JP2019145763A - Printed circuit board and electronic device including the same - Google Patents

Abstract

To provide a printed circuit board and an electronic device including the printed circuit board.SOLUTION: An electronic device of the invention includes: a first substrate 10 having a first connection area A1 provided with a first pad 14; a second substrate 20 which has a second connection area A2 facing the first connection area A1 and in which a second pad 24 is provided at the second connection area A2; and a printed circuit board 100 disposed between the first substrate 10 and the second substrate 20 and connecting the first pad 14 to the second pad 24. The printed circuit board 100 includes a hard substrate area and a soft substrate area. The hard substrate area is disposed between the first connection area A1 and the second connection area A2. The soft substrate area extends from the hard substrate area and is connected with the first pad 14 and the second pad 24.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a printed circuit board and an electronic device including the printed circuit board.

  Mobile devices tend to become thinner and smaller continuously, but on the other hand, battery capacity tends to increase continuously to increase usage time. Thereby, in order to maximize the space utilization, a multilayer structure in which the substrate and the electronic component are made very thin and stacked may be adopted.

  However, a conventional interposer substrate for connection between substrates having a multi-layer structure has a severe structural restriction, and there is a problem that there are many design restrictions such as a signal connection method.

Korean Published Patent No. 10-2017-0002599

  According to one aspect of the present invention, a first substrate having a first connection region provided with a first pad, a second connection region facing the first connection region, and a second pad in the second connection region. And a printed circuit board that is interposed between the first board and the second board and connects the first pad and the second pad, and the printed circuit board has a rigid board region. And the flexible substrate region, the rigid substrate region is disposed between the first connection region and the second connection region, and the flexible substrate region is extended from the rigid substrate region and connected to the first pad and the second pad. Electronic equipment is provided.

  According to another aspect of the present invention, a printed circuit board is interposed between a first board and a second board, and includes a hard board area and a soft board area, and the hard board area includes the first board and the second board. A printed circuit board is provided which is disposed between the second board and the flexible board area is extended from the hard board area and connected to the first board and the second board.

It is a figure which shows the electronic device which concerns on 1st Example of this invention. It is a figure which shows the printed circuit board of the electronic device which concerns on 1st Example of this invention. It is a figure which shows the printed circuit board of the electronic device which concerns on 1st Example of this invention. It is a figure which shows the printed circuit board of the electronic device which concerns on 1st Example of this invention. It is a figure which shows the printed circuit board which concerns on 2nd Example of this invention. It is a figure which shows the printed circuit board which concerns on 3rd Example of this invention. It is a figure which shows the printed circuit board which concerns on 4th Example of this invention. It is a figure which shows the printed circuit board which concerns on 5th Example of this invention.

  Embodiments of a printed circuit board and a method for manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings, and the same or corresponding components are denoted by the same reference numerals in the description with reference to the accompanying drawings. In addition, redundant explanation for this will be omitted.

  In addition, the first and second terms used in the following are merely identification symbols for distinguishing the same or corresponding components, and the same or corresponding components are limited by the first and second terms. It will never be done.

  In addition, the term “coupled” does not mean that the components are in direct physical contact with each other in the contact relationship between the components, but other configurations are interposed between the components, It is used as a concept that encompasses all cases where components are in contact with other components.

  FIG. 1 is a diagram showing an electronic apparatus according to a first embodiment of the present invention.

  Referring to FIG. 1, the electronic apparatus according to the first embodiment of the present invention includes a first substrate 10, a second substrate 20, and a printed circuit board 100.

  The first substrate 10 and the second substrate 20 in the electronic device are opposed to each other and can have a multilayer structure, and can be formed in a space between the first substrate 10 and the second substrate 20. The printed circuit board 100 may be disposed as a board that supports the multilayer structure and connects the two boards.

  Referring to FIG. 1, a first connection region A1 provided with a first pad 14 is formed on the first substrate 10, and a second connection region A2 provided with a second pad 24 on the second substrate 20. Can be formed. Here, the first connection region A1 and the second connection region A2 are arranged to face each other, and the printed circuit board 100 connects the first connection region A1 and the second connection region A2 that face each other.

  At this time, although not illustrated, the electronic device may include a case, and the first substrate 10, the second substrate 20, and the printed circuit board 100 may be disposed inside the case. For example, the electronic device may be a portable terminal, and the first substrate 10 and / or the second substrate 20 may be a main substrate on which electronic components such as a CPU, a memory, and a communication module are mounted. At this time, electronic components such as a CPU, a memory, and a communication module can be disposed in a space formed between the first substrate 10 and the second substrate 20 supported by the printed circuit board 100.

  2 to 4 are views showing a printed circuit board according to the first embodiment of the present invention. Referring to FIG. 3, the printed circuit board 100 includes a hard substrate region R and flexible substrate regions F1 and F2. The printed circuit board 100 of the present embodiment may have a rigid-flex printed circuit board (rigid flex PCB) structure.

  For example, a flexible substrate that can be bent by stacking a flexible insulating layer such as a polyimide film and an FCCL (Flexible Copper Clad Laminate) made of a copper foil is formed and selectively formed on the flexible substrate. Further, a hard insulating layer made of a material harder than the soft substrate can be formed by further forming a hard insulating layer (an insulating layer relatively harder than the soft insulating layer) such as a circuit pattern and epoxy. As a result, it is possible to form a rigid-flex printed circuit board in which only the remaining flexible substrate becomes the flexible substrate regions F1 and F2 that can be bent and the other becomes the rigid substrate region R. Here, “soft” and “hard” mean a difference in relative bending degree, and a material having a strength that can be bent according to the intention of the user is called a soft material, and the bending is possible. Those that are not are called hard materials.

  In the present embodiment, the rigid substrate region R is disposed between the first substrate 10 and the second substrate 20, and the flexible substrate regions F1 and F2 having a structure extending from the rigid substrate region R are connected to the first substrate 10. A structure for connecting to the second substrate 20 can be provided.

  1 and 3, the rigid substrate region R is disposed between the first connection region A1 of the first substrate 10 and the second connection region A2 of the second substrate 20, and the rigid substrate region R It can serve as a support member that supports the multilayer structure between the first substrate 10 and the second substrate 20. The flexible substrate regions F1 and F2 having a structure extended from the rigid substrate region R can form a signal path that electrically connects the first substrate 10 and the second substrate 20. The flexible substrate regions F1 and F2 can be connected to the first pad 14 in the first connection region A1 and the second pad 24 in the second connection region A2.

  3 and 4, the printed circuit board 100 can be bent, and a soft insulating layer having a first circuit pattern 112 connecting the first substrate 10 and the second substrate 20 formed on one surface. 110 and a hard insulating layer 120 partially formed on the other surface of the soft insulating layer 110. In the printed circuit board 100, the portion where the hard insulating layer 120 is formed becomes the hard substrate region R, the hard insulating layer 120 is not formed, and the remaining portions can become the soft substrate regions F1 and F2.

  Referring to FIG. 3, the hard substrate region R may be formed at the center, and the soft substrate regions F <b> 1 and F <b> 2 may be formed on both sides of the hard substrate region R. At this time, if the flexible substrate regions F1 and F2 are bent by about 90 ° so as to cover the side surfaces of the rigid substrate region R, both side surfaces of the rigid substrate region are covered with the flexible substrate regions F1 and F2, as shown in FIG. A structure can be formed.

  Referring to FIGS. 1 and 2, one of both side surfaces of the rigid substrate region R may be a first surface facing the first substrate 10, and the other one may be a second surface facing the second substrate 20. . The flexible substrate regions F1 and F2 are placed on the first surface and are connected to the first substrate 10, and the second flexible region F2 is placed on the second surface and is connected to the second substrate 20. And can be divided into That is, the rigid substrate region R can be arranged in a shape standing on both sides so as to face the first substrate 10 and the second substrate 20, respectively, and the flexible substrate regions F1 and F2 are bent to be a rigid substrate. The side surface of the region R is covered, and the first substrate 10 and the second substrate 20 can be electrically connected by the first circuit pattern 112 formed in the flexible substrate regions F1 and F2. At this time, the first circuit pattern 112 may include pads 114 connected to the first substrate 10 and the second substrate 20.

  At this time, the printed circuit board 100 may further include a support 130 in order to more firmly support the first substrate 10 and the second substrate 20 having a multilayer structure. The support 130 can be disposed between the first flexible region F1 and the second flexible region F2 that protrude from the rigid substrate region R. By forming the first flexible region F1 and the second flexible region F2 longer than the side surface of the rigid substrate region R, the first flexible region F1 and the second flexible region F2 project beyond the side surface of the rigid substrate region R. You can do that.

  Referring to FIGS. 3 and 4, the support 130 may include a first support part 132 coupled to the first soft region F1 and a second support part 134 coupled to the second soft region F2. When the first flexible region F1 and the second flexible region F2 cover the side surface of the rigid substrate region R, the first support part 132 and the second support part 134 are arranged to overlap each other, and the first substrate 10 and the second substrate are arranged. One support body 130 that supports the space between the two can be configured.

  At this time, the support 130 includes a metal material, and can also have an EMI (Electro Magnetic Interference) shielding function. For example, the support 130 may be made of a SUS material. Referring to FIG. 1, a support 130 made of SUS material is disposed toward the electronic element 126 of the first substrate 10 and / or the second substrate 20, and plays a role of blocking electromagnetic waves generated from the electronic components 12 and 22. Can do.

  On the other hand, a plurality of printed circuit boards 100 can be arranged in the space between the first board 10 and the second board 20. Referring to FIG. 1, at least one of the electronic component 12 of the first substrate 10 and the electronic component 22 of the second substrate 20 may be disposed between the plurality of printed circuit boards 100. That is, the plurality of printed circuit boards 100 serve as a plurality of pillars that support the space between the first board 10 and the second board 20, and electronic components are placed in the spaces between the plurality of printed circuit boards 100. 12, 22 can be arranged.

  At this time, it may further include an EMI shielding member 140 that covers the outside of the printed circuit board 100 exposed between the first substrate 10 and the second substrate 20. Referring to FIG. 1, a metallic EMI shielding member 140 may be attached to the soft insulating layer 110 that is the outer layer of the printed circuit board 100. At this time, the EMI shielding member 140 can be attached by adding the adhesive layer 142 to the soft insulating layer 110. Since the EMI shielding member 140 has a structure that covers the outside of the printed circuit board 100, not only the electromagnetic waves generated from the electronic components 12 and 22 of the first board 10 and / or the second board 20, but also the printed circuit board 100. Electromagnetic waves generated from the first circuit pattern 112 can also be blocked.

  FIG. 5 is a view showing a printed circuit board 101 according to the second embodiment of the present invention.

  In the present embodiment, the first pad 14 of the first substrate 10 and the second pad 24 of the second substrate 20 do not have to have a structure corresponding to the upper and lower sides. Accordingly, the first circuit pattern 112 ′ in the printed circuit board 101 of the present embodiment shown in FIG. 5 differs from that in FIG. 2 in that the pads in the first flexible region F 1 and the pads in the second flexible region F 2 are vertically moved. So that they are not matched one-to-one. For example, the first soft region pad and the second soft region pad can be arranged so as to be displaced from each other with respect to the vertical direction, and the first soft region pad and the second soft region pad The sequence structure itself may be different. At this time, the first circuit pattern 112 ′ may have a structure in which diagonal lines or a part of the first circuit pattern 112 ′ is bent in order to connect pads that are not matched vertically. Compared with the conventional interposer in which the signal connection is possible only in the straight line structure using the through via, the printed circuit board 101 of the present embodiment has the first substrate 10 and the second substrate by various signal connection structures. 20 can be connected. Thereby, in the 1st board | substrate 10 and the 2nd board | substrate 20, arrangement | positioning of the 1st pad 14 and the 2nd pad 24 can be decided freely.

  FIG. 6 is a view showing a printed circuit board 102 according to the third embodiment of the present invention.

  In this embodiment, the metal layer 115 can be laminated on the soft insulating layer 110 to form an EMI shielding structure. For example, the metal layer 115 can be formed on the other surface of the soft insulating layer 110 to form an EMI shielding structure.

  Referring to FIG. 6, a double-sided FCCL (Flexible Copper Clad Laminate) having metal layers formed on both sides can be used. One metal layer of the double-sided FCCL can be patterned to form the first circuit pattern 112, and the other metal layer 115 of the double-sided FCCL can be left as it is to form an EMI shielding structure.

  FIG. 7 is a view showing a printed circuit board 103 according to the fourth embodiment of the present invention.

  In this embodiment, the printed circuit board 103 can form a circuit layer on the hard insulating layer 120. Referring to FIG. 7, the second circuit pattern 122 having a multilayer structure can be formed on the hard insulating layer 120. At this time, a via 124 penetrating the soft insulating layer 110 can be further formed to connect the first circuit pattern 112 of the soft insulating layer 110 and the second circuit pattern 122 of the hard insulating layer 120.

  FIG. 8 is a view showing a printed circuit board 104 according to the fifth embodiment of the present invention.

  In this embodiment, the printed circuit board 104 can incorporate and / or mount the electronic element 126 in the hard insulating layer 120. Referring to FIG. 8, the electronic element 126 can be built in the hard insulating layer 120. At this time, a via 128 penetrating the soft insulating layer 110 can be further formed to connect the first circuit pattern 112 of the soft insulating layer 110 and the electronic element 126 of the hard insulating layer 120.

  On the other hand, the hard insulating layer 120 may be mounted on the outer layer without incorporating the electronic element 126. Accordingly, the electronic elements of the first substrate 10 and / or the second substrate 20 can be built in or mounted on the printed circuit board 100, and the area of the first substrate 10 and / or the second substrate 20 can be reduced.

  In the above, one embodiment of the present invention has been described. However, those who have ordinary knowledge in the technical field can add components without departing from the spirit of the present invention described in the claims. Various modifications and changes can be made to the present invention by alterations, deletions, additions, and the like, and these are also included in the scope of the present invention.

R hard substrate region F1, F2 flexible substrate region 10 first substrate 12, 22 electronic component 14 first pad 20 second substrate 24 second pad 100, 101, 102, 103, 104 printed circuit board 110 flexible insulating layers 112, 112 ′ First circuit pattern 120 Hard insulating layer 122 Second circuit pattern 124, 128 Via 126 Electronic element 130 Support 140 EMI shielding member

Claims (16)

A first substrate having a first connection region provided with a first pad;
A second substrate having a second connection region facing the first connection region, and a second pad provided in the second connection region;
A printed circuit board interposed between the first board and the second board and connecting the first pad and the second pad;
The printed circuit board comprises a hard substrate region and a flexible substrate region,
The rigid substrate region is disposed between the first connection region and the second connection region, and the flexible substrate region is extended from the rigid substrate region and connected to the first pad and the second pad. Electronic equipment. The rigid substrate region includes a first surface facing the first connection region and a second surface facing the second connection region;
The flexible substrate region is placed on the first surface and connected to the first pad, and the second flexible region is placed on the second surface and connected to the second pad. The electronic device according to claim 1, comprising: The first soft region and the second soft region are extended to protrude from the hard substrate region,
The electronic device according to claim 2, further comprising a support member disposed between the protruding first soft region and the second soft region. The support includes a first support unit coupled to the first flexible region and a second support unit coupled to the second flexible region;
The electronic device according to claim 3, wherein the first support portion and the second support portion are arranged to overlap each other. The printed circuit board is:
A soft insulating layer that can be bent and has a first circuit pattern formed on one side thereof to connect the first pad and the second pad;
The electronic device according to claim 1, further comprising: a hard insulating layer formed on the other surface of the soft insulating layer in the hard substrate region.   The electronic device according to claim 5, wherein a metal layer is formed on the other surface of the soft insulating layer. The printed circuit board is:
A second circuit pattern formed on the hard insulating layer;
The electronic device according to claim 5, further comprising a via that connects the first circuit pattern and the second circuit pattern and penetrates the flexible insulating layer. The printed circuit board is:
An electronic element embedded in or attached to the hard insulating layer;
The electronic device according to claim 5, further comprising a via that connects the first circuit pattern and the electronic element and penetrates the flexible insulating layer. The printed circuit board is plural,
9. The electronic apparatus according to claim 1, wherein at least one of the electronic component of the first substrate and the electronic component of the second substrate is disposed between the plurality of printed circuit boards. .   The electronic apparatus according to claim 9, further comprising an EMI (Electro Magnetic Interference) shielding member that covers an outside of the printed circuit board exposed between the first board and the second board. A printed circuit board interposed between the first board and the second board,
Including a hard substrate region and a flexible substrate region,
The rigid substrate region is disposed between the first substrate and the second substrate;
The flexible substrate region is a printed circuit board that extends from the rigid substrate region and is connected to the first substrate and the second substrate. The rigid substrate region comprises a first surface facing the first substrate and a second surface facing the second substrate;
The flexible substrate region is placed on the first surface and connected to the first substrate, and the second flexible region is placed on the second surface and connected to the second substrate. And a printed circuit board according to claim 11. A first support unit coupled to the first soft region and a second support unit coupled to the second soft region;
The printed circuit board according to claim 12, wherein the first support portion and the second support portion are disposed to overlap each other. A soft insulating layer that can be bent and has a first circuit pattern formed on one surface for connecting the first substrate and the second substrate;
The printed circuit board according to claim 11, further comprising: a hard insulating layer formed on the other surface of the soft insulating layer in the hard substrate region. A second circuit pattern formed on the hard insulating layer;
The printed circuit board according to claim 14, further comprising a via that connects the first circuit pattern and the second circuit pattern and penetrates the flexible insulating layer. An electronic element embedded in or attached to the hard insulating layer;
The printed circuit board according to claim 14, further comprising a via that connects the first circuit pattern and the electronic element and penetrates the flexible insulating layer.