JP2007324030A - Socket, its manufacturing method, and semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an excellent socket capable of responding to low resistance, large current, and high speed, and a semiconductor device having the same. <P>SOLUTION: The socket comprises an elastomer in which a groove or a through hole is provided at the surrounding of a metallic terminal arrangement region and a terminal installation through hole is provided at a part of the periphery of the metallic terminal arrangement region, and a metallic terminal of U-shape of which the main column portion contacts the inner face of the terminal installation through hole and has an arm portion extending to the metallic terminal arrangement region along the front and the rear surfaces of the elastomer from the both ends of the main column part. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a socket used when an IC package such as a CPU or LSI is mounted on a printed board, and more particularly, a socket suitably used when mounting an IC package such as an LGA package or a BGA package on a printed board. The present invention relates to a manufacturing method and a semiconductor device using the same.

Conventionally, a technique for mounting an IC package such as a CPU or LSI on a printed circuit board through a socket has been studied. Many of the semiconductor devices such as personal computers and server motherboards include LGA packages and BGA packages. A socket for mounting the CPU is mounted.
The number of pins and the speed of CPUs are increasing year by year in order to improve the functions and performance of the CPUs.
As a result, it is necessary to handle sockets with a higher pin count, and it is necessary to cope with an increase in the amount of deflection caused by an increase in the size of the package and to deal with variations in the contact land of the package and the height of the ball. Therefore, there is a demand for a structure that can ensure the stroke of the socket contact.
In order to cope with the fine pitch, it is important to reduce the size of the socket contact, and it is desired that the contact between the IC pin and the socket contact can be secured with an appropriate contact pressure.
Further, in order to increase the speed, it is important that the contact has a low inductance, and it is required that the contact resistance is low and the allowable current is high in response to an increase in current consumption due to the increase in speed.

The current mainstream of LGA package sockets is 400 to 800 pins with a pitch of about 1 mm. A method of manufacturing a contact terminal having a predetermined shape by bending a metal plate in a complicated manner and inserting the contact terminal into the socket housing. Is used. These conventional techniques are disclosed in Patent Documents 1 and 2, for example.
JP 2004-158430 A JP-A-2005-19284 US Pat. No. 6,669,490

  However, in the prior arts disclosed in Patent Documents 1 and 2, since the contact terminal is a leaf spring system, if the spring is lengthened to increase the contact stroke, the pin contacts the adjacent pin. Then, there is a problem that the stroke cannot be increased.

  In order to solve this problem, for example, a technique disclosed in Patent Document 3 is proposed as a structure using a column made of a conductive elastomer as a contact. In this case, since the resilience of the socket is determined by the characteristics and structure of the conductive elastomer, a socket capable of securing a sufficient stroke at the required load is realized with a conductive elastomer with an appropriate repulsive force. Is possible.

However, when using a conductive elastomer as disclosed in Patent Document 3,
-Since the contact is not metal but elastomer, contact resistance is higher compared to metal contact, and there is a risk that heat generation and voltage drop will increase with increasing current.
-When the package is inserted, since the contacts do not wipe the metal lands, new problems such as the oxide film removal from the lands cannot be expected.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an excellent socket that can cope with low resistance, large current, and high speed, and a semiconductor device using the socket.

  In order to achieve the above object, the present invention provides an elastomer in which a groove or a through hole is provided around a metal terminal arrangement region, and a terminal mounting through hole is provided in a part of the periphery of the metal terminal arrangement region, A U-shaped metal terminal having an arm portion in contact with the inner surface of the terminal mounting through-hole and extending from both ends of the main column portion along the front and back surfaces of the elastomer to the metal terminal arrangement region. A socket is provided.

  In the socket of the present invention, the elastomer is preferably a fluorine-based elastomer.

  In the socket of the present invention, it is preferable that a groove having a depth not penetrating the elastomer is provided around the metal terminal arrangement region on either the front or back side of the elastomer.

  In the socket of the present invention, the elastomer may have a configuration in which a through hole penetrating the front and back is provided around the metal terminal arrangement region.

  In the socket of the present invention, it is preferable that a convex portion is provided on the outer surface of the arm portion of the metal terminal.

  The socket of the present invention preferably has a configuration in which a plurality of metal terminals are provided on a plate-like elastomer.

The present invention also provides
(1) Prepare a terminal mounting through hole at a part of the periphery of the metal terminal formation position, and provide an elastomer with a groove or a through hole around the metal terminal formation position and a U-shaped metal terminal. And
(2) Next, a part of the metal terminal is passed through the elastomer terminal mounting through hole, and the elastomer at the metal terminal formation position is sandwiched between both arm portions of the metal terminal to obtain the socket according to the present invention described above. A socket manufacturing method is provided.

The present invention also provides
(A) A terminal mounting through hole is formed in a part of the periphery of the metal terminal forming position, and an elastomer having a groove or a through hole around the metal terminal forming position, and an L-shaped or linear metal member Prepare
(B) Next, the metal member is inserted into the elastomer terminal mounting through hole,
(C) Next, one end side or both end sides of the metal member are bent to form a U-shaped metal terminal, and an elastomer at a metal terminal forming position is sandwiched between both arm portions of the metal terminal, and the above-described present invention is concerned. Provided is a method for manufacturing a socket, characterized in that the socket is obtained.

  The present invention also provides a semiconductor device comprising the socket according to the present invention described above, and a printed circuit board and an IC package electrically connected via the socket.

The socket of the present invention uses a U-shaped metal terminal as a contact terminal, and has a socket terminal structure in which the repulsive force is secured by an elastomer sandwiched between the metal terminals. Since the through hole is provided and the terminal mounting through hole is provided at a part of the periphery of the metal terminal arrangement region, a socket with a small number of parts can be realized, and a low cost socket can be provided.
In addition, by adjusting the dimensions of the grooves provided around the metal terminal arrangement area, it is possible to control the load-displacement characteristics to some extent and easily manufacture various sockets with different load-displacement characteristics. It can respond to the demands of various sockets with different displacement characteristics.
Further, since the contact portion is made of metal, the same metal as the connection terminal can be plated, and connection with low contact resistance is possible.
Further, a current flows through the U-shaped metal terminal, and connection can be made with low inductance.
In addition, when a load is applied, the arm part sinks with the main pillar part of the U-shaped metal terminal as a fulcrum, so it is possible to realize a wiping function that shifts the position while rubbing against the opposing contact surface and makes contact As a result, the oxide film and the foreign matter on the metal surface are removed, and the fresh metal surfaces can be connected to each other, and the connection resistance can be further reduced.
In addition, since the upper and lower contacts can be realized by a load connection, a replaceable socket can be designed, and the maintenance required for server applications is excellent.
Further, even if the substrate to be connected is warped, the elastomer follows the warped shape, so that the influence of the warp of the substrate can be reduced.

  In addition, since the elastomer is made of fluoro rubber, the heat resistance is increased, and when this socket contact terminal is joined to the board or package, the solder can be reflowed, the joining process is simplified, and the production cost is increased. Can be reduced.

  Further, if a structure is provided in which a groove having a depth not penetrating the elastomer is provided around the metal terminal arrangement region of the elastomer, when the structure is such that a large number of metal terminals are arranged in one elastomer, the groove is adjacent. The deformation of the elastomer does not affect the matching metal terminal, and stability is achieved when a load is applied to the metal terminal because the groove does not penetrate.

  Further, if a configuration is provided in which a through-hole penetrating the front and back is provided around the metal terminal arrangement region of the elastomer, it is not necessary to pay attention to the control in the depth direction of the recess, and the manufacture of the socket is facilitated.

  In addition, if the projection is provided on the outer surface of the arm part of the metal terminal, it can be used with a predetermined load-displacement characteristic even for flat electrodes such as printed circuit boards and LGA packages. The scope of application can be expanded.

  Moreover, in the socket of the present invention, by providing a plurality of metal terminals on a plate-like elastomer, a socket having a plurality of metal terminals can be provided at low cost, and the arrangement density of the metal terminals can be increased. it can.

  Further, according to the method for manufacturing a socket of the present invention, the socket according to the present invention described above can be manufactured easily and efficiently, so that a high-performance socket can be manufactured at low cost.

  In addition, the semiconductor device of the present invention includes the socket according to the present invention described above, and a printed circuit board and an IC package electrically connected through the socket, so that low resistance, large current, and high speed are supported. A high-performance device that can be provided can be provided.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1 and 2 are views showing a first embodiment of the socket of the present invention. FIG. 1 is a plan view of the socket 10 of the present embodiment, and FIG. 2 is a cross-sectional view taken along line AA ′ in FIG. is there. In these drawings, reference numeral 10 denotes a socket, 11 denotes an elastomer, 12 denotes a groove, 13 denotes a terminal mounting through hole, 14 denotes a metal terminal, 14A denotes a main pillar portion, 14B denotes an arm portion, and 15 denotes a convex portion.

  The socket 10 of the present embodiment includes an elastomer 11 in which a groove 12 is provided around the metal terminal arrangement area, and a terminal attachment through hole 13 is provided in a part of the periphery of the metal terminal arrangement area, and a terminal attachment penetration. The main pillar portion is in contact with the inner surface of the hole 13, and a U-shaped metal terminal 14 having arm portions extending from both ends of the main pillar portion along the front and back surfaces of the elastomer 11 to the metal terminal arrangement region is provided. is doing. In the example of FIG. 1, a large number of metal terminals 14 are arranged on a plate-like elastomer 11.

  This basic structure is a structure in which the elastomer 11 is provided with a terminal mounting through hole 13 through which the metal terminal 14 is passed, the U-shaped metal terminal 14 is provided in the hole, and the elastomer 11 is sandwiched between the metal terminals 14. In addition, by removing at least part of the periphery of the elastomer 11 that is in contact with the metal terminal 14 on the front and back surfaces of the elastomer 11, the transmission of force due to the tension and compression of the elastomer that occurs between adjacent terminals in a state where a load is applied is reduced. The socket structure is characterized by the above.

The socket 10 of the present embodiment adopts the above-described structure, so that the load-stroke characteristic can be designed with the characteristic of the elastomer 11 while being a contact by metal contact, and the contact part is a U-shaped metal. Since the base of the terminal 14 sinks to the fulcrum, a wiping effect can be expected.
In addition, since current flows through the U-shaped metal terminal 14, it is possible to realize low inductance by shortening the electrical conduction path, and to provide a socket corresponding to low resistance, high current, and high speed. .
In addition, since the elastomer portion narrowed by the U-shaped metal terminal 14 for obtaining a repulsive force and the support plate for connecting and positioning between the terminals can be realized by the same elastomer 11, a predetermined hole processing is performed. Manufacture is possible simply by sandwiching the U-shaped metal terminal 14 in the performed elastomer plate, and a socket can be provided at low cost.

  The U-shaped metal terminal 14 shown in FIGS. 1 and 2 is suitably made of a material having good conductivity such as copper or brass, and it is desirable that the outer surface thereof be plated with gold in order to reduce contact resistance. In addition, when gold is plated on copper, it is common to apply nickel plating to the base as a block layer against diffusion.

  It is desirable that the height of the elastomer 11 sandwiched between the U-shaped metal terminals 14 is the same as the height dimension inside the metal terminals 14.

  Further, if the width of the groove 12 provided around the elastomer 14 sandwiched between the metal terminals 14 is too narrow, the crushed elastomer 11 interferes with the side wall of the groove 13 when a load is applied to the metal terminal 14, and to some extent. With the above displacement amount, the required load becomes high, and the transmission of force due to the pulling and compression of the elastomer 11 to the adjacent metal terminal 14 cannot be reduced. On the other hand, if the width of the groove 12 provided around the elastomer 11 sandwiched between the metal terminals 14 is excessively widened to the outside of the metal terminals 14, the distance between the metal terminals becomes long and a fine pitch socket cannot be realized.

  Further, if the width of the groove 12 provided around the elastomer 11 sandwiched between the metal terminals 14 is excessively widened inside the metal terminal 14, in other words, if the volume of the portion of the elastomer 11 sandwiched between the metal terminals 14 is reduced, the repulsive force of the elastomer 11 Cannot be obtained sufficiently.

  For the above reasons, it is desirable that the width of the elastomer 11 at the portion sandwiched between the metal terminals 14 (inside the groove 12) is the same as or slightly larger than the area of the metal terminals 14. In other words, the load-displacement characteristic of each terminal can be controlled by adjusting the dimension of the groove 12.

  The groove 12 may allow the elastomer 11 to pass through, but if not, the elastomer 11 sandwiched between the metal terminals 14 will be fixed. Therefore, when a load is applied to the metal terminal 14 Moreover, the elastomer 11 becomes unstable, and the metal terminal 14 slips on the surface of the elastomer 11 and the effect of suppressing the metal terminal 14 from dropping from the surface of the elastomer 11 is also obtained.

Next, the contact operation in the socket 10 of this embodiment will be described.
FIG. 3 shows an example of a semiconductor device using the socket 10 of the present embodiment. When the terminal on the IC side is a land, or the contact part is exchanged at the time of maintenance like a server socket, the printed circuit board side is also It is a figure which shows operation | movement at the time of using the socket 10 of the said 1st Embodiment as a socket for IC of the LGA package used when not connecting with a land and connecting with a land. FIG. 3A is a side view showing a state of the semiconductor device 20 before the pressing force is applied (or a restored state after the pressing force is applied), and FIG. 3B shows a state when the pressing force is applied to the semiconductor device 20. It is a side view. In FIG. 3, reference numeral 20 is a semiconductor device, 21 is a printed circuit board, 22 is an LGA package (IC package), 23 is a circuit conductor, and 24 is an LGA land.

  The semiconductor device 20 has a structure in which one arm portion of the socket 10 is mounted on the circuit conductor 23 of the printed circuit board 21 and the LGA land 24 of the LGA package 22 is brought into contact with the other arm portion of the socket 10. Yes. As shown in FIG. 3, the socket 10 of the present embodiment has a structure in which a stroke is generated depending on the height of the convex portion 15 by providing the convex portion 15 on the U-shaped metal terminal 14.

  FIG. 3B shows a state where a load is applied in this state. When a load is applied, the elastomer 11 is compressed and sinks while generating a repulsive force accordingly, and the load at this time and the generated sink become load-stroke characteristics. Further, since the arm portion of the metal terminal 14 sinks with the main column portion as a fulcrum, when a load is applied, the contact point moves to the main column portion side, thereby bringing about a wiping effect and removing the oxide film to make it fresh. Since metal surfaces can be brought into contact with each other, contact can be realized with low resistance. Of course, the height and width dimensions of the elastomer 11 should be designed to have a resilience that satisfies the required load-stroke characteristics. In particular, the height dimension of the elastomer 11 is at least larger than the stroke. Must be dimensioned.

  FIG. 4 shows the contact operation when the socket 16 according to the second embodiment is used as a socket for an IC of a BGA package as an example of a semiconductor device using the socket according to the second embodiment of the present invention. FIG. 4A is a side view showing a state before the pressing force is applied to the semiconductor device 30 (or a restored state after the pressing force is applied), and FIG. 4B is a state when the pressing force is applied to the semiconductor device 30. FIG. FIG. In FIG. 4, 11 is an elastomer, 16 is a socket, 17 is a metal terminal, 30 is a semiconductor device, 31 is a printed circuit board, 32 is a BGA package (IC package), 33 is a circuit conductor, 34 is an aluminum pad, and 35 is solder. , 36 are BGA terminal solder balls.

  In the semiconductor device 30, one arm portion of the socket 16 is joined to the circuit conductor 33 of the printed circuit board 31 with the solder 35, and the BGA terminal solder ball 36 of the BGA package 32 is brought into contact with the other arm portion of the socket 16. Is configured. The socket 16 of the present embodiment is configured to include substantially the same components as the socket of the first embodiment described above, and is configured using a metal terminal 17 in which a convex portion is not provided on the outer surface of the metal terminal. Is different.

  In the semiconductor device 30 shown in FIG. 4, when connecting the socket 16 to the circuit conductor 33 (terminal) on the printed circuit board 31, paste solder is applied in advance only to a necessary portion on the printed circuit board 31 side, and the socket 16 is formed thereon. The outer surface of one of the arms is mounted in contact and soldered through a reflow furnace to achieve electrical connection. In this case, it is desirable that the elastomer 11 has heat resistance that can withstand reflow, but for example, there are fluoroelastomers on the market that can withstand reflow, which can be used.

  FIG. 4A shows a state in which the IC of the BGA package 32 is placed on the socket 16 mounted on the printed circuit board 31. Furthermore, the state which added the load in this state is FIG.4 (b). When a load is applied, the elastomer 11 is compressed and sinks while generating a repulsive force, and the load and the generated sink at this time become load-stroke characteristics. Also in this case, the arm part sinks with the main column part as a fulcrum, so when a load is applied, the contact point moves to the main column part side, thereby bringing about a wiping effect and removing the oxide film on the metal surface to make it fresh. Since the metal surfaces can be brought into contact with each other, the contact can be realized with low resistance.

As described above, the sockets 10 and 16 of the present invention have a low contact resistance even when the terminal portion is convex like a BGA package or when the terminal is flat like a land of an LGA package or a printed circuit board. A large stroke can be realized with a low load.
Further, the sockets 10 and 16 according to the present invention are configured such that a portion for fixing the U-shaped metal terminal 14 and a mold portion are integrally formed, and the sockets 10 and 16 are formed of a soft elastomer 11. Even if the substrate to be installed is warped, the elastomer 11 follows the warp, so that the influence of the warp of the substrate can be reduced.

  FIG. 5 is a plan view showing a third embodiment of the socket of the present invention. In FIG. 5, reference numeral 40 denotes a socket, 41 denotes an elastomer, 42 denotes a through hole, 43 denotes a terminal mounting through hole, 44 denotes a metal terminal, and 45 denotes a convex portion.

  The sockets 10 and 16 in the first embodiment and the second embodiment described above only have the groove 12 around the metal terminal, but instead of the groove 12 to be inserted around the metal terminal 12, in this embodiment, A through hole 42 penetrating the elastomer 41 as in the socket 40 may be used. By adopting such a structure, there is an advantage that it is not necessary to pay attention to the control in the depth direction of the groove 12, and it is possible to visually confirm whether or not the optimum processing is performed. Even in such a structure, the basic characteristics are the same as those of the sockets 10 and 16 in the first and second embodiments described above.

The socket of the present invention is preferably manufactured by the following manufacturing method.
(1) Prepare a terminal mounting through hole at a part of the periphery of the metal terminal formation position, and provide an elastomer with a groove or a through hole around the metal terminal formation position and a U-shaped metal terminal. The process of
(2) Next, a step of passing a part of the metal terminal through the terminal mounting through hole of the elastomer and sandwiching the elastomer at the metal terminal forming position between both arm portions of the metal terminal to obtain the socket of the present invention.

  The material of the metal terminal used in the method for manufacturing a socket of the present invention can be easily produced by applying a metal part processing technique such as copper or brass using an existing press or mold molding. In addition, as for the plating process, a normal nickel plating or gold plating technique can be applied, and it is possible to cope with a fine pitch as much as possible by these techniques.

  On the other hand, for the elastomer, a method of extruding a liquid raw material into a plate shape and a method of realizing a necessary shape by injection molding can be applied, and an existing manufacturing method can also be applied thereto. The grooves or through holes formed in the elastomer and the terminal mounting through holes are preferably formed simultaneously when the elastomer is formed into a plate shape, but these grooves and through holes are formed after forming into a plate shape. You can also.

In the method for manufacturing a socket according to the present invention, the metal fitting to be a metal terminal does not have to be U-shaped from the beginning. After inserting an L-shaped or linear metal member into an elastomer, the metal member is bent and processed to be U-shaped. The metal terminal may be formed. When using such a metal member, it is desirable to manufacture a socket through the following steps (A) to (C).
(A) A terminal mounting through hole is formed in a part of the periphery of the metal terminal forming position, and an elastomer having a groove or a through hole around the metal terminal forming position, and an L-shaped or linear metal member Prepare
(B) Next, the metal member is inserted into the elastomer terminal mounting through hole,
(C) Next, a step of bending one end side or both end sides of the metal member to form a U-shaped metal terminal and sandwiching the elastomer at the metal terminal formation position between both arm portions of the metal terminal to obtain a socket.

  According to the socket manufacturing method of the present invention, the above-described sockets 10, 16, and 40 according to the present invention can be manufactured easily and efficiently, so that a high-performance socket can be manufactured at low cost.

A socket having the configuration shown in FIG. 1 was produced, and this was used as a socket for connecting a printed circuit board and an LGA package as shown in FIG.
In the semiconductor device shown in FIG. 3, a predetermined load was applied from the LGA package side, and the displacement (mm) at that time was measured. As a result of the experiment, a result satisfying a displacement characteristic of 0.3 mm was obtained at a load of 50 gf required in the field of IC sockets.

  Further, in the state shown in FIG. 3B, a voltage was applied between the circuit conductor of the printed circuit board and the LGA land, and the current and voltage were measured to examine the electrical characteristics of the socket. The measurement results of the electrical characteristics are shown in Table 1.

  From this result, it can be seen that a socket having a low resistance and a low inductance can be realized by using the socket of the present invention.

It is a top view which shows 1st Embodiment of the socket of this invention. It is A-A 'part sectional drawing in FIG. It is a figure which shows the contact operation | movement at the time of using as a socket for IC of a LGA package as an example of the semiconductor device using the socket of 1st Embodiment, (a) is the state before giving the pressing force of a semiconductor device ( Or, a side view showing a restored state after applying a pressing force), and (b) is a side view showing a state when the pressing force is applied to the semiconductor device. FIG. 7 is a diagram showing a contact operation when used as a socket for an IC of a BGA package as an example of a second embodiment of the socket of the present invention and a semiconductor device using the socket; FIG. FIG. 5B is a side view showing a state before the pressing force is applied (or a restored state after the pressing force is applied), and FIG. 5B is a side view showing a state when the pressing force is applied to the structure of the semiconductor device. It is a top view which shows 2nd Embodiment of the socket of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10, 16, 40 ... Socket, 11, 41 ... Elastomer, 12 ... Groove, 13, 43 ... Terminal mounting through-hole, 14, 17, 44 ... Metal terminal, 14A ... Main pillar part, 14B ... Arm part, 15, 45 ... convex part, 20, 30 ... semiconductor device, 21, 31 ... printed circuit board, 22 ... LGA package (IC package), 23, 33 ... circuit conductor, 24 ... LGA land, 32 ... BGA package (IC package), 34 ... Aluminum pad, 35 ... Solder, 36 ... BGA terminal solder ball, 42 ... Through hole.

Claims (14)

  An elastomer in which grooves or through holes are provided around the metal terminal arrangement area, and a terminal attachment through hole is provided in a part of the periphery of the metal terminal arrangement area, and a main pillar portion on the inner surface of the terminal attachment through hole And a U-shaped metal terminal having an arm portion extending from both ends of the main pillar portion to the metal terminal arrangement region along both the front and back surfaces of the elastomer.   The socket according to claim 1, wherein the elastomer is a fluorine-based elastomer.   The socket according to claim 1 or 2, wherein the elastomer is provided with a groove having a depth not penetrating the elastomer around a metal terminal arrangement region on either the front or back surface side.   The socket according to claim 1 or 2, wherein the elastomer is provided with a through hole penetrating the front and back around the metal terminal arrangement region.   The socket according to claim 1, wherein a convex portion is provided on an outer surface of the arm portion of the metal terminal.   The socket according to any one of claims 1 to 5, wherein a plurality of metal terminals are provided on a plate-like elastomer. (1) Prepare a terminal mounting through hole at a part of the periphery of the metal terminal formation position, and provide an elastomer with a groove or a through hole around the metal terminal formation position and a U-shaped metal terminal. And
(2) Next, a part of the metal terminal is passed through the elastomer terminal mounting through hole, and the elastomer at the metal terminal formation position is sandwiched between both arm portions of the metal terminal to obtain the socket according to claim 1. A method for manufacturing a socket. (A) A terminal mounting through hole is formed in a part of the periphery of the metal terminal forming position, and an elastomer having a groove or a through hole around the metal terminal forming position, and an L-shaped or linear metal member Prepare
(B) Next, the metal member is inserted into the elastomer terminal mounting through hole,
(C) Next, one end side or both end sides of the metal member are bent to form a U-shaped metal terminal, and an elastomer at a metal terminal forming position is sandwiched between both arm portions of the metal terminal, A method for manufacturing a socket, comprising obtaining a socket.   The socket manufacturing method according to claim 7 or 8, wherein the elastomer is a fluorine-based elastomer.   The said elastomer is provided with the groove | channel of the depth which does not penetrate the said elastomer in the circumference | surroundings of the metal terminal arrangement | positioning area | region of the surface side of either the front and back. Socket manufacturing method.   The method for manufacturing a socket according to any one of claims 7 to 9, wherein the elastomer is provided with a through hole penetrating the front and back around a metal terminal arrangement region.   The method for manufacturing a socket according to claim 7, wherein a convex portion is provided on an outer surface of the arm portion of the metal terminal.   The method for manufacturing a socket according to any one of claims 7 to 12, wherein a plurality of metal terminals are provided on a plate-like elastomer. A semiconductor device comprising: the socket according to claim 1; and a printed circuit board and an IC package that are electrically connected through the socket.

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