JP3661309B2 - Sensor mounting structure - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a sensor mounting structure in which an output corresponding to a pressing position is generated when a belt-shaped sensor surface is partially pressed.
[0002]
[Prior art]
A mounting structure of a sensor having a mechanism that generates an output corresponding to a pressure position when the belt-shaped sensor surface is partially pressurized (hereinafter, this type of sensor is referred to as a “multi-size sensor” in this specification). An example is shown in FIG. The main part of the multi-size sensor is an elongated belt-like sheet-like sensor 10, which is formed by sandwiching a tape resist 13 between a lower sheet 11 and an upper sheet 12. Since this sheet-like sensor 10 is thin and flexible, it cannot be used as a multi-size sensor as it is. In view of this, an elongated metal substrate 20 (usually using an aluminum plate) having high rigidity is prepared, and the sheet-like sensor 10 is bonded onto the metal substrate 20. A protective film 30 is bonded to the upper surface of the sheet-like sensor 10.
[0003]
One end of the sheet sensor 10 is a terminal portion 10a. The metal substrate 20 and the protective film 30 are shorter than the sheet sensor 10, and the terminal portion 10a of the sheet sensor 10 protrudes from the metal substrate 20 as shown in FIG. Further, most of the center of the sheet-like sensor 10 on the metal substrate 20 is the effective area 10b, and when an arbitrary position on the effective area 10b is pressed, the resistance value corresponding to the pressed position is a terminal portion. Occurs at 10a. The contact position information can be obtained by detecting the resistance value by an application circuit (not shown).
[0004]
The terminal portion 10a of the sheet-like sensor 10 and the application circuit are connected as shown in FIG. 2 or FIG. In the connection example of FIG. 2, an FPC (flexible printed wiring board) connector 1 is connected to the terminal portion 10 a of the sheet-like sensor 10, and the FPC connector 1 and the general connector 2 are connected by the lead wire 3. Connected to the application circuit via the connector 2. In the connection example of FIG. 3, the FPC connector 2 is omitted, and the lead wire 3 extending from the general connector 2 is directly connected to the terminal portion 10 a of the sheet-like sensor 10 by soldering or a conductive adhesive.
[0005]
[Problems to be solved by the invention]
In the method of connecting the sheet sensor 10 to an external application circuit using the FPC connector 1 as shown in FIG. 2, the reliability of the contact portion between the FPC connector 1 and the terminal portion 10a is particularly insufficient. Repeated attachment and detachment was likely to cause poor contact. Further, since the FPC connector 1 is used in addition to the general connector 2, there is a problem that the wiring cost is high.
[0006]
On the other hand, in the method of directly connecting the lead wire 3 to the terminal portion 10a of the sheet-like sensor 10 as shown in FIG. 3, if a large force is applied to the connecting portion after the connection, the wiring pattern of the terminal portion 10a is peeled off and disconnected. Or it is easy to cause poor contact. Also, when replacing the multi-size sensor, the soldering and bonding operations must be performed again, which is troublesome.
[0007]
The present invention has been made in view of the above-described background, and the object of the present invention is to solve the above-described problems and to connect an external application circuit and a multi-size sensor with a highly reliable general substrate. It is an object of the present invention to provide a sensor mounting structure that can be easily and reliably performed via a connector.
[0008]
[Means for Solving the Problems]
In order to achieve the above-described object, in the sensor mounting structure according to the present invention, a long and narrow rigid printed wiring board is used as a substrate, a short and long sheet-like sensor is provided on the substrate, and one end side of the printed wiring board is provided. The printed wiring board and the wiring pattern of the sheet-like sensor are connected to each other, and a board connector connected to the drawn wiring pattern is mounted on one end of the printed wiring board . And, the connection between the lead-out wiring pattern and the wiring pattern is such that the patterns to be connected are opposed to each other, or are opposed to the wiring pattern for relay connection, and are connected via the wiring pattern, The board connector is for connection to an external circuit .
[0009]
With such a configuration, the sheet-like sensor, which is the sensing unit of the sensor (multi-size sensor), is mounted on the printed wiring board having high rigidity, so that it bends even if an arbitrary position of the sensor part is pressed. There is nothing. And it can connect to an external circuit through the board | substrate connector mounted in the edge part of a printed wiring board. This board connector has high reliability and can be easily attached to and detached from an external circuit. Further, since the board connector and the sensor are both mounted on the printed wiring board, they can be easily conducted through the lead-out wiring pattern provided on the printed wiring board.
[0010]
Various structures can be used for providing the sensor on the printed wiring board. For example, the sheet-like sensor is a film on which the wiring pattern different from the printed wiring board is formed. It is comprised from a material, The sensor can be joined on the said printed wiring board, and the said wiring pattern and the said lead-out wiring pattern can be connected through a conductive connection member (Claim 2). This corresponds to the first embodiment.
[0011]
Further, a part of the wiring pattern of the sheet-like sensor is directly printed on the printed wiring board, and the connection between the wiring pattern and the lead-out wiring pattern is made directly on the printed wiring board. (Claim 3). This corresponds to the second embodiment. In particular, when configured as in claim 3, the printed wiring board forms part of the sensor, so the number of parts can be reduced. Further, the connection between the sensor wiring pattern and the lead wiring pattern can be easily performed.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
The structure of the first embodiment of the present invention is shown in FIG. An elongated printed wiring board 4 having a large rigidity is prepared. Three wiring patterns A1, B1, C1 are printed on the upper surface of one end side of the printed wiring board 4, and a ground pattern is formed on the entire back surface. Further, a board connector 5 is mounted on the end portion of the printed wiring board 4, and this connector 5 is connected to the lead wiring patterns A1, B1, C1 and the ground pattern.
[0013]
The sheet-like sensor that forms the main part of the multi-size sensor, which will be described in detail below, is formed in an elongated strip shape, but its length is shorter than the printed wiring board 4 and the end on the side where the board connector 5 is mounted. Sheet sensors do not overlap.
[0014]
First, the lower sheet 6 is bonded to the upper surface of the printed wiring board 4. On the upper surface of the lower sheet 6, wiring patterns A2 and B2 are printed. The end of the lower sheet 6 is dimensioned so as not to overlap the lead-out wiring patterns A1, B1, C1 of the printed wiring board 4.
[0015]
Further, a tape resist 7 is bonded on the lower sheet 6. The tape resist 7 is shorter than the lower sheet 6, and the tape resist 7 does not overlap the end portions of the wiring patterns A 2 and B 2 on the upper surface of the lower sheet 6.
[0016]
Then, the upper sheet 8 is bonded onto the tape resist 7. A wiring pattern C3 for sensors and wiring patterns A3 and B3 for relay connection are printed on the lower surface of the upper sheet 8. The upper sheet 8 is longer than the lower sheet 6 and is positioned and bonded so that the end portions of the wiring patterns A3, B3, C3 on the lower surface of the upper sheet 8 are drawn wiring patterns on the upper surface of the printed wiring board 4. Patterns are formed so as to overlap the end portions of A1, B1, and C1, respectively, and the other end sides of the wiring patterns A3 and B3 overlap the end portions of the wiring patterns A2 and B2 on the upper surface of the lower sheet 6.
[0017]
Then, the overlapping wiring patterns are firmly connected and made conductive via the conductive adhesive film 11 as a conductive connecting member (the adjacent non-overlapping wiring patterns are not connected via the conductive adhesive film 11). Continuity) . In this embodiment, the protective film 9 is adhered on the upper sheet 8, but the protective film 9 may not be provided depending on the material of the upper sheet 8. Furthermore, in this embodiment, the ground pattern is provided on the back surface of the printed wiring board 4, but the present invention is not limited to this. For example, the ground pattern may be provided on the upper surface of the upper sheet 8.
[0018]
With the above configuration, the multi-size sensor in which the tape resist 7 is sandwiched between the two wiring patterns A2 and B2 on the upper surface of the lower sheet 6 and the wiring pattern C3 on the lower surface of the upper sheet 8 is a printed wiring board 4 having high rigidity. It will be implemented on top of. That is, in this embodiment, it is composed of a film material on which another wiring pattern independent of the printed wiring board 4 is formed.
[0019]
In addition, the board connector 5 mounted on the end of the printed wiring board 4 is connected to the wiring patterns A2, B2, and C3. Therefore, in order to connect the multi-size sensor to an external application circuit, it is only necessary to connect a required wiring or a printed wiring board to the board connector 5.
[0020]
In the above description of the embodiment, a predetermined sheet or the like is sequentially laminated on the substrate. However, this is for convenience of explanation and does not indicate the order of actual manufacturing steps.
[0021]
FIG. 5 shows a second embodiment of the present invention. This eliminates the lower sheet 6 in the first embodiment of FIG. 4 and directly forms the wiring patterns A2 and B2 formed on the upper surface of the lower sheet 6 on the printed wiring board 4. Thereby, since the wiring patterns A2 and B2 constituting the sensor and the lead wiring patterns A1 and B1 are formed on the same substrate surface, the corresponding patterns (A2 and A1, B2 and B1) are directly connected to each other. Can do. That is, each pattern may be formed simultaneously when forming the pattern on the substrate.
[0022]
Further, a tape resist 7 is bonded onto the wiring patterns A2 and B2 in the printed wiring board 4, and an upper sheet 8 is bonded thereon. The upper sheet 8 does not need the wiring patterns A3 and B3 for relay connection as in the embodiment of FIG. Further, the conductive connection film 11 is also unnecessary. Since other configurations and operational effects are the same as those of the above-described embodiment, detailed description thereof is omitted. Of course, the present embodiment can be modified as described in the first embodiment.
[0023]
【The invention's effect】
As described in detail above, in the sensor employing the mounting structure of the present invention, it is connected to an external application circuit via a general board connector mounted on the end of the printed wiring board serving as the board. Therefore, high contact reliability can be ensured even after repeated attachment and detachment, and since it can be handled as an integrated connector, maintenance is easy. Furthermore, since the external connection can be made very simply, the wiring cost is low.
[Brief description of the drawings]
FIG. 1A is a plan view of a multi-size sensor having a conventional mounting structure, and FIG.
FIG. 2 is a diagram showing a connection example of a conventional sensor.
FIG. 3 is a diagram showing another connection example of the conventional sensor.
FIG. 4 is an exploded perspective view of a main part of the first embodiment of the present invention.
FIG. 5 is an exploded perspective view of main parts of a second embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 FPC connector 2 General connector 3 Lead wire 4 Printed wiring board 5 Board connector 6 Lower sheet 7 Tape resist 8 Upper sheet 9 Protective film 11 Conductive adhesive film (conductive adhesive member)

Claims (3)

Using a rigid and long printed wiring board as a substrate,
A short and long sheet-like sensor is provided on the substrate,
A printed wiring board printed on one end side of the printed wiring board is connected to the wiring pattern of the sheet-like sensor, and a printed circuit board is connected to the printed wiring board on one end of the printed wiring board. Equipped with
The connection between the lead-out wiring pattern and the wiring pattern is made by connecting the patterns to be connected to face each other, or by making the wiring patterns for relay connection facing each other, and through the wiring pattern for relay connection. To connect,
A mounting structure for a sensor, wherein the board connector is for connection to an external circuit . The sheet-like sensor is composed of a film material on which the wiring pattern different from the printed wiring board is formed,
The sensor mounting structure according to claim 1, wherein the sensor is bonded onto the printed wiring board, and the wiring pattern and the lead-out wiring pattern are connected via a conductive connection member. . A part of the wiring pattern of the sheet-like sensor is directly printed on the printed wiring board,
The sensor mounting structure according to claim 1, wherein the wiring pattern and the lead-out wiring pattern are directly connected on the printed wiring board.

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