JP2010050375A - Printed circuit board, electronic equipment, and method of manufacturing printed circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed circuit board capable of bending and fixing the board in which non-component mounting surfaces face each other after mounting a component on a flexible board. <P>SOLUTION: The printed circuit board is composed of: a first board part 1 and a second board part 2, each made up of a component mounting surface having a land 10 for mounting the component and a non-component mounting surface not having the land 10; and a third board part 3 having a wiring pattern for electrically connecting the first board part 1 and the second board part 2. The third board part 3 can be bent so that the non-component mounting surface of the first board part 1 and the non-component mounting surface of the second board part 2 are fixed to face each other. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a printed circuit board in which the flexible substrate is folded and fixed so that non-component mounting surfaces face each other after mounting components on the flexible substrate.

  Specifically, a first board part having a component mounting land part, a second board part having a component mounting land part, the first board part, and both board parts of the second board part are electrically connected. In a flexible substrate including a third substrate portion having a wiring pattern to be connected to the first substrate portion, after mounting a component on the flexible substrate, the first substrate portion and the non-component mounting surface of the second substrate portion face each other. As described above, the present invention relates to a printed circuit board in which a third substrate portion is bent and fixed.

In the layout of the product board on the imposition board, the component mounting positions are arranged so as to be plane-symmetric, and the front surface side and the rear surface side of the imposition board are alternately positioned and arranged, and the component mounting process is performed. A fluid component mounting method is known (see, for example, Patent Document 1).
Japanese Unexamined Patent Publication No. 09-223856 (2nd page, FIG. 3)

  In a conventional component mounting process, a series of processes such as solder printing, component mounting, and reflow are continuously performed.

  Further, in the case of double-sided mounting, the series of component mounting steps must be performed on each side of the 1st surface and the 2nd surface.

  Therefore, before the component mounting process, it is necessary to set the components to be mounted, the mask for solder printing, the program of the mounting apparatus, etc. according to each mounting surface.

  On the other hand, in order to solve the problems as described above, there has been proposed a method of mounting components in a state where the front surface and the back surface of the imposition substrate are alternately positioned and arranged.

  According to the above method, the solder printing mask required for the solder printing process and the component mounting program are one type.

  However, since a series of component mounting processes are performed in a state where a plurality of independent boards are arranged, there is a problem that it is difficult to accurately position the board.

  Therefore, the present invention proposes a method for realizing a component mounting process with high productivity without reducing component mounting accuracy.

  In order to solve the above problems, the present invention proposes the following means.

The printed circuit board according to the present invention includes a first board part and a second board part configured from a component mounting surface having a land part for component mounting, a non-component mounting surface not having the land part, and the first board part. And a printed circuit board comprising a third substrate portion having a wiring pattern for electrically connecting the second substrate portion,
The third substrate portion is bent, and the non-component mounting surface of the first substrate portion and the non-component mounting surface of the second substrate portion are fixed relative to each other.

  In the printed circuit board described above, it is more preferable to provide an input / output terminal part for connecting an external board on either or both of the first board part and the second board part.

  In the printed circuit board, it is more preferable to have a reinforcing plate on the non-terminal surface of the input / output terminal portion.

  In the printed circuit board, it is more preferable that the non-component mounting surfaces of the first board portion and the second board portion are bonded and fixed to each other.

  In the printed circuit board described above, it is more preferable that inner surfaces of the bent substrate of the third substrate portion are bonded and fixed.

  In the printed circuit board, it is more preferable that the input / output terminal portion is constituted by a wiring pattern of a third substrate portion.

  In the printed circuit board, a non-terminal surface of the input / output terminal portion provided on the first substrate portion and a non-terminal surface of the input / output terminal portion provided on the second substrate portion are interposed via a reinforcing plate. More preferably, they are fixed relative to each other.

  In the above printed board, it is more preferable to use a non-conductive adhesive for bending and fixing the third board portion.

  In the printed board, it is more preferable to use a double-sided adhesive tape for bending and fixing the third substrate portion.

  Moreover, in an electronic device, it is more preferable to mount on said printed circuit board.

  In the method for manufacturing a printed circuit board according to the present invention, a first board part and a second board part constituted by a component mounting surface having a land part for component mounting and a non-component mounting surface not having the land part, A printed circuit board mounting method comprising a third substrate portion having a wiring pattern for electrically connecting the first substrate portion and the second substrate portion, wherein the component mounting surface of the first substrate portion and the third substrate portion After mounting a component on the component mounting surface of the second substrate portion, the third substrate portion is bent so that the non-component mounting surface of the first substrate portion and the non-component mounting surface of the second substrate portion are relative to each other. And fixing it.

  The printed circuit board according to the present invention includes a first substrate portion and a second substrate portion, each of which includes a component mounting surface having a land portion for component mounting, a non-component mounting surface having no land portion, and the first substrate. Printed circuit board comprising a third substrate portion having a wiring pattern for electrically connecting a portion and the second substrate portion, wherein the third substrate portion is bent and the non-component mounting of the first substrate portion The surface and the non-component mounting surface of the second substrate portion are fixed relative to each other.

  Specifically, after a series of processes such as solder printing, component mounting, and reflow are performed on the first substrate portion and the second substrate portion, the first substrate portion and the second substrate portion are provided. Using the guide portion such as a guide hole as a reference, the third substrate portion is bent and bonded and fixed so that the first substrate portion and the non-component mounting surface of the second substrate portion face each other. With such a structure, the component mounting process on the substrate is the same as the single-sided substrate, and the substrate can be a component-mounted substrate similar to the double-sided substrate.

  Moreover, since the first substrate portion and the second substrate portion are provided with guide portions such as guide holes, it is easy to bend the third substrate portion, and at the same time, the first substrate and the second substrate portion. Since the substrate is fixed at the opposed position, the size of the substrate can be reduced.

  According to the printed circuit board of the present invention, after completion of a series of component mounting processes such as solder printing, component mounting, and reflow, the first substrate unit and the non-component mounting surface of the second substrate unit are opposed to each other. Since the three substrate portions can be bent and fixed, a thin and small double-sided printed board having high flexibility can be obtained.

  In addition, by simplifying the setting of component mounting equipment such as printing solder masks and component mounting programs, the mounting process time was reduced and a highly productive double-sided mounting board was easily realized.

  In addition, by attaching a reinforcing plate to the substrate, it has become possible to cope with substrate strength and substrate thickness adapted to product applications.

  Moreover, since the flexible substrate is used, it is easy to provide the input / output terminal portion.

  Further, if the third substrate portion is set as an input / output terminal portion and bent near the center thereof, a printed circuit board having an input / output terminal portion for connection of upper and lower contacts is obtained.

  The printed circuit board of the present invention includes a first substrate portion and a third substrate portion electrically connected to the second substrate portion. The first board part and the second board part have lands for mounting electronic components on one side, and nothing is mounted on the opposite side. A 3rd board | substrate part means the place which has the wiring of the part which connects a 1st board | substrate part and a 2nd board | substrate part. The first substrate portion, the second substrate portion, and the third substrate portion are made of a freely deformable material and are integrally configured.

  In the printed circuit board of the present invention, components are mounted on the land portion of the first substrate portion and the land portion of the second substrate portion, and the non-component mounting surface of the first substrate portion and the second substrate portion is further provided. The third substrate portion is bent and fixed so as to face each other. With this structure, it is possible to complete solder printing, component mounting, reflow, and the like, which are component mounting processes on the first substrate portion and the second substrate portion, and realize high productivity.

  In addition, by providing a guide portion such as a guide hole in the first substrate portion and the second substrate portion, the third substrate portion after the component mounting process can be easily folded accurately, and at the same time, the substrate Realized downsizing.

  In addition, by arranging a reinforcing plate on the printed circuit board, the board strength suitable for the product and the degree of freedom in designing the board thickness were increased.

  Furthermore, by providing an input / output terminal portion for connection to an external board, it is possible to reduce the thickness of the board without connectors and to increase the degree of freedom in designing the external board connected to the printed board of the present invention.

  In particular, if the third board part is provided with an input / output terminal part for connection to an external board, and the central plate is bent at the same time, and a reinforcing plate is arranged on the inner surface of the bent part, it becomes an input / output terminal part for upper and lower contacts, The degree of freedom in design can be expanded.

Hereinafter, embodiments of the printed circuit board of the present invention will be described with reference to the drawings.
Example 1
The printed circuit board according to this embodiment will be described with reference to FIGS. As shown in the figure, the printed circuit board of the present invention includes a component mounting land portion 10, a guide hole portion 8, a first substrate portion 1 having an input / output terminal portion 5, a component mounting land portion 20 and a guide hole portion 18. The second substrate portion 2 having the first substrate portion 1 and the third substrate portion 3 having the wiring pattern 4 for electrically connecting the second substrate portion 2 are constituted by an integrated flexible substrate. Yes.

  Further, a reinforcing plate 7 having rigidity higher than that of the flexible substrate is disposed on the non-terminal surface side of the input / output terminal portion 5. Thereby, the strength of the input / output terminal portion 5 is increased, and the input / output terminal portion 5 can be connected to a connector. In this state, after mounting the component 6 on the land portion 10 of the first substrate portion 1 and the component 16 on the land portion 20 of the second substrate portion 2 in the same process, the guide provided on the first substrate portion 1 is provided. The third substrate portion 3 was bent so that the non-component mounting surface faced the hole 8 and the guide hole 18 provided in the second substrate portion 2 as a reference, and the third substrate portion 3 was bonded and fixed on the bonding surface 9. With such a printed circuit board, it is possible to complete solder printing, component mounting, reflow, and the like, which are component mounting processes on the first substrate unit 1 and the second substrate unit 2, at once. Productivity can be easily realized.

  Further, by providing the first board part 1 and the second board part 2 with the guide hole 8 and the guide hole 18, respectively, the third board part 3 can be accurately bent after the component mounting process is completed. . As a result, it is possible to easily reduce the size of the substrate plane, which is a problem with a single-sided component mounting substrate.

Furthermore, by providing the input / output terminal portion 5 on the first substrate portion 1, it is possible to reduce the thickness of the substrate without connector and to connect to an external substrate.
(Example 2)
The printed circuit board according to the present embodiment will be described with reference to FIGS. As shown in the figure, the printed circuit board of the present invention includes a component mounting land portion 10, a guide hole portion 8, a first substrate portion 1 having an input / output terminal portion 5, a component mounting land portion 20 and a guide hole portion 18. The second substrate portion 2 having the output terminal portion 15, the first substrate portion 1, and the third substrate portion 3 having the wiring pattern 4 that electrically connects the second substrate portion 2 are integrated and flexible. Consists of a substrate.

  Further, the input / output terminal portion 5 and the input / output terminal portion 15 are shaped and arranged so as to face each other when bent by the third substrate portion 3. The reinforcing plate 7 is attached and fixed to the adhesive surface 19 of the input / output terminal portion 5. In this state, after mounting the component 6 on the land portion 10 of the first substrate portion 1 and the component 16 on the land portion 20 of the second substrate portion 2 in the same process, the guide provided on the first substrate portion 1 is provided. The third substrate portion 3 was bent so that the non-component mounting surface faced the hole 8 and the guide hole 18 provided in the second substrate portion 2 as a reference, and was bonded and fixed at the bonding surface 9 and the bonding surface 29. With such a printed circuit board, it is possible to complete solder printing, component mounting, reflow, and the like, which are component mounting processes on the first substrate unit 1 and the second substrate unit 2, at once. Productivity can be easily realized.

  Further, by providing the first board part 1 and the second board part 2 with the guide hole 8 and the guide hole 18, respectively, the third board part 3 can be accurately bent after the component mounting process is completed. . As a result, it is possible to easily reduce the size of the substrate plane, which is a problem with a single-sided component mounting substrate.

In addition, the input / output terminal portion 5 and the input / output terminal portion 15 are terminals for double-sided connection with an external board, so that the degree of freedom of design of the external board is expanded and the connector mounted on the external board It was possible to connect.
(Example 3)
The printed circuit board according to this embodiment will be described with reference to FIGS. As shown in the figure, the printed circuit board of the present invention includes a component mounting land portion 10, a guide hole portion 8, a first substrate portion 1 having an input / output terminal portion 5, a component mounting land portion 20 and a guide hole portion 18. The second substrate portion 2 having the output terminal portion 15, the first substrate portion 1, and the third substrate portion 3 having the wiring pattern 4 electrically connected to the second substrate portion 2 are integrated with a flexible substrate. Configured.

  The input / output terminal portion 5 and the input / output terminal portion 15 are arranged so as not to overlap when the third substrate portion 3 is bent, and the input / output terminal portion 5 has an adhesive surface 19 and the input / output terminal portion 15. The reinforcing plate 7 and the reinforcing plate 17 were pasted and fixed to the adhesive surface 29 of the output terminal portion 15, respectively. With such a printed circuit board configuration, after mounting the component 6 on the land portion 10 of the first substrate portion 1 and the component 16 on the land portion 20 of the second substrate portion 2 in the same process, the first substrate portion 1 The third substrate portion 3 was bent so that the non-component mounting surface was opposed to the guide hole 8 provided in the second substrate portion 2 and the guide hole 18 provided in the second substrate portion 2 as a reference, and the third substrate portion 3 was bonded and fixed on the bonding surface 9. With such a printed circuit board, it is possible to complete solder printing, component mounting, reflow, and the like, which are component mounting processes on the first substrate unit 1 and the second substrate unit 2, at once. Productivity can be easily realized.

  Further, by providing the first board part 1 and the second board part 2 with the guide hole 8 and the guide hole 18, respectively, the third board part 3 can be accurately bent after the component mounting process is completed. . As a result, it is possible to easily reduce the size of the substrate plane, which is a problem with a single-sided component mounting substrate.

Further, since the input / output terminal portion 5 and the input / output terminal portion 15 are arranged independently, only one of the input / output terminal portions is used, or two necessary input / output terminals are provided. It is also possible to sort out the parts, and the design flexibility of the external board has been expanded.
Example 4
The printed circuit board according to this embodiment will be described with reference to FIGS. As shown in the drawing, the printed circuit board of the present invention includes a first board part 1 having a component mounting land part 10 and a guide hole part 8, a second board part 2 having a component mounting land part 20 and a guide hole part 18. The first substrate unit 1 and the second substrate unit 2 are electrically connected to the third substrate unit 3 having the wiring pattern 4 to form an integrated flexible substrate.

  The third substrate portion 3 is provided with an input / output terminal portion 25, and the reinforcing plate 7 is attached and fixed to the third substrate portion 3 through an adhesive surface 19. With such a printed circuit board configuration, after mounting the component 6 on the land portion 10 of the first substrate portion 1 and the component 16 on the land portion 20 of the second substrate portion 2 in the same process, the first substrate portion 1 The third board portion 3 is bent so that the non-component mounting surface faces the guide hole 8 provided in the second substrate portion 2 and the guide hole 18 provided in the second substrate portion 2 as a reference, and the bonding surface 9 and the bonding surface 29 are bonded. Fixed.

  With such a printed circuit board, it is possible to complete solder printing, component mounting, reflow, and the like, which are component mounting processes on the first substrate unit 1 and the second substrate unit 2, at once. Productivity can be easily realized.

  Further, by providing the first board part 1 and the second board part 2 with the guide hole 8 and the guide hole 18, respectively, the third board part 3 can be accurately bent after the component mounting process is completed. . As a result, it is possible to easily reduce the size of the substrate plane, which is a problem with a single-sided component mounting substrate.

In addition, since the input / output terminal portion 25 is a terminal for double-sided connection with an external board, the degree of freedom in designing the external board can be expanded and at the same time, it can be connected to a connector mounted on the external board.
(Example 5)
A printed circuit board according to this embodiment will be described with reference to FIGS. As shown in the figure, the printed circuit board of the present invention includes a first board portion 1 having a component mounting land portion 10 and a guide hole portion 8, a component mounting land portion 20, a guide hole portion 18, and an input / output terminal portion 15. A wiring pattern 4 for electrically connecting the second substrate portion 2, the first substrate portion 1, and the second substrate portion 2, and a third substrate portion 3 having an input / output terminal portion 25 are integrated. It was composed of a flexible substrate. Here, in the present embodiment, two third substrate portions are provided independently, but the present embodiment can be configured even if the number of third substrate portions is three or more.

  Further, the reinforcing plate 7 is attached and fixed to the input / output terminal portion 15 of the second substrate portion 2 through an adhesive surface 29.

  In addition, the input / output terminal portion 25 is provided in a part of the third substrate portion 3, and the reinforcing plate 7 is disposed when the third substrate portion 3 is bent. The reinforcing plate 17 was attached via the adhesive surface 29. In such a printed circuit board configuration, after mounting the component 6 on the land portion 10 of the first substrate portion 1 and the component 16 on the land portion 20 of the second substrate portion 2 in the same process, the first substrate portion The third substrate portion 3 is bent so that the non-component mounting surface faces the guide hole 8 provided in 1 and the guide hole 18 provided in the second substrate portion 2 as a reference. Bonded and fixed. With such a printed circuit board, it is possible to complete solder printing, component mounting, reflow, and the like, which are component mounting processes on the first substrate unit 1 and the second substrate unit 2, at once. Productivity can be easily realized.

  Further, by providing the first board part 1 and the second board part 2 with the guide hole 8 and the guide hole 18, respectively, the third board part 3 can be accurately bent after the component mounting process is completed. . As a result, it is possible to easily reduce the size of the substrate plane, which is a problem with a single-sided component mounting substrate.

Further, since the input / output terminal portion 15 and the input / output terminal portion 25 are arranged independently, only one of the input / output terminal portions is used, or two necessary input / output terminals are provided. In particular, the input / output terminal portion 25 is an input / output terminal for the upper and lower contacts, so that the degree of freedom in designing the external substrate can be greatly increased.
(Example 6)
In Example 6, a printed board in which the reinforcing plate 7 is arranged on the non-component mounting surface of the first board part 1 and the second board part 2 is used. Since other configurations are the same as those of the fourth embodiment, description thereof is omitted.

  A printed circuit board according to the present embodiment will be described with reference to FIG. As shown in the drawing, the printed circuit board of the present invention is formed of a flexible substrate, and the third substrate portion 3 is provided with an input / output terminal portion 25, and when the third substrate portion 3 is bent, The reinforcing plate 7 is affixed to the bonding surface 19 of the first substrate portion 1 and the third substrate portion 3 so that the reinforcing plate 7 is disposed on the inner surface of the non-terminal portion. After mounting the components in such a printed circuit board configuration, the third substrate portion 3 is bent so that the non-component mounting surface and the non-terminal surface face each other, and the second substrate portion 2 and the third substrate portion 3 are bonded at the bonding surface 29. Then, the reinforcing plate 7 was bonded and fixed. With such a printed circuit board, solder printing, component mounting, reflow, etc., which are component mounting processes, can be completed at once, and high productivity can be easily realized.

  Further, by providing the first board part 1 and the second board part 2 with the guide hole 8 and the guide hole 18, respectively, the third board part 3 can be accurately bent after the component mounting process is completed. . As a result, it is possible to easily reduce the size of the substrate plane, which is a problem with a single-sided component mounting substrate.

  Further, since the input / output terminal portion 25 is an input / output terminal for connecting the upper and lower contacts to the external board, the design freedom of the external board can be greatly increased.

  In addition, since the reinforcing plate 7 is disposed in almost the entire area of the inner surface of the substrate, the flexibility of the flexible substrate and the strength of the entire substrate can be greatly improved.

In Example 6, the first board part 1, the reinforcing plate 7 attached to the non-component mounting surface of the second board part 2, and the non-terminal surface of the input / output terminal part 25 were attached. Although the reinforcing plate 7 is an integrated reinforcing plate, the reinforcing plate 7 is divided into two bodies, and the thickness and strength of each reinforcing plate can be changed (Example 7).
In Example 7, a printed board in which the reinforcing plate 7 is arranged on the non-component mounting surface of the first board part 1 and the second board part 2 was used. Since other configurations are the same as those of the fifth embodiment, the description thereof is omitted.

  A printed circuit board according to this embodiment will be described with reference to FIG. As shown in the figure, the printed circuit board of the present invention is composed of a flexible substrate, and the second substrate portion 2 and the third substrate portion 3 are provided with an input / output terminal portion 15 and an input / output terminal portion 25, respectively. Further, when the third substrate portion 3 is bent, the second substrate portion 2 and the third substrate portion are reinforced so that the reinforcing plate 7 is disposed on the non-component mounting inner surface and the non-terminal portion inner surface. The plate 7 was pasted through the adhesive surface 29. With such a configuration of the printed circuit board, the first substrate unit 1 is folded so that the first substrate unit 1 and the non-component mounting surface of the second substrate unit 2 face each other after mounting the components, 2 and the third substrate portion 3 and the reinforcing plate 7 were bonded and fixed via the bonding surface 19. With such a printed circuit board, solder printing, component mounting, reflow, etc., which are component mounting processes, can be completed at once, and high productivity can be easily realized.

Further, by providing the first board part 1 and the second board part 2 with the guide hole 8 and the guide hole 18, respectively, the third board part 3 can be accurately bent after the component mounting process is completed. . This makes it possible to easily reduce the size of the board plane, which is a problem with a single-sided component mounting board. Also, the input / output terminal section 15 and the input / output terminal section 25 are arranged independently. Therefore, it is possible to use only one of the input / output terminal portions, or to distribute necessary terminals to the two input / output terminal portions. Since it is an output terminal, the design freedom of the external board can be greatly expanded.

  Further, since the reinforcing plate 7 is disposed in almost the entire area of the inner surface of the substrate, the overall strength of the substrate after the third substrate portion 3 is bent and bonded can be significantly improved by utilizing the flexibility of the flexible substrate. .

  In the seventh embodiment, the first substrate 1, the reinforcing plate 7 attached to the non-component mounting surface of the second substrate 2, and the non-terminals of the input / output terminal portion 15 and the input / output terminal portion 25. Although the reinforcing plates 7 attached to the surface are all integrated reinforcing plates, the reinforcing plates 7 can be divided into two or three bodies, and the thickness and strength of each reinforcing plate can be changed.

  The printed circuit board of the present invention can be widely used in mobile phones, personal computers, and other electronic devices.

  According to the printed circuit board of the present invention, after completion of a series of component mounting processes such as solder printing, component mounting, and reflow, the first substrate unit and the non-component mounting surface of the second substrate unit are opposed to each other. By bending and fixing the three substrate parts, a thin and compact double-sided printed board with high flexibility was obtained.

  In addition, by simplifying the setting of component mounting equipment such as printing solder masks and component mounting programs, the mounting process time was reduced and a highly productive double-sided mounting board was easily realized.

  In addition, by attaching a reinforcing plate to the substrate, the substrate structure can be adapted to the substrate strength and substrate thickness adapted to the product application.

  Further, since a flexible substrate is used, it is easy to provide an input / output terminal portion for connecting an external substrate.

  Further, if the third substrate portion is set as an input / output terminal portion and bent near the center thereof, a printed circuit board having an input / output terminal portion for connection of upper and lower contacts is obtained.

It is a plane development view showing typically the printed circuit board of Example 1 of the present invention. It is sectional drawing which shows typically the printed circuit board of Example 1 of this invention. It is a plane expanded view which shows typically the printed circuit board of Example 2 of this invention. It is sectional drawing which shows typically the printed circuit board of Example 2 of this invention. It is a plane development view showing a printed circuit board of Example 3 of the present invention typically. It is sectional drawing which shows typically the printed circuit board of Example 3 of this invention. It is a plane expanded view which shows typically the printed circuit board of Example 4 of this invention. It is sectional drawing which shows typically the printed circuit board of Example 4 of this invention. It is a plane expanded view which shows typically the printed circuit board of Example 5 of this invention. It is sectional drawing which shows typically the printed circuit board of Example 5 of this invention. It is sectional drawing which shows typically the printed circuit board of Example 6 of this invention. It is sectional drawing which shows typically the printed circuit board of Example 7 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st board | substrate part 2 2nd board | substrate part 3 3rd board | substrate part 4 Wiring pattern part 5 Input / output terminal part 6 Parts 7 Reinforcement board 8 Guide hole 9 Adhesion surface 10 Land part

Claims (11)

A first board part and a second board part comprising a component mounting surface having a land part for component mounting, a non-component mounting surface not having the land part, the first board part, and the second board part; A printed circuit board comprising a third substrate part having a wiring pattern for electrically connecting
The printed circuit board, wherein the third substrate portion is bent, and the non-component mounting surface of the first substrate portion and the non-component mounting surface of the second substrate portion are fixed relative to each other.   The printed circuit board according to claim 1, wherein an input / output terminal portion for connecting an external substrate is provided on both or either of the first substrate portion and the second substrate portion.   The printed circuit board according to claim 2, further comprising a reinforcing plate on a non-terminal surface of the input / output terminal portion.   The printed circuit board according to claim 1, wherein the non-component mounting surfaces of the first board part and the second board part are bonded and fixed to each other.   5. The printed circuit board according to claim 1, wherein inner surfaces of the third substrate portion are bonded and fixed to each other.   The printed circuit board according to claim 2, wherein the input / output terminal portion is configured by a wiring pattern of the third substrate portion.   A non-terminal surface of the input / output terminal portion provided on the first substrate portion and a non-terminal surface of the input / output terminal portion provided on the second substrate portion are fixed relative to each other via the reinforcing plate. The printed circuit board according to claim 3, wherein the printed circuit board is provided.   The printed circuit board according to claim 1, wherein a non-conductive adhesive is used for bending and fixing the third substrate portion.     The printed circuit board according to any one of claims 1 to 7, wherein a double-sided adhesive tape is used for bending and fixing the third substrate part.   An electronic device comprising the printed circuit board according to claim 1. A first board part and a second board part, a first board part and a second board part, each comprising a component mounting surface having a land part for mounting a component and a non-component mounting surface not having the land part; A printed circuit board manufacturing method comprising a third substrate part having a wiring pattern for electrically connecting
After mounting components on the component mounting surface of the first substrate portion and the component mounting surface of the second substrate portion, the third substrate portion is bent, and the non-component mounting surface of the first substrate portion and the A printed circuit board manufacturing method, wherein the non-component mounting surface of the second board portion is fixed relative to each other.

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