JP2012151126A - Connector - Google Patents

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JP2012151126A
JP2012151126A JP2012084878A JP2012084878A JP2012151126A JP 2012151126 A JP2012151126 A JP 2012151126A JP 2012084878 A JP2012084878 A JP 2012084878A JP 2012084878 A JP2012084878 A JP 2012084878A JP 2012151126 A JP2012151126 A JP 2012151126A
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conductor
film
elastic body
contact portion
conductor contact
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Katsumi Arai
勝巳 荒井
Hiroshi Akimoto
比呂志 秋元
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Japan Aviation Electronics Industry Ltd
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Japan Aviation Electronics Industry Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a connector which can be made at a high density.SOLUTION: A film 7 is adhered to an almost belt-like elastic body 206. A first conducting path 208 and a second conducting path 209 are provided at an equal interval along a longitudinal direction L of the elastic body 206. The first conducting path 208 is constituted with a first conductor film 280, first and second conductor contact parts 281, 282, and first and second vias 283, 284. The first conductor contact part 281 can contact an electronic component 21. The second conductor contact part 282 can contact a printed circuit board 22. The first and second vias 283, 284 penetrate through the film 7, and couples the first and second conductor contact parts 281, 282 with the first conductor film 280. The second conducting path 209 is provided on a surface of the film 7, and extends from one end to the other end in a width direction W. A third conductor contact part 291 which can contact the electronic component 21 is provided at one end of the second conducting path 209, and a fourth conductor contacting part 292 which can contact the printed circuit board 22 is provided at the other end.

Description

この発明はコネクタに関し、2つの接続対象物間に配置してその接続対象物同士を電気的に接続するコネクタに関する。   The present invention relates to a connector, and relates to a connector that is disposed between two connection objects and electrically connects the connection objects.

従来、コンタクト部材とインシュレータとを備えているコネクタが知られている(下記特許文献1参照)。   Conventionally, a connector including a contact member and an insulator is known (see Patent Document 1 below).

コンタクト部材は弾性体とフィルムと導体部とを有する。   The contact member has an elastic body, a film, and a conductor portion.

弾性体はほぼ板状であり、その幅方向(弾性体の長手方向及び厚さ方向のそれぞれに直交する方向)で2つの接続対象物に挟まれる。弾性体は保持面と基面とを有する。保持面は弾性体の厚さ方向の一端側の面であり、ほぼ湾曲している。基面は弾性体の厚さ方向の他端側の面であり、ほぼ平坦である。   The elastic body is substantially plate-shaped, and is sandwiched between two connection objects in the width direction (direction orthogonal to the longitudinal direction and the thickness direction of the elastic body). The elastic body has a holding surface and a base surface. The holding surface is a surface on one end side in the thickness direction of the elastic body and is substantially curved. The base surface is a surface on the other end side in the thickness direction of the elastic body and is substantially flat.

フィルムは弾性体の保持面に貼り付けられている。   The film is attached to the holding surface of the elastic body.

フィルム上には複数のベルト状の導体部が形成されている。導体部は弾性体の幅方向へ延びるとともに、弾性体の長手方向に沿って等間隔に並べられている。   A plurality of belt-like conductor portions are formed on the film. The conductor portions extend in the width direction of the elastic body and are arranged at equal intervals along the longitudinal direction of the elastic body.

インシュレータは複数の保持孔を有する。保持孔にはコンタクト部材が挿入され、保持される。   The insulator has a plurality of holding holes. A contact member is inserted and held in the holding hole.

このコネクタを使用するには、まず、コネクタを2つの接続対象物の間に配置する。   In order to use this connector, first, the connector is disposed between two connection objects.

次に、コネクタのコンタクト部材が少し潰れるまで接続対象物同士を互いに近づける。   Next, the connection objects are brought close to each other until the contact members of the connector are slightly crushed.

最後に、コンタクト部材が少し潰れた状態を維持するためにボルト、ナット等の適宜の結合手段によって接続対象物同士を結合する。   Finally, in order to maintain the contact member in a slightly crushed state, the objects to be connected are coupled by appropriate coupling means such as bolts and nuts.

その結果、コンタクト部材の導体部が接続対象物のパッドに押し付けられ、この導通部を介して接続対象物同士が電気的に接続される。   As a result, the conductor part of the contact member is pressed against the pad of the connection object, and the connection objects are electrically connected to each other through the conductive part.

特開2006−310140号公報(段落0022〜0026、図1、2参照)JP 2006-310140 A (see paragraphs 0022 to 0026, FIGS. 1 and 2)

上述のコネクタでは、フィルムの表面に形成された導電路の数を増やすのが困難であり、近年の導電路の高密度化の要請に応えることができない。   In the above-described connector, it is difficult to increase the number of conductive paths formed on the surface of the film, and it cannot meet the recent demand for higher density of conductive paths.

この発明はこのような事情に鑑みてなされたもので、その課題は導体部の高密度化を達成することができるコネクタを提供することである。   This invention is made | formed in view of such a situation, The subject is providing the connector which can achieve the high density of a conductor part.

前述の課題を解決するため請求項1の発明のコンタクト部材は、ほぼ帯状の弾性体と、前記弾性体に貼付されたフィルムと、前記弾性体の長手方向に沿って所定間隔に形成される複数の導電路とを備え、前記弾性体の厚さ方向と前記弾性体の長手方向とのそれぞれに直交する前記弾性体の幅方向で前記弾性体を挟むよう配置される2つの接続対象物を電気的に接続するためのコンタクト部材において、前記複数の導電路は、第1の導電路と第2の導電路とで構成され、前記第1の導電路は、前記弾性体と前記フィルムとの間に設けられ、前記弾性体の幅方向の一端から他端へ延びる第1の導体膜と、前記フィルムに設けられ、前記2つの接続対象物の一方の接続対象物に接触可能な第1の導体接触部と、前記フィルムに設けられ、前記2つの接続対象物の他方の接続対象物に接触可能な第2の導体接触部と、前記フィルムを貫通し、前記第1の導体接触部と前記第1の導体膜の一端部とを結合させる第1の導体結合部と、前記フィルムを貫通し、前記第2の導体接触部と前記第1の導体膜の他端部とを結合させる第2の導体結合部とを有し、前記第2の導電路は、前記フィルムの表面に設けられ、前記第1の導体接触部の近傍から前記第2の導体接触部の近傍へ延びる第2の導体膜と、前記第2の導体膜の一端部に設けられ、前記2つの接続対象物の一方の接続対象物に接触可能な第3の導体接触部と、前記第2の導体膜の他端部に設けられ、前記2つの接続対象物の他方の接続対象物に接触可能な第4の導体接触部とを有し、前記第1の導体接触部と前記第3の導体接触部と間、前記第2の導体接触部と前記第4の導体接触部との間に、それぞれ隙間が形成されていることを特徴とする。   In order to solve the above-mentioned problem, the contact member of the invention of claim 1 is a plurality of belt-like elastic bodies, a film affixed to the elastic bodies, and a plurality of contacts formed along the longitudinal direction of the elastic bodies. Two connection objects that are arranged so as to sandwich the elastic body in the width direction of the elastic body orthogonal to the thickness direction of the elastic body and the longitudinal direction of the elastic body. In the contact member for connection, the plurality of conductive paths are composed of a first conductive path and a second conductive path, and the first conductive path is between the elastic body and the film. A first conductor film that extends from one end to the other end in the width direction of the elastic body, and a first conductor that is provided on the film and that can contact one of the two connection objects. A contact portion and the film, the two A second conductor contact portion that can contact the other connection object of the connection object, and a first that penetrates the film and connects the first conductor contact portion and one end portion of the first conductor film. And a second conductor coupling portion that penetrates through the film and couples the second conductor contact portion and the other end of the first conductor film. A path is provided on the surface of the film, and is provided at a second conductor film extending from the vicinity of the first conductor contact portion to the vicinity of the second conductor contact portion, and at one end of the second conductor film. A third conductor contact portion capable of contacting one of the two connection objects, and the other connection of the two connection objects, provided on the other end of the second conductor film. A fourth conductor contact portion capable of contacting an object, and between the first conductor contact portion and the third conductor contact portion, Between the serial and the second conductor contact portion and the fourth conductive contact portions, respectively, characterized in that a gap is formed.

請求項2の発明のコネクタは、請求項1記載のコンタクト部材と、前記弾性体の幅方向の両端部が露出するように前記コンタクト部材を保持するフレームとを備えていることを特徴とする。   A connector according to a second aspect of the invention includes the contact member according to the first aspect and a frame that holds the contact member so that both end portions in the width direction of the elastic body are exposed.

この発明によれば、導電路の高密度化を達成することができる。   According to the present invention, it is possible to achieve high density of the conductive path.

図1はこの発明の実施形態の理解を容易にするための第1の参考例のコネクタの斜視図である。FIG. 1 is a perspective view of a first reference connector for facilitating understanding of an embodiment of the present invention. 図2は図1のA部の拡大断面図である。FIG. 2 is an enlarged cross-sectional view of a portion A in FIG. 図3は図1に示すコネクタのコンタクト部材を示し、同図(a)は正面図、同図(b)は平面図、同図(c)は同図(a)のIIIC−IIIC線に沿う断面図である。3 shows a contact member of the connector shown in FIG. 1. FIG. 3A is a front view, FIG. 3B is a plan view, and FIG. 3C is taken along the line IIIC-IIIC in FIG. It is sectional drawing. 図4は図1に示すコネクタに電子部品及びヒートシンクを装着する前の状態を示す斜視図である。4 is a perspective view showing a state before the electronic component and the heat sink are attached to the connector shown in FIG. 図5は図1に示すコネクタの使用状態を示す断面図である。FIG. 5 is a cross-sectional view showing a usage state of the connector shown in FIG. 図6はこの発明の実施形態の理解を容易にするための第2の参考例のコネクタのコンタクト部材を示し、同図(a)は正面図、同図(b)は平面図、同図(c)は同図(a)のVIC−VIC線に沿う断面図である。FIG. 6 shows a contact member of a connector of a second reference example for facilitating understanding of the embodiment of the present invention. FIG. 6 (a) is a front view, FIG. 6 (b) is a plan view, and FIG. c) is a sectional view taken along the line VIC-VIC in FIG. 図7はこの発明の一実施形態に係るコネクタのコンタクト部材を示し、同図(a)は正面図、同図(b)は平面図、同図(c)は同図(a)のVIIC−VIIC線に沿う断面図である。7A and 7B show a contact member of a connector according to an embodiment of the present invention. FIG. 7A is a front view, FIG. 7B is a plan view, and FIG. 7C is a VIIC- in FIG. It is sectional drawing which follows a VIIC line.

以下、この発明の実施の形態を図面に基づいて説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

この発明の実施形態の理解を容易にするために、まず、図1〜図6に基づいて第1、第2の参考例について説明する。   In order to facilitate understanding of the embodiment of the present invention, first and second reference examples will be described based on FIGS.

図1、2に示すように、この第1の参考例のコネクタ1はフレーム3と複数のコンタクト部材5と備えている。コネクタ1は平面実装型のLSI等の電子部品(接続対象物)21とプリント基板(接続対象物)22とを電気的に接続する(図4、図5参照)。   As shown in FIGS. 1 and 2, the connector 1 of the first reference example includes a frame 3 and a plurality of contact members 5. The connector 1 electrically connects an electronic component (connection object) 21 such as a planar mounting type LSI and a printed circuit board (connection object) 22 (see FIGS. 4 and 5).

フレーム3は収容凹部3aを有する。収容凹部3aの底部には複数の保持孔3bが形成されている。複数の保持孔3bは2次元配列されている。保持孔3bは収容凹部3aの底部を貫通する。保持孔3bにはコンタクト部材5が挿入されている。保持孔3bに保持されたコンタクト部材5の上端部と下端部とはそれぞれ収容凹部3aの底部の上面と下面とからそれぞれ突出している(図2、図4参照)。   The frame 3 has an accommodation recess 3a. A plurality of holding holes 3b are formed at the bottom of the housing recess 3a. The plurality of holding holes 3b are two-dimensionally arranged. The holding hole 3b penetrates the bottom of the housing recess 3a. A contact member 5 is inserted into the holding hole 3b. The upper end portion and the lower end portion of the contact member 5 held in the holding hole 3b respectively protrude from the upper surface and the lower surface of the bottom portion of the housing recess 3a (see FIGS. 2 and 4).

フレーム3の下面には位置決めボス3cが形成されている(図5参照)。位置決めボス3cはプリント基板22に形成された位置決め孔22bに挿入され、コネクタ1がプリント基板22に対して位置決めされる。   A positioning boss 3c is formed on the lower surface of the frame 3 (see FIG. 5). The positioning boss 3 c is inserted into a positioning hole 22 b formed in the printed board 22, and the connector 1 is positioned with respect to the printed board 22.

コンタクト部材5は図3(a)〜(c)に示すように弾性体6とフィルム7と複数の導電路8とを有する。   As shown in FIGS. 3A to 3C, the contact member 5 has an elastic body 6, a film 7, and a plurality of conductive paths 8.

弾性体6は絶縁材料で形成され、ほぼ帯状であり、弾性体6の幅方向W(弾性体6の長手方向L及び厚さ方向Tのそれぞれに直交する方向)で電子部品21とプリント基板22とで挟まれる。弾性体6の正面には湾曲面6aが形成され、弾性体6の背面には平坦面6bが形成されている。弾性体6の断面形状はほぼD字形である。弾性体6の上部及び下部にはそれぞれ切欠き6cが等間隔に形成されている。切欠き6cは互いに隣接する導電路8の間に位置する。切欠き6cによって弾性体6の上部及び下部に独立変位部6dが形成される。独立変位部6dは独立して変位可能な部分である。弾性体6の材料(絶縁材料)としては、例えばシリコンゴム、シリコンゲル等のエラストマがある。弾性体6の平坦面6bには補強板10が埋め込まれている。   The elastic body 6 is formed of an insulating material and has a substantially band shape. The electronic component 21 and the printed board 22 are formed in the width direction W of the elastic body 6 (directions orthogonal to the longitudinal direction L and the thickness direction T of the elastic body 6). It is sandwiched between. A curved surface 6 a is formed on the front surface of the elastic body 6, and a flat surface 6 b is formed on the back surface of the elastic body 6. The cross-sectional shape of the elastic body 6 is substantially D-shaped. Cutouts 6c are formed at equal intervals in the upper and lower portions of the elastic body 6, respectively. The notch 6c is located between the conductive paths 8 adjacent to each other. Independent displacement portions 6d are formed at the upper and lower portions of the elastic body 6 by the notches 6c. The independent displacement portion 6d is a portion that can be displaced independently. Examples of the material (insulating material) of the elastic body 6 include elastomers such as silicon rubber and silicon gel. A reinforcing plate 10 is embedded in the flat surface 6 b of the elastic body 6.

フィルム7は絶縁性を有し、弾性体6の湾曲面6aに貼り付けられている。   The film 7 has insulating properties and is attached to the curved surface 6 a of the elastic body 6.

複数の導電路8はそれぞれ導体膜80と第1の導体接触部81と第2の導体接触部82と第1のビア(第1の導体結合部)83と第2のビア(第2の導体結合部)84とを有する。   The plurality of conductive paths 8 include a conductor film 80, a first conductor contact portion 81, a second conductor contact portion 82, a first via (first conductor coupling portion) 83, and a second via (second conductor), respectively. Coupling portion) 84.

導体膜80はほぼベルト状である。導体膜80はフィルム7の裏面(フィルム7の弾性体6側の面)に形成され、弾性体6の幅方向wの一端から他端へ延びている。導電路8は弾性体6の長手方向Lに沿って等間隔に並んでいる。   The conductor film 80 has a substantially belt shape. The conductor film 80 is formed on the back surface of the film 7 (the surface of the film 7 on the elastic body 6 side) and extends from one end of the elastic body 6 in the width direction w to the other end. The conductive paths 8 are arranged at equal intervals along the longitudinal direction L of the elastic body 6.

第1の導体接触部81は矩形であり、弾性体6の幅方向wの一端部に形成されている。第1の導体接触部81の幅は導体膜80の幅よりも狭い。   The first conductor contact portion 81 is rectangular and is formed at one end of the elastic body 6 in the width direction w. The width of the first conductor contact portion 81 is narrower than the width of the conductor film 80.

第2の導体接触部82は矩形であり、弾性体6の幅方向wの他端部に形成されている。第2の導体接触部82の幅は導体膜80の幅よりも狭く、第1の導体接触部81の幅と同じである。   The second conductor contact portion 82 is rectangular and is formed at the other end of the elastic body 6 in the width direction w. The width of the second conductor contact portion 82 is narrower than the width of the conductor film 80 and is the same as the width of the first conductor contact portion 81.

第1のビア83はフィルム7を貫通し、導体膜80の一端部と第1の導体接触部81とを導通させる。   The first via 83 penetrates through the film 7 and electrically connects one end portion of the conductor film 80 and the first conductor contact portion 81.

第2のビア84はフィルム7を貫通し、導体膜80の他端部と第2の導体接触部82とを導通させる。   The second via 84 penetrates the film 7 and makes the other end portion of the conductor film 80 and the second conductor contact portion 82 conductive.

フィルム7が弾性体6に貼り付けられた状態で、第1、第2の導体接触部81,82はそれぞれ弾性部材6の上端部、下端部の独立変位部6d上に位置する。第1の導体接触部81は電子部品21のパッド(図示せず)に接触し、第2の導体接触部82はプリント基板22のパッド(図示せず)に接触する。   In a state where the film 7 is attached to the elastic body 6, the first and second conductor contact portions 81 and 82 are positioned on the independent displacement portions 6d at the upper end portion and the lower end portion of the elastic member 6, respectively. The first conductor contact portion 81 contacts a pad (not shown) of the electronic component 21, and the second conductor contact portion 82 contacts a pad (not shown) of the printed circuit board 22.

導電路8の材料としては例えば銅に金メッキをしたものやニッケルに金メッキしたものがある。   Examples of the material of the conductive path 8 include copper plated with gold and nickel plated with gold.

フィルム7の材料としてはポリイミド樹脂、アラミド樹脂等がある。弾性体6に対するフィルム7の貼付方法としては接着、粘着、超音波溶着、レーザー溶着等がある。貼付箇所は部分的であるか全体的であるかを問わない。   Examples of the material of the film 7 include polyimide resin and aramid resin. Examples of the method for attaching the film 7 to the elastic body 6 include adhesion, adhesion, ultrasonic welding, laser welding, and the like. It does not matter whether the location is a part or the whole.

導電路8は例えば金属薄膜をパターニングすることによってフィルム7に形成される。例えばメッキやスパッタやエッチング等の微細加工技術が用いられる。   The conductive path 8 is formed in the film 7 by patterning a metal thin film, for example. For example, fine processing techniques such as plating, sputtering, and etching are used.

次に、コネクタ1を用いて電子部品21とプリント基板22とを接続する手順について図4,5に基づいて説明する。   Next, a procedure for connecting the electronic component 21 and the printed board 22 using the connector 1 will be described with reference to FIGS.

まず、コネクタ1をプリント基板22上に配置する。このとき、フレーム3の位置決めボス3cをプリント基板22の位置決め孔22bに挿入して、コネクタ1をプリント基板22に対して位置決めする(図5参照)。   First, the connector 1 is disposed on the printed circuit board 22. At this time, the positioning boss 3c of the frame 3 is inserted into the positioning hole 22b of the printed board 22, and the connector 1 is positioned with respect to the printed board 22 (see FIG. 5).

次に、電子部品21をフレーム3の収容凹部3aに収容する。   Next, the electronic component 21 is housed in the housing recess 3 a of the frame 3.

その後、電子部品21上にヒートシンク23を配置する。   Thereafter, the heat sink 23 is disposed on the electronic component 21.

次に、ヒートシンク23のボルト挿入孔23a、フレーム3のボルト挿入孔3d及びプリント基板22のボルト挿入孔(図示せず)にボルト(図示せず)を挿入し、このボルトにナット(図示せず)を装着する。   Next, bolts (not shown) are inserted into the bolt insertion holes 23a of the heat sink 23, the bolt insertion holes 3d of the frame 3, and the bolt insertion holes (not shown) of the printed circuit board 22, and nuts (not shown) are inserted into the bolts. ).

最後に、ナットを締め付け、プリント基板22とコネクタ1とヒートシンク23とを結合する。   Finally, the nut is tightened, and the printed circuit board 22, the connector 1, and the heat sink 23 are joined.

このとき、コンタクト部材5の上、下端部は電子部品21とプリント基板22とで挟まれて潰れ、潰された弾性体6の復元力によって第1、第2の導体接触部81,82はそれぞれ電子部品21のパッド、プリント基板22のパッドに押し付けられる。   At this time, the upper and lower end portions of the contact member 5 are sandwiched between the electronic component 21 and the printed circuit board 22 and are crushed, and the first and second conductor contact portions 81 and 82 are respectively restored by the restoring force of the crushed elastic body 6. It is pressed against the pad of the electronic component 21 and the pad of the printed circuit board 22.

したがって、コネクタ1を介して電子部品21とプリント基板22とが電気的に接続される。   Therefore, the electronic component 21 and the printed board 22 are electrically connected via the connector 1.

この第1の参考例によれば、導電路8の第1、第2の接触部81,82だけがフィルム7の表面に形成されているので、コネクタ1の使用時にコンタクト部材5が必要以上に潰れても、電子部品21やプリント基板22に対する第1、第2の導体接触部81,82の接触面積が増えない。その結果、電子部品21やプリント基板22のパッドの狭ピッチ化を可能にするとともに、コンタクト部材5の狭ピッチ化をも達成することができる。   According to the first reference example, since only the first and second contact portions 81 and 82 of the conductive path 8 are formed on the surface of the film 7, the contact member 5 is more than necessary when the connector 1 is used. Even if it is crushed, the contact area of the first and second conductor contact portions 81 and 82 with respect to the electronic component 21 and the printed circuit board 22 does not increase. As a result, the pitch of the pads of the electronic component 21 and the printed circuit board 22 can be reduced, and the pitch of the contact member 5 can be reduced.

また、弾性体6に切欠き6cを形成したので、独立変位部6dが独立して変位可能になる。その結果、導電路8の接触安定性を高めることができる。   Moreover, since the notch 6c is formed in the elastic body 6, the independent displacement portion 6d can be independently displaced. As a result, the contact stability of the conductive path 8 can be enhanced.

次に、図6(a)〜図6(c)に基づいて第2の参考例のコネクタについて説明する。   Next, a connector according to a second reference example will be described with reference to FIGS. 6 (a) to 6 (c).

上述の第1の参考例と共通する部分については同一符号を付してその説明を省略する。以下、上述の第1の参考例との主な相違部分についてだけ説明する。   Portions common to the first reference example described above are denoted by the same reference numerals and description thereof is omitted. Only the main differences from the first reference example will be described below.

コンタクト部材205は弾性体206とフィルム7と第1の導電路208と第2の導電路209と補強板10とで構成されている。   The contact member 205 includes an elastic body 206, a film 7, a first conductive path 208, a second conductive path 209, and the reinforcing plate 10.

ほぼ帯状の弾性体206は切欠き6cに相当するものを有していない。   The substantially band-shaped elastic body 206 does not have a portion corresponding to the notch 6c.

第1の導電路208は第1の参考例のコンタクト部材5の導電路8と同様の構成を有し、第1の導体膜280と第1導体接触部281と第2の導体接触部282と第1のビア(第1の導体結合部)283と第2のビア(第2の導体結合部)284とで構成される。第1の導体膜280、第1の導体接触部281、第2の導体接触部282、第1のビア283、第2のビア284は第1の参考例の導体膜80、第1の導体接触部81、第2の導体接触部82、第1のビア83、第2のビア84にそれぞれ対応する。   The first conductive path 208 has the same configuration as the conductive path 8 of the contact member 5 of the first reference example, and the first conductive film 280, the first conductor contact portion 281, the second conductor contact portion 282, The first via (first conductor coupling portion) 283 and the second via (second conductor coupling portion) 284 are configured. The first conductor film 280, the first conductor contact portion 281, the second conductor contact portion 282, the first via 283, and the second via 284 are the conductor film 80 of the first reference example and the first conductor contact. This corresponds to the portion 81, the second conductor contact portion 82, the first via 83, and the second via 84, respectively.

但し、第1、第2の導体接触部281,282の幅は第1の導体膜280の幅と同じである。   However, the widths of the first and second conductor contact portions 281 and 282 are the same as the width of the first conductor film 280.

第2の導電路209はフィルム7の表面に設けられている。第2の導電路209の形状はほぼベルト状であり、弾性体206の幅方向Wへ延びている。第2の導電路209は第2の導体膜290と第3の導体接触部291と第4の導体接触部292とで構成される。第2の導体膜290の一端部に第3の導体接触部291が設けられ、他端部に第4の導体接触部292が設けられている。   The second conductive path 209 is provided on the surface of the film 7. The second conductive path 209 has a substantially belt shape and extends in the width direction W of the elastic body 206. The second conductive path 209 includes a second conductor film 290, a third conductor contact portion 291, and a fourth conductor contact portion 292. A third conductor contact portion 291 is provided at one end of the second conductor film 290, and a fourth conductor contact portion 292 is provided at the other end.

第1の導体接触部281と第3の導体接触部291とは弾性体206の厚さ方向Tでずれており、第3の導体接触部291の方が第1の導体接触部281よりも前方に(正面側に)位置する(図6(b)参照)。   The first conductor contact portion 281 and the third conductor contact portion 291 are displaced in the thickness direction T of the elastic body 206, and the third conductor contact portion 291 is more forward than the first conductor contact portion 281. (Refer to FIG. 6B).

第2の導体接触部282と第4の導体接触部292とは弾性体206の厚さ方向Tでずれており、第4の導体接触部292の方が第2の導体接触部282よりも前方に(正面側に)位置する(図6(c)参照)。   The second conductor contact portion 282 and the fourth conductor contact portion 292 are shifted in the thickness direction T of the elastic body 206, and the fourth conductor contact portion 292 is more forward than the second conductor contact portion 282. (Refer to FIG. 6C).

第1の導電路208と第2の導電路209とは弾性体206の長手方向Lに沿って交互に並べられ、第1の導電路208の第1の導体膜280はフィルム7の裏面にあり、第2の導電路209の第2の導体膜290はフィルム7の表面にある。   The first conductive path 208 and the second conductive path 209 are alternately arranged along the longitudinal direction L of the elastic body 206, and the first conductive film 280 of the first conductive path 208 is on the back surface of the film 7. The second conductive film 290 of the second conductive path 209 is on the surface of the film 7.

この第2の参考例によれば、第1の導体接触部281と第3の導体接触部291とは弾性体206の厚さ方向Tでずれており、同様に第2の導体接触部282と第4の導体接触部292とは弾性体206の厚さ方向Tでずれており、しかも第1の導電路208の第1の導体膜280はフィルム7の裏面にあり、第2の導電路209の第2の導体膜290はフィルム7の表面にあるので、第1の導電路208と第2の導電路209とが短絡の虞が低くなり、第1の導電路208と第2の導電路209との間隔を狭めることができる(狭ピッチ化)。   According to the second reference example, the first conductor contact portion 281 and the third conductor contact portion 291 are displaced in the thickness direction T of the elastic body 206, and similarly the second conductor contact portion 282 and The fourth conductor contact portion 292 is displaced in the thickness direction T of the elastic body 206, and the first conductor film 280 of the first conductive path 208 is on the back surface of the film 7 and the second conductive path 209. Since the second conductive film 290 is on the surface of the film 7, the first conductive path 208 and the second conductive path 209 are less likely to be short-circuited, and the first conductive path 208 and the second conductive path are reduced. 209 can be narrowed (narrow pitch).

次に、図7(a)〜図7(c)に基づいてこの発明の一実施形態に係るコネクタについて説明する。   Next, a connector according to an embodiment of the present invention will be described based on FIGS. 7 (a) to 7 (c).

第1、第2の参考例と共通する部分については同一符号を付してその説明を省略する。以下、主な相違部分についてだけ説明する。   Portions common to the first and second reference examples are denoted by the same reference numerals and description thereof is omitted. Only the main differences will be described below.

第2の参考例では、第1の導電路208と第2の導電路209とが弾性体206の長手方向Lに沿って交互に並べられているが、第1の実施形態では、第1の導電路208の第1の導体膜280はフィルム7の裏面に等間隔に形成され、第2の導電路209の第2の導体膜290はフィルム7の表面に等間隔に形成されている。第1の導体膜280と第2の導体膜290とはフィルム7を介して対向する。   In the second reference example, the first conductive path 208 and the second conductive path 209 are alternately arranged along the longitudinal direction L of the elastic body 206. In the first embodiment, the first conductive path 208 and the second conductive path 209 are arranged alternately. The first conductor films 280 of the conductive paths 208 are formed at equal intervals on the back surface of the film 7, and the second conductor films 290 of the second conductive paths 209 are formed at equal intervals on the surface of the film 7. The first conductor film 280 and the second conductor film 290 are opposed to each other through the film 7.

この実施形態によれば、第1の導電路208の第1の導体膜280がフィルム7の裏面に形成され、第2の導電路209の第2の導体膜290がフィルム7の表面に形成され、しかも、第1の導体接触部281と第3の導体接触部291、第2の導体接触部282と第4の導体接触部292との間にそれぞれ隙間Gが形成されているので、第1の導電路208と第2の導電路209とが短絡する虞がなく、導電路208,209の狭ピッチ化及び高密度化を達成することができる。   According to this embodiment, the first conductor film 280 of the first conductive path 208 is formed on the back surface of the film 7, and the second conductor film 290 of the second conductive path 209 is formed on the surface of the film 7. In addition, since gaps G are formed between the first conductor contact portion 281 and the third conductor contact portion 291, and the second conductor contact portion 282 and the fourth conductor contact portion 292, respectively, The conductive path 208 and the second conductive path 209 are not short-circuited, and the pitch and density of the conductive paths 208 and 209 can be reduced.

なお、上述の参考例や実施形態では、導体膜80,280をフィルム7の裏面に形成したが、導体膜80,280を弾性体6,206に形成してもよいし、フィルム7と導電路8と弾性体6,206との間に配置してもよい。   In the above-described reference examples and embodiments, the conductor films 80 and 280 are formed on the back surface of the film 7, but the conductor films 80 and 280 may be formed on the elastic bodies 6 and 206, or the film 7 and the conductive path. You may arrange | position between 8 and the elastic bodies 6,206.

また、上述の参考例や実施形態では、第1、2の導体結合部83,283,84,284としてビアを用いたが、導体結合部はビアに限られず、例えばスルーホールでもよい。   In the above-described reference examples and embodiments, vias are used as the first and second conductor coupling portions 83, 283, 84, and 284. However, the conductor coupling portions are not limited to vias, and may be through holes, for example.

1 コネクタ
3 フレーム
3a 収容凹部
3b 保持孔
3c 位置決めボス
3d ボルト挿入孔
5,205,305 コンタクト部材
6,206 弾性体
6a 湾曲面
6b 平坦面
6c 切欠き
6d 独立変位部
7 フィルム
8 導電路
208 第1の導電路
80 導体膜
280 第1の導体膜
81,281 第1の導体接触部
82,282 第2の導体接触部
83,283 第1のビア(第1の導体結合部)
84,284 第2のビア(第2の導体結合部)
209 第2の導電路
290 第2の導体膜
291 第3の導体接触部
292 第4の導体接触部
10 補強板
21 電子部品(接続対象物)
22 プリント基板(接続対象物)
22b 位置決め孔
23 ヒートシンク
23a ボルト挿入孔
DESCRIPTION OF SYMBOLS 1 Connector 3 Frame 3a Housing recessed part 3b Holding hole 3c Positioning boss 3d Bolt insertion hole 5,205,305 Contact member 6,206 Elastic body 6a Curved surface 6b Flat surface 6c Notch 6d Independent displacement part 7 Film 8 Conductive path 208 1st Conductive path 80 Conductor film 280 First conductor film 81,281 First conductor contact portion 82,282 Second conductor contact portion 83,283 First via (first conductor coupling portion)
84,284 Second via (second conductor coupling portion)
209 Second conductive path 290 Second conductor film 291 Third conductor contact portion 292 Fourth conductor contact portion 10 Reinforcing plate 21 Electronic component (object to be connected)
22 Printed circuit board (object to be connected)
22b Positioning hole 23 Heat sink 23a Bolt insertion hole

Claims (2)

ほぼ帯状の弾性体と、
前記弾性体に貼付されたフィルムと、
前記弾性体の長手方向に沿って所定間隔に形成される複数の導電路とを備え、
前記弾性体の厚さ方向と前記弾性体の長手方向とのそれぞれに直交する前記弾性体の幅方向で前記弾性体を挟むよう配置される2つの接続対象物を電気的に接続するためのコンタクト部材において、
前記複数の導電路は、第1の導電路と第2の導電路とで構成され、
前記第1の導電路は、
前記弾性体と前記フィルムとの間に設けられ、前記弾性体の幅方向の一端から他端へ延びる第1の導体膜と、
前記フィルムに設けられ、前記2つの接続対象物の一方の接続対象物に接触可能な第1の導体接触部と、
前記フィルムに設けられ、前記2つの接続対象物の他方の接続対象物に接触可能な第2の導体接触部と、
前記フィルムを貫通し、前記第1の導体接触部と前記第1の導体膜の一端部とを結合させる第1の導体結合部と、
前記フィルムを貫通し、前記第2の導体接触部と前記第1の導体膜の他端部とを結合させる第2の導体結合部とを有し、
前記第2の導電路は、
前記フィルムの表面に設けられ、前記第1の導体接触部の近傍から前記第2の導体接触部の近傍へ延びる第2の導体膜と、
前記第2の導体膜の一端部に設けられ、前記2つの接続対象物の一方の接続対象物に接触可能な第3の導体接触部と、
前記第2の導体膜の他端部に設けられ、前記2つの接続対象物の他方の接続対象物に接触可能な第4の導体接触部とを有し、
前記第1の導体接触部と前記第3の導体接触部との間、前記第2の導体接触部と前記第4の導体接触部との間に、それぞれ隙間が形成されている
ことを特徴とするコンタクト部材。
An almost band-shaped elastic body,
A film affixed to the elastic body;
A plurality of conductive paths formed at predetermined intervals along the longitudinal direction of the elastic body,
A contact for electrically connecting two connection objects arranged so as to sandwich the elastic body in the width direction of the elastic body perpendicular to the thickness direction of the elastic body and the longitudinal direction of the elastic body In the member,
The plurality of conductive paths includes a first conductive path and a second conductive path,
The first conductive path is:
A first conductor film provided between the elastic body and the film and extending from one end to the other end in the width direction of the elastic body;
A first conductor contact portion provided on the film and capable of contacting one connection object of the two connection objects;
A second conductor contact portion provided on the film and capable of contacting the other connection object of the two connection objects;
A first conductor coupling portion that penetrates the film and couples the first conductor contact portion and one end of the first conductor film;
A second conductor coupling portion that penetrates the film and couples the second conductor contact portion and the other end of the first conductor film;
The second conductive path is
A second conductor film provided on the surface of the film and extending from the vicinity of the first conductor contact portion to the vicinity of the second conductor contact portion;
A third conductor contact portion provided at one end of the second conductor film and capable of contacting one connection object of the two connection objects;
A fourth conductor contact portion provided at the other end of the second conductor film and capable of contacting the other connection object of the two connection objects;
A gap is formed between the first conductor contact portion and the third conductor contact portion, and between the second conductor contact portion and the fourth conductor contact portion, respectively. Contact member to be used.
請求項1記載のコンタクト部材と、
前記弾性体の幅方向の両端部が露出するように前記コンタクト部材を保持するフレームと
を備えていることを特徴とするコネクタ。
A contact member according to claim 1;
And a frame for holding the contact member such that both end portions in the width direction of the elastic body are exposed.
JP2012084878A 2012-04-03 2012-04-03 Connector Pending JP2012151126A (en)

Priority Applications (1)

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Family

ID=46793160

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Country Link
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0888062A (en) * 1994-09-16 1996-04-02 Toshiba Corp Connector and substrate mounting method
JP2006228453A (en) * 2005-02-15 2006-08-31 Japan Aviation Electronics Industry Ltd Connector
JP2006253067A (en) * 2005-03-14 2006-09-21 Japan Aviation Electronics Industry Ltd Connector
JP2006310140A (en) * 2005-04-28 2006-11-09 Japan Aviation Electronics Industry Ltd Connector
JP2007095632A (en) * 2005-09-30 2007-04-12 Japan Aviation Electronics Industry Ltd Connecting apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0888062A (en) * 1994-09-16 1996-04-02 Toshiba Corp Connector and substrate mounting method
JP2006228453A (en) * 2005-02-15 2006-08-31 Japan Aviation Electronics Industry Ltd Connector
JP2006253067A (en) * 2005-03-14 2006-09-21 Japan Aviation Electronics Industry Ltd Connector
JP2006310140A (en) * 2005-04-28 2006-11-09 Japan Aviation Electronics Industry Ltd Connector
JP2007095632A (en) * 2005-09-30 2007-04-12 Japan Aviation Electronics Industry Ltd Connecting apparatus

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