JPH1185937A - Non-contact lsi card and method for inspecting the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To individually inspect a coil and a semiconductor integrated circuit element in a state in which a coil is sealed between two resin substrates in a non-contact LSI card. SOLUTION: A non-contact LSI card is constituted of a card main body 10 in which a coil 15 is sealed between two resin substrates 12 and 14, and a device 20 united with the card main body 10. The device 20 is provided with a substrate part interfit to an opening 14a provided at the resin substrate 14, and a semiconductor integrated circuit element 22 mounted on the inside surface of the substrate part. The device 20 is mounted on the card main body 10 so that contact parts 23 and 23 of the semiconductor integrated circuit element 22 can be brought into contact with contact parts 15b and 15b of a coil 15, and an electronic circuit can be completed. The card main body 10 and the device 20 can be individually inspected in a state they are separated before they are united with each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a non-contact LSI.
The present invention relates to a card and a method for inspecting the card.

[0002]

2. Description of the Related Art A non-contact type LSI card does not require a terminal exposed to the outside. Therefore, a sandwich structure in which a coil and a semiconductor integrated circuit element such as an LSI element are sealed between a pair of laminated resin substrates. It has become. here,
The coil is formed by printing or pasting a foil on the inner surface of one resin substrate, and the semiconductor integrated circuit element connected to the coil is also mounted on the same surface.

[0003]

In a non-contact LSI card having such a structure, a coil is formed on the surface of one resin substrate, and a semiconductor integrated circuit element is mounted on the surface of the resin substrate. It is manufactured by pasting the other resin substrate on, and undergoes a characteristic test at the final stage of the manufacturing, but in order to undergo a characteristic test after the coil and the semiconductor integrated circuit element are sealed between the pair of resin substrates, When a characteristic defect is found, there is a problem that it is difficult to determine whether the cause is on the coil side or on the semiconductor integrated circuit element side.

[0004] Incidentally, if a characteristic test is performed before attaching the other resin substrate to the one resin substrate on which the formation of the coil and the mounting of the semiconductor integrated circuit element have been completed, the disconnection of the coil caused in the attaching process, etc. Will not be found.

The present invention has been made in view of the above circumstances, and it is possible to inspect a coil and a semiconductor integrated circuit element separately even though an inspection is performed after bonding a pair of resin substrates. An object of the present invention is to provide a contact-type LSI card and an inspection method thereof.

[0006]

A non-contact type L according to the present invention.
The SI card includes two laminated resin substrates, a coil is formed on the inner surface of one of the resin substrates, and a contact portion of the coil is exposed to the outside of the other resin substrate. The card body in which an opening is formed on the other resin substrate corresponding to the portion including the contact portion, the substrate portion fitted into the opening of the other resin substrate, and the inside surface of the substrate portion A device comprising a mounted semiconductor integrated circuit element, wherein a contact portion of the semiconductor integrated circuit element is brought into contact with a contact portion of the coil by being fitted into an opening of the other resin substrate and being combined with a card body. Are provided.

According to this configuration, the portion where the semiconductor integrated circuit element is mounted is separated from the card body as a device. After the card main body is manufactured, by incorporating the device into the card main body, the coil in the card main body and the semiconductor integrated circuit element in the device are electrically contacted, and the electronic circuit is completed. If the inspection is performed before the device is combined with the card body, each inspection can be performed independently in a state where both are separated.

[0008] The card body preferably has a resin layer which also serves as an adhesive and a spacer, between two laminated resin substrates.

The device is preferably fixed to the card body by bonding the contact portion of the semiconductor integrated circuit element to the contact portion of the coil with a conductive adhesive and bonding the substrate portion to a resin layer.

It is preferable that the one resin substrate having the coil formed on the surface has an opening serving as a relief portion at a portion facing the semiconductor integrated circuit element. According to this configuration, the semiconductor integrated circuit element enters the opening when the devices are combined, so that the thickness of the card can be easily reduced.

In this case, the card body preferably has a protective film attached to the outer surface of one resin substrate. With this configuration, the opening provided in one resin substrate is closed.

A method for inspecting a non-contact LSI card according to the present invention is a method for inspecting a non-contact LSI card according to the present invention, wherein the card main body and the device are separated before the device is combined with the card main body. Each inspection is performed in a state in which the characteristic failure is found, so that when a characteristic defect is found, it is possible to accurately determine whether the cause is the coil side or the semiconductor integrated circuit element side.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a non-contact LSI card according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of the non-contact LSI card, FIG. FIG. 4 is an explanatory diagram of a coil forming method in the non-contact LSI card, and FIG. 5 is an explanatory diagram of a test method of the non-contact LSI card.

As shown in FIG. 1, a non-contact LSI card according to an embodiment of the present invention is a general non-contact LSI card.
A card body 10 having a shape and size similar to a card, and a device 20 combined with the card body 10 are provided.

As shown in FIG. 2, the card body 10 includes a protective film 11, a first resin substrate 12, a resin layer 13, and a second resin from the back side (the lower side in the figure) to the front side (the upper side in the figure). The structure is such that the substrates 14 are sequentially laminated. In the following description, the back side is referred to as a lower side, and the front side is referred to as an upper side.

On the upper surface of the first resin substrate 12,
A coil 15 is formed. The coil 15 includes a rectangular spiral main body 15a and a pair of contact portions 15b, 1
5b, both ends of the main body 15a, and contact portions 15b, 15b
Are connected to each other. One lead portion 15c connecting the inner peripheral end of the main body portion 15a and one contact portion 15b has a first portion 15c 'parallel to the other lead portion 15c, and a second portion 1 straddling the main body portion 15a.
5c ".

The first resin substrate 12 also has a rectangular opening 1 located near the contact portions 15b, 15b of the coil 15.
2a is provided. The opening 12a is an escape hole into which a semiconductor integrated circuit element 22 such as an LSI element of the device 20 described later is inserted. The lower part of the opening 12a is closed by the protective film 11 attached to the lower surface of the first resin substrate 12.

The second resin substrate 14 is joined to the first resin substrate 12 by a resin layer 13 which also functions as an adhesive and a spacer. The resin layer 13 is formed on the first resin substrate 12
The second resin substrate 14 which is covered on the first resin substrate 12 while avoiding the coil 15 and the opening 16 provided on the first resin substrate 12 and is overlaid thereon is joined.

The second resin substrate 14 is provided with a rectangular opening 14a for incorporating the device 20. The opening 14a is located at a position corresponding to the opening 12a provided in the first resin substrate 12 and the contact portions 15b, 15b of the coil 15 formed on the surface of the first resin substrate 12, whereby the opening is formed. Part 12a and contact parts 15b, 1
5b is exposed above the second resin substrate 14 through the opening 14a.

Device 20 to be combined with card body 10
As shown in FIG. 3, a rectangular substrate portion 21 is fitted into the opening 14 a provided in the second resin substrate 14. The board portion 21 is a resin board having the same thickness as the second resin board 14.

On the lower surface of the substrate 21, a semiconductor integrated circuit element 22 is mounted and contact portions 23, 23 are formed.
And lead portions 24, 24 are formed. They are,
The semiconductor integrated circuit element 22 is inserted into the opening 12a provided in the first resin substrate 12 in a state where the substrate 21 is fitted in the opening 14a, and the contact portions 23, 23 are connected to the first resin substrate 12. Contact portion 15 of coil 15 formed on the surface of
b and 15b from the upper side.

Then, the substrate 21 fitted into the opening 14a is adhered to the upper surface of the resin layer 13 by an adhesive 25, and the contact portions 23, 23 are attached to the contact portions 15b, 15b by a conductive adhesive 26. Glued. Thus, the device 20 combined with the card body 10 is fixed to the card body 10. Also, reliable electrical connection between the contact portions 23, 23 and the contact portions 15b, 15b is achieved.

Next, the non-contact type L according to the embodiment of the present invention will be described.
A method for manufacturing an SI card will be described.

The coil 15 is formed on the upper surface of the first resin substrate 12 in which the opening 12a has been formed in advance. This can be performed, for example, by the method shown in FIG.

That is, as shown in FIG. 4A, by printing a conductive resin on the upper surface of the first resin substrate 12, the main body 15a of the coil 15 and the contact portions 15b, 1 are formed.
5b, one lead 15c and the other lead 15c
Is formed as the first portion 15c '. That is, the second portion 15c ″ of the lead portion 15c straddling the main body portion 15a of the coil 15.
To form a portion excluding.

Next, as shown in FIG.
5 has an insulating resist 1 on the upper surface of the first resin substrate 12 so as to cover at least the main body 15a.
9 is coated. Thereafter, as shown in FIG. 4C, a conductive resin is printed on the upper surface of the first resin substrate 12 so that the second portion 15c of the lead portion 15c straddling the main body portion 15a of the coil 15 is formed. ″, Which results in
A short circuit between the second portion 15c ″ straddling the main body 15a of the coil 15 and the main body 15a is avoided.

In the method of forming the coil 15 shown in FIG.
Although a part of the lead portion 15c is provided in the second layer, the entire portion can be provided in the second layer, and further, a part of the main body portion 15a can be provided in the second layer. Instead of printing, the coil 15 can be formed by, for example, attaching a foil.

When the coil 15 is formed on the upper surface of the first resin substrate 12, a resin layer 13 is coated on the upper surface of the first resin substrate 12, and the second resin is formed thereon. The substrates 14 are overlapped and joined. Thereby, the resin substrate 12,
Between the coils 14, the coil 15 is enclosed in a sandwich shape.

Then, the protective film 11 is attached to the lower surface of the first resin substrate 12, whereby the card body 10 is completed.

When the card body 10 is completed, the device 20 is combined with the card body 10 to complete the non-contact LSI card. This combining operation is performed by connecting the substrate portion 21 of the device 20 to the opening 14 of the second resin substrate 14.
a, and the substrate portion 21 is adhered to the upper surface of the resin layer 13 with an adhesive 25, so that the contact portions 23,
23 is bonded to the contact portions 15b, 15b of the coil 15 with a conductive adhesive 26.

If the thickness of the non-contact type LSI card is allowed, after the device 20 is combined with the card body 10, a protective film may be attached to the upper surface of the second resin substrate 14 including the device 20. it can. By doing so, the device 20 integrated with the card body 10
Is more securely fixed to the card body 10.

The non-contact LSI card according to the embodiment of the present invention has the following features.

The mounting portion of the semiconductor integrated circuit element 22 is separated as a device 20 from the card body 10 in which the coil 15 has been sealed. Therefore, before the device 20 is combined with the card body 10, each characteristic test can be independently performed in a state where both are separated. This inspection can be performed, for example, by the method shown in FIG.

That is, the personal computer 30, the inspection device 40, and the reader / writer 50 are interconnected, and the reader / writer 5 is connected.
0 and the device 20
Is connected to the inspection device 50, and the card body 10 and the device 2 are connected.
A single inspection is performed in a state where 0 is electrically combined.

If there is no abnormality in both the card body 10 and the device 20, the two are combined to form a completed non-contact LSI card. If an abnormality is found in any of them, replace only the person who found the abnormality with a new one,
Check again.

As described above, in the non-contact type LSI card according to the embodiment of the present invention, since the portion on which the semiconductor integrated circuit element 22 is mounted is separated from the card body 10 as the device 20, both are electrically connected. A single inspection can be performed in a state combined with the above. Therefore, when a characteristic defect is found, it can be accurately determined whether the cause is on the coil 15 side or on the semiconductor integrated circuit element 22 side.

Further, since the first resin substrate 12 is provided with the opening 12a into which the semiconductor integrated circuit element 22 is inserted, even if the resin layer 13 also serving as a spacer is thinned, the resin integrated circuit element 22 and the semiconductor integrated circuit element 22 can be formed. Interference of the first resin substrate 12 is avoided. Therefore, it is easy to keep the card thickness within the specified value.

FIG. 6 is a schematic plan view of a non-contact LSI card according to another embodiment of the present invention. As in this embodiment, the arrangement position of the device 20 may be the central portion of the card body 10, and the arrangement position is not particularly limited.

Although the coil 15 is formed in a rectangular spiral shape, it is needless to say that the coil 15 may be formed in another shape, for example, concentrically.

[0040]

As described above, in the case of the non-contact LSI card and the inspection method therefor according to the present invention, the part on which the semiconductor integrated circuit element is mounted is separated from the card body as a device. By doing so, it is possible to perform a single inspection in a state where both are electrically combined, so that when a characteristic defect is found, it is accurately determined whether the cause is on the side of the coil or on the side of the semiconductor integrated circuit element be able to.

In the case where one of the resin substrates having the coil formed on the surface has an opening as a clearance at a portion where the semiconductor integrated circuit element is opposed, when the device is integrated, the semiconductor integrated circuit Since the element enters the opening and avoids interference with one of the resin substrates, it is easy to reduce the thickness of the card.

[Brief description of the drawings]

FIG. 1 is a perspective view of a non-contact LSI card according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view of the non-contact LSI card.

FIG. 3 is a structural explanatory view of a main part of the non-contact LSI card.

FIG. 4 is an explanatory diagram of a coil forming method in the non-contact LSI card.

FIG. 5 is an explanatory diagram of an inspection method for the non-contact LSI card.

FIG. 6 is a schematic plan view of a non-contact LSI card according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Card main body 11 Protective film 12, 14 Resin substrate 12a, 14a Opening 13 Resin layer 15 Coil 15a Main body 15b Contact 15c Lead 20 Device 21 Substrate 22 Semiconductor integrated circuit element 23 Contact 24 Lead

Claims (6)

[Claims] The present invention comprises two laminated resin substrates, wherein a coil is formed on an inner surface of one of the resin substrates, and a contact portion of the coil is exposed to the outside of the other resin substrate. A card body in which an opening is formed in the other resin substrate so as to correspond to the portion including the contact portion, a substrate portion fitted in the opening in the other resin substrate, and a surface on the inner surface of the substrate portion The contact portion of the semiconductor integrated circuit element comes into contact with the contact portion of the coil by being fitted into the opening of the other resin substrate and being integrated with the card body. A non-contact type LSI card comprising a device. 2. The non-contact LSI card according to claim 1, wherein the card body has a resin layer serving also as an adhesive and a spacer between the two resin substrates stacked. 3. The device is fixed to a card body by bonding a contact portion of a semiconductor integrated circuit element to a contact portion of a coil with a conductive adhesive and bonding a substrate portion to a resin layer. 3. The non-contact LSI card according to claim 2, wherein: 4. The one resin substrate having a coil formed on a surface thereof has an opening as a relief portion at a portion facing the semiconductor integrated circuit element.
5. The non-contact LSI card according to 2, 3, or 4. 5. The non-contact LSI card according to claim 4, wherein the card body has a protective film attached to an outer surface of the one resin substrate. 6. The method for inspecting a non-contact type LSI card according to claim 1, wherein the card body and the device are separated before the device is combined with the card body. A non-contact type LSI card inspection method, wherein each inspection is performed.