sandwiched and sealed semiconductor integrated circuit elements such as coils and LSI device structure It has become. ここで、 here,
コイルは、一方の樹脂基板の内側の表面上に印刷又は箔の貼り付けにより形成されており、コイルに接続される半導体集積回路素子も、同じ表面上に実装されている。 Coil is formed by pasting printing or foil on the inner surface of one of the resin substrate, even a semiconductor integrated circuit element connected to the coil, it is mounted on the same surface.

【0003】 [0003]

【発明が解決しようとする課題】このような構造の非接触式LSIカードは、一方の樹脂基板の表面上にコイルを形成すると共に、その表面上に半導体集積回路素子を実装した後、その上に他方の樹脂基板を貼り付けることにより製作され、その製作の最終段階で特性検査を受けるが、一対の樹脂基板の間にコイル及び半導体集積回路素子が封入された後に特性検査を受けるために、特性不良が発見された場合にその原因がコイルの側にあるのか、半導体集積回路素子の側にあるのかを判別し難いという問題がある。 Contactless LSI card INVENTION Problems to be Solved] Such a structure, to form a coil on the surface of one resin substrate, after mounting the semiconductor integrated circuit device on the surface, on which to be fabricated by pasting the other resin substrate, for receiving is subjected to property test at the final stage of its manufacture, the characteristic inspection after the coil and the semiconductor integrated circuit device is sealed between a pair of resin substrates, whether the cause when the characteristic defect is found is on the side of the coil, there is a problem that it is difficult to determine whether the the side of the semiconductor integrated circuit device.

【0004】ちなみに、コイルの形成及び半導体集積回路素子の実装を終えた一方の樹脂基板に他方の樹脂基板を貼り付ける前に特性検査を行った場合は、貼り付けの工程で生じるコイルの断線等を発見できないことになる。 [0004] Incidentally, when the characteristic inspection was carried out before the one of the resin substrate after the implementation of formation and the semiconductor integrated circuit device of the coil paste other resin substrate, breakage of the coil caused by pasting step, such as You will not be able to discover.

【0005】本発明はかかる事情に鑑みて創案されたものであり、一対の樹脂基板の貼り合わせの後に検査を行うにもかかわらず、コイルと半導体集積回路素子を別々に検査することができる非接触式LSIカード及びその検査方法を提供することを目的とする。 [0005] The present invention has been made in view of such circumstances, despite inspected after attachment of the pair of resin substrates, non of the coil and the semiconductor integrated circuit device can be inspected separately and to provide a contact type LSI card and an inspection method thereof.

【0006】 [0006]

【課題を解決するための手段】本発明に係る非接触式L Contactless L according to the present invention, in order to solve the problems]
SIカードは、積層された2枚の樹脂基板を備えており、その一方の樹脂基板の内側の表面上にコイルが形成されると共に、該コイルの接点部が他方の樹脂基板の外側に露出するように他方の樹脂基板に前記接点部を含む部分に対応して開口部が形成されたカード本体と、他方の樹脂基板の開口部に嵌合する基板部及び該基板部の内側の表面上に実装された半導体集積回路素子を備えており、他方の樹脂基板の開口部に嵌合されてカード本体と合体されることにより、半導体集積回路素子の接点部が前記コイルの接点部に接触するデバイスとを具備することを特徴としている。 SI card features two resin substrates are laminated, the coil is formed on the inner surface of the one of the resin substrate, the contact portion of the coil is exposed to the outside of the other resin substrate as the other a card body in which an opening is formed on the resin substrate corresponding to the portion including the contact portion, on the inner surface of the base plate and the base plate portion fitted in the opening of the other resin substrate includes a mounted semiconductor integrated circuit device, by being combined with the card body is fitted into the opening of the other resin substrate, a device contact portion of a semiconductor integrated circuit device is in contact with the contact portion of the coil It is characterized by comprising and.

【0007】この構成によると、半導体集積回路素子が実装される部分が、デバイスとしてカード本体から分離されている。 [0007] According to this configuration, the portion where the semiconductor integrated circuit device is mounted is separated from the card body as a device. カード本体を製作した後、そのカード本体にデバイスを合体させることにより、カード本体内のコイルとデバイス内の半導体集積回路素子が電気的に接触し、電子回路が完成する。 After preparing the card body, by combining the device to the card body, a semiconductor integrated circuit device in the coil and the device in the card body in electrical contact, the electronic circuit is completed. カード本体にデバイスを合体させる前に検査を行うならば、両者を分離した状態でそれぞれの検査を独立して行うことができる。 If the test performed prior to combine the device to the card body, in a state of being separate them can be performed independently of each inspection.

【0008】カード本体は、積層された2枚の樹脂基板の間に、接着剤及びスペーサを兼ねる樹脂層を有するのが好ましい。 [0008] A card body between two resin substrates are laminated, preferably it has a resin layer serving also as an adhesive and the spacer.

【0009】デバイスは、半導体集積回路素子の接点部をコイルの接点部に導電性接着剤により接着し、且つ基板部を樹脂層に接着することにより、カード本体に固定されることが好ましい。 [0009] device, the contact portion of the semiconductor integrated circuit device is bonded by a conductive adhesive to the contact portion of the coil, and by adhering a substrate portion in the resin layer, it is preferably fixed to the card body.

【0010】表面上にコイルが形成された一方の樹脂基板は、半導体集積回路素子が対向する部分に、逃げ部としての開口部を有するのが好ましい。 [0010] One of the resin substrate coil is formed on the surface, the portion where the semiconductor integrated circuit element is opposite, that has an opening of a relief portion preferably. この構成によると、デバイスを合体させたときにその半導体集積回路素子がこの開口部に入り込むので、カードの厚みを薄くするのが容易となる。 According to this structure, the semiconductor integrated circuit device when coalesce device so enters into the opening, it is easy to reduce the thickness of the card.

【0011】この場合、カード本体は、一方の樹脂基板の外側の表面に貼り付けられた保護フィルムを有するのが好ましい。 [0011] In this case, the card main body preferably has a protective film applied to the outer surface of one of the resin substrate. この構成により、一方の樹脂基板に設けられた開口部が閉塞される。 With this configuration, an opening provided in one of the resin substrate is closed.

【0012】本発明に係る非接触式LSIカードの検査方法は、本発明に係る非接触式LSIカードを検査する方法であって、カード本体にデバイスを合体させる前に、カード本体とデバイスが分離した状態でそれぞれの検査を行うものであり、これにより特性不良が発見された場合にその原因がコイルの側にあるか半導体集積回路素子の側にあるかを正確に判別することができる。 [0012] inspection method of contactless LSI card according to the present invention is a method for inspecting a non-contact type LSI card according to the present invention, prior to combining the device to the card body, the card body and the device isolation It was it performs a respective test state, thereby the cause if the characteristic defect is found to accurately discriminate whether the side of the semiconductor integrated circuit device or the side of the coil.

【0013】 [0013]

【発明の実施の形態】以下に本発明の実施形態を図面に基づいて説明する。 It is described with reference to embodiments of the present invention DETAILED DESCRIPTION OF THE INVENTION Hereinafter the drawings. 図1は本発明の実施形態に係る非接触式LSIカードの斜視図、図2は同非接触式LSIカードの分解斜視図、図3は同非接触式LSIカードの主要部の構造説明図、図4は同非接触式LSIカードにおけるコイル形成法の説明図、図5は同非接触式LSIカードの検査方法の説明図である。 Figure 1 is a perspective view of contactless LSI card according to an embodiment of the present invention, FIG 2 is an exploded perspective view of the contactless LSI card, FIG. 3 is the structure diagram of a principal portion of the non-contact type LSI card, Figure 4 is an explanatory view of a coil forming process in the same non-contact type LSI card, FIG. 5 is an explanatory view of the inspection method of the same non-contact type LSI card.

【0014】本発明の実施形態に係る非接触式LSIカードは、図1に示されるように、一般の非接触式LSI [0014] Non-contact LSI card according to an embodiment of the present invention, as shown in FIG. 1, the non-contact type LSI General
カードに準じる形状及び大きさのカード本体10と、カード本体10に合体されたデバイス20とを具備している。 A card body 10 in shape and size conform to the card, and a device 20 which is incorporated into the card body 10.

【0015】カード本体10は、図2に示されるように、裏側(図で下側)から表側(図で上側)へ保護フィルム11、第1の樹脂基板12、樹脂層13及び第2の樹脂基板14を順に積層した構造になっている。 The card body 10, as shown in FIG. 2, the back protection from (lower side in the figure) to the front side (upper side in the figure) film 11, the first resin substrate 12, the resin layer 13 and the second resin It has become the substrate 14 to the laminated structure in order. 以下の説明では裏側を下側、表側を上側と称する。 The following lower backside in the description refers to a front side and upper side.

【0016】第1の樹脂基板12の上側の表面上には、 [0016] On the surface of the upper side of the first resin substrate 12,
コイル15が形成されている。 Coil 15 is formed. コイル15は、角形の渦巻き状をした本体部15aと、一対の接点部15b,1 Coil 15 includes a body portion 15a which has a rectangular spiral, the pair of contact portions 15b, 1
5bと、本体部15aの両端部と接点部15b,15b And 5b, both end portions and the contact portion 15b of the main body portion 15a, 15b
を接続するリード部15c,15cとからなる。 Lead portion 15c to connect, consisting of 15c. 本体部15aの内周側の端部と一方の接点部15bを接続する一方のリード部15cは、他方のリード部15cに平行な第1部分15c′と、本体部15aを跨ぐ第2部分1 One lead portion 15c connecting the end and one contact portion 15b of the inner peripheral side of the main body portion 15a, the second portion straddles the first portion 15c 'which is parallel to the other lead portion 15c, the main body portion 15a 1
5c″とからなる。 Consisting of a 5c ".

【0017】第1の樹脂基板12には又、コイル15の接点部15b,15bの近傍に位置して角形の開口部1 [0017] The first resin substrate 12 also contacts 15b, prismatic located in the vicinity of 15b opening 1 of the coil 15
2aが設けられている。 2a is provided. 開口部12aは、後述するデバイス20のLSI素子等の半導体集積回路素子22が挿入される逃げ孔である。 Opening 12a is a relief hole in which the semiconductor integrated circuit device 22 such as an LSI device will be described later device 20 is inserted. 開口部12aの下方は、第1の樹脂基板12の下側の表面に貼り付けられる保護フィルム11により閉塞される。 Below the opening 12a is closed by a protective film 11 is adhered to the lower surface of the first resin substrate 12.

【0018】第2の樹脂基板14は、接着剤及びスペーサを兼ねる樹脂層13によって、第1の樹脂基板12上に接合されている。 [0018] The second resin substrate 14, the resin layer 13 serving also as an adhesive and the spacer are bonded on the first resin substrate 12. 樹脂層13は、第1の樹脂基板12 The resin layer 13, the first resin substrate 12
に設けられたコイル15及び開口部16を避けて第1の樹脂基板12上に被覆され、この上に重ねられた第2の樹脂基板14を接合する。 The coil 15 and the opening 16 provided in avoiding coated on the first resin substrate 12, to join the second resin substrate 14 overlaid thereon.

【0019】第2の樹脂基板14には、デバイス20を合体させるための角形の開口部14aが設けられている。 [0019] The second resin substrate 14, rectangular opening 14a for coalescing the device 20 is provided. 開口部14aは、第1の樹脂基板12に設けられた開口部12a及び第1の樹脂基板12の表面上に形成されたコイル15の接点部15b,15bに対応する位置にあり、これにより開口部12a及び接点部15b,1 Opening 14a is at a position corresponding to the first opening 12a provided on the resin substrate 12 and the first contact portion 15b of the coil 15 formed on the surface of the resin substrate 12, 15b, thereby opening parts 12a and contact portions 15b, 1
5bは、開口部14aを通して第2の樹脂基板14の上側に露出することとなる。 5b is a possible exposed to the upper side of the second resin substrate 14 through the opening 14a.

【0020】カード本体10に合体されるデバイス20 [0020] The device is incorporated into the card body 10 20
は、図3に示されるように、第2の樹脂基板14に設けられた開口部14aに嵌合する角形の基板部21を備えている。 , As shown in FIG. 3, comprises a rectangular substrate portion 21 to be fitted into the opening 14a provided in the second resin substrate 14. 基板部21は第2の樹脂基板14と同じ厚みの樹脂基板である。 Substrate 21 is a resin substrate having the same thickness as the second resin substrate 14.

【0021】基板部21の下側の表面上には、半導体集積回路素子22が実装されると共に、接点部23,23 [0021] On the lower surface of the substrate section 21, together with the semiconductor integrated circuit device 22 is mounted, the contact portions 23, 23
及びリード部24,24が形成されている。 And the lead portions 24, 24 are formed. これらは、 They are,
開口部14aに基板部21を嵌合させた状態で、半導体集積回路素子22が第1の樹脂基板12に設けられた開口部12aに挿入され、接点部23,23が第1の樹脂基板12の表面上に形成されたコイル15の接点部15 The opening 14a in a state where the fitting substrate 21, the semiconductor integrated circuit device 22 is inserted into the opening 12a provided in the first resin substrate 12, the contact portions 23, 23 are the first resin substrate 12 contact portion 15 of the coil 15 formed on the surface of the
b,15bに上側から対向接触するようになっている。 b, so that the opposing contact from above 15b.

【0022】そして、開口部14aに嵌合された基板部21が接着剤25によって樹脂層13の上側の表面に接着され、接点部23,23が接点部15b,15bに導電性接着剤26によって接着される。 [0022] The substrate portion 21 is fitted into the opening portion 14a is bonded to the upper surface of the resin layer 13 by adhesive 25, the contact portion 15b is contact portions 23, 23, by a conductive adhesive 26 to 15b It is bonded. これらにより、カード本体10に合体されたデバイス20はそのカード本体10に固定される。 These device 20 that is incorporated into the card body 10 is fixed to the card body 10. また、接点部23,23と接点部15b,15bの確実な電気的接続が達成される。 Further, the contact portions 23, 23 and the contact portion 15b, a reliable electrical connection 15b is achieved.

【0023】次に、本発明の実施形態に係る非接触式L Next, the non-contact type L according to an embodiment of the present invention
SIカードの製造方法について説明する。 A method for manufacturing the SI card.

【0024】予め開口部12aが形成された第1の樹脂基板12の上側の表面上にコイル15を形成する。 [0024] forming the coil 15 in advance on the first upper surface of the resin substrate 12 with an opening 12a is formed. これは例えば図4に示す方法により行うことができる。 This can be done by the method shown in FIG. 4, for example.

【0025】即ち、図4(a)に示すように、第1の樹脂基板12の上側の表面上に導電性樹脂を印刷することにより、コイル15の本体部15a、接点部15b,1 [0025] That is, as shown in FIG. 4 (a), by printing a conductive resin on a surface of the upper side of the first resin substrate 12, the main body portion 15a of the coil 15, the contact portion 15b, 1
5b、一方のリード部15c及び他方のリード部15c 5b, one of the lead portion 15c and the other lead portion 15c
の第1部分15c′を形成する。 Forming a first portion 15c 'of. つまり、コイル15の本体部15aを跨ぐリード部15cの第2部分15c″ That is, the second portion 15c of the lead portion 15c straddling the body portion 15a of the coil 15 "
を除く部分を形成する。 Forming part with the exception of.

【0026】次に、図4(b)に示すように、コイル1 Next, as shown in FIG. 4 (b), the coil 1
5の少なくとも本体部15aが覆われるように第1の樹脂基板12の上側の表面上に絶縁性を有するレジスト1 5 of the resist 1 having a first upper surface on the insulating resin substrate 12 such that at least the main body portion 15a is covered
9を被覆する。 9 covers. その後で、図4(c)に示すように、第1の樹脂基板12の上側の表面上に導電性樹脂を印刷することにより、コイル15の本体部15aを跨ぐリード部15cの第2部分15c″を形成する。これにより、 Thereafter, as shown in FIG. 4 (c), by printing a conductive resin on a surface of the upper side of the first resin substrate 12, the second portion 15c of the lead portion 15c straddling the body portion 15a of the coil 15 to form a ". As a result,
コイル15の本体部15aを跨ぐ第2部分15c″と本体部15aの間の短絡が回避される。 Short circuit between the second portion 15c "a main body 15a straddling the main body portion 15a of the coil 15 is avoided.

【0027】図4に示されたコイル15の形成法では、 [0027] In the method of forming the coil 15 shown in FIG. 4,
リード部15cの一部を2層目に設けているが、その全部を2層目にすることもでき、更には本体部15aの一部を2層目に設けることも可能である。 Is provided with the part of the lead portion 15c to the second layer, it can also be in its entirety second layer, and further it is also possible to provide the second layer a portion of the body portion 15a. また、印刷によらず、例えば箔の貼り付け等によってコイル15を形成することも可能である。 Further, regardless of the print, it is also possible to form the coil 15 by pasting or the like of the foil.

【0028】第1の樹脂基板12の上側の表面上にコイル15が形成されると、その第1の樹脂基板12の上側の表面上に樹脂層13を被覆し、その上に第2の樹脂基板14を重ねて接合する。 [0028] When the coil 15 to the upper surface of the first resin substrate 12 is formed, a resin layer 13 is coated on the upper surface of the first resin substrate 12, a second resin thereon joining overlapping the substrate 14. これにより、樹脂基板12, Thus, the resin substrate 12,
14の間にコイル15がサンドイッチ状に封入される。 Coil 15 during 14 is enclosed in a sandwich.

【0029】そして、第1の樹脂基板12の下側の表面に保護フィルム11を貼り付けることにより、カード本体10が完成する。 [0029] Then, by attaching the protective film 11 on the lower surface of the first resin substrate 12, the card body 10 is completed.

【0030】カード本体10が完成すると、そのカード本体10にデバイス20を合体させることにより、非接触式LSIカードが完成する。 [0030] When the card body 10 is completed, by combining the device 20 to the card body 10, the non-contact type LSI card is completed. この合体作業は、デバイス20の基板部21を第2の樹脂基板14の開口部14 The combined operation, the opening 14 of the substrate portion 21 of the device 20 and the second resin substrate 14
aに嵌合させると共に、その基板部21を接着剤25によって樹脂層13の上側の表面に接着し、接点部23, Causes fitted into a, adhere the substrate 21 to the upper surface of the resin layer 13 by adhesive 25, the contact portion 23,
23をコイル15の接点部15b,15bに導電性接着剤26によって接着することにより行われる。 23 contact portion 15b of the coil 15, carried out by bonding with a conductive adhesive 26 to 15b.

【0031】非接触式LSIカードの厚みが許されるならば、カード本体10にデバイス20を合体させた後に、デバイス20を含む第2の樹脂基板14の上側の表面に保護フィルムを貼り付けることもできる。 [0031] If the thickness of the non-contact type LSI card is allowed, after the device 20 was incorporated into the card body 10, also paste a protective film on the upper surface of the second resin substrate 14 including the device 20 it can. こうすることにより、カード本体10に合体されたデバイス20 By doing so, the device 20 that is incorporated into the card body 10
はより確実にカード本体10に固定される。 It is more securely fixed to the card body 10.

【0032】上記した本発明の実施形態に係る非接触式LSIカードは、次のような特徴を有する。 The contactless LSI card according to an embodiment of the present invention described above has the following characteristics.

【0033】半導体集積回路素子22の実装部分が、コイル15の封入を終えたカード本体10から、デバイス20として分離している。 The mounting portion of the semiconductor integrated circuit device 22, the card body 10 having been subjected to the encapsulation of the coil 15, it is separated as a device 20. このため、カード本体10にデバイス20を合体させる前に、両者が分離した状態でそれぞれの特性検査を独立に行うことができる。 Therefore, it is possible to make prior to combining the device 20 to the card body 10, independently of each characteristic test in a state where both are separated. この検査は、例えば図5に示す方法に行うことができる。 This test can be performed to the method shown in FIG. 5, for example.

【0034】即ち、パソコン30、検査器40及びリーダ/ライター50を相互に接続し、リーダ/ライター5 [0034] That is, to connect the personal computer 30, the tester 40 and the reader / writer 50 to each other, the reader / writer 5
0にカード本体10をセットすると共に、デバイス20 With setting the card body 10 to 0, the device 20
を検査器50に接続して、カード本体10とデバイス2 And connected to the test unit 50, the card body 10 and the device 2
0を電気的に組み合わせた状態で単体検査する。 0 to a single inspection in an electrically combined state.

【0035】カード本体10及びデバイス20の両方に異常がなければ、両者を組み合わせて非接触式LSIカードの完成品とする。 [0035] If there is no abnormality in both of the card body 10 and the device 20, the finished product of the combination of both non-contact type LSI card. いずれかに異常が発見された場合、異常が発見された方のみを新しいものと取り替え、 If an abnormality is found in either, replaced with a new one only person who abnormality is found,
検査をし直す。 Re-inspection.

【0036】このように、本発明の実施形態に係る非接触式LSIカードでは、半導体集積回路素子22が実装される部分が、デバイス20としてカード本体10から分離されているので、両者を電気的に組み合わせた状態で単体検査することができる。 [0036] Thus, in the non-contact type LSI card according to an embodiment of the present invention, since the portion where the semiconductor integrated circuit device 22 is mounted it is separated from the card body 10 as the device 20, electrically both it can be a single test in a state combined to. このため、特性不良が発見された場合にその原因がコイル15の側にあるか半導体集積回路素子22の側にあるかを正確に判別することができる。 Therefore, it is possible to the cause when the characteristic defect is found to accurately determine the side of either the semiconductor integrated circuit device 22 on the side of the coil 15.

【0037】また、第1の樹脂基板12に、半導体集積回路素子22が挿入される開口部12aが設けられているので、スペーサを兼ねる樹脂層13を薄くしても、半導体集積回路素子22と第1の樹脂基板12の干渉が回避される。 Further, the first resin substrate 12, the opening portions 12a in which the semiconductor integrated circuit device 22 is inserted is provided, even if thin resin layer 13 serving as a spacer, a semiconductor integrated circuit device 22 interference of the first resin substrate 12 is avoided. このため、カード厚を規定値に収めるのが容易である。 Therefore, it is easy to fit the card thickness to a specified value.

【0038】図6は本発明の別の実施形態に係る非接触式LSIカードの模式平面図である。 [0038] FIG. 6 is a schematic plan view of a non-contact type LSI card according to another embodiment of the present invention. この実施形態のように、デバイス20の配置位置はカード本体10の中央部でもよく、特にその配置位置を限定するものではない。 As in this embodiment, the arrangement position of the device 20 may be a central portion of the card body 10, not particularly limited to its position.

【0039】また、コイル15は、角形の渦巻き状に形成されているとしたが、他の形状、例えば、同心円状に形成されていてもよいことは勿論である。 Further, the coil 15 is set to be formed in the rectangular spiral, other shapes, for example, that may be formed in concentric circles, as a matter of course.

【0040】 [0040]

【発明の効果】以上に述べたとおり、本発明に係る非接触式LSIカード及びその検査方法による場合には、半導体集積回路素子が実装される部分が、デバイスとしてカード本体から分離されていることにより、両者を電気的に組み合わせた状態で単体検査することができるので、特性不良が発見された場合にその原因がコイルの側にあるか半導体集積回路素子の側にあるかを正確に判別することができる。 As mentioned above, according to the present invention, in the case of non-contact LSI card and an inspection method thereof according to the present invention, the portion of the semiconductor integrated circuit device is mounted is separated from the card body as a device Accordingly, since both can be electrically combined alone inspected state and the cause is determined accurately whether the side of the semiconductor integrated circuit device or the side of the coil when the characteristic defect is found be able to.

【0041】表面上にコイルが形成された一方の樹脂基板が、半導体集積回路素子が対向する部分に、逃げ部としての開口部を有する場合には、デバイスを合体させたときにその半導体集積回路素子がこの開口部に入り込み、一方の樹脂基板との干渉が回避されるので、カードの厚みを薄くすることが容易となる。 [0041] One of the resin substrate coil is formed on the surface, the portion where the semiconductor integrated circuit element is opposite, when having an opening as relief portion, the semiconductor integrated circuit when coalesce device element enters into the opening, since the interference between one of the resin substrate is avoided, it becomes easy to reduce the thickness of the card.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の実施形態に係る非接触式LSIカードの斜視図である。 It is a perspective view of contactless LSI card according to the embodiment of the present invention; FIG.

【図2】同非接触式LSIカードの分解斜視図である。 2 is an exploded perspective view of the contactless LSI card.

【図3】同非接触式LSIカードの主要部の構造説明図である。 3 is a schematic diagram of the structure of the main portion of the non-contact type LSI card.

【図4】同非接触式LSIカードにおけるコイル形成法の説明図である。 4 is an explanatory view of a coil forming methods in the non-contact LSI card.

【図5】同非接触式LSIカードの検査方法の説明図である。 5 is an explanatory diagram of a testing method of the same non-contact type LSI card.

【図6】本発明の別の実施形態に係る非接触式LSIカードの模式平面図である。 6 is a schematic plan view of a non-contact type LSI card according to another embodiment of the present invention.

【符号の説明】 DESCRIPTION OF SYMBOLS

10 カード本体 11 保護フィルム 12,14 樹脂基板 12a,14a 開口部 13 樹脂層 15 コイル 15a 本体部 15b 接点部 15c リード部 20 デバイス 21 基板部 22 半導体集積回路素子 23 接点部 24 リード部 10 card body 11 protective film 12 resin substrate 12a, 14a opening 13 resin layer 15 coil 15a main body portion 15b contacts 15c leads 20 device 21 substrate 22 semiconductor integrated circuit device 23 contact portion 24 leads

Claims (6)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 積層された2枚の樹脂基板を備えており、その一方の樹脂基板の内側の表面上にコイルが形成されると共に、該コイルの接点部が他方の樹脂基板の外側に露出するように他方の樹脂基板に前記接点部を含む部分に対応して開口部が形成されたカード本体と、 他方の樹脂基板の開口部に嵌合する基板部及び該基板部の内側の表面上に実装された半導体集積回路素子を備えており、他方の樹脂基板の開口部に嵌合されてカード本体と合体されることにより、半導体集積回路素子の接点部が前記コイルの接点部に接触するデバイスとを具備することを特徴とする非接触式LSIカード。 1. A has a stacked two resin substrates were exposed with a coil is formed on the inner surface of the one of the resin substrate, the contact portion of the coil on the outer side of the other resin substrate a card body in which an opening portion corresponding to the portion including the other resin substrate to the contact portion is formed to the substrate portion and a substrate portion of the inner surface which fits into the opening of the other resin substrate It includes a mounted semiconductor integrated circuit device, fitted into the opening of the other of the resin substrate by being combined with the card body, the contact portion of the semiconductor integrated circuit device is in contact with the contact portion of the coil contactless LSI card, characterized by comprising a device.
  2. 【請求項2】 カード本体は、積層された2枚の樹脂基板の間に、接着剤及びスペーサを兼ねる樹脂層を有することを特徴とする請求項1に記載の非接触式LSIカード。 2. A card body, contactless LSI card of claim 1 between two resin substrates are laminated, characterized by having a resin layer serving also as an adhesive and the spacer.
  3. 【請求項3】 デバイスは、半導体集積回路素子の接点部をコイルの接点部に導電性接着剤により接着し、且つ基板部を樹脂層に接着することにより、カード本体に固定されていることを特徴とする請求項2に記載の非接触式LSIカード。 3. A device, by the contact portion of the semiconductor integrated circuit device is bonded by a conductive adhesive to the contact portion of the coil, and bonding the substrate unit to the resin layer, that is fixed to the card body contactless LSI card according to claim 2, characterized.
  4. 【請求項4】 表面上にコイルが形成された一方の樹脂基板は、半導体集積回路素子が対向する部分に、逃げ部としての開口部を有することを特徴とする請求項1、 Wherein one of the resin substrate coil is formed on the surface, according to claim 1, the semiconductor integrated circuit device in a portion opposed, and having an opening as a relief portion,
    2、3又は4に記載の非接触式LSIカード。 2, 3 or 4 non-contact type LSI card according to.
  5. 【請求項5】 カード本体は、一方の樹脂基板の外側の表面に貼り付けられた保護フィルムを有することを特徴とする請求項4に記載の非接触式LSIカード。 5. A card body, contactless LSI card according to claim 4, characterized in that it comprises a protective film applied to the outer surface of one of the resin substrate.
  6. 【請求項6】 請求項1、2、3、4又は5に記載の非接触式LSIカードを検査する方法であって、カード本体にデバイスを合体させる前に、カード本体とデバイスが分離した状態でそれぞれの検査を行うことを特徴とする非接触式LSIカードの検査方法。 6. A method of testing a non-contact type LSI card according to claim 1, 2, 3, 4 or 5, state prior to combining the device to the card body, the card body and the device are separated in the inspection method of contactless LSI card and performing each test.
JP25424497A 1997-09-02 1997-09-02 Non-contact lsi card and method for inspecting the same Pending JPH1185937A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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Publications (1)

Publication Number Publication Date
JPH1185937A true JPH1185937A (en) 1999-03-30

Family

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Country Link
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