JP2002039874A - Pressure-sensitive sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pressure sensitive sensor capable of facilitating assembling by simple constitution, and reducing an assembling cost and a component cost. SOLUTION: This pressure-sensitive sensor 10 is constituted to include an electrode part 12 comprising electrodes 12a, 12b formed on a surface of a substrate 11 for constituting various kinds of electric equipments, and a sensor part 13 bonded layeredly onto the electrode part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure-sensitive sensor used in, for example, a keyboard or a controller of a game machine.

[0002]

2. Description of the Related Art Conventionally, such a pressure-sensitive sensor is configured as shown in FIG. In FIG. 2, the pressure-sensitive sensor 1 is configured by, for example, arranging an electrode portion 3 and a sensor portion 4 on a printed circuit board 2 provided in a keyboard, and further laying a protective cover 5 thereon. Have been.

The electrode section 3 is formed by forming an electrode on a film sheet using a conductive pattern such as a silver paste, for example, and has a pair of comb-shaped electrodes 3a and 3b in the illustrated case. The sensor section 4 is formed by applying a carbon resistor or the like on a sheet of, for example, polyethylene to form an electrode 4a.
“a” is formed so as to face the entirety of the electrodes 3 a and 3 b of the electrode section 3.

According to the pressure sensor 1 having such a configuration,
At the time of assembly, the electrode portion 3 is first adhered to a predetermined position on the surface of the printed circuit board 2 and the sensor portion 4 and the protective cover 5 are sequentially adhered to the surface of the electrode portion 3. , Assembled, and further the electrodes 3a, 3b of the electrode section 3
Are electrically connected to the connection lands on the printed circuit board 2 by reflow soldering or the like, so that the connection lands are mounted on the printed circuit board 2.

[0005]

However, in the pressure-sensitive sensor 1 having such a configuration, the cost is increased because each of the electrodes 3a and 3b of the electrode section 3 is formed of a metal conductive pattern. Would. In assembling, it is necessary to sequentially attach the electrode portion 3 and the sensor portion 4 to a predetermined position on the surface of the printed circuit board 2 and to attach the electrodes 3 a and 3 b of the electrode portion 3 to the printed circuit board 2. It is necessary to electrically connect to the connection land. Therefore,
The assembling work becomes complicated, and the assembling cost increases.

SUMMARY OF THE INVENTION In view of the above, it is an object of the present invention to provide a pressure-sensitive sensor which can be easily assembled with a simple structure and can reduce assembly costs and parts costs.

[0007]

According to the present invention, there is provided an electrode part (12) comprising electrodes (12a) and (12b) formed on a surface of a substrate (11) constituting various electric appliances. And a sensor unit (13) attached to the electrode unit (12) so as to be overlaid on the electrode unit (12).

The pressure sensor (10) according to the present invention is preferably such that the electrodes (12a), (12) of the electrode section (12) are provided.
b) is formed by carbon printing on the surface of the printed circuit board (11).

According to the above construction, the electrodes (12a) and (12b) constituting the electrode section (12) are formed directly on the surface of the substrate (11) constituting various electric devices, so that assembly is not required. In this case, the electrode portion (12) composed of the electrodes (12a) and (12b) formed on the surface of the substrate (11)
By pasting the sensor unit (13), the pressure-sensitive sensor (10) can be assembled. Therefore, it is not necessary to attach the electrode portion (12) to a predetermined position on the surface of the substrate as in the prior art.
a) and (12b) are formed integrally with a conductive pattern to form another circuit formed on the substrate surface,
There is no need to electrically connect the electrodes (12a) and (12b) to the connection lands on the substrate. As a result, the number of parts is reduced, so that parts costs and assembly costs are reduced,
Assembly is facilitated.

The electrodes (12a) of the electrode section (12),
When (12b) is formed by carbon printing on the surface of the printed circuit board (11), the cost can be further reduced by not using a metal conductive pattern. In addition, the code in the parenthesis is
It is provided for easy understanding, is merely an example, and is not limited to these.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings. FIG. 1 shows the configuration of an embodiment of the pressure-sensitive sensor according to the present invention.

In FIG. 1, a pressure-sensitive sensor 10 is formed integrally with a substrate 11 constituting, for example, a controller of a game machine, and comprises electrodes 12a and 12b formed on the surface of the substrate 11. It comprises an electrode section 12, a sensor section 13 disposed on the electrode section 12, and a protective cover 14 disposed thereon.

The electrode section 12 is formed by forming an electrode directly on a predetermined position on the surface of the printed circuit board 11 by carbon printing. In the illustrated case, the electrode section 12 has a pair of comb-shaped electrodes 12a and 12b. are doing.

The sensor section 13 is formed by, for example, applying a carbon resistor on a polyethylene sheet to form an electrode 13a. The electrode 13a is opposed to the entire electrodes 12a and 12b of the electrode section 12. Is formed. Further, the sensor unit 13 is provided with the electrode unit 12.
Is attached to the surface with an adhesive or the like.

The protective cover 14 is attached to the surface of the sensor section 13 with an adhesive or the like.

The pressure-sensitive sensor 10 according to the embodiment of the present invention comprises:
With the above configuration, at the time of assembly, the sensor unit 13 is first attached to the surface of the electrode unit 12 provided at a predetermined position on the surface of the substrate 11 with an adhesive or the like. By attaching the protective cover 14 from above,
Assembled.

In this case, each electrode 12a, 1
2b is formed on the surface of the substrate 11 by carbon printing together with a conductive pattern to form another circuit.
It can be formed at low cost. Therefore, the number of parts is reduced, and a metal conductive pattern is not required, so that parts costs and assembly costs can be reduced. If connection patterns for connecting the electrodes 12a and 12b to other conductive patterns are formed at the same time, the electrodes 12a and 12b are connected to the other conductive patterns on the substrate 11 by, for example, reflow soldering. There is no need to electrically connect them. Therefore, assembling workability is improved, production efficiency is improved, and occurrence of disconnection failure can be eliminated, thereby improving product reliability.

In the above embodiment, the pressure sensor 10
Has been described as being incorporated in the board 11 of the controller of the game machine. However, the present invention is not limited to this, and the present invention can be applied to various devices including a pressure-sensitive sensor having such a configuration, such as a keyboard. it is obvious.
Further, in the above embodiment, the pressure sensor 10
It is covered by the protective cover 14, but is not limited to this.
The protection cover 14 may be omitted.

[0019]

As described above, according to the present invention, the electrodes constituting the electrode portion are formed directly on the surface of the substrate constituting various electric devices. For the electrode part consisting of the electrode formed on the surface of the substrate,
By attaching the sensor unit, the pressure-sensitive sensor can be assembled. Therefore, unlike the conventional case, it is not necessary to attach the electrode portion to a predetermined position on the substrate surface, so that the assembly is easy and the electrode is formed integrally with a conductive pattern to form another circuit formed on the substrate surface. This eliminates the need to electrically connect the electrodes to the connection lands on the substrate. As a result, the number of components is reduced, so that component costs and assembly costs are reduced, and assembly is facilitated.

When the electrodes of the electrode section are formed by printing carbon on the surface of a printed circuit board, the cost can be further reduced by not using a metal conductive pattern.

Thus, according to the present invention, it is possible to provide an extremely excellent pressure-sensitive sensor that can be easily assembled with a simple configuration and that can reduce assembly costs and parts costs.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of a pressure-sensitive sensor according to the present invention.

FIG. 2 is an exploded perspective view showing a configuration of an example of a conventional pressure-sensitive sensor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Pressure sensitive sensor 11 Substrate 12 Electrode part 12a, 12b Electrode 13 Sensor part 13a Electrode 14 Protective cover

Claims (2)

[Claims] 1. An electronic device comprising: an electrode portion formed of an electrode formed on a surface of a substrate constituting various electric devices; and a sensor portion superposed and adhered on the electrode portion. , Pressure sensor. 2. The pressure-sensitive sensor according to claim 1, wherein the electrodes of the electrode section are formed by carbon printing on the surface of a printed circuit board.