JP2006054405A - Mounting structure of semiconductor laser device - Google Patents

Mounting structure of semiconductor laser device Download PDF

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Publication number
JP2006054405A
JP2006054405A JP2004236793A JP2004236793A JP2006054405A JP 2006054405 A JP2006054405 A JP 2006054405A JP 2004236793 A JP2004236793 A JP 2004236793A JP 2004236793 A JP2004236793 A JP 2004236793A JP 2006054405 A JP2006054405 A JP 2006054405A
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JP
Japan
Prior art keywords
semiconductor laser
circuit board
printed circuit
flexible printed
laser element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004236793A
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Japanese (ja)
Inventor
Hideaki Funakoshi
秀明 船越
Yoki Nakamura
洋喜 中村
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Funai Electric Co Ltd
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Funai Electric Co Ltd
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Priority to JP2004236793A priority Critical patent/JP2006054405A/en
Publication of JP2006054405A publication Critical patent/JP2006054405A/en
Pending legal-status Critical Current

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  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Semiconductor Lasers (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting structure of semiconductor laser devices, allowing the semiconductor laser device to be easily mounted on a flexible printed circuit board using a simple constitution. <P>SOLUTION: In mounting a semiconductor laser device 3, the folded portion 1bb of the tip of a flexible printed circuit board 1b is folded upward, and a retaining part 1bc is laminated on a soldering part 1ba, so that respective through holes c overlap. Furthermore, from the upper part of it, the terminal pin 3a of the semiconductor laser device 3 is inserted continuously into the respective through holes c of the retaining part 1bc and the soldering part 1ba in overlapped manner. In this condition, the folded part 1bb tries to be restored due to its resiliency, and a force (restoring force) is exerted, in a direction in which the retaining part 1bc and the soldering part 1ba open, as shown by arrow B. Then, the inner peripheral edge of each through hole c of the retaining part 1bc and the soldering part 1ba makes contact with the outer peripheral surface of the terminal pin 3a and presses it. Consequently, the semiconductor laser device 3 is retained to the tip of the flexible printed circuit board 1b by means of friction. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、光ディスク装置等の光ピックアップ装置に用いられる半導体レーザ素子（Ｌ
Ｄ）の取付構造に関するものである。 The present invention relates to a semiconductor laser element (L) used in an optical pickup device such as an optical disk device.
This relates to the mounting structure of D).

従来より、光ディスク装置等においては、光ディスクや光磁気ディスク等の記録媒体に
記録された情報を光学的に読み取るために、光ピックアップ装置が設けられている。そし
て、このような光ピックアップ装置の光源には、主として半導体レーザ素子（ＬＤ）が用
いられている。半導体レーザ素子は、例えば回路基板中のプリント配線基板より延びるフ
レキシブルプリント回路基板の先端に搭載された上で、光ピックアップ装置本体に取り付
けられる。 2. Description of the Related Art Conventionally, in an optical disk device or the like, an optical pickup device is provided to optically read information recorded on a recording medium such as an optical disk or a magneto-optical disk. A semiconductor laser element (LD) is mainly used as a light source of such an optical pickup device. For example, the semiconductor laser element is mounted on the tip of a flexible printed circuit board extending from a printed wiring board in the circuit board, and then attached to the optical pickup apparatus main body.

図７は、従来よりのこのような回路基板の一例を模式的に示す図である。同図において
、回路基板１は、略長方形状のプリント配線基板１ａと、プリント配線基板１ａより延び
るフレキシブルプリント回路基板１ｂ，１ｃを有している。プリント配線基板１ａにはコ
ネクタ２や図示しない抵抗，コンデンサ等の電子部品が搭載されており、その両側には図
示しない光ピックアップ装置本体にネジ固定するための取付孔１ｄが開けられている。 FIG. 7 is a diagram schematically showing an example of such a conventional circuit board. In the figure, a circuit board 1 has a substantially rectangular printed wiring board 1a and flexible printed circuit boards 1b and 1c extending from the printed wiring board 1a. The printed wiring board 1a is mounted with electronic components such as a connector 2 and resistors and capacitors (not shown), and mounting holes 1d for fixing screws to the optical pickup device main body (not shown) are formed on both sides thereof.

また、フレキシブルプリント回路基板１ｂの先端部には半導体レーザ素子３が搭載され
ており、フレキシブルプリント回路基板１ｃの先端部には受光素子４が搭載されている。
回路基板１は、フレキシブルプリント回路基板１ｂ，１ｃの部分で立体的に折り曲げられ
、図示しない光ピックアップ装置本体に、取付孔１ｄを介してネジ止めされる。また、半
導体レーザ素子３及び受光素子４も、それぞれフレキシブルプリント回路基板１ｂ，１ｃ
に搭載された状態で、この光ピックアップ装置に取り付けられる。 The semiconductor laser element 3 is mounted on the tip of the flexible printed circuit board 1b, and the light receiving element 4 is mounted on the tip of the flexible printed circuit board 1c.
The circuit board 1 is three-dimensionally bent at the portions of the flexible printed circuit boards 1b and 1c, and is screwed to the optical pickup device main body (not shown) through the mounting hole 1d. The semiconductor laser element 3 and the light receiving element 4 are also flexible printed circuit boards 1b and 1c, respectively.
It is attached to this optical pick-up apparatus in the state mounted in.

図８に、半導体レーザ素子の形状を模式的に示す。同図（ａ）は半導体レーザ素子の正
面図、同図（ｂ）は下面図である。同図（ａ）に示すように、下端に鍔状部を有する略円
柱状の半導体レーザ素子３の下面より下方に向かって、端子ピン３ａが延びている。端子
ピン３ａは、同図（ｂ）に示すように、半導体レーザ素子３の下面中心周りに、仮想の円
周ａ上に等角度ピッチ（ここでは９０゜）で４本配設されている。寸法の一例として、円
周ａの直径は２．０ｍｍ、端子ピン３ａの外径は０．４５ｍｍとなっている。 FIG. 8 schematically shows the shape of the semiconductor laser element. FIG. 2A is a front view of the semiconductor laser device, and FIG. As shown in FIG. 2A, the terminal pin 3a extends downward from the lower surface of the substantially cylindrical semiconductor laser element 3 having a bowl-shaped portion at the lower end. As shown in FIG. 4B, four terminal pins 3a are arranged around the center of the lower surface of the semiconductor laser element 3 at an equiangular pitch (90 ° here) on a virtual circumference a. As an example of the dimensions, the diameter of the circumference a is 2.0 mm, and the outer diameter of the terminal pin 3a is 0.45 mm.

図９に、フレキシブルプリント回路基板の先端部の形状を模式的に示す。同図（ａ）は
フレキシブルプリント回路基板の先端部の平面図、同図（ｂ）は正面図である。同図（ａ
）に示すように、フレキシブルプリント回路基板１ｂの先端部は略円板状を成す半田付け
部１ｂａとなっており、その上面中心周りに、仮想の円周ｂ上に等角度ピッチ（ここでは
９０゜）で４個の挿通孔ｃが開けられている。 In FIG. 9, the shape of the front-end | tip part of a flexible printed circuit board is shown typically. FIG. 4A is a plan view of the tip of the flexible printed circuit board, and FIG. 4B is a front view. Figure (a
), The distal end portion of the flexible printed circuit board 1b is a soldered portion 1ba having a substantially disc shape, and is equiangularly pitched (here 90 °) on the virtual circumference b around the center of the upper surface. Four insertion holes c are opened at (°).

この構成により、半導体レーザ素子３の端子ピン３ａがそれぞれフレキシブルプリント
回路基板１ｂの半田付け部１ｂａの挿通孔ｃに挿入されたときに、端子ピン３ａの中心が
それぞれ挿通孔ｃの中心に合致するようにしている。また、寸法の一例として、円周ｂの
直径は２．０ｍｍ、挿通孔ｃの孔径は、端子ピン３ａの外径よりも０．１ｍｍ大きい、０
．５５ｍｍとなっている。 With this configuration, when the terminal pin 3a of the semiconductor laser element 3 is inserted into the insertion hole c of the soldering portion 1ba of the flexible printed circuit board 1b, the center of the terminal pin 3a matches the center of the insertion hole c. I am doing so. As an example of the dimensions, the diameter of the circumference b is 2.0 mm, the hole diameter of the insertion hole c is 0.1 mm larger than the outer diameter of the terminal pin 3a, 0
. It is 55 mm.

図１０に、従来より採用されている半導体レーザ素子の取付構造を模式的に示す。同図
はフレキシブルプリント回路基板に半導体レーザ素子を搭載した状態の正面図である。さ
て、光ピックアップ装置を組み立てる際に、フレキシブルプリント回路基板１ｂの半田付
け部１ｂａの挿通孔ｃに、半導体レーザ素子３の端子ピン３ａを容易に挿入できるように
するため、従来は上述したように、端子ピン３ａの中心が挿通孔ｃに合致するようにして
おり、また、挿通孔ｃの孔径が端子ピン３ａの外径よりも大きくなるようにしている。 FIG. 10 schematically shows a conventional semiconductor laser element mounting structure. This figure is a front view of a state in which a semiconductor laser element is mounted on a flexible printed circuit board. Now, when assembling the optical pickup device, the terminal pin 3a of the semiconductor laser element 3 can be easily inserted into the insertion hole c of the soldering portion 1ba of the flexible printed circuit board 1b. The center of the terminal pin 3a matches the insertion hole c, and the hole diameter of the insertion hole c is larger than the outer diameter of the terminal pin 3a.

ところが、このような従来の構成では、光ピックアップ装置の組立中に端子ピン３ａが
挿通孔ｃから容易に抜けてしまうため、これを防止するために、両面テープを使用して仮
止めを行っている。具体的には、同図に示すように、フレキシブルプリント回路基板１ｂ
の上面と半導体レーザ素子３の下面との間に両面テープ５を設け、挿通孔ｃに端子ピン３
ａを挿入した状態で、フレキシブルプリント回路基板１ｂに半導体レーザ素子３を両面テ
ープ５で貼り付けている。この状態で、端子ピン３ａとフレキシブルプリント回路基板１
ｂ下面との間で半田付けを行っている（半田は不図示）。 However, in such a conventional configuration, the terminal pin 3a is easily pulled out from the insertion hole c during assembly of the optical pickup device. To prevent this, a temporary fixing is performed using a double-sided tape. Yes. Specifically, as shown in the figure, the flexible printed circuit board 1b
A double-sided tape 5 is provided between the upper surface of the semiconductor laser device 3 and the lower surface of the semiconductor laser element 3, and the terminal pin 3 is inserted into the insertion hole c.
The semiconductor laser element 3 is affixed to the flexible printed circuit board 1b with a double-sided tape 5 in a state where a is inserted. In this state, the terminal pins 3a and the flexible printed circuit board 1
b Soldering is performed between the lower surface (solder is not shown).

その他、光ピックアップ装置として、半田が剥がれるおそれがなく、端子ピンが基板か
ら抜け出る状態となることを防止する構成のものが、特許文献１に開示されている。これ
は、半導体レーザ素子のレーザ部を取り付けるレーザ取付部と、その外側面に取り付ける
回路基板とを含み、回路基板はレーザ部の端子ピンを貫通して設けた複数のピン貫通孔を
有している光ピックアップ装置において、レーザ取付部に回路基板を取り付けるための複
数のボスが突出して設けられており、回路基板には、ボスを一対一に嵌め込むための複数
のボス孔が形成されている構成としている。
特開２００２−２９８４１９号公報 In addition, as an optical pickup device, Patent Document 1 discloses a configuration that prevents solder from being peeled off and prevents the terminal pins from coming out of the substrate. This includes a laser mounting portion for mounting the laser portion of the semiconductor laser element and a circuit board to be mounted on the outer surface thereof, and the circuit substrate has a plurality of pin through holes provided through the terminal pins of the laser portion. In the optical pickup device, a plurality of bosses for attaching the circuit board to the laser attachment portion are provided so as to protrude, and the circuit board is provided with a plurality of boss holes for fitting the bosses one to one. It is configured.
JP 2002-298419 A

しかしながら、上記図１０で示したような従来の構成では、フレキシブルプリント回路
基板１ｂに予め両面テープ５を設けておかなければならず、また半導体レーザ素子３を取
り付ける際には、両面テープ５の剥離紙を剥がす作業が必要となる等、作業性が悪くなる
とともにコストアップとなる。 However, in the conventional configuration as shown in FIG. 10, the double-sided tape 5 must be provided in advance on the flexible printed circuit board 1b, and when the semiconductor laser element 3 is attached, the double-sided tape 5 is peeled off. The workability is deteriorated and the cost is increased, for example, the work of peeling the paper is required.

また、上記特許文献１に記載の構成では、まずレーザ取付部にレーザ部を取り付けた後
、回路基板のピン貫通孔にレーザ部の端子ピンを貫通させ、更に回路基板のボス孔にレー
ザ取付部のボスを嵌め込まなくてはならず、作業性の悪いものとなっている。また、レー
ザ部を回路基板に先に取り付けようとすると、上記背景技術で説明したものと同様にして
、端子ピンがピン貫通孔から容易に抜けてしまうという問題が生じる。 In the configuration described in Patent Document 1, after the laser portion is first attached to the laser attachment portion, the terminal pin of the laser portion is passed through the pin through hole of the circuit board, and the laser attachment portion is further inserted into the boss hole of the circuit board. The boss must be fitted, and workability is poor. Further, if the laser part is first attached to the circuit board, there is a problem that the terminal pin is easily pulled out from the pin through hole in the same manner as described in the background art.

本発明は、以上のような問題点に鑑み、簡単な構成で、半導体レーザ素子をフレキシブ
ルプリント回路基板に容易に取り付け可能とする、半導体レーザ素子の取付構造を提供す
ることを目的とする。 In view of the above problems, an object of the present invention is to provide a mounting structure of a semiconductor laser element that allows a semiconductor laser element to be easily mounted on a flexible printed circuit board with a simple configuration.

上記目的を達成するために、本発明では、半導体レーザ素子をフレキシブルプリント回
路基板に取り付ける構成において、前記フレキシブルプリント回路基板に折り曲げ部を設
け、その折り曲げ部の弾性による復元力を用いて、前記半導体レーザ素子を前記フレキシ
ブルプリント回路基板に摩擦保持するようにしたことを特徴とする。 In order to achieve the above object, according to the present invention, in a configuration in which a semiconductor laser element is attached to a flexible printed circuit board, a bent portion is provided in the flexible printed circuit board, and a resilience force due to the elasticity of the bent portion is used. The laser element is frictionally held on the flexible printed circuit board.

また、前記フレキシブルプリント回路基板に、前記半導体レーザ素子を取り付ける取付
部と、前記折り曲げ部を介して前記取付部と隣接し前記復元力を前記半導体レーザ素子に
作用させる作用部とを設け、前記取付部は前記半導体レーザ素子より延びる端子ピンが挿
通する挿通孔を備え、前記作用部からの前記復元力により前記挿通孔の内周縁部で前記端
子ピンの外周面を押圧するようにしたことを特徴とする。 In addition, the flexible printed circuit board is provided with an attachment portion for attaching the semiconductor laser element, and an action portion that is adjacent to the attachment portion via the bent portion and causes the restoring force to act on the semiconductor laser element. The portion includes an insertion hole through which a terminal pin extending from the semiconductor laser element is inserted, and the outer peripheral surface of the terminal pin is pressed by the inner peripheral edge portion of the insertion hole by the restoring force from the action portion. And

具体的には、前記取付部は前記半導体レーザ素子より延びる端子ピンが挿通する第１の
挿通孔を備え、前記作用部はその端子ピンが挿通する第２の挿通孔を備え、前記作用部か
らの前記復元力により前記第１及び第２の挿通孔の内周縁部で前記端子ピンの外周面を押
圧するようにしたことを特徴とする。 Specifically, the attachment portion includes a first insertion hole through which a terminal pin extending from the semiconductor laser element is inserted, and the action portion includes a second insertion hole through which the terminal pin is inserted, from the action portion. The outer peripheral surface of the terminal pin is pressed by the inner peripheral edge of the first and second insertion holes by the restoring force.

或いは、前記取付部は前記半導体レーザ素子より延びる端子ピンが挿通する挿通孔を備
え、前記作用部は少なくとも１つの前記端子ピンと係合し、前記作用部からの前記復元力
により前記挿通孔の内周縁部で前記端子ピンの外周面を押圧するようにしたことを特徴と
する。 Alternatively, the attachment portion includes an insertion hole through which a terminal pin extending from the semiconductor laser element is inserted, and the action portion engages with at least one of the terminal pins, and the inside of the insertion hole is caused by the restoring force from the action portion. The outer peripheral surface of the terminal pin is pressed by the peripheral edge portion.

本発明によれば、簡単な構成で、半導体レーザ素子をフレキシブルプリント回路基板に
容易に取り付け可能とする、半導体レーザ素子の取付構造を提供することができる。 According to the present invention, it is possible to provide a semiconductor laser element mounting structure that allows a semiconductor laser element to be easily mounted on a flexible printed circuit board with a simple configuration.

具体的には、フレキシブルプリント回路基板に折り曲げ部を設け、その折り曲げ部の弾
性による復元力を用いて、半導体レーザ素子をフレキシブルプリント回路基板に摩擦保持
するようにしたことにより、余計な部品を用いずに半導体レーザ素子を確実にフレキシブ
ルプリント回路基板に保持することが可能となるので、作業性の向上及びコストダウンを
図ることができる。 More specifically, the flexible printed circuit board is provided with a bent portion, and the elastic force of the bent portion is used to frictionally hold the semiconductor laser element on the flexible printed circuit board. Therefore, it is possible to reliably hold the semiconductor laser element on the flexible printed circuit board, thereby improving workability and reducing costs.

以下、本発明の実施の形態について、図面を参照しながら説明する。なお、上記従来例
と共通する部分には同一の符号を付して、詳細な説明を適宜省略する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected to the part which is common in the said prior art example, and detailed description is abbreviate | omitted suitably.

図１に、本発明の実施例１に係る半導体レーザ素子の取付構造における、フレキシブル
プリント回路基板の先端部の形状を模式的に示す。同図（ａ）はフレキシブルプリント回
路基板の先端部の平面図、同図（ｂ）は正面図である。同図に示すように、本実施例にお
けるフレキシブルプリント回路基板１ｂの先端部は、略円板状の半田付け部１ｂａに加え
て、短い帯状の折り曲げ部１ｂｂを介して、同径の略円板状である保持部１ｂｃを隣接さ
せた構成となっている。 FIG. 1 schematically shows the shape of the tip of a flexible printed circuit board in the semiconductor laser device mounting structure according to the first embodiment of the present invention. FIG. 4A is a plan view of the tip of the flexible printed circuit board, and FIG. 4B is a front view. As shown in the figure, the distal end portion of the flexible printed circuit board 1b in this embodiment is a substantially circular plate having the same diameter via a short strip-like bent portion 1bb in addition to the substantially disk-shaped soldering portion 1ba. It is the structure which made the holding | maintenance part 1bc which is a shape adjacent.

保持部１ｂｃの上面中心周りには、半田付け部１ｂａと同様にして、これとは別に仮想
の円周ｂ上に等角度ピッチ（ここでは９０゜）で４個の挿通孔ｃが開けられている。この
構成により、半導体レーザ素子３の端子ピン３ａがそれぞれフレキシブルプリント回路基
板１ｂの保持部１ｂｃの挿通孔ｃに挿入されたときに、端子ピン３ａの中心がそれぞれ挿
通孔ｃの中心に合致するようにしている。また、寸法の一例として、これも半田付け部１
ｂａと同様にして、円周ｂの直径は２．０ｍｍ、挿通孔ｃの孔径は、端子ピン３ａの外径
よりも０．１ｍｍ大きい、０．５５ｍｍとなっている。 Around the center of the upper surface of the holding portion 1bc, similarly to the soldering portion 1ba, apart from this, four insertion holes c are opened at an equiangular pitch (90 ° in this case) on the virtual circumference b. Yes. With this configuration, when the terminal pin 3a of the semiconductor laser element 3 is inserted into the insertion hole c of the holding portion 1bc of the flexible printed circuit board 1b, the center of the terminal pin 3a matches the center of the insertion hole c. I have to. Also, as an example of dimensions, this is also the soldering part 1
Similarly to ba, the diameter of the circumference b is 2.0 mm, and the hole diameter of the insertion hole c is 0.55 mm, which is 0.1 mm larger than the outer diameter of the terminal pin 3a.

図２に、本実施例におけるフレキシブルプリント回路基板の先端部に、半導体レーザ素
子を取り付けた状態を模式的に示す。同図（ａ）は正面図、同図（ｂ）は端子ピンと挿通
孔との位置関係を示すＡ部拡大断面図である。同図に示すように、フレキシブルプリント
回路基板１ｂの先端部に半導体レーザ素子３を取り付ける際には、フレキシブルプリント
回路基板１ｂ先端部の折り曲げ部１ｂｂを上側に折り曲げ、保持部１ｂｃを半田付け部１
ｂａに積層して、それぞれの挿通孔ｃが重なり合うようにする。そして、更にその上側よ
り、半導体レーザ素子３の端子ピン３ａを、重なり合った保持部１ｂｃ及び半田付け部１
ｂａそれぞれの挿通孔ｃに連続して挿入させる。 FIG. 2 schematically shows a state in which a semiconductor laser element is attached to the distal end portion of the flexible printed circuit board in the present embodiment. FIG. 4A is a front view, and FIG. 4B is an enlarged sectional view of a portion A showing the positional relationship between the terminal pins and the insertion holes. As shown in the figure, when the semiconductor laser element 3 is attached to the tip of the flexible printed circuit board 1b, the bent portion 1bb of the tip of the flexible printed circuit board 1b is bent upward, and the holding portion 1bc is soldered to the soldering portion 1.
It is laminated on ba so that each insertion hole c overlaps. Further, from the upper side, the terminal pin 3a of the semiconductor laser element 3 is overlapped with the overlapping holding portion 1bc and soldering portion 1.
It is made to insert continuously in each penetration hole c of ba.

この状態においては、同図（ａ）に示すように、折り曲げ部１ｂｂがその弾性により復
元しようとして、矢印Ｂで示したような、保持部１ｂｃと半田付け部１ｂａが開く方向に
力（復元力）が働く。そして、同図（ｂ）に示すように、保持部１ｂｃと半田付け部１ｂ
ａの各挿通孔ｃの内周縁部が、端子ピン３ａの外周面と接触しこれを押圧することにより
、フレキシブルプリント回路基板１ｂの先端部に半導体レーザ素子３が摩擦により確実に
保持される。この状態で、半田付け部１ｂａ下面と端子ピン３ａとの間で半田付けが行わ
れる（半田は不図示）。 In this state, a force (restoring force) in a direction in which the holding portion 1bc and the soldering portion 1ba open as indicated by an arrow B as the bent portion 1bb tries to restore due to its elasticity as shown in FIG. ) Works. Then, as shown in FIG. 5B, the holding portion 1bc and the soldering portion 1b
The inner peripheral edge of each insertion hole c of a is in contact with and presses the outer peripheral surface of the terminal pin 3a, so that the semiconductor laser element 3 is reliably held by friction at the tip of the flexible printed circuit board 1b. In this state, soldering is performed between the lower surface of the soldering portion 1ba and the terminal pins 3a (solder is not shown).

図３に、本発明の実施例２に係る半導体レーザ素子の取付構造における、フレキシブル
プリント回路基板の先端部の形状を模式的に示す。同図（ａ）はフレキシブルプリント回
路基板の先端部の平面図、同図（ｂ）は正面図である。同図に示すように、本実施例にお
けるフレキシブルプリント回路基板１ｂの先端部は、略円板状の半田付け部１ｂａに加え
て、その周縁部より外側へと延びる略Ｌ字状の係合部１ｂｄを設けた構成となっている。
略Ｌ字状の係合部１ｂｄは、その先端がフレキシブルプリント回路基板１ｂの内側へと略
直角に曲がった鍵状部となっている。 FIG. 3 schematically shows the shape of the tip of the flexible printed circuit board in the semiconductor laser device mounting structure according to the second embodiment of the present invention. FIG. 4A is a plan view of the tip of the flexible printed circuit board, and FIG. 4B is a front view. As shown in the figure, the distal end portion of the flexible printed circuit board 1b in this embodiment has a substantially disk-shaped soldering portion 1ba and a substantially L-shaped engagement portion extending outward from the peripheral edge portion. 1bd is provided.
The substantially L-shaped engaging portion 1bd is a key-like portion whose tip is bent at a substantially right angle toward the inside of the flexible printed circuit board 1b.

図４に、本実施例におけるフレキシブルプリント回路基板の先端部に、半導体レーザ素
子を取り付けた状態を模式的に示す。同図（ａ）は正面図、同図（ｂ）は端子ピンと挿通
孔及び係合部との位置関係を示すＡ部拡大断面図である。同図に示すように、フレキシブ
ルプリント回路基板１ｂの先端部に半導体レーザ素子３を取り付ける際には、半田付け部
１ｂａの上側より、半導体レーザ素子３の端子ピン３ａを、半田付け部１ｂａの挿通孔ｃ
に挿入させる。そして、係合部１ｂｄの根元部ｄを上側に折り曲げ、係合部１ｂｄを半導
体レーザ素子３と半田付け部１ｂａとの間に介在させ、先端の鍵状部を半田付け部１ｂａ
の外側より少なくとも１つの端子ピン３ａに係合させる。 FIG. 4 schematically shows a state in which a semiconductor laser element is attached to the tip of the flexible printed circuit board in the present embodiment. FIG. 4A is a front view, and FIG. 4B is an enlarged sectional view of a portion A showing the positional relationship between the terminal pin, the insertion hole, and the engaging portion. As shown in the figure, when the semiconductor laser element 3 is attached to the tip of the flexible printed circuit board 1b, the terminal pin 3a of the semiconductor laser element 3 is inserted into the soldering part 1ba from above the soldering part 1ba. Hole c
To insert. Then, the base portion d of the engaging portion 1bd is bent upward, the engaging portion 1bd is interposed between the semiconductor laser element 3 and the soldering portion 1ba, and the key-like portion at the tip is soldered to the soldering portion 1ba.
Is engaged with at least one terminal pin 3a from the outside.

この状態においては、同図（ａ）に示すように、係合部１ｂｄの根元部ｄがその弾性に
より復元しようとして、矢印Ｃで示したような、係合部１ｂｄと半田付け部１ｂａが開く
方向に力（復元力）が働き、係合部１ｂｄの先端が半導体レーザ素子３の下面を押圧する
。そして、同図（ｂ）に示すように、半田付け部１ｂａの挿通孔ｃの内周縁部が、端子ピ
ン３ａの外周面と接触しこれを押圧することにより、フレキシブルプリント回路基板１ｂ
の先端部に半導体レーザ素子３が摩擦により保持される。 In this state, the engagement portion 1bd and the soldering portion 1ba as shown by the arrow C open as the root portion d of the engagement portion 1bd tries to recover due to its elasticity as shown in FIG. A force (restoring force) acts in the direction, and the tip of the engaging portion 1 bd presses the lower surface of the semiconductor laser element 3. Then, as shown in FIG. 4B, the inner peripheral edge of the insertion hole c of the soldering portion 1ba comes into contact with and presses the outer peripheral surface of the terminal pin 3a, whereby the flexible printed circuit board 1b.
The semiconductor laser element 3 is held by friction at the front end portion.

この状態で、半田付け部１ｂａ下面と端子ピン３ａとの間で半田付けが行われる（半田
は不図示）。但し、係合部１ｂｄの先端は必ずしも半導体レーザ素子３の下面を押圧する
ことを要しない。係合部１ｂｄが端子ピン３ａと確実に係合して、半導体レーザ素子３が
摩擦によりフレキシブルプリント回路基板１ｂの先端部に確実に保持されれば良い。本実
施例では、端子ピン３ａを半田付け部１ｂａの挿通孔ｃに挿入後、係合部１ｂｄを端子ピ
ン３ａに係合させれば良いので、作業性は更に良い。 In this state, soldering is performed between the lower surface of the soldering portion 1ba and the terminal pins 3a (solder is not shown). However, the tip of the engaging portion 1bd does not necessarily need to press the lower surface of the semiconductor laser element 3. It is only necessary that the engaging portion 1bd is reliably engaged with the terminal pin 3a and the semiconductor laser element 3 is securely held at the tip portion of the flexible printed circuit board 1b by friction. In this embodiment, since the terminal pin 3a is inserted into the insertion hole c of the soldering portion 1ba and then the engaging portion 1bd is engaged with the terminal pin 3a, the workability is further improved.

図５に、本発明の実施例３に係る半導体レーザ素子の取付構造における、フレキシブル
プリント回路基板の先端部の形状を模式的に示す。同図（ａ）はフレキシブルプリント回
路基板の先端部の平面図、同図（ｂ）は正面図である。同図に示すように、本実施例にお
けるフレキシブルプリント回路基板１ｂの先端部は、略円板状の半田付け部１ｂａの周縁
部より外側へと延びる略Ｌ字状の係合部１ｂｄを、半田付け部１ｂａ寄りに少し傾斜して
設けた構成となっている。 FIG. 5 schematically shows the shape of the tip of the flexible printed circuit board in the semiconductor laser element mounting structure according to the third embodiment of the present invention. FIG. 4A is a plan view of the tip of the flexible printed circuit board, and FIG. 4B is a front view. As shown in the figure, the distal end portion of the flexible printed circuit board 1b in this embodiment has a substantially L-shaped engaging portion 1bd extending outward from the peripheral edge of the substantially disc-shaped soldering portion 1ba. It is configured to be slightly inclined toward the attachment portion 1ba.

図６に、半導体レーザ素子を取り付ける場合の、本実施例におけるフレキシブルプリン
ト回路基板の先端部の状態を模式的に示す。同図（ａ）は平面図、同図（ｂ）は正面図で
ある。同図において、フレキシブルプリント回路基板１ｂの先端部に、ここでは図示しな
い半導体レーザ素子３を取り付ける際には、上記実施例２の図４で示したものと同様にし
て、半田付け部１ｂａの上側より、半導体レーザ素子３の端子ピン３ａを、半田付け部１
ｂａの挿通孔ｃに挿入させる。そして、係合部１ｂｄの根元部ｄを上側に折り曲げ、係合
部１ｂｄを半導体レーザ素子３と半田付け部１ｂａとの間に介在させ、先端の鍵状部を半
田付け部１ｂａの外側より少なくとも１つの端子ピン３ａに係合させる。 FIG. 6 schematically shows the state of the distal end portion of the flexible printed circuit board in this embodiment when the semiconductor laser element is attached. The figure (a) is a top view, The figure (b) is a front view. In this figure, when the semiconductor laser element 3 (not shown) is attached to the tip of the flexible printed circuit board 1b, the upper side of the soldering portion 1ba is the same as that shown in FIG. Thus, the terminal pin 3 a of the semiconductor laser element 3 is connected to the soldering portion 1.
It inserts in the insertion hole c of ba. Then, the base part d of the engaging part 1bd is bent upward, the engaging part 1bd is interposed between the semiconductor laser element 3 and the soldering part 1ba, and the key part at the tip is at least from the outside of the soldering part 1ba. Engage with one terminal pin 3a.

この状態においては、同図（ｂ）に示すように、係合部１ｂｄの根元部ｄがその弾性に
より復元しようとして、矢印Ｃで示したような、係合部１ｂｄと半田付け部１ｂａが開く
方向に力（復元力）が働き、係合部１ｂｄの先端が半導体レーザ素子３の下面を押圧する
。そして、半田付け部１ｂａの挿通孔ｃの内周縁部が、端子ピン３ａの外周面と接触しこ
れを押圧することにより、フレキシブルプリント回路基板１ｂの先端部に半導体レーザ素
子３が摩擦により保持される。但し、係合部１ｂｄの先端は必ずしも半導体レーザ素子３
の下面を押圧することを要しない。係合部１ｂｄが端子ピン３ａと確実に係合して、半導
体レーザ素子３が摩擦によりフレキシブルプリント回路基板１ｂの先端部に確実に保持さ
れれば良い。 In this state, the engagement portion 1bd and the soldering portion 1ba as shown by the arrow C open as the root portion d of the engagement portion 1bd tries to recover due to its elasticity, as shown in FIG. A force (restoring force) acts in the direction, and the tip of the engaging portion 1 bd presses the lower surface of the semiconductor laser element 3. Then, the inner peripheral edge portion of the insertion hole c of the soldering portion 1ba comes into contact with and presses the outer peripheral surface of the terminal pin 3a, whereby the semiconductor laser element 3 is held by friction at the distal end portion of the flexible printed circuit board 1b. The However, the tip of the engaging portion 1bd is not necessarily the semiconductor laser element 3
It is not necessary to press the lower surface of the. It is only necessary that the engaging portion 1bd is reliably engaged with the terminal pin 3a and the semiconductor laser element 3 is securely held at the tip portion of the flexible printed circuit board 1b by friction.

本実施例では更に、上述したように、係合部１ｂｄを半田付け部１ｂａ寄りに少し傾斜
して設けてあるので、同図（ａ）の矢印Ｄで示すように、端子ピン３ａの外周面が、係合
部１ｂｄの弾性によりその先端で押圧され、横方向に力を受ける。これにより、半導体レ
ーザ素子３を保持する摩擦力が更に付加される。以上の状態で、半田付け部１ｂａ下面と
端子ピン３ａとの間で半田付けが行われる（半田は不図示）。但し、係合部１ｂｄは必ず
しも半田付け部１ｂａ寄りに傾斜して設けることを要せず、係合部１ｂｄの根元部ｄを折
り曲げたときに、弾性により係合部１ｂｄの先端部が端子ピン３ａの外周面を押圧する位
置関係となっていれば良い。 In the present embodiment, as described above, the engaging portion 1bd is slightly inclined toward the soldering portion 1ba, so that the outer peripheral surface of the terminal pin 3a is indicated by an arrow D in FIG. However, it is pressed at its tip by the elasticity of the engaging portion 1bd and receives a force in the lateral direction. Thereby, a frictional force for holding the semiconductor laser element 3 is further added. In the above state, soldering is performed between the lower surface of the soldering portion 1ba and the terminal pin 3a (solder is not shown). However, the engaging portion 1bd does not necessarily need to be inclined toward the soldering portion 1ba, and when the base portion d of the engaging portion 1bd is bent, the end portion of the engaging portion 1bd is elastically connected to the terminal pin. What is necessary is just to become the positional relationship which presses the outer peripheral surface of 3a.

なお、特許請求の範囲で言う取付部は、実施例における半田付け部１ｂａに対応してお
り、作用部は保持部１ｂｃ或いは係合部１ｂｄに、折り曲げ部は折り曲げ部１ｂｂ或いは
係合部１ｂｄの根元部ｄに、それぞれ対応している。 The attachment portion referred to in the claims corresponds to the soldering portion 1ba in the embodiment, the acting portion is the holding portion 1bc or the engaging portion 1bd, and the bent portion is the bent portion 1bb or the engaging portion 1bd. Each corresponds to the root portion d.

本発明の実施例１に係る半導体レーザ素子の取付構造における、フレキシブルプリント回路基板の先端部の形状を模式的に示す図。The figure which shows typically the shape of the front-end | tip part of a flexible printed circuit board in the attachment structure of the semiconductor laser element which concerns on Example 1 of this invention. 本実施例におけるフレキシブルプリント回路基板の先端部に、半導体レーザ素子を取り付けた状態を模式的に示す図。The figure which shows typically the state which attached the semiconductor laser element to the front-end | tip part of the flexible printed circuit board in a present Example. 本発明の実施例２に係る半導体レーザ素子の取付構造における、フレキシブルプリント回路基板の先端部の形状を模式的に示す図。The figure which shows typically the shape of the front-end | tip part of a flexible printed circuit board in the attachment structure of the semiconductor laser element which concerns on Example 2 of this invention. 本実施例におけるフレキシブルプリント回路基板の先端部に、半導体レーザ素子を取り付けた状態を模式的に示す図。The figure which shows typically the state which attached the semiconductor laser element to the front-end | tip part of the flexible printed circuit board in a present Example. 本発明の実施例３に係る半導体レーザ素子の取付構造における、フレキシブルプリント回路基板の先端部の形状を模式的に示す図。The figure which shows typically the shape of the front-end | tip part of a flexible printed circuit board in the attachment structure of the semiconductor laser element concerning Example 3 of this invention. 半導体レーザ素子を取り付ける場合の、本実施例におけるフレキシブルプリント回路基板の先端部の状態を模式的に示す図。The figure which shows typically the state of the front-end | tip part of the flexible printed circuit board in a present Example in the case of attaching a semiconductor laser element. 従来よりの回路基板の一例を模式的に示す図。The figure which shows an example of the conventional circuit board typically. 半導体レーザ素子の形状を模式的に示す図。The figure which shows the shape of a semiconductor laser element typically. 従来よりのフレキシブルプリント回路基板の先端部の形状を模式的に示す図。The figure which shows typically the shape of the front-end | tip part of the conventional flexible printed circuit board. 従来より採用されている半導体レーザ素子の取付構造を模式的に示す図。The figure which shows typically the attachment structure of the semiconductor laser element employ | adopted conventionally.

符号の説明Explanation of symbols

１ 回路基板
１ａ プリント配線基板
１ｂ フレキシブルプリント回路基板
１ｂａ 半田付け部
１ｂｂ 折り曲げ部
１ｂｃ 保持部
１ｂｄ 係合部
１ｃ フレキシブルプリント回路基板
１ｄ 取付孔
２ コネクタ
３ 半導体レーザ素子
３ａ 端子ピン
４ 受光素子
５ 両面テープ
ｃ 挿通孔
ｄ 根元部 DESCRIPTION OF SYMBOLS 1 Circuit board 1a Printed wiring board 1b Flexible printed circuit board 1ba Soldering part 1bb Bending part 1bc Holding part 1bd Engagement part 1c Flexible printed circuit board 1d Mounting hole 2 Connector 3 Semiconductor laser element 3a Terminal pin 4 Light receiving element 5 Double-sided tape c Insertion hole d Root

Claims (4)

半導体レーザ素子をフレキシブルプリント回路基板に取り付ける、半導体レーザ素子の
取付構造において、
前記フレキシブルプリント回路基板に折り曲げ部を設け、該折り曲げ部の弾性による復
元力を用いて、前記半導体レーザ素子を前記フレキシブルプリント回路基板に摩擦保持す
るようにした半導体レーザ素子の取付構造であって、
前記フレキシブルプリント回路基板に、前記半導体レーザ素子を取り付ける取付部と、
前記折り曲げ部を介して前記取付部と隣接し前記復元力を前記半導体レーザ素子に作用さ
せる作用部とを設け、
前記取付部は前記半導体レーザ素子より延びる端子ピンが挿通する第１の挿通孔を備え
、前記作用部は該端子ピンが挿通する第２の挿通孔を備え、
前記作用部からの前記復元力により前記第１及び第２の挿通孔の内周縁部で前記端子ピ
ンの外周面を押圧するようにしたことを特徴とする半導体レーザ素子の取付構造。 In the mounting structure of the semiconductor laser device, the semiconductor laser device is mounted on the flexible printed circuit board.
A mounting structure for a semiconductor laser device, wherein a bent portion is provided on the flexible printed circuit board, and the semiconductor laser element is frictionally held on the flexible printed circuit board by using a restoring force due to elasticity of the bent portion,
A mounting portion for attaching the semiconductor laser element to the flexible printed circuit board;
An action portion that is adjacent to the attachment portion via the bent portion and causes the restoring force to act on the semiconductor laser element;
The mounting portion includes a first insertion hole through which a terminal pin extending from the semiconductor laser element is inserted, and the action portion includes a second insertion hole through which the terminal pin is inserted.
An attachment structure of a semiconductor laser element, wherein the outer peripheral surface of the terminal pin is pressed by inner peripheral edge portions of the first and second insertion holes by the restoring force from the action portion. 半導体レーザ素子をフレキシブルプリント回路基板に取り付ける、半導体レーザ素子の
取付構造において、
前記フレキシブルプリント回路基板に折り曲げ部を設け、該折り曲げ部の弾性による復
元力を用いて、前記半導体レーザ素子を前記フレキシブルプリント回路基板に摩擦保持す
るようにした半導体レーザ素子の取付構造であって、
前記フレキシブルプリント回路基板に、前記半導体レーザ素子を取り付ける取付部と、
前記折り曲げ部を介して前記取付部と隣接し前記復元力を前記半導体レーザ素子に作用さ
せる作用部とを設け、
前記取付部は前記半導体レーザ素子より延びる端子ピンが挿通する挿通孔を備え、前記
作用部は少なくとも１つの前記端子ピンと係合し、
前記作用部からの前記復元力により前記挿通孔の内周縁部で前記端子ピンの外周面を押
圧するようにしたことを特徴とする半導体レーザ素子の取付構造。 In the mounting structure of the semiconductor laser device, the semiconductor laser device is mounted on the flexible printed circuit board.
A mounting structure for a semiconductor laser device, wherein a bent portion is provided on the flexible printed circuit board, and the semiconductor laser element is frictionally held on the flexible printed circuit board by using a restoring force due to elasticity of the bent portion,
A mounting portion for attaching the semiconductor laser element to the flexible printed circuit board;
An action portion that is adjacent to the attachment portion via the bent portion and causes the restoring force to act on the semiconductor laser element;
The mounting portion includes an insertion hole through which a terminal pin extending from the semiconductor laser element is inserted, and the action portion is engaged with at least one terminal pin,
A mounting structure of a semiconductor laser element, wherein the outer peripheral surface of the terminal pin is pressed by the inner peripheral edge portion of the insertion hole by the restoring force from the action portion. 半導体レーザ素子をフレキシブルプリント回路基板に取り付ける、半導体レーザ素子の
取付構造において、
前記フレキシブルプリント回路基板に折り曲げ部を設け、該折り曲げ部の弾性による復
元力を用いて、前記半導体レーザ素子を前記フレキシブルプリント回路基板に摩擦保持す
るようにしたことを特徴とする半導体レーザ素子の取付構造。 In the mounting structure of the semiconductor laser device, the semiconductor laser device is mounted on the flexible printed circuit board.
Mounting the semiconductor laser device, wherein the flexible printed circuit board is provided with a bent portion, and the semiconductor laser device is frictionally held on the flexible printed circuit board by using a restoring force due to elasticity of the bent portion. Construction. 前記フレキシブルプリント回路基板に、前記半導体レーザ素子を取り付ける取付部と、
前記折り曲げ部を介して前記取付部と隣接し前記復元力を前記半導体レーザ素子に作用さ
せる作用部とを設け、
前記取付部は前記半導体レーザ素子より延びる端子ピンが挿通する挿通孔を備え、
前記作用部からの前記復元力により前記挿通孔の内周縁部で前記端子ピンの外周面を押
圧するようにしたことを特徴とする請求項３に記載の半導体レーザ素子の取付構造。 A mounting portion for attaching the semiconductor laser element to the flexible printed circuit board;
An action portion that is adjacent to the attachment portion via the bent portion and causes the restoring force to act on the semiconductor laser element;
The mounting portion includes an insertion hole through which a terminal pin extending from the semiconductor laser element is inserted,
4. The semiconductor laser device mounting structure according to claim 3, wherein the outer peripheral surface of the terminal pin is pressed by the inner peripheral edge portion of the insertion hole by the restoring force from the action portion.
JP2004236793A 2004-08-16 2004-08-16 Mounting structure of semiconductor laser device Pending JP2006054405A (en)

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