JPH0888062A - Connector and substrate mounting method - Google Patents

Abstract

PURPOSE: To obtain a stack connection between numerous substrates in which a high cost and a high accuracy of process is not required but the characteristic impedance is controlled, by arranging terminals two-dimensionally to both ends of a flexible substrate. CONSTITUTION: A connector 2 is composed of two parts including a flexible substrate 4 and a rubber member 6. To the flexible substrate 4, plural terminals 10 arranged two-dimensionally to both ends 16, and plural wirings 12 connecting between the terminals 10, are provided. In this structure, plural terminals 10 are arranged two-dimensionally. Since it is the two-dimensional arrangement, more terminals than in the terminal group in a primary arrangement can be provided. It is preferable to cover the upper part of the wirings 12 with a wiring cover.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector used for stacking connection between boards of an electronic circuit and a board mounting method using this connector, and particularly to mounting a large-scale system such as a massively parallel computer on an electronic circuit board. The present invention relates to a board mounting method.

[0002]

[Prior art]

(1) As a conventional connector used for stacking connection between boards of an electronic circuit, a surface mount type two-piece type connector is typical.

This type of connector has a problem that it is generally difficult to control the characteristic impedance, and when a signal having an excessively high frequency is passed, reflection by the connector has an adverse effect. In addition, because the surface mount type two-piece connector is fixed to the board by solder, the number of cores is not enough with one connector. Therefore, when using multiple connectors, solder within the tight tolerances that the connectors allow. The relative position accuracy of must be improved. In particular, when a high-density connector having a terminal pitch of 1 mm or less is used, the deviation allowed by the connector can be made extremely small, and the size of the connector such as natural movement during solder melting cannot be absorbed. It is not possible to combine multiple connectors at once, or even if they can be combined, too many connectors cannot be combined at the same time because a large amount of force is required to insert them. There are problems that the connection portion is broken and contact failure occurs due to deformation of the connector.

In order to solve such a problem, there is a connector provided with a contact holding portion having a floating structure or a crimp type connector. Crimping type connectors include connectors with spring-like vertically movable structure embedded in a plastic case, connectors with conductive rubber and insulating rubber laminated, and connectors with rubber or carbon fiber penetrated. , There is a connector in which a flexible substrate or a conductor is wrapped around rubber.

A connector having a contact holding portion of a floating structure is slightly large due to its complicated structure,
The maximum number of cores will decrease and the cost will increase. Further, since the floating portion must be deformed, the insertion force is large, and it is difficult to combine too many connectors at the same time.

In a connector in which a terminal having a spring-like vertically movable structure is embedded in a plastic case, since the terminal absorbs subtle unevenness of the board, stacking connection of the board without soldering is possible. A terminal having a vertically movable structure cannot be realized very inexpensively because of its structure.

[0007] A connector in which a conductive rubber and an insulating rubber are laminated has a large conductor resistance of wiring and cannot pass a very large current. Further, in this type of connector, the terminals can be arranged only one-dimensionally (for example, in a straight line), so that a large number of cores cannot be obtained.

A connector obtained by penetrating carbon or metal fibers in rubber is generally expensive. With carbon fibers, the conductor resistance of the wiring is large, and when penetrating metal fibers, it is particularly expensive. Further, in these types of rubber connectors, if the thickness is large, it becomes difficult to maintain the linearity of the conductor fiber, and therefore the wiring pitch cannot be made fine.

A conventional connector in which a flexible substrate or a conductive wire is wound around rubber is cheaper than other types of connectors because parallel wiring with a fine pitch is wound around rubber or sponge having a D-shaped cross section. In Although,
If the distance between the parallel substrates is large, the problem of positional deviation occurs, so that the terminal pitch of the substrates cannot be made very small. Further, since the connector of this type can arrange the terminals only one-dimensionally, it is not possible to obtain a large number of cores.

Further, in stacking connection of a large number of boards using a conventional crimp type connector, a screw that penetrates is used to reduce the distance between parallel boards, but many connectors and boards are It requires a very large force because it must be compressed, and there is a risk of uneven pressure as the number of stacked substrates increases.
Further, in this compression method, the expandability is poor when the number of substrates to be stacked is expanded later, and it is impossible to stack the number of substrates exceeding the length of the threaded screw.

Further, since power must be supplied through a separate path, wiring for this is difficult, and the number of cores that can be used for signals can be obtained by supplying power from the signal line of the compression type connector. It was not possible to increase the number of substrates to be stacked due to pressure on the device and the inability to pass a large current.

(2) On the other hand, as a general mounting method of an electronic circuit board in a system composed of a plurality of conventional electronic circuit boards, a method using a backplane (motherboard) is widely used.

However, in this mounting method, the number of wires that can be output from the board is limited by the number of connectors that can be mounted on one side of the board, so that a three-dimensional torus in which a large number of element processors are mounted on one board, etc. When implementing a massively parallel computer with a connection topology of, it was not possible to secure a sufficient number of wirings between boards for the communication link between the element processors, and high performance communication between processors was achieved. It was difficult to realize a massively parallel computer.

Therefore, a connector for horizontal and vertical board-to-board connections is mounted on the peripheral portion of a small board on which one or a few element processors are mounted, and the length of the board peripheral portion per element processor is set. A three-dimensional mounting method has been proposed in which the number of wirings between boards per element processor can be increased by increasing the number.

However, this method is suitable for mounting a simple three-dimensional torus, but since the number of element processors per board is reduced, the connection within the same board does not receive the pin neck of the connector. It is not possible to effectively utilize the locality in the implementation due to.
If more element processors are mounted in a larger board, a tighter coupling topology than a torus can be adopted like crossbar coupling, but in that case, the length of the board per element processor is reduced. However, it has been difficult to secure the number of vertical inter-board wirings for the vertical communication link, which is proportional to the number of element processors mounted on the board.

Further, when the boards are three-dimensionally arranged and a large number of board-to-board connections are realized by using a large number of connecting means, the above-mentioned three-dimensional mounting method sufficiently absorbs mounting errors entwined in complicated directions. However, even if a flexible connecting means is used, stress remains in the joint portion and a large force is required at the time of joining. If the flexibility of the connection means is insufficient, give vibration or leave it for a long time,
In some cases, the connector could not withstand the residual stress, resulting in poor contact.

Therefore, it is necessary to reduce the number of wires per connecting means in order to make the connecting means sufficiently flexible, or it is not possible to use a sufficient ground layer for EMI countermeasures. Was the cause.

[0018]

[Problems to be Solved by the Invention]

(1) As described above, in the conventional connector, it is difficult to control the characteristic impedance, the accuracy of the connector itself and the accuracy of soldering must be sufficiently increased, the total number of wiring between boards cannot be increased, the cost is high, and the conductive resistance is high. There was some problem such as high.

The present invention has been made in consideration of the above circumstances, and has a large area between a large number of substrates which has a small area, a low price, does not require very high processing accuracy, and has a well controlled characteristic impedance. It is an object to provide a connector that enables stacking connection.

It is another object of the present invention to provide a board mounting method capable of maintaining stable connection with a small force and increasing expandability of board-to-board connection and power supply in the board stacking direction. .

(2) On the other hand, as described above, in the conventional board mounting method, a sufficiently large communication bandwidth and connection stability with a coupling topology reinforced locally by a crossbar network based on a three-dimensional torus. It was difficult to implement a massively parallel computer and so on.

The present invention has been made in consideration of the above circumstances, and has a large number of elements on a large board while ensuring the expandability of the number of boards in the horizontal and vertical directions and the stability of connection during three-dimensional mounting. An object of the present invention is to provide a board mounting method capable of achieving both enhancement of local coupling utilizing the advantage of wiring within a board by mounting a processor and securing of the number of wiring between boards in the vertical direction.

[0023]

In the connector according to the first aspect of the present invention, a rubber-like elastic body having an upper end surface and a lower end surface that are substantially flat and substantially parallel to each other, and both end portions are the upper end surface and the lower end of the elastic body. A board portion connected to the end surface, a plurality of terminals two-dimensionally arranged on both end portions of the board portion, a terminal arranged at one end portion of the board portion and the other terminal corresponding to the terminal. It is characterized by comprising a flexible substrate having a plurality of wirings that respectively connect the terminals arranged at the ends.

According to a second aspect of the present invention, in the connector according to the first aspect of the present invention, there is provided a wiring group including a plurality of wirings for connecting between terminal groups including a plurality of two-dimensionally arranged terminals provided on the flexible substrate. It is characterized in that the parallel wiring is used and the characteristic impedance is controlled.

According to a third invention, in the connector according to the first invention, a flexible substrate having a substantially rectangular shape is provided with a terminal group which is two-dimensionally arranged near the central portion and both end portions, and the central portion is provided. The terminal in the vicinity is provided with a wiring group that is connected to the terminal arranged at the closer end of the two ends.

A fourth invention is characterized in that, in the connector according to the first invention, a projection is provided on at least one surface of a rubber-like elastic body.

A fifth aspect of the invention is characterized in that, in the connector according to the fourth aspect of the invention, the flexible substrate is provided with a hole that matches the position of the protrusion of the rubber-like elastic body.

A sixth aspect of the invention is characterized in that, in the connector according to the fourth aspect of the invention, the protrusion provided on the rubber-like elastic body is integrally formed.

According to a seventh aspect of the invention, in the connector according to the fourth aspect, the projection provided on the rubber-like elastic body is realized by inserting the rod-shaped part into the hole provided in the rubber-like elastic body. It is characterized by doing.

The eighth invention is characterized in that, in the connector according to the seventh invention, the hole provided in the rubber-like elastic body is not penetrated.

According to a ninth aspect of the present invention, in a board mounting method in which a connector is sandwiched between boards facing each other substantially in parallel and pressure bonding is applied thereto, a space between the connector and the board according to the size of the connector is defined. A first spacer having a screw structure at both ends is inserted between the substrates substantially perpendicularly to the substrates, and one substrate is a second spacer having the same structure as the first spacer. It is characterized in that one end of one of the first and second spacers sandwiching the one substrate is screwed into the other end of the other spacer.

A tenth invention is characterized in that, in the substrate mounting method according to the ninth invention, the spacer is made of a conductor and is also used as a power supply path.

In the board mounting method according to the eleventh aspect of the invention, the first connecting means arranged in a region avoiding the peripheral portion of each circuit board with a directivity that does not hinder the cooling allows the circuit boards facing each other to be almost mutually separated. By connecting so as to face each other in parallel and connecting the second connecting means provided in the peripheral portion of each of the circuit boards by the third connecting means having flexibility, the direction of the board surface of the circuit board It is characterized in that the substrates adjacent to each other are connected.

According to a twelfth invention, in the board mounting method according to the eleventh invention, the third connecting means is a flexible board having a plurality of bent portions which are in a positional relationship of being twisted with each other. .

According to a thirteenth invention, in the board mounting method according to the eleventh invention, when the nodes are connected by a topology including an n-dimensional torus or n-dimensional mesh-like connection, the wiring between the boards is a torus or mesh-like one. It is characterized in that it is used for inter-node connection, and the wiring in the board is used for inter-node connection by a coupling topology having a diameter smaller than that of a torus or mesh.

In a fourteenth invention, in the board mounting method according to the eleventh invention, a plurality of nodes are mounted on one circuit board when the nodes are connected by a topology including an n-dimensional torus connection. 3rd dimension so that adjacent nodes are on adjacent substrates in the direction of the substrate plane in one dimension.
The second connecting means is connected by the connecting means of, and the remaining one dimension is arranged so that the adjacent nodes are on the substrate two sheets above or two sheets below, and the connection wiring between nodes is skipped. It is characterized by having.

According to a fifteenth invention, in the board mounting method according to the eleventh invention, when the nodes are connected by a topology including an n-dimensional torus connection, a plurality of nodes are
Mounted on a single circuit board, and connecting the second connecting means by the third connecting means such that adjacent nodes are on adjacent boards in the direction of the board surface or on boards that face each other substantially in parallel in one dimension. However, with respect to the remaining one dimension, it is characterized in that the adjacent nodes are arranged so that the adjacent nodes are on the substrate above or below the substrate by four, and the internode connection wiring is skipped by three.

[0038]

In the first aspect of the invention, a flexible substrate having a wiring group made up of a plurality of wirings for connecting terminal groups made up of a plurality of terminals arranged two-dimensionally is combined with a rubber-like elastic body. Configure the connector. Since the terminals are arranged two-dimensionally, it is possible to increase the number of terminals per connector. When connecting the same number of pins, it is possible to make the terminal pitch coarser than that of a normal surface mount connector in which gull wing type terminals are provided.

Since the flexible substrate is flexible and the rubber-like elastic body is also flexible, even if there is some unevenness on the surface of the parallel substrate facing each other, it is absorbed by these flexibility, so that it has a hard structure. The certainty of connection is increased rather than crimping objects.

In particular, since it is possible to easily use thick rubber as compared with a connector of a type in which a conductor fiber penetrates a thin rubber, the compression ratio becomes smaller for unevenness of the same size. Even if the number is small, the reliability of connection can be increased.

Since the electrical connection is achieved by the wiring group of the flexible substrate having the wiring group for connecting the two-dimensionally arranged terminal groups, the conductor resistance is higher than that in the case of using conductive rubber or the like. Low.

Such a low resistance wiring is advantageous especially when it is desired to increase the distance between the substrates.

Since electricity does not pass through the rubber-like portion, it is not necessary to mix silver particles or the like like conductive rubber, and an inexpensive material can be used for manufacturing.

Further, since the flexible substrate can be multi-layered, it can be used to some extent even if the number of terminals is large.

Further, by preparing rubber-like elastic bodies of different sizes, the same flexible substrate can be used to cope with different board intervals, and the same wiring length can be realized even though the board intervals are different. Is.

In a second aspect of the invention, in the connector according to the first aspect of the invention, the wiring group for connecting the two-dimensionally arranged terminal groups provided on the flexible substrate is parallel wiring.

Since the wiring is realized by parallel wiring, the characteristic impedance can be easily controlled by the dielectric constant of the insulating material of the flexible substrate, the width of the wiring, and the distance between adjacent wirings. Therefore, it is possible to reduce the reflection in the wiring between the boards by bringing it close to the characteristic impedance of the printed board to be connected.

According to a third aspect of the present invention, in the connector according to the first aspect of the present invention, a flexible substrate having a substantially rectangular shape is provided with two-dimensionally arranged terminal groups in the vicinity of the central portion and both end portions thereof. The terminal in the vicinity includes a wiring group that is connected to the terminal arranged at the closer end of the two ends.

Therefore, almost half of the wiring is guided to the end portion of the flexible board, so that twice the number of wirings that can be wired by a flexible board of a predetermined width with one flexible board are opposed to each other by rubber-like elasticity. Allows connections between body planes.

Comparing the case where the same number of connections are made in this way and the case where terminals are arranged only at both ends of the flexible substrate, the connector and the board are aligned as compared with the case where terminals are arranged only at both ends of the flexible substrate. Can be achieved in half the number of times.

According to a fourth aspect of the invention, in the connector according to the first aspect, at least one surface of the rubber-like elastic body is provided with a protrusion. Therefore, the position of the rigid substrate to be crimped and the rubber-like elastic body can be surely aligned during assembly.

Therefore, even if the distance between the rigid substrates becomes large, the risk of connection failure due to the deformation of the rubber-like elastic body is reduced. In the case of a connector of a type in which conductor fibers penetrate rubber, when the distance between rigid boards is increased and the thickness of rubber is increased, when the cross section of rubber is deformed by tilting into a parallelogram shape, or when crimping occurs,
Connection failure is likely to occur when the conductor fiber penetrates at an angle with respect to the center line of the rubber, but in the case of the connector to which the present invention is applied, the alignment is performed by the projection, so there is little such concern.

According to a fifth aspect of the invention, in the connector according to the fourth aspect of the invention, the flexible substrate is provided with a hole matching the position of the protrusion of the rubber-like elastic body.

Accordingly, the rubber-like elastic body and the flexible substrate can be aligned with each other, and the rigid substrate to be pressure-bonded and the rubber-like elastic body can be aligned with each other. As a result, the flexible substrate and the rigid substrate to be pressure-bonded can be aligned with each other. Become.

That is, according to the present invention, the flexible substrate and the rubber-like elastic body may be separated until the assembly. For this reason, the flexible board can be manufactured by a manufacturer who is good at manufacturing flexible boards, and the rubber part can be made to be manufactured by a manufacturer who is good at manufacturing rubber molding, and can be integrated at the time of assembly. Furthermore, by preparing only one type of flexible board and combining it with rubbers of different sizes, it is possible to easily realize a connector of another size having the same electrical characteristics during assembly.

According to a sixth aspect of the invention, in the connector according to the fourth aspect, the projections provided on the rubber-like elastic body are integrally formed. Therefore, the positioning accuracy can be achieved by the accuracy of the mold when molding the rubber part,
Since the protrusions are easy to manufacture, there is almost no increase in cost.
However, since the protrusion is formed of a rubber-like elastic body and may be deformed, it is necessary to carefully insert the soft protrusion into the hole on the rigid board side during assembly.

According to a seventh aspect of the present invention, in the connector according to the fourth aspect, the projection provided on the rubber-like elastic body is realized by inserting the rod-shaped part into the hole provided on the rubber-like elastic body. To do.

Therefore, since the hole formed in the rubber-like elastic body does not have the accuracy of the mold at the time of molding, the positioning accuracy is performed with the accuracy of this mold, and the rod-shaped part inserted into the hole is Since the protrusions are formed, it is not necessary for the protrusions to be rubber-like elastic bodies. Therefore, by making the rod-shaped parts rigid, deformation of the protrusions can be prevented and reliable alignment with a rigid board can be realized. .

According to the eighth invention, in the connector according to the seventh invention, the hole provided in the rubber-like elastic body is not penetrated. Therefore, the rod-shaped component will not be retracted at the time of alignment on one side, and will not project from the other side, thus preventing misalignment. That is, by inserting another rod-shaped component from both sides without penetrating the hole, the height of the protrusion can be reliably made constant.

According to a ninth aspect of the present invention, in a board mounting method of sandwiching a connector that secures a crimp connection by applying pressure between rigid boards that face each other substantially in parallel, both ends that realize a board interval according to the size of the connector are mounted. The first spacer having a screw structure and the connector are inserted between the rigid boards facing each other substantially in parallel to each other substantially perpendicular to the boards, and the board is sandwiched between the first spacer and the second spacer. Screw the second spacer into the first spacer.

Therefore, by screwing in the second spacer, the rigid substrate exerts a pressure on the first spacer side, and this pressure is eventually exerted on the connector, so that the connection is exerted on the rigid substrate and the connector. Fixed in the state. Since this screwing is involved only in the compression of the connector for stacking one sheet, the screws penetrating all the boards can be fixed with less force than compressing the connectors between all the boards.

Further, since the screws are replenished one after another as the number of substrates to be stacked increases, there is no problem that the length of the screws becomes insufficient and the screws cannot be expanded any more.

In a tenth aspect of the invention, in the substrate mounting method according to the ninth aspect, the spacer is made of a conductor and is also used as a power supply path. When power is supplied from a path other than the mechanism that compresses and fixes between boards, it becomes difficult to secure a space for the power supply path, especially in a system that is assembled in high density and three-dimensionally. However, according to the present invention, since the mechanism for compressing and fixing the substrates also serves as the power supply path, the space can be effectively used, and as a result, the packaging density of the system can be improved.

When the power is supplied through another path and another structure cannot be inserted for some reason, the power can be supplied from the signal line of the compression type connector to be used for the signal. Pressing the number of cores,
There is a problem that the number of substrates to be stacked cannot be increased because a large amount of current cannot be applied. However, if the present invention is applied, the power supply is a separate path from the signal line of the compression type connector, so all the pins of the connector are Since a metallic spacer that can be used for signal transmission and has a larger current capacity can be used, there is less problem that the number of substrates is limited due to insufficient current capacity.

According to the above effects of the present invention, when applied to a two-dimensional torus-like inter-substrate connection of a massively parallel computer in which the wiring within the substrate is strengthened by using a relatively large substrate, the substrates are stacked for each substrate. It is possible to realize a huge wiring between adjacent boards exceeding 10,000 lines in one direction, and it is possible to construct a massively parallel computer with outstanding communication performance.

In the eleventh aspect of the invention, the circuit boards facing each other substantially in parallel to each other are connected by the first connecting means which is arranged in a region avoiding the peripheral portion of the circuit board so as not to interfere with cooling. . For this reason, it is not essential that the first connecting means for connecting the circuit boards facing each other substantially in parallel to each other be arranged in the peripheral portion, so that the first connecting means can be added if necessary, and the crimping can be performed. A very large number of wirings between the substrates facing each other in parallel can be realized by using a mold connector or the like.

Since the first connecting means is arranged in a directional manner, the flow of the air flow in that direction is not obstructed, so that the cooling is smoothly performed.

By using a crimp type connector or the like between the circuit boards facing each other in substantially parallel to each other, the relative positions of the boards are fixed while there is some error in the board spacing. Here, the second connecting means is provided in the peripheral portion of the circuit board, and the second connecting means is connected by the flexible third connecting means to connect the boards adjacent to each other in the direction of the board surface. .

Since the third connecting means has flexibility, mounting errors such as a height shift between adjacent substrates in the direction of the board surface due to an error in the board spacing and a slight positional deviation in the board surface direction may occur. It is possible to prevent the destruction and the contact failure due to the stress concentration on the fixed portion due to the soldering of the connecting means to the substrate or the like and the connecting portion between the second and third connecting means.

Since the wiring for connection between the circuit boards facing each other substantially parallel to each other does not pass through the peripheral part of the board, the wiring between the boards adjacent to each other in the direction of the board surface is limited to the board from the peripheral part. It becomes possible to allocate more wiring.

According to a twelfth invention, in the board mounting method according to the eleventh invention, a plurality of flexible boards having a plurality of bent portions having a positional relationship of being twisted with each other are used for inter-board connection. Therefore, when the boards to be connected in various directions and the connecting means mounted on the boards are mounted in a displaced manner, the respective bent portions in the positional relationship of being twisted with each other are in different directions. The gap can be absorbed.

According to a thirteenth invention, in the substrate mounting method according to the eleventh invention, when nodes are connected by a topology including an n-dimensional torus or n-dimensional mesh-like connection,
Inter-substrate wiring is used for torus or mesh node connection. In the board mounting method of the eleventh invention, since the number of wires between adjacent boards can be increased as compared with the case where all the board-to-board wiring is processed in the board peripheral portion, the torus based on the adjacent connection is used. Alternatively, it is possible to realize a short wiring distance while using many wirings in a mesh-shaped connection between nodes.

On the other hand, the wiring in the substrate is used for connecting the nodes by the coupling topology having a diameter smaller than that of the torus or mesh. Unlike the inter-board wiring, the wiring inside the board is not restricted by the pin neck of the connector, so that it is relatively easy to realize even if the connections are tight. Therefore, the diameter of the connecting network can be shortened without increasing the wiring between the boards,
If we take advantage of the fact that communication within the board will be faster, it will lead to higher processing speed in parallel computers.

According to a fourteenth invention, in the board mounting method according to the eleventh invention, a plurality of nodes are mounted on one circuit board when the nodes are connected by a topology including an n-dimensional torus connection. . When multiple nodes are mounted on a single circuit board, the number of links that must be connected between boards increases, making it easier to face a board-to-board wiring neck. Since the second connecting means is connected to each other by the third connecting means so as to be on the board adjacent to each other, the number of connections using the peripheral part of the board realizes the torus connection by using the jump wiring. It will be half of the case.

Therefore, many wirings can be assigned to each link using the limited peripheral area. However, in order to form the ring in this direction, the shape of the substrate must be fan-shaped, or the length of the third connecting means must be changed depending on the place of use. When the number of substrates arranged in the substrate surface direction changes, the substrate shape and the length of the third connecting means must be adjusted.

On the other hand, in the fourteenth invention, regarding the remaining one dimension, the adjacent nodes are arranged so as to be on the substrate two sheets above or two sheets below, and the internode connection wiring is skipped by one sheet. Wiring in the direction perpendicular to the substrate surface can be increased by arranging a large number of the first connecting means according to the eleventh invention, as compared with the case where the peripheral portion of the substrate is used.
It is easy to deal with the doubling of the number of wirings between the boards due to the use of the connection wirings between the nodes. When the wiring is skipped, it is possible to form a ring only by regular wiring between adjacent substrates, so that the mounting can be performed without using a cable.

As described above, according to the board mounting method of the fourteenth aspect of the present invention, the wiring between the boards in the board surface direction is saved, while the appearance of the adjacent boards is apparent in the direction perpendicular to the board surface. Since the ring can be formed only by regular wiring, the n-dimensional torus can be mounted without using a cable. In addition, the number of substrates can be freely selected in the vertical direction.

According to a fifteenth invention, in the board mounting method according to the eleventh invention, a plurality of nodes are mounted on one circuit board when the nodes are connected by a topology including an n-dimensional torus connection. In one dimension, the second connecting means provides a second connection so that the adjacent nodes are on adjacent substrates in the direction of the surface of the substrate or on substantially opposite substrates.
Connect between the connection means.

Whether the adjacent node is placed on the substrate adjacent to the direction of the substrate surface or the substrate facing in substantially parallel is
It is used properly depending on the position of the board. That is, the board-to-board connecting portions which are not located at both ends of the board group arranged in the board-plane direction are adjacent to the second board,
A third connecting means is provided between the second connecting means of the substrates facing each other substantially in parallel with respect to the inter-board connecting portions located at both ends of the board group arranged in the board surface direction, which are connected via the third connecting means. Connect by means.

As described above, the formation of the inter-node ring in the substrate surface direction is performed by the two substrate surfaces.

As described above, in the fourteenth aspect of the invention, in order to form the ring in the direction of the substrate surface, the shape of the substrate must be trapezoidal or the length of the third connecting means must be changed depending on the place of use. However, when the number of substrates arranged in the substrate surface direction fluctuates, the substrate shape and the length of the third connecting means must be adjusted. However, when the fifteenth invention is used, such a problem occurs. Disappears.

However, when the ring is formed in the direction perpendicular to the substrate surface, the position where the adjacent node exists is not 4 on the substrate or 2 on the lower substrate as in the case of applying the fourteenth invention. One sheet above or four sheets below.

Therefore, each of the substrates has one wiring for connecting to the upper and lower substrates, two wirings for connecting to the upper and lower substrates, three wirings for connecting to the upper and lower boards, and four wirings for the upper and lower boards. The wiring for doing so goes in and out of the substrate by using the first connecting means, and more twice as much wiring as in the case of applying the fourteenth invention goes out in the direction perpendicular to the substrate surface.

In the fifteenth invention, since the board mounting method of the eleventh invention is used, the wiring in the direction perpendicular to the board surface is limited in the peripheral area by arranging a large number of the first connecting means. Since it is possible to realize more wirings than the wirings through the parts, it is possible to facilitate the wirings in the horizontal direction by utilizing the wirings in the direction vertical to the substrate surface as described above.

As described above, according to the board mounting method of the fifteenth invention, in addition to the effect of the fourteenth invention, it becomes possible to select the number of boards both in the horizontal direction and in the vertical direction with respect to the board surface. Therefore, n with various numbers of units per dimension
A parallel computer including dimensional torus coupling can be easily realized with the same type of board.

[0086]

Embodiments of the present invention will be described below with reference to the drawings.

<Embodiment 1 (Embodiment of the First Invention)> (Main Structure / Operation of Embodiment 1) In this embodiment, a wiring group for connecting between two-dimensionally arranged terminal groups is provided. A connector is formed by combining the provided flexible substrate and a rubber-like elastic body. The electrical connection between the two-dimensionally arranged terminal groups is achieved by the wiring group provided on the flexible substrate.

Since the flexible substrate is flexible and the rubber-like elastic body is also flexible, even if the surface of the opposing parallel substrate has some irregularities, it is absorbed by the flexibility. Further, since thick rubber can be easily used, the ratio of compression with respect to unevenness of the same size can be reduced.

(Effects of Embodiment 1) According to this embodiment, even if the wiring resistance is low, the contact resistance due to the unevenness of the substrate is small, and the distance between the substrates is flexible even if the force applied at the time of coupling and fixing is small. Therefore, it is possible to obtain a connector in which the number of wires per occupied area of the connector can be significantly improved.

(Specific Description of Embodiment 1) FIG. 1 shows a connector of this embodiment. The connector 2 of this embodiment is roughly composed of two parts, a flexible substrate part 4 and a rubber part 6.

FIG. 2 is a development view of the flexible board 4 which constitutes the connector 2 of FIG. In this embodiment, a flexible substrate having one conductor layer is used, but a multilayer flexible substrate may be used. The flexible substrate 4 is provided with a terminal group (plurality of terminals 10) that is two-dimensionally arranged at both ends 16 and a wiring group (plurality of wirings 12) that connects these terminals. Wiring 12 of flexible substrate 4
In general, since a copper film is used, the wiring resistance is small even if the wiring distance is longer than that of a connector using a conductive rubber or the like.

In this embodiment, the plurality of terminals 10 are two-dimensionally arranged. Since it is a two-dimensional array, it is possible to provide a larger number of terminals as compared with a conventional flexible substrate consisting of only parallel exposed wiring and a terminal group of a one-dimensional array in which a conductor is wound around rubber and can be connected by a connector. Moreover, if the terminals 10 are arranged in a staggered arrangement, the inter-terminal wiring 12 can be drawn linearly. Therefore, it is also desirable from the viewpoint of improving the terminal density and uniformity of characteristic impedance.

It is desirable that the upper part of the wiring 12 is covered with an insulating coating 14 as shown by the hatched portion in the figure. In this case, the terminal 10 exposes the conductor.

A bump such as solder may be placed on the terminal 10 so that it is slightly projected from other portions so that the pressure is concentrated on the terminal portion.

FIG. 3 is a view showing an embodiment of the rubber portion 6 which constitutes the connector 2 of FIG. In the present embodiment, the rubber portion 6 is also provided with bump-like protrusions 22 in accordance with the arrangement of the terminals 10 in order to strengthen the terminal pressure. However, the flexible substrate 4 is connected to the terminal 10 side or the rigid substrate for connection ( If bumps are provided (not shown), bump-like protrusions are not necessary on the rubber 6 side as shown in FIG. 4, and depending on the flatness of the substrate and the pressure at the time of bonding, the flexible substrate 4 may also be provided on the rubber 6 side. There may be no bump on the side. When the bumps are not provided, the adhesiveness is improved by adhering the flexible substrate 4 and the rubber portion 6 together.

In this embodiment, as shown in FIGS. 1 and 2, the flexible substrate portion 4 is provided with a hole 8 and the rubber portion 6 is provided with an upper surface 26.
From the bottom surface to the lower surface 28 (20 in FIG. 3, 2 in FIG. 4)
4) is provided, and the upper and lower surfaces of the rubber portion 6 and both ends of the flexible substrate 4 are bonded to each other by aligning the positions of the holes.

Although the flexible substrate 4 is not adhered to the side surface of the rubber portion 6 in this embodiment, it may be adhered thereto. (In other embodiments described below, the flexible substrate is not adhered to the side surface of the rubber portion, but the flexible substrate may be adhered to the side surface of the rubber portion in any of the embodiments.) Next, FIG. FIG. 7 shows a state in which a plurality of boards are mounted using the connector of this embodiment. At the bottom, a terminator 34 is fixed to the through screw 32 with a nut 36 (not shown) or the like. The terminator 34 has a material and a structure having high rigidity so that it is not easily deformed even when a force is applied. If necessary, electrical wiring and terminating resistors may be provided,
It may be a simple plate.

On this, the rigid printed circuit board 30 on which the connector 2 of this embodiment and the electronic circuit are mounted is stacked by alternately inserting the through screws 32 through the holes. After stacking the uppermost substrates, the connector 2 and the terminator 34 are stacked and tightened with a nut 36 or the like to fix the connector 2 in a compressed state.

FIG. 6 is a cross-sectional view of the connecting portion in a state where sufficient pressure is not applied during the assembly as shown in FIG. When the rigid printed circuit board 30 is severely undulated, contact failure between the terminal 10 on the connector 2 side and the terminal 38 on the rigid circuit board 30 side occurs. In the figure,
The portion indicated by ◯ is in contact, but the portion indicated by × is floated due to the corrugation of the substrate 30, and the state of poor contact still remains.

FIG. 7 is a cross-sectional view of the same connection portion in a state where sufficient pressure is applied, unlike the state of FIG. Even when the rigid printed circuit board 30 is severely undulated, the connector 2 is made of the thick rubber 6 and the flexible circuit board 4, so that it can be greatly deformed. Therefore, the terminal 10 on the connector 2 side and the terminal on the rigid circuit board 30 side. Poor contact between 38 is less likely to occur.

In this embodiment, the rubber portion 6 of the connector 2 is
Since the bump-shaped terminal pressure enhancing projections 22 are provided in accordance with the positions of the terminals 10, the terminals are more easily deformed, and when pressure is applied, the bumps are deformed more than other parts. Since the pressure is concentrated on, stable connection is possible even with a small pressure.

As described above, according to the present embodiment, a large number of inexpensive multi-pin connectors having a low wiring resistance are used, and a rigid board which has been used for inter-board wiring in a normal mounting method is used. A huge amount of inter-board wiring can be realized without using any peripheral part, and the peripheral part should be used for horizontal connection between board stacks in a large-scale system in which a plurality of such board stacks are arranged. You can

Next, various embodiments of various variations of this embodiment and a board mounting method using the connector of this embodiment will be described. The effects described here are also applied to each of these embodiments. It goes without saying that you play.

<Embodiment 2 (Embodiment of the Second Invention)> (Main Structure / Operation of Embodiment 2) In this embodiment, the connector according to the first invention is equipped with a flexible board. A wiring group that connects terminal groups arranged in a dimension is defined as parallel wiring. Thereby, the characteristic impedance can be easily set to a constant value for all wirings.

(Effect of Embodiment 2) According to this embodiment, since reflection on the wiring between the substrates can be reduced, higher frequency transmission and highly reliable signal transmission are possible.

(Specific Description of Embodiment 2) FIG. 8 is a view showing another embodiment of the flexible board portion of the connector of FIG. In a flexible substrate 4'having a copper foil wiring layer 44 on an insulating film 46 having a permittivity ε, a two-dimensional staggered array is arranged at an end 48 using parallel wiring 44 having a wiring width W and a wiring gap S. A wiring pattern for connecting the terminals 42 of is formed.

With this configuration, the characteristic impedances of the lines that are not at both ends can be expressed by almost the same function f (ε, W, S), so that the characteristic impedances can be adjusted to desired values. By bringing the characteristic impedance of this line close to the characteristic impedance of the printed circuit board to which it is connected, it is possible to reduce reflection in the wiring between the boards.

Since crosstalk occurs in the parallel wirings in proportion to the wiring length in this manner, for example, odd-numbered wirings are ground lines and even-numbered wirings are signal lines, so that a more stable signal can be obtained. Transmission becomes possible.

<Embodiment 3 (Embodiment according to the third invention)> (Main structure and action of Embodiment 3) In this embodiment, in the connector according to the first invention, a flexible structure having a substantially rectangular shape is used. A wiring group that has terminals arranged two-dimensionally near the center and both ends of the board, and the terminals near the center are connected to the terminals located at the closer end of the two ends. It is equipped with. Therefore, almost half of the wiring is
It will be guided to the end of the flexible substrate.

(Effect of Embodiment 3) According to this embodiment, the rubber-like elastic body in which twice as many wirings face each other as compared with the case where terminals are arranged only at both ends of the flexible substrate for the same number of connections. It is possible to connect between the surfaces. In addition, as compared with the case where the terminals are arranged only at both ends of the flexible board, the connector and the board can be aligned in half the number of times.

(Specific Description of Embodiment 3) FIG. 9 is a view showing still another embodiment of the flexible board constituting the connector of FIG. The connector in which the rubber and the flexible substrate of Example 1 are combined includes a terminal group that is two-dimensionally arranged near the center and both ends of the flexible substrate having a substantially rectangular shape, and the terminals near the center are A wiring group for connecting to a terminal arranged at the closer end of the two ends is provided.

In this embodiment, a plurality of terminals 51 arranged in two rows in a two-dimensional zigzag pattern are provided at the ends A and B of the flexible substrate 104, and four rows in a two-dimensional zigzag pattern are arranged in the central portion C. It has a plurality of terminals 52. Of the terminals 52 in the central portion C, the upper half two rows in FIG.
9 are connected to the terminal group 51 arranged in parallel with each other by parallel wirings 54, and the two rows of the lower half of the terminals 52 in the central portion C in FIG. 9 are connected in parallel with the terminals 51 arranged in the lower end portion B. 54 are connected to each other.

FIG. 10 shows the connector of this embodiment. The lower portion of the rectangular parallelepiped rubber portion 56 is adhered to the central portion C of the flexible substrate portion, and the end portions A and B of the flexible substrate portion are adhered to the upper portion of the rubber portion 6.

As described above, even if the number of terminals is increased to four columns, there is no intersection of wirings and wiring can be performed with the same wiring gap. Therefore, a flexible substrate having the same characteristics as those of the previous embodiments is used. A connector having twice the number of terminals with the same characteristics can be easily realized.

Therefore, according to the present embodiment, inter-board wiring can be performed with half the number of connectors as compared with the case where terminals are arranged only at both ends of the flexible board for the same number of connections. Further, since it is necessary to align each connector with a screw penetrating therethrough, the fact that the number of connectors is half means that the alignment of the connector and the board can be realized in half.

(Modification of Embodiment 3) In order to make a connector having a larger number of terminals by using a flexible board of the same size, it is effective to use a multilayer flexible board (any number of layers). Here, a connector using a flexible substrate having four wiring layers will be described.

First, the wiring pattern of the fourth layer is formed by a single-sided flexible substrate similar to that shown in FIG.

FIG. 11 is a diagram showing an example of the wiring pattern of the third layer of the four-layer flexible substrate. The third layer is also formed by the single-sided flexible substrate 114. Figure 9
The end portions A4 and B of the third layer are aligned with the positions of the terminals A and B of the fourth layer and the terminals 52 of the central portion C shown in FIG.
Through holes (71 in FIG. 14) are provided at positions 4 and C4. Further, in the third layer, a plurality of terminals 57 and 58 in the same two-row staggered two-dimensional array are provided at the end portions A3 and B3 and the central portions C3a and C3b, and the correspondence between A3 and C3a and B3 and C3b is provided. A wiring pattern is formed to connect the terminals 57 and 58 to each other by parallel wiring 60.

FIG. 12 is a diagram showing an example of the wiring pattern of the second layer of the four-layer flexible substrate. The second layer, together with the first layer, is formed as one side of the double-sided flexible substrate 124. As in the case of the third layer, a through hole (71 in FIG. 14) corresponding to the lower layer terminal is formed at the end A2.
To A4, B2 to B4 and central portions C2a, C2b, C3
a, C3b, C4, and further provided with a plurality of terminals 61, 62 at the ends A2, B2 and the central portions C2a, C2b,
Corresponding terminals 61 of A2 and C2a and B2 and C2b,
Wiring patterns are formed to connect the parts 62 with parallel wires 64.

FIG. 13 is a diagram showing an example of the wiring pattern of the first layer of the four-layer flexible substrate. The first layer is the back surface of the second layer and is a rigid substrate (not shown)
To contact. As in the above-described embodiments, the through holes (71 in FIG. 14) corresponding to the lower layer terminals are formed at the end portions A2 to A2.
4, B2-B4 and central portions C2a, C2b, C3a,
Provided at C3b and C4, and further at the end portions A1 and B1 and the central portion C
1a and C1b are provided with a plurality of terminals 66, and wiring patterns are formed to connect corresponding terminals of A1 and C1a and B1 and C1b with parallel wirings 68, respectively.

A four-layer flexible substrate is constructed by using the two single-sided flexible substrates 104 and 114 and the one screen flexible substrate 124 as described above.

FIG. 14 is a block diagram of the configuration 4 as described above.
FIG. 6 is a cross-sectional view showing a three-dimensional structure of a layer flexible substrate 134.

First, the double-sided flexible substrate 124 and the third
The flexible substrate 114 of the layer is bonded and the through hole 71 is plated. Next, this flexible substrate and the fourth-layer flexible substrate 104 are bonded and the through holes 71 are plated. Thus, the flexible substrate 134 having four layers of wiring is completed.

FIG. 15 is a diagram showing an embodiment of the connector 132 using the four-layer flexible substrate 134 shown in FIG. The flexible substrate 134 is wound around and adhered to the rubber portion 136 so that the end portion A4 and the end portion B4 are adjacent to each other.

By using the multilayer flexible substrate as described above, a connector having a large number of pins can be manufactured.

<Embodiment 4 (Embodiment of Fourth Invention)> (Main Structure of Embodiment 4) In this embodiment, at least one rubber-like elastic body is used in the connector of the first invention. A projection is provided on the surface.

(Effect of Embodiment 4) According to this embodiment, the rigid substrate to be pressure-bonded and the rubber-like elastic member can be reliably aligned during assembly.

(Specific Description of Fourth Embodiment) FIG. 16 shows a connector of the present embodiment. Similar to the connector of FIG. 1, the flexible board 74 having a plurality of terminals 80 connected at a plurality of wires 82 at both ends and a rubber portion 76 are combined, but in the present embodiment, the connector 72 is configured. Positioning protrusions U1 and U at the upper two locations and the lower two locations on the rubber portion 76
2, D1 and D2 are provided. (Protrusion D2 (not shown)
Is on the diagonal portion of the protrusion D1. 17 is a diagram showing a method of mounting a substrate using the connector of FIG. When the connector 72 of FIG. 16 is sandwiched by the two rigid boards 78 provided with the plurality of terminals 84, first the alignment protrusions D1 and D2 of the connector 72 are inserted into the holes HD1 and HD2 of the lower rigid board. , The terminal portion of the connector is aligned with the terminal portion of the lower rigid board side, and then the connector alignment protrusions U1 and U2 are formed on the upper rigid board holes HU1 and HU2.
By inserting the connector into the terminal part of the connector and the upper terminal part of the rigid board.

FIG. 18 is a diagram showing that even if the connector 72 shown in FIG. 16 is deformed by the tilted pressure, the connection can be correctly made. When pressure is applied in a state where the upper and lower rigid boards 78 sandwiching the connector 72 are displaced, or when the connector 72 itself is deformed, as shown in FIG. 18, it is directly below the terminals 84 of the upper rigid board 78. It is possible that the terminal 84 of the lower rigid board 78 corresponding to the position of does not come.

However, according to this embodiment, if the flexible substrate 74 is fixed to the rubber portion 76 at the correct position, the alignment protrusions U1, U2, D1, D2 and the holes HU1, HU2, HD1, HD2 of the rigid substrate are formed. By fitting the terminals, the terminals 84 of the rigid board 78 and the corresponding terminals 80 of the flexible board 74 face each other correctly.

Therefore, even if pressure bonding occurs when the cross section of the rubber portion 76 is inclined and deformed into a parallelogram shape, the corresponding terminals are connected to each other, so that the reliability of the connection is improved.

<Embodiment 5 (Embodiment of the Fifth Invention)> (Main Structure of Embodiment 5) In this embodiment, in the connector according to the fourth invention, the position of the protrusion of the rubber-like elastic body The flexible substrate is provided with a hole conforming to.

(Effect of Embodiment 5) According to this embodiment, the rubber-like elastic body and the flexible substrate can be aligned with each other, and the rigid substrate to be pressure-bonded and the rubber-like elastic body can be aligned with each other. It is possible to align the rigid board and the rigid board that are pressure bonded.

(Specific Description of Fifth Embodiment) FIG. 19 is a diagram showing an example of a flexible board constituting the connector of the present embodiment. A plurality of terminals 100 are arranged on both ends 88 of the flexible substrate 94, and wirings 102 are provided between the terminals 100.
However, holes 86 for inserting the alignment protrusions are provided at predetermined relative positions with respect to these terminals 100. Positioning protrusions of a rubber-like elastic body are formed at positions corresponding to the positional relationship with the holes.

FIG. 20 shows the connector of this embodiment. The rubber portion 96 having the alignment protrusions U1, U2, D1 and D2 formed thereon and the flexible substrate 92 shown in FIG. 19 are used to form the alignment protrusions U1, U2, D1 and D2.
It is configured by inserting the two holes 86 and inserting them.

In this way, the rubber-like elastic body and the flexible substrate can be easily aligned.

In this embodiment, holes for inserting the alignment protrusions having the same positional relationship are provided on the rigid board side corresponding to the terminals and holes of the flexible board. Therefore, the rigid substrate to be pressure bonded and the rubber-like elastic body can be easily aligned. Therefore, as a result, it becomes easy to align the rigid substrate and the rigid substrate to be pressure-bonded.

Sixth Embodiment (Embodiment of Sixth Invention) (Main Structure of Sixth Embodiment) In this embodiment, the connector according to the fourth invention is provided with a rubber-like elastic body. It is realized by integrally molding the protrusion. The protrusion can be realized with the precision of the mold when molding the rubber portion.

(Effect of Embodiment 6) According to this embodiment, the accuracy of the alignment can be realized by the accuracy of the mold at the time of molding the rubber portion, and the production of the protrusions is easy, so that the cost is hardly increased.

(Specific Description of Embodiment 6) In this embodiment,
In the connector according to the fourth aspect of the present invention, the protrusion provided on the rubber-like elastic body is integrally formed. Therefore, the accuracy of alignment can be realized by the accuracy of the mold at the time of molding the rubber portion, and the production of the protrusions is easy, so that the cost hardly increases. However, since the protrusions are formed of a rubber-like elastic body and may be deformed, it is necessary to carefully insert the soft protrusions into the holes on the rigid board side during assembly.

<Embodiment 7 (Embodiment of the 7th Invention)> (Main Structure and Operation of Embodiment 7) In this embodiment, a rubber-like elastic body is provided in the connector according to the 4th invention. The protrusion is realized by inserting a rod-shaped part into a hole provided in a rubber-like elastic body. Since the protrusion does not have to be a rubber-like elastic body, the protrusion is prevented from being deformed by making the rod-shaped part a rigid body.

(Effect of Seventh Embodiment) According to the present embodiment, it is possible to prevent the deformation of the protrusions and realize the reliable alignment with the rigid substrate. Further, since the protrusion can be made elongated and small, a small connector can be realized.

(Specific Description of Seventh Embodiment) FIG. 21 is a view showing a cross section of a rubber portion in the connector of the present embodiment.

In this embodiment, the hole 1 penetrating the rubber portion 96
06 is opened at two places, and a rod-shaped metal 90 for forming a projection is inserted therein, so that a metal portion of a predetermined length is exposed above and below.

In this way, since the protrusion is made of metal, it is hard and difficult to deform. Further, since the protrusion can be made elongated and small, a small connector can be realized.

<Embodiment 8 (Embodiment of Eighth Invention)> (Main Structure / Operation of Embodiment 8) In this embodiment, a rubber elastic body is provided in the connector according to the seventh invention. Do not penetrate through the holes Therefore, even if a force is applied to the protrusion, the height of the protrusion is unlikely to change.

(Effects of the Eighth Embodiment) According to the present embodiment, it is possible to prevent an accident in which the projections hit the rigid substrate or the like and are retracted at the time of alignment, and the alignment is not successful.

(Specific Description of Eighth Embodiment) FIG. 22 is a view showing a sectional view of a rubber portion in the connector of the present embodiment.

In this embodiment, unlike the connector shown in FIG. 21, a hole 107 that does not penetrate the rubber-like elastic body is provided. A rod-shaped metal 108 having a wedge-shaped tip portion 109 is inserted into the hole 107. Therefore, there is no inconvenience that the rod-shaped component is retracted at the time of alignment on one side and does not project from the other side, resulting in defective alignment. That is, the height of the protrusion can be reliably made constant by inserting another rod-shaped component from both sides without penetrating the hole.

Further, in this embodiment, since the tip end portion 109 of the rod-shaped metal 108 for forming the projection is formed in a wedge shape, the rod-shaped metal once inserted is prevented from falling off.

<Embodiment 9 (Embodiment of the ninth invention)> (Main structure and operation of Embodiment 9) In this embodiment, pressure is applied between the substrates facing each other substantially in parallel to ensure crimp connection. In the board mounting method that sandwiches the connector,
The above-mentioned connector and the first spacer having a screw structure at both ends for realizing a board interval according to the size of the connector,
The substrates are inserted substantially perpendicular to the substrates between the substrates facing each other substantially in parallel, the substrate is sandwiched between the first spacer and the second spacer, and the second spacer is screwed into the first spacer. One screwing only involves the compression of a stack of connectors. It is also possible to add screws.

(Effects of the Ninth Embodiment) According to the present embodiment, it is possible to fix the connectors between all the boards with a force smaller than that required to compress the connectors between all the boards with the screws penetrating all the boards. In addition, there is no problem that the length of the screw becomes insufficient and the screw cannot be expanded any more.

(Specific Description of Ninth Embodiment) FIG. 23 is a diagram showing a substrate mounting method according to the present embodiment. In this board mounting method, the connector of the above-described embodiment is used.

As shown in FIG. 23, the spacer S0 is screwed vertically into the base 112. A termination substrate 118 is placed on this, and a deformation prevention member 116 is inserted below the termination substrate 118 in order to prevent the deformation. A hole is formed at a predetermined position in the termination board 118, and a pad 110 for supplying power to the board is formed around the hole. The termination board 118 is fixed by screwing the spacer S1 into the spacer S0 through the hole.

Next, the alignment holes HD1 and H of the termination board 118 are formed on the termination board 118.
The connector C1 is placed while inserting the connector alignment protrusions D1 and D2 into D2, and the connector alignment protrusions U1 and U2 are further inserted into the alignment holes HU1 and HU2.
While mounting the rigid substrate R1 and inserting the spacer S2
Is screwed into the metallic spacer S1 to fix the rigid substrate R1 while compressing the connector C1. The rigid substrate R1 also has a power supply pad 110 formed around the hole, and the metal spacer S1 and the pad 11 are provided.
When 0 touches, power is supplied to the rigid substrate R1.

By repeating the above operation for the metallic spacer S3, the rigid board R2, and the connector C2, the rigid board R2 is fixed, the rigid board R1 is connected to the connector C2, and the rigid board R2 is connected to the connector C2. . The connector compressed by screwing the metallic spacer S3 is C2, and the connector C1
Since it has already been compressed, the force required for screwing in is smaller than that in the system in which all connectors are compressed at once, and pressure unevenness for each connector can be reduced.

Further, since the screws are replenished one after another as the number of substrates to be stacked increases, there is no problem that the length of the screws becomes insufficient and the screws cannot be expanded any more.

<Embodiment 10 (Embodiment of the 10th Invention)> (Main Structure / Operation of Embodiment 10) In this embodiment, a spacer is made of a conductor in the board mounting method according to the 9th invention. Also serves as a power supply path. The power is supplied through a path different from the signal line of the compression type connector.

(Effect of Tenth Embodiment) According to this embodiment,
Since the mechanism for compressing and fixing between the boards also serves as the power supply path, the space can be effectively used, and as a result, the packaging density of the system can be improved. Further, all the pins of the connector can be used for signal transmission, and there is little problem that the number of boards is limited due to insufficient current capacity.

(Specific Description of Tenth Embodiment) FIG. 24 is a diagram showing a board mounting method according to the present embodiment.

A power supply cable 120 connected to a power supply (not shown) is connected to a metal power supply bar 113 having a sufficiently small electric resistance with a washer 121 / a screw 122 or the like.
And the metallic spacer S0 is screwed vertically to the power supply bar 113. A hole is formed at a predetermined position in the termination board 118, and a pad 110 for supplying power to the board is formed around the hole. The termination board 118 is fixed and power is supplied by screwing the spacer S1 into the spacer S0 through the hole.

After that, the pad 110 for supplying power is also formed on the rigid substrate, and mounting is performed in the same manner as in Example 9 except that the spacer is made of metal. Spacer S0, S
, S2, ..., Power is supplied to each rigid substrate R0, R1, R2 ,.

Here, when power is supplied from a path other than the mechanism for compressing and fixing the substrates regardless of the present embodiment, especially in a system assembled in high density three-dimensionally, Although it becomes difficult to secure the space of the passage, according to the present embodiment, the mechanism for compressing and fixing the substrates also serves as the power supply passage, so that the space can be effectively used, and as a result, the system The packaging density of can be improved.

When the power is supplied through another path and another structure cannot be put in for some reason, the power is supplied from the signal line of the compression type connector for the signal. There was a problem that the number of boards that can be stacked cannot be increased too much because the number of cores that can be used is squeezed and a large current cannot flow.
If the present invention is applied, since the power supply is a separate path from the signal line of the compression type connector, all the pins of the connector can be used for signal transmission, and a metal spacer having a larger current capacity can be used, so There is little problem that the number of substrates is limited due to lack of capacity.

(2) Next, various embodiments of a method of three-dimensionally mounting a plurality of substrates vertically and horizontally will be described. <Embodiment 11 (embodiment of the eleventh invention)> (Embodiment 11) (Main Structure / Operation of Embodiment 11) In this embodiment, the first connecting means and the peripheral portion of the circuit board are arranged in a region avoiding the peripheral portion of the circuit board so as not to interfere with cooling. The second connecting means and the third connecting means having flexibility are provided. Since it is not essential that the first connecting means is arranged in the peripheral portion, the first connecting means can be added as needed. By connecting the second connecting means by the third connecting means, the third connecting means has flexibility when connecting between the adjacent boards in the direction of the board surface, so that a mounting error such as a positional deviation may occur. Absorb.

(Effect of Embodiment 11) According to this embodiment,
A very large number of wirings between the boards facing each other in parallel can be realized without hindering cooling. Further, destruction or contact failure due to stress concentration on the fixing portion due to soldering of the connecting means to the substrate or the like or the connecting portion between the second and third connecting means is prevented. Further, it becomes possible to allocate more inter-board wiring from the limited peripheral portion to the wiring between the boards adjacent to each other in the direction of the board surface.

(Specific Description of Embodiment 11) FIG. 25 is a diagram showing a board mounting method according to the present embodiment.
The connection means 201, the plurality of second connection means 202, the plurality of third connection means 203 and the plurality of spacers 204 are three-dimensionally connected to the 200 substrates.

In this embodiment, the first connecting means 201 for stacking the boards 200 is mounted in a region avoiding the peripheral portion of the circuit board 200. Since the first connecting means 201 are arranged in a line in the long direction of the substrate, when cooling is performed in the long direction of the substrate, there is an advantage that the airflow smoothly flows and the cooling is not hindered.

As the first connecting means 201, various types of connectors can be used.

FIG. 26 is a diagram showing a connector of the first type which is an example of the first connecting means 201 in this embodiment. The flexible substrate 214 is wound around the rubber 216, and by compressing the substrate interval to a specified length or less, it is possible to connect the substrates facing each other in substantially parallel. Of course, as the connector, the connectors of the first to ninth embodiments already described can be used.

FIG. 27 is a view showing a second type connector which is another example of the first connecting means 201 in this embodiment. A structure in which a thin metal wire or a carbon fiber 232 penetrates through a rubber 230 having a substantially rectangular parallelepiped shape, and by connecting the substrates to each other in a substantially parallel manner by compressing the substrate distance to a specified length or less, It can be performed.

FIG. 28 is a diagram showing a third type connector which is still another example of the first connecting means 201 in this embodiment. The rubber 216 having a substantially rectangular parallelepiped shape has a structure having a conductive portion 230 and an insulating portion 234, and by compressing the substrate distance to a prescribed length or less, a space between the substrates facing each other in substantially parallel is provided. The connection can be made.

FIG. 29 is a view showing a fourth type connector which is still another example of the first connecting means 201 in this embodiment. Rigid body case 2 with almost rectangular parallelepiped shape
A terminal 238 having a structure in which a thin metal wire having a contact portion slightly protruding like 238 in the drawing is rolled is penetrated through 36, and the board interval is compressed to a specified length or less. By doing so, it is possible to make a connection between the substrates facing each other substantially in parallel. FIG. 30 is a diagram showing a fifth type connector which is still another example of the first connecting means 201 in the present embodiment. A metal case 236 having a substantially rectangular parallelepiped shape has a structure in which a spring-like elastic metal terminal 242 having a contact portion slightly protruding as shown in FIG. By compressing the length to a specified length or less, it is possible to make a connection between the substrates facing each other substantially in parallel.

The crimp type connector as described above does not necessarily have to be arranged in the peripheral portion of the substrate, and a large number of two-piece type connectors can be simultaneously used even if the relative positions of the plurality of connectors are not exactly aligned. Since there is no problem that it does not fit well like the case of fitting, the connector of the first connecting means can be added as needed.

In the case of the compression type connector, since the first connecting means 201 connects the boards facing each other in parallel substantially by compressing the board interval to a specified length or less, the first connecting means 201 according to the present embodiment. Then, the substrate interval is set to a specified value by the spacer. FIG. 31 is a diagram showing an example of the spacer 204 in this embodiment. A female screw 242 is axially cut on one end of the hexagonal columnar body, and a female screw 241 is axially cut on the other end. Power can be supplied by making the spacer 204 metallic.

FIG. 32 shows the spacer 20 in this embodiment.
FIG. 6 is a diagram showing a state of substrate spacing compression using No. 4. By screwing the upper-layer spacers 204 into the lower-layer spacers 204, the substrate spacing is compressed to a specified value. By disposing this spacer 204 in the vicinity of the crimp type connector of the first connecting means 201, pressure is applied to the connector, and the connection between the facing substrates is generally established.

Here, the substrate usually has a slight warp from the original, and when a force is applied to the substrate as in this embodiment, the substrate is slightly deformed, which makes it difficult to treat the substrate as a perfect flat plate. Become. In addition, in the case where individual boards are fixed in such a manner that they are warped one by one, it is difficult to evenly screw in the spacers, and as a result, the position of the peripheral portion of the board is slightly different. While holding, the substrate adjacent to the substrate surface direction and the substrate periphery are aligned. further,
As shown in FIG. 25, the second connecting means 2 is provided around the substrate 200.
When No. 02 is mounted, the second connecting means 20 on the board 200 adjacent in the board surface direction due to a mounting error at the time of soldering.
In the case of connecting between 20 by the third connecting means 203, it is not possible to stably connect between adjacent substrates in the substrate surface direction unless the above various errors can be absorbed.

Therefore, in this embodiment, the third connecting means 20 is used.
3 has flexibility. FIG. 33 is a diagram showing an example of the third connecting means 203 used for mounting on the board according to the present embodiment. Surface mount type two-piece connectors 252 are soldered one by one to the rigid portions 250 at both ends of a small flexible rigid board 254 having a flexible central portion. The third connecting means 203 shown in FIG.
As shown in FIG. 25, the second connecting means 202 mounted on the peripheral portion of the substrate 200 is combined to realize the connection between the substrates adjacent in the substrate surface direction. Since the central portion of the third connecting means 203 is the flexible substrate 254, the above various errors are absorbed within a range where flexibility can be followed, and stable connection between the adjacent substrates in the substrate surface direction is realized.

(Modification of the 11th Embodiment) In the above-mentioned embodiment, the third connecting means to which the twelfth invention is applied to improve the adaptability to the positional deviation may be used.

FIG. 34 is a development view of the third connecting means 203 according to the modification, which is used for mounting on the board according to the eleventh embodiment.

Here, the rigid parts 262A and 262B at both ends are provided with surface mount connectors 260A and 2A, respectively.
Although 60B is mounted and the central portion is flexible, it is the same as the previous example, but the third connecting means 203 of the present embodiment is improved in terms of error absorbing capability. If wiring is passing through the flexible part 266 at a very high density, or if E
In the case where there is a ground surface as a countermeasure against MI, the flexibility becomes dull even though it is a flexible substrate. Therefore, the structure shown in FIG. 33 may not be able to completely absorb the error.

Therefore, in the case of this embodiment, four bent portions 264a, 264b, 264c and 264d are provided so that errors in various directions can be absorbed. FIG.
FIG. 35 is a diagram showing a three-dimensional structure when the third connecting means 203 shown in FIG. 34 is mounted. When the bent portions 264a and 264c are valley-folded and the bent portions 264b and 264d are mountain-folded, the shape shown in the figure is obtained. The connector 260A mounted on the rigid portion 262A is integrated with the second connecting means 202A on the main rigid board 200A, and the connector 260B mounted on the rigid portion 262B is connected on the main rigid board 200B. Means 20
Combined with 2B.

In the bent state as described above, the bent portion 264 is formed even if the flexible portion is slightly hardened.
Since b and the bent portion 264c are in the twisted position with respect to each other, it is possible to simultaneously absorb fairly large errors in various directions. Specifically, the bent portion 264b is formed on the rigid substrate 200.
The bent portion 264c absorbs the step difference in the vertical direction d5 of A and the rigid substrate 200B, and the bent portion 264c causes the horizontal deviation d4 of the rigid substrate 200A and the rigid substrate 200B and the relative connection between the second connecting means 202A and the second connecting means 202B. The error d6 due to the rotation from the parallel position is absorbed.

<Embodiment 12 (Embodiment of the 13th invention)> (Main structure and operation of Embodiment 12) In this embodiment, the directivity is such that cooling is not hindered in the area avoiding the peripheral portion of the circuit board. In the electronic system implemented by the first connecting means arranged with a plurality, the second connecting means in the peripheral portion of the circuit board, and the third connecting means having flexibility, an n-dimensional torus or an n-dimensional mesh shape is provided. The inter-node connection and the inter-node connection by the coupling topology with a diameter smaller than the torus or mesh using the wiring in the board are the components.

It is possible to increase the number of wirings between the adjacent substrates, and the connection form has good compatibility with the n-dimensional torus or the n-dimensional mesh from the viewpoint of the wiring distance. Also, since it is possible to provide a large number of wirings between the substrates facing each other,
A large number of nodes can be mounted inside the board, and the nodes can be tightly coupled using the wiring inside the board without being restricted by the pin neck.

(Effect of Embodiment 12) According to this embodiment,
A torus or mesh-shaped inter-node connection based on adjacent connection can realize a short wiring distance while using many wirings. Compared with the case of connecting torus or mesh in the board, the diameter of the connecting network can be shortened without increasing the wiring between the boards, and if the communication inside the board becomes faster, the parallel computer This leads to higher processing speed.

(Specific Description of Twelfth Embodiment) FIG. 36 is a diagram showing inter-node connections in a board in a board mounting method according to the present embodiment. Each node 0 to 7 has N, S,
It has seven ports of E, W, U, D, and X, and a one-dimensional torus is constructed by connecting ports N and S between adjacent nodes by internal wiring of the board.

The W port of the node 0 is used as the second connecting means CW0 in the peripheral portion of the substrate, the E port is used as the second connecting means CE0 in the peripheral portion of the substrate, and the U port is used as the second connecting means CU0 in the central portion of the substrate. , D port is connected to the second connecting means CD0 at the center of the back surface of the substrate. Similarly, W of node i (i = 1 to 7)
The port is the second connecting means CWi in the peripheral portion of the substrate, the E port is the second connecting means CEi in the peripheral portion of the substrate, the U port is the second connecting means CUi in the central portion of the substrate, and the D port is the rear central portion of the substrate. The second connecting means CDi of the part.

By performing the inter-substrate connection using the first connecting means and the inter-substrate connection using the second and third connecting means by the above connection, a three-dimensional torus or three-dimensional mesh can be realized. ing.

Further, the port X of each node is connected to the crossbar switch by the wiring inside the board. As a result, all connections to the crossbar switch are handled by the wiring inside the board, which eliminates the generation of cables due to the pin neck of the connector and the mismatch of the topology of the crossbar connection and the position where the node is mounted. The reduction in diameter is achieved without undue implementation difficulty.

As a result of the above, the diameter of the connection between the nodes on the board was 4 in the case of a simple torus, whereas in the case of this embodiment using a crossbar switch, the diameter is 1, which is significantly large. The communication performance is improved.

<Embodiment 13 (Embodiment of the 14th invention)
(Main Configuration / Operation of Thirteenth Embodiment) In the present embodiment, the first connection means and the periphery of the circuit board are arranged in a region avoiding the peripheral portion of the circuit board so as not to interfere with cooling. In the electronic system implemented by the second connecting means of the section and the third connecting means having flexibility, when connecting the nodes in a topology including an n-dimensional torus-like connection, a circuit in which a plurality of nodes are one The third connecting means connects between the second connecting means such that the adjacent nodes are on the adjacent boards in the direction of the board surface, and the remaining one is dimensionally related to the remaining one. Adjacent nodes are arranged so that they are on the upper or lower two substrates, and the inter-node connection wiring is skipped by one.

The number of connections using the peripheral portion of the substrate is half that in the case of realizing the torus connection by using the skipped wiring. Wiring in the direction perpendicular to the substrate surface can be increased by arranging a large number of first connecting means as compared with the case of using the peripheral portion of the substrate. It is easy to deal with the doubling of the number of inter-wirings.

(Effect of Embodiment 13) According to this embodiment,
While saving wiring between boards in the direction of the board surface, a ring can be formed only by regular wiring between adjacent boards in the direction perpendicular to the board surface, so that a cable is not required.
You can implement a dimensional torus.

(Specific Description of Embodiment 13) FIG. 37 is a diagram showing the appearance of connection in the board surface direction in the board mounting method according to this embodiment.

In the present embodiment, 16 trapezoidal substrates 200 having the in-board node connection shown in FIG. 36 whose sides on which the second connecting means 202 are mounted are not parallel are prepared. The second connecting means on the substrates adjacent in the direction are connected by the third connecting means 203. The cooling fan 2 is provided near the side where the second connecting means 202 of the board is not mounted.
70 is arranged, and an airflow is made to flow in the direction of the row of the first connecting means in the central portion of the substrate for cooling.

FIG. 38 is a diagram showing the connection relationship of the nodes 280 in the connection in the board surface direction of FIG. In this figure, the connection by the crossbar switch in the substrate is omitted. In this way, the intra-board link 282 is provided between the nodes.
It can be seen that the two-dimensional torus connection of the 8 × 16 structure including the inter-substrate link 284 is made.

It is possible to mount the three-dimensional torus by stacking the planes of the two-dimensional torus mounted in the donut shape constructed as described above in the direction perpendicular to the substrate surface via the first connecting means. Think

FIG. 39 is a diagram showing the physical connection relationship in the direction perpendicular to the board surface in the board mounting method according to the present embodiment. Horizontal links are indicated by dotted lines,
This corresponds to the link shown in FIG. From the nodes 300, 301 to the board surface direction via the second connecting means 202, the third connecting means 203 arranged in the peripheral portion of the board 200, and the second connecting means 202 of the board adjacent in the board surface direction. It is connected to the nodes 300 and 301 at the same position on the adjacent boards 200.

Wirings for realizing jumping of one sheet are provided on the substrate in a direction perpendicular to the substrate surface. By stacking the substrates through the first connecting means 201, all the diagonal lines on the two or two lower substrates except the uppermost or lowermost substrate 200 are provided in the direction perpendicular to the substrate surface. Nodes 300 are connected with shaded nodes, and nodes 301 filled with black are connected with nodes filled with black.

A vertical short circuit substrate 304 provided with a deformation preventing means 302 is used above the uppermost substrate and below the lowermost substrate in the direction perpendicular to the substrate surface, and the uppermost substrate 200 is
The lowermost substrate 200 is connected to the node on the lower substrate, and the lowermost substrate 200 is connected to the node on the upper substrate.

As described above, since the wiring is skipped one by one, the wiring for two links passes through the first connecting means 201. In other words, in the horizontal direction, only one link per node in the board passes through the second connecting means 202, so that it is understood that the vertical direction is realized by using the double wiring in the horizontal direction. . In the horizontal direction, the length of the peripheral portion of the substrate is limited, and thus the number of the second connecting means 202 cannot be increased so much. In the vertical direction, the number of the first connecting means 202 is relatively large by arranging the first connecting means on the substrate. Wiring can be easily realized.

Thus, in exchange for using twice the horizontal wiring in the vertical direction, the uppermost vertical short circuit board is removed, a free number of boards are inserted in its place, and the vertical short circuit board is finally attached. This makes it possible to freely select the number of substrates to be stacked.

FIG. 40 is a diagram showing a logical connection relationship between nodes in the board mounting shown in FIG. When the ring of eight nodes 300 and 301 is formed in the vertical direction and the two-dimensional torus is formed in the horizontal direction on the substrate surface, the vertical link 310 and the horizontal link 311 as a whole. Consisting of 16x
It can be seen that a three-dimensional torus of 8 × 8 configuration was formed.

<Embodiment 14 (Embodiment of Fifteenth Invention)> (Main Structure / Operation of Embodiment 14) In this embodiment, there is a directivity that does not hinder cooling in a region avoiding the peripheral portion of the circuit board. In the electronic system implemented by the first connecting means arranged in a fixed manner, the second connecting means in the peripheral portion of the circuit board, and the third connecting means having flexibility, an n-dimensional torus-like connection is included. When connecting nodes in a topology, multiple nodes are mounted on one circuit board so that adjacent nodes in one dimension are on adjacent boards in the direction of the board surface or on boards facing each other substantially in parallel. The second connecting means is connected by the third connecting means, and with respect to the remaining one dimension, the adjacent nodes are arranged so that the adjacent nodes are located on the substrate four sheets above or four sheets below, and the connection between the nodes skipping three sheets. Have wiring.

The number of connections using the peripheral portion of the substrate is half that in the case of realizing the torus connection by using the skipped wiring. Wiring in the direction perpendicular to the substrate surface can be increased by arranging a large number of first connecting means as compared with the case where the peripheral portion of the substrate is used. It is easy to deal with the doubling of the number of inter-wirings.

(Effect of Embodiment 14) According to this embodiment,
While saving wiring between boards in the direction of the board surface, a ring can be formed only by regular wiring between adjacent boards in the direction perpendicular to the board surface, so that a cable is not required.
You can implement a dimensional torus. It becomes possible to select the number of substrates either in the direction horizontal to the substrate surface or in the direction vertical to the substrate surface. Therefore, it is possible to easily realize a parallel computer including an n-dimensional torus coupling having various numbers of units for each dimension with the same type of board.

(Specific Description of Embodiment 14) FIG. 41 is a diagram showing a physical connection relationship in a direction perpendicular to a board surface in a board mounting method according to the present embodiment. Horizontal links are indicated by dotted lines. In the case of a substrate that is not located at the end in the direction horizontal to the substrate surface, the nodes 300, 30
1 to the second connecting means 20 arranged on the periphery of the substrate
The second and third connecting means 203 and the second connecting means 202 of the board adjacent to the board surface direction are connected to the nodes 300 and 301 at the same position of the board adjacent to the board surface direction.

In the case of the substrate at the end in the direction horizontal to the substrate surface, the second substrate arranged from the node to the peripheral portion of the substrate.
Via the connecting means 202, the horizontal short-circuit board 320, and the second connecting means 202 of the adjacent boards facing each other substantially in parallel, and connected to the node at the same position of the adjacent board facing each other in substantially parallel.

FIG. 42 is a development view of a horizontal short-circuit board according to the present embodiment with an increased ability to adapt to positional deviation. Both ends are rigid parts 321A and 321B, and connectors 322A and 322B are mounted there. Horizontal short circuit board 3
20 has a flexible portion 324 having flexibility in the central portion similarly to the third connecting means 303. The bent portions 323a, 323b, 323c at the three locations are connected to the flexible portion 324.
To have.

FIG. 43 is a diagram showing a three-dimensional structure of the horizontal short circuit board 320 of FIG. 42 in a mounted state. Bent portions 323a, 323b, 323 at three twist positions
It is possible to absorb various positional deviations between the second connecting means mounted on the substrates facing each other by c.

As described above, the ring formation between the nodes in the substrate surface direction is performed by the two substrate surfaces.

With respect to the direction vertical to the substrate surface, the line shown by the thick solid line in FIG. 41 is a link, and the substrate is provided with wiring that realizes skipping of three in the direction perpendicular to the substrate surface. . By stacking via the first connecting means, basically four sheets or four sheets are provided in the direction perpendicular to the substrate surface.
The shaded nodes on the substrate under the sheet are connected to each other by the shaded nodes, and the nodes filled with black are connected to each other filled with black.

A vertical short circuit substrate having deformation preventing means is used above the uppermost substrate and below the lowermost substrate in the direction perpendicular to the substrate surface, and the nodes on the uppermost substrate are from the top. Connected to the node on the third board, the node on the second board from the top is connected to the node on the fourth board from the top, and the node on the bottom board is the third The second lowest node is connected to the fourth lowest node.

FIG. 44 is a diagram showing a logical connection relationship between nodes in the board mounting shown in FIG. When eight pieces are stacked in a direction perpendicular to the substrate surface, a ring composed of four nodes 300 and 301 is formed. In the figure, 310 is a vertical link and 311 is a horizontal link.

As described above, since the wiring for skipping three sheets is provided, the wiring for four links passes through the first connecting means. That is, one node per board in the horizontal direction
Since the link of the book only passed through the second connecting means, it can be seen that the vertical direction is realized by using four times the horizontal wiring.

The number of the second connecting means cannot be increased so much in the horizontal direction because there is a limit to the length of the peripheral portion of the substrate, whereas in the vertical direction, a large number of the first connecting means are arranged on the substrate for comparison. Many wirings can be easily realized.

In this way, the uppermost vertical short circuit board is removed in exchange for the use of four times the horizontal wiring in the vertical direction. By attaching the vertical short circuit board to
It is possible to freely select the number of substrates to be stacked.

As for the direction horizontal to the substrate surface, Example 1
In No. 3, the number of substrates in the horizontal direction was fixed if the shape of the substrates was determined. However, in the present embodiment, the horizontal short circuit board at the end is removed and the desired number of columns are expanded horizontally by the third connecting means in exchange for using four times the horizontal wiring in the vertical direction. By attaching horizontal short-circuit boards to the ends and stacking them vertically by the first connecting means, it is possible to freely change the number of boards in the horizontal direction.

The present invention is not limited to the above-described embodiments, but can be variously modified and implemented without departing from the scope of the invention.

[0221]

【The invention's effect】

(1) According to the connector of the first aspect of the invention, the terminals are two-dimensionally arranged on both ends of the flexible substrate, so that the area is small, the cost is low, and the processing precision is not so high. An extremely large number of board-to-board stacking connections with controlled impedance can be realized.

According to the board mounting method of the ninth invention,
It is possible to maintain stable connection with a small amount of force in realizing it and increase the expandability of the inter-board connection and the power supply in the board stacking direction.

(2) According to the board mounting method of the eleventh invention, a very large number of wirings between the boards facing each other in parallel can be realized without hindering cooling. Further, destruction or contact failure due to stress concentration on the fixing portion due to soldering of the connecting means to the substrate or the like or the connecting portion between the second and third connecting means is prevented. Further, it becomes possible to allocate more inter-board wiring from the limited peripheral portion to the wiring between the boards adjacent to each other in the direction of the board surface.

According to the board mounting method of the twelfth invention, in the case where the wiring is passed through at a very high density and the flexible portion of the connecting means has a little flexibility due to a ground surface or the like. However, it is possible to realize the inter-board connection capable of absorbing a considerably large error in various directions at the same time, and it is possible to achieve the connection stability even when a large number of connections are three-dimensionally mounted by a large number of connection means.

[Brief description of drawings]

FIG. 1 is a diagram showing a connector according to a first embodiment.

FIG. 2 is a development view of a flexible board that constitutes the connector of FIG.

FIG. 3 is a view showing an example of a rubber portion having bumps which constitutes the connector of FIG.

FIG. 4 is a view showing an example of a flat rubber portion which constitutes the connector of FIG.

5 is a diagram showing a mounting state of a board using the connector of FIG.

FIG. 6 is a cross-sectional view of a connection portion in a state where no pressure is applied.

FIG. 7 is a cross-sectional view of the connection portion under pressure.

FIG. 8 is a diagram showing a flexible board portion of the connector according to the second embodiment.

FIG. 9 is a diagram showing a flexible substrate that constitutes a connector according to a third embodiment.

FIG. 10 is a diagram showing a connector according to a third embodiment.

FIG. 11 is a diagram showing a wiring pattern of a third layer of a four-layer flexible substrate which constitutes a connector according to a modification of the third embodiment.

FIG. 12 is a diagram showing a wiring pattern of a second layer of a four-layer flexible substrate that constitutes the connector according to the modification.

FIG. 13 is a diagram showing a wiring pattern of a first layer of a four-layer flexible substrate which constitutes a connector according to the modification.

FIG. 14 is a cross-sectional view showing a three-dimensional structure of a four-layer flexible substrate that constitutes a connector according to the modification.

15 is a diagram showing a connector using the four-layer flexible substrate of FIG.

FIG. 16 is a diagram showing a connector according to a fourth embodiment.

17 is a diagram showing a method of mounting a board using the connector of FIG.

FIG. 18 is a diagram showing that even if the connector of FIG. 16 is deformed by tilted pressure, a correct connection can be made.

FIG. 19 is a diagram showing a flexible board that constitutes a connector according to a fifth embodiment.

FIG. 20 is a diagram showing a connector according to a fifth embodiment.

FIG. 21 is a sectional view of a rubber portion of the connector according to the seventh embodiment.

FIG. 22 is a sectional view of a rubber portion of the connector according to the eighth embodiment.

FIG. 23 is a diagram showing a board mounting method according to a ninth embodiment.

FIG. 24 is a diagram showing a board mounting method according to the tenth embodiment.

FIG. 25 is a diagram showing a board mounting method according to the eleventh embodiment.

FIG. 26 is a view showing a connector of a first type which is an example of first connecting means.

FIG. 27 is a view showing a second type connector which is an example of the first connecting means.

FIG. 28 is a view showing a third type connector which is an example of the first connecting means.

FIG. 29 is a view showing a fourth type connector which is an example of a first connecting means.

FIG. 30 is a view showing a fifth type connector which is an example of the first connecting means.

FIG. 31 is a diagram showing an example of a spacer.

FIG. 32 is a diagram showing a state of substrate spacing compression using spacers.

FIG. 33 is a diagram showing an example of third connecting means according to the eleventh embodiment.

FIG. 34 is a view showing another example of the third connecting means according to the modified example of the eleventh embodiment.

FIG. 35 is a diagram showing a three-dimensional structure of the third connecting means of FIG. 34 at the time of mounting.

FIG. 36 is a diagram showing inter-node connections in the board in the board mounting method according to the twelfth embodiment.

FIG. 37 is a diagram showing the appearance of connections in the board surface direction in the board mounting method according to the thirteenth embodiment.

38 is a diagram showing the connection relationship of the nodes in the connection in the board surface direction of FIG. 37.

FIG. 39 is a view showing the physical connection relationship in the direction perpendicular to the board surface in the board mounting method according to the thirteenth embodiment.

FIG. 40 is a diagram showing a logical connection relationship between nodes in the board mounting shown in FIG. 39.

FIG. 41 is a view showing the physical connection relationship in the direction perpendicular to the board surface in the board mounting method according to the fourteenth embodiment.

FIG. 42 is a development view of a horizontal short circuit board according to a fourteenth embodiment with improved adaptability to positional deviation.

43 is a diagram showing a three-dimensional structure of the horizontal short-circuit board of FIG. 42 in a mounted state.

FIG. 44 is a diagram showing a logical connection relationship between nodes in the board mounting shown in FIG. 41.

[Explanation of symbols]

2, 2 '' ... connector, 4,4 '... flexible board part,
6 ... Rubber part, 8 ... Hole, 10 ... Terminal, 12 ... Wiring, 14 ...
Insulation coating, 16 ... End, 18 ... Rubber, 20 ... Hole, 22 ...
Terminal pressure enhancing protrusions, 24 ... Holes, 26 ... Upper surface, 28 ... Lower surface, 30 ... Rigid printed circuit board, 32 ... Penetration screw, 3
4 ... Terminator, 36 ... Nut, 38 ... Terminal, 40
... hole, 42 ... terminal, 44 ... wiring, 46 ... insulating film,
48 ... Ends, 51, 52 ... Terminals, 54 ... Wiring, 56 ... Rubber parts, 57, 58 ... Terminals, 60 ... Wiring layers, 61, 62 ...
Terminals, 64 ... Wiring layers, 65, 66 ... Terminals, 68 ... Wiring layers, 69 ... Wiring layers, 70 ... Adhesive layers, 71 ... Through holes, 72 ... Connectors, 74 ... Flexible boards, 76 ...
Rubber portion, 78 ... Rigid substrate, 80 ... Terminal, 82 ... Wiring, 84 ... Terminal, 86 ... Hole, 88 ... End portion, 90 ... Rod-shaped metal, 92 ... Flexible substrate, 94 ... Flexible substrate, 96 ... Rubber portion, 100 ... terminals, 102 ... wiring, 10
4 ... Single-sided flexible substrate, 106 ... Hole, 108 ... Rod-shaped metal, 109 ... Tip part, 110 ... Pad, 112 ... Base, 113 ... Power supply bar, 114 ... Single-sided flexible substrate, 116 ... Deformation preventing member, 118 ... Termination Board, 120 ... power supply cable, 121 ... washer, 122 ... screw, 124 ... double-sided flexible board,
132 ... connector, 134 ... 4-layer flexible substrate, 1
36 ... Rubber part, U1, U2, D1, D2 ... Positioning protrusion, HU1, HU2, HD1, HD2 ... Hole, S0-S4
... Spacer, C1-C3 ... Connector, R1-R3 ... Rigid board

Claims (4)

[Claims] 1. A rubber-like elastic body having an upper end surface and a lower end surface that are substantially flat and substantially parallel to each other, a substrate portion whose both ends are connected to the upper end surface and the lower end surface of the elastic body, and both ends of the substrate portion. A plurality of terminals that are two-dimensionally arranged on the board, and a terminal that is provided at one end of the board and a terminal that is provided at the other end corresponding to the terminal, respectively. A connector comprising: a flexible substrate having a plurality of wirings. 2. A board mounting method in which a connector is sandwiched between boards facing each other substantially in parallel and pressure-bonded by applying pressure, and a screw structure is provided on both ends of the connector to define a board interval according to the size of the connector. A first spacer having a space between the substrates is inserted substantially perpendicularly to the substrates, and one substrate is sandwiched by a second spacer having the same structure as the first spacer, A substrate mounting method, characterized in that one end of one of the first and second spacers sandwiching one substrate is screwed into the other end of the other spacer. 3. A first connecting means arranged in a region avoiding a peripheral portion of each circuit board so as to have a direction that does not hinder cooling, so that the circuit boards facing each other are connected so as to face each other substantially in parallel, By connecting the second connecting means provided in the peripheral portion of each circuit board by the third connecting means having flexibility, connecting between adjacent boards in the direction of the board surface of the circuit board. A board mounting method characterized by the above. 4. The board mounting method according to claim 3, wherein the third connecting means is a flexible board having a plurality of bent portions which are in a positional relationship of being twisted with each other.