JPH11126950A - Flexible substrate and jack device using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the number of parts used on a flexible substrate. SOLUTION: When a flexible substrate 20 is soldered at the time of using the substrate 20 for a jack device, the soldering is performed by folding the substrate 30 so that through holes 21 and 22 for folding may be superposed upon another and placing the substrate 20 on the main body 2 of the jack device so that terminals 11 may be passed through the holes 21 and 22. Therefore, the number of parts used on the substrate 20 can be reduced, because it becomes unnecessary to use a sheet, etc., as separate parts for closing terminal leading- out holes 10 in which the terminals 11 are positioned or for making the distances to the holes 10 from soldering parts longer. In the jack device, the flowing distances of solder until the solder flows in the holes 10 become longer and the solder is hardened in the middle courses of flowing to the holes 10, because the flexible substrate 20 is not simply folded, but a cover body is held between the folded parts of the substrate 20. Therefore, the flowing of the solder in the holes 10 can be prevented effectively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a flexible substrate and a jack device using the same. Specifically, by soldering connecting parts such as terminals while the flexible board is folded, solder flows through the terminals using a part of the flexible board without using a sheet etc. to prevent solder inflow Thus, the number of components can be reduced.

[0002]

2. Description of the Related Art FIG. 6 shows a plug 1 for a headphone cord used in a conventional portable headphone stereo and a jack body 2 to which the plug 1 is connected.

A headphone cord used in this example is provided with a remote controller (not shown) for performing a reproducing operation, volume adjustment, and the like in the middle of the headphone cord. Therefore, the plug 1 has a plate-shaped remote control plug 4 in addition to the pin-shaped headphone plug 3. In this example, the headphone plug 3 has three divided electrodes, and the remote control plug 4 has
Have two electrodes.

On the other hand, in FIG. 6, a jack body 2 is a molded product made of plastic resin, and has a circular insertion hole 8 into which a headphone plug 3 is inserted and a rectangular insertion hole 9 into which a remote control plug 4 is inserted. Are formed. Plug-in hole 8 for portable stereo headphones
And the insertion hole 9 are mounted so as to be exposed to the outside.
At this time, the mounting hole 5 is fixed by screwing it.

[0005] Four terminal lead holes 10 each having a rectangular shape are formed outside the insertion hole 8 in this example, and a terminal 11 for electrically connecting to the headphone plug 3 is drawn out of the hole. Further, behind the insertion hole 9, five terminals 12 connected to the remote control plug 4 are arranged (see FIG. 7A).

As shown in FIG. 6, these terminals 11, 1
A flexible substrate 6 in the form of a film is used to connect 2 to a circuit provided in the product body. The flexible substrate 6 has a plurality of lands 13 and 1 for terminals 11 and 12.
4 are formed, and terminals 11,
A through-hole is formed so that 12 can be inserted.

[0007] As shown in FIG.
The copper foil pattern 6c is sandwiched between the insulating films 6a and 6b from above and below. In the example of the figure, a part of the upper insulating film 6 a is cut off to form a land 13 for the terminal 11. Note that the lower insulating film 6b can be connected to the land 13 from the lower surface by shaving off the lower insulating film 6b.

The terminals 11 and lands 13 and the terminals 12 and lands 14 are connected by soldering with the terminals 11 and 12 inserted.
As shown in FIG. 9A, the sheet 7 is disposed between the jack body 2 and the flexible board 6 as shown in FIG. 9B to prevent solder or flux from flowing along the terminal 11 (or the terminal 12). Be placed. This is because when the solder flows along the terminal 11 having the contact for electrode contact, the movement of the contact becomes unstable, and there is a possibility that a contact failure may occur.

This sheet 7 is made of a non-conductive resin.
As shown in B, it is formed in a substantially rectangular shape, and is attached to the jack body 2 so as to be surrounded by the four terminals 11. As can be seen from the figure, most of the terminal lead-out holes 10 are closed by attaching the sheet 7. The sheet 7 also serves to separate the flexible substrate 6 from the main body 5 by a distance d (FIG. 9B). The separation is performed in order to increase the distance that the solder flows so that the solder hardens before flowing into the terminal lead-out hole 10.

As described above, if the sheet 7 is sandwiched between the main body 5 and the flexible substrate 6, the solder can be solidified before the solder flows into the terminal lead-out hole 10, and at the same time, the solder is Since the sheet 7 can be blocked by the sheet 7 even if it flows into the outlet hole 10, the flow of solder can be prevented as much as possible.

[0011]

In mounting the flexible board 6 shown in FIG. 5, the sheet 7 is required in addition to the flexible board 6, so that the number of parts is increased. Further, since the sheet 7 is smaller than the main body 5 having a size as small as a fingertip, it is difficult to pick up the sheet 7 and it takes time and effort to attach the sheet 7, and it is not easy to determine the mounting direction.

In view of the above, the present invention has been made to solve the above-mentioned problem, and provides a flexible substrate capable of preventing solder leaching without increasing the number of components, and a jack device using the same.

[0013]

In order to solve the above-mentioned problems, a flexible substrate according to the present invention is a flexible substrate for soldering terminals and the like, in which terminals and the like are inserted. A through-hole is drilled, and a substrate for folding is formed so as to extend from the portion where the through-hole is drilled, and the substrate for folding is symmetrical with the position of the through-hole with respect to the bent portion of the substrate. A through hole for folding is formed so that terminals are inserted and soldered in a state where the board for folding is folded so that the through hole and the through hole for folding overlap. Is what you do.

[0014] In the jack device according to the second aspect,
In the jack device from which the terminals are drawn out at the top, a hole for inserting the terminals is formed in a cover body for covering the upper part of the jack device, and the terminals are inserted with the flexible substrate sandwiching the cover body so that the terminals are inserted. It is characterized by being soldered.

In the present invention, when the flexible substrate is soldered, it is folded and doubled. If the flexible board is doubled, the thickness will be doubled and the distance from the part to be soldered to the terminal lead-out hole will be long. Since it is doubly closed, it does not reach the terminal lead-out hole side. Also,
The solder can be solidified before reaching the terminal lead-out hole. Therefore, the flow of solder into the terminal lead-out holes is prevented. In this way, it is not necessary to use a sheet or the like as a separate component to cover the terminal lead-out hole in which the terminals are arranged.

In a jack device using a flexible board, the flexible board is not only folded but also sandwiched by using a cover.
The distance from the part to be soldered to the terminal lead-out hole where the terminals are located is longer, the solder is easy to solidify before flowing into the terminal lead-out holes, and the terminal lead-out holes where the terminals are placed due to solder rising etc. Is prevented more effectively.

[0017]

Next, an embodiment of a flexible substrate according to the present invention will be described in detail with reference to the drawings. The same parts as those in the related art are denoted by the same reference numerals, and detailed description thereof will be omitted.

FIG. 1 shows a case where a flexible board 20 according to an embodiment of the present invention is used for a jack body 2. In this example, when the flexible board 20 is soldered to the jack body 2, the flexible board 20 is configured to prevent the solder from flowing into the terminal lead-out holes 10 in which the terminals 11 are arranged. is there.

In FIG. 1, a predetermined position on the upper surface side of a flexible substrate 20 having a copper foil pattern inside a film-like sheet is cut off, and a land 14 for soldering to a terminal 12 is exposed. Four through holes 22 for inserting the four terminals 11 are formed on the right side of the portion where the lands 14 are exposed so as to correspond to the positions of the terminals 11. The size of the through hole 22 is set to be substantially the same as the size of the terminal 11 so that no gap is generated when the terminal 11 is inserted.

A turn-back substrate is formed so as to extend from the portion where the through-holes 22 are formed. Here, the turn-through holes 21 are formed in substantially the same size as the terminals 11.

Four through-holes 21 are provided so as to be symmetrical with the position of the through-hole 22 with respect to a dotted line c corresponding to the center of the U-shaped portion of the substrate.
This is because, in FIG. 1, the flexible board 20 on the side of the through hole 21 for folding is folded in the direction of arrow a with the dotted line c as a fulcrum, and soldering work is performed in a state where the through hole 21 for folding and the through hole 22 overlap. This is to make it possible.

In order to solder in such a state,
As shown in FIG. 2, the position of the return through-hole 21 on the rear surface of the flexible substrate 20 is cut off in a circular shape to expose the land 23. In other words, Land 2
3, and a through hole 21 for turning back is formed.

Thus, the land 23 is located on the upper surface of the folded flexible substrate 20. Therefore, as shown in FIG. 3A, after the flexible board 20 is placed on the jack main body 2, the flexible board 20 is folded as shown in FIG.
The terminal 11 is inserted in a state where the first and the through holes 22 are overlapped,
The terminal 11 can be soldered to the land 23 from outside.

As a result, in FIG. 3, the terminal lead-out hole 10 of the jack main body 2 is almost completely closed by the through-holes 21 and 22 for turning back, and the thickness of the flexible substrate 20 is more than doubled. By increasing the distance from the portion to be soldered to the terminal lead-out hole 10, the flow of solder into the terminal lead-out hole 10 due to solder rising or the like is prevented.

Therefore, if the flexible board 20 is folded and soldered in a double state, it is not necessary to use the sheet 7 (FIG. 6) used in the conventional example, so that the number of components does not increase.

Although the case where the flexible board 20 is connected to the jack main body 2 has been described above, the present invention is not limited to this, and can be used for various things using a flexible board.

Next, a case where the flexible substrate 20 is used in a jack device having a cover body will be described with reference to FIGS. The same parts as those in the related art are denoted by the same reference numerals, and detailed description thereof will be omitted.

In the present invention, when attaching the flexible board 20 to the jack body 2 described above, the cover body attached to the upper portion of the jack body 2 is soldered while being sandwiched by the flexible board 20. That is, for a component that is easily subjected to a repeated load, such as the jack body 2, a cover body that is originally used for protecting the soldered portion, assisting the attachment thereof, and increasing the rigidity of the jack body 2 The flexible substrate 20 is attached by utilizing this.

In FIG. 4, the jack device 40 includes the jack body 2, the cover body 30, and the flexible substrate 20. Cover body 30 made of plastic resin
Is composed of a plate-shaped plate portion 31 that covers the upper surface of the jack body 2 and leg portions 32 provided on both sides thereof. Plate part 3
1 is set to a predetermined thickness because it is sandwiched between the flexible substrates 20.

The predetermined position of the plate portion 31 (right side in the figure)
Are provided with four holes 33 at four locations corresponding to the positions of the four terminals 11 of the jack body 2, and the size of the
The size is set to be substantially the same as 1. Mounting holes 34 are formed in the legs 32 at positions corresponding to the mounting holes 5 of the jack body 2.

The cover body 30 constructed as described above is shown in FIG.
As shown in A, the terminal 11 is placed on the flexible board 20 placed on the jack body 2 so as to pass through the hole 33. Then, the folding through hole 21 is fitted into the terminal 11 while the flexible substrate 20 is folded with the dotted line c (FIG. 4) as a fulcrum and the cover body 30 is sandwiched therebetween. In this state, the terminal 11 is soldered to the land 23 (FIG. 5B).

As described above, if the flexible board 20 is not merely folded but is sandwiched by using the cover body 30, the distance from the portion to be soldered to the terminal lead-out hole 10 is reduced by the cover body 30. Since it becomes longer than when it is not used and the solder solidifies before flowing into the terminal lead-out hole 10, the flow of solder into the terminal lead-out hole 10 due to solder rising or the like is more effectively prevented.

Of course, since the flexible substrate 20 is soldered in a folded state, the sheet 7 used in the conventional example becomes unnecessary.

[0034]

As described above, in the flexible board according to the present invention, connection parts such as terminals are soldered while the flexible board is folded, and in the jack device, the cover is sandwiched between the flexible boards. It was made.

Therefore, if soldering is performed in a state where the flexible substrate is doubled, there is no need to use a sheet or the like as a separate component, so that the number of components can be reduced. Also, in the jack device, the distance until the solder flows in can be made longer, so that the solder is solidified in the middle and it is possible to more effectively prevent the solder from flowing along the connecting parts such as terminals. effective.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view when a flexible board 20 according to the present invention is used for a jack body 2. FIG.

FIG. 2 is a rear view of the flexible substrate 20;

FIG. 3 is a cross-sectional view of a flexible substrate 20.

FIG. 4 is an exploded perspective view of the jack device 40 according to the present invention.

FIG. 5 is a sectional view of a main part of the jack device 40.

FIG. 6 is an exploded perspective view showing a configuration of a conventional example.

FIG. 7 is a top view of the jack main body 2. FIG.

FIG. 8 is a sectional view of a flexible substrate 6;

FIG. 9 is a sectional view of a main part of the jack body 2 after soldering.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Plug 2 Jack main body 3 Headphone plug 4 Remote control plug 6,20 Flexible board 7 Sheet 10 Terminal lead-out hole 11,12 Terminal 13,14,23 Land 21 Folding through hole 22 Through hole 30 Cover body 31 Plate part 32 Leg part 33 hole 40 Jack device

Claims (2)

[Claims] 1. A flexible substrate for soldering a terminal or the like, wherein the flexible substrate has a through-hole through which the terminal or the like is inserted, and extends from a portion where the through-hole is drilled. A folding substrate is formed so as to make the same as above, and a folding through hole is formed in the folding substrate so as to be symmetrical with the position of the through hole at the bent portion thereof. A flexible board, wherein the terminals and the like are inserted and soldered in a state where the board for folding is folded so that the hole and the through-hole for folding overlap. 2. A jack device in which a terminal is pulled out from an upper portion, wherein a hole for inserting the terminal is formed in a cover body for covering the upper portion of the jack device, and the flexible substrate sandwiches the cover body. Wherein the terminal is inserted and the terminal is soldered.