JP2638953B2 - Optical pickup - Google Patents
Optical pickupInfo
- Publication number
- JP2638953B2 JP2638953B2 JP63173350A JP17335088A JP2638953B2 JP 2638953 B2 JP2638953 B2 JP 2638953B2 JP 63173350 A JP63173350 A JP 63173350A JP 17335088 A JP17335088 A JP 17335088A JP 2638953 B2 JP2638953 B2 JP 2638953B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- flexible printed
- hole
- semiconductor laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Landscapes
- Optical Head (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明はディスクに光スポットを投影させて、光学的
に記録，再生を行なう光ピックアップに関するものであ
る。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical pickup for projecting a light spot on a disk and optically recording and reproducing.
従来の技術 光ピックアップの半導体レーザの端子を電気的に接続
するために、従来からプリント基板がよく用いられてい
る。第５図は従来の構成を示すものであり、１は半導体
レーザ、９はプリント基板である。このプリント基板９
には半導体レーザの端子2a,2b,2cを挿入するための孔10
a,10b,10cが設けられている、また第６図は他の従来例
であるが、プリント基板９の孔11は１つ孔で構成されて
いる。第７図，第８図に示すように端子2a,2b,2cを孔10
a,10b,10cもしくは孔11に挿入後、端子2a,2b,2cとパタ
ーンのランド部12a,12b,12cを半田付することにより、
電気的に接続を行なっている。2. Description of the Related Art A printed circuit board has been often used to electrically connect terminals of a semiconductor laser of an optical pickup. FIG. 5 shows a conventional configuration, in which 1 is a semiconductor laser, and 9 is a printed circuit board. This printed circuit board 9
Has a hole 10 for inserting the semiconductor laser terminals 2a, 2b, 2c.
a, 10b, and 10c are provided. FIG. 6 shows another conventional example, but the hole 11 of the printed circuit board 9 is constituted by one hole. As shown in FIGS. 7 and 8, the terminals 2a, 2b, and 2c are
a, 10b, 10c or after insertion into the hole 11, by soldering the terminals 2a, 2b, 2c and the land portions 12a, 12b, 12c of the pattern,
The connection is made electrically.
発明が解決しようとする課題 これら従来例のうち第５図のものが最も良く用いられ
ているが、このような構成ではプリント基板９を半導体
レーザ１に自動機で挿入しようとした場合、３つの端子
2a,2b,2cのピッチが1.4〜2mmと小さいため、端子2a,2b,
2cと孔10a,10b,10cの位置合わせが非常に困難になって
くる。Problems to be Solved by the Invention Of these conventional examples, the one shown in FIG. 5 is most often used. However, in such a configuration, when an attempt is made to insert the printed circuit board 9 into the semiconductor laser 1 by an automatic machine, three types are used. Terminal
Since the pitch of 2a, 2b, 2c is as small as 1.4 to 2 mm, the terminals 2a, 2b,
It becomes very difficult to align the hole 2a with the holes 10a, 10b, 10c.
第６図はこのような欠点を解決しようとしたもので、
３つの端子2a,2b,2cの円ピッチよりも孔11を大きくして
おき、端子を挿入後、外側に少し押し広げて、パターン
のランド部12a,12b,12cに半田付する構成になってい
る。しかしながらこのような構成の場合、端子2a,2b,2c
とパターンのランド部との半田部分が、各端子の半周以
下になるため、組立後のストレスや、温度変化によるヒ
ートショックなどにより、半田付の信頼性が著しく低下
する。FIG. 6 is intended to solve such a disadvantage.
The hole 11 is made larger than the circular pitch of the three terminals 2a, 2b, 2c, and after inserting the terminals, the terminal 11 is slightly pushed outward and soldered to the land portions 12a, 12b, 12c of the pattern. I have. However, in such a configuration, the terminals 2a, 2b, 2c
Since the solder portion between the terminal and the land portion of the pattern is less than half the circumference of each terminal, the reliability of soldering is significantly reduced due to stress after assembly, heat shock due to temperature change, and the like.
本発明は上記課題に鑑みて自動組立てが容易で信頼性
のある光ピックアップを提供するものである。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides an optical pickup which is easy to assemble automatically and has high reliability.
課題を解決するための手段 本発明のピックアップはプリント基板を、補強板を裏
打ちしたフレキシブルプリント基板で構成し、フレキシ
ブル基板の孔部を補強板の孔部より小さくするか、ある
いはフレキシブル基板の３つの孔をスリットで結ぶこと
により、半導体レーザの端子をプリント基板へ自動挿入
が可能にしたものである。Means for Solving the Problems In the pickup of the present invention, the printed circuit board is constituted by a flexible printed circuit board lined with a reinforcing board, and the hole of the flexible board is made smaller than the hole of the reinforcing board. By connecting the holes with slits, the terminals of the semiconductor laser can be automatically inserted into the printed circuit board.
作用 本発明は上記構成のフレキシブルプリント基板を用い
ることにより、プリント基板を半導体レーザ端子に挿入
する際は、１つ孔の場合と同様の容易さで自動挿入が可
能であり、かつ半田付の際は独立した３つの孔の場合と
同様の信頼性を得ることができる。Function The present invention uses the flexible printed circuit board having the above-described configuration, so that when the printed circuit board is inserted into the semiconductor laser terminal, it can be automatically inserted with the same ease as in the case of a single hole, and when soldering. Can obtain the same reliability as in the case of three independent holes.
実 施 例 第１図は本発明の一実施例を示すもので３は補強板、
５はフレキシブルプリント基板であり、4,6はそれぞれ
の孔を示す。また、第２図は補強板３と、フレキシブル
プリント基板５が貼合わされた状態を示しており、点線
が補強板３の孔４、実線がフレキシブルプリント基板５
の孔６である。FIG. 1 shows an embodiment of the present invention, in which 3 is a reinforcing plate,
Reference numeral 5 denotes a flexible printed circuit board, and reference numerals 4 and 6 denote respective holes. FIG. 2 shows a state in which the reinforcing plate 3 and the flexible printed circuit board 5 are bonded together. The dotted line indicates the hole 4 of the reinforcing plate 3 and the solid line indicates the flexible printed circuit board 5.
Hole 6.
これらの孔と半導体レーザ１の端子2a,2b,2cは第２図
に示す位置関係になっており、半導体レーザ１にフレキ
シブルプリント基板５を挿入させる時は、少々位置精度
がずれても、端子2a,2b,2cが補強板３の孔４よりも内側
にあれば、フレキシブルプリント基板５を押し広げて挿
入することが可能である。また挿入後は端子2a,2b,2cを
それぞれ孔６の7a,7b,7cの位置まで押し広げて半田付を
行なう。これにより端子の半周以上，全周近くまで半田
付をすることが可能となり、従来例の第８図と比べて半
田付の信頼性を向上させることができる。These holes and the terminals 2a, 2b, 2c of the semiconductor laser 1 have the positional relationship shown in FIG. 2, and when the flexible printed circuit board 5 is inserted into the semiconductor laser 1, even if the positional accuracy is slightly shifted, If 2a, 2b, and 2c are inside the holes 4 of the reinforcing plate 3, the flexible printed circuit board 5 can be expanded and inserted. After insertion, the terminals 2a, 2b, and 2c are spread out to the positions of the holes 6a, 7b, and 7c, respectively, and soldering is performed. As a result, soldering can be performed over a half or more circumference of the terminal and near the entire circumference, and the reliability of soldering can be improved as compared with the conventional example shown in FIG.
第３図は他の実施例であり、第４図は第２図同様、補
強板３とフレキシブルプリント基板５が貼合わされた状
態を示している。FIG. 3 shows another embodiment, and FIG. 4 shows a state in which the reinforcing plate 3 and the flexible printed circuit board 5 are bonded together as in FIG.
これは第２図のフレキシブル基板５の孔が１つの孔で
構成されているのに対し、独立した３つの孔7a,7b,7cを
スリット8a,8b,8cで結んだものであり、半田を端子の全
周に回すことが可能である。In FIG. 2, three independent holes 7a, 7b, and 7c are connected by slits 8a, 8b, and 8c, whereas the hole of the flexible substrate 5 in FIG. It can be turned all around the terminal.
以上のように本実施例によれば端子とプリント基板と
の挿入が容易で、かつ半田付の信頼性の高い光ピックア
ップが実現できる。As described above, according to the present embodiment, it is possible to realize an optical pickup in which the terminal and the printed circuit board can be easily inserted and the soldering is highly reliable.
発明の効果 以上のように本発明は半導体レーザの端子に挿入する
プリント基板を補強板を裏打したフレキシブルプリント
基板で構成し、補強板とフレキシブルプリント基板の孔
形状を異ならせることにより、プリント基板の端子への
自動挿入が可能でかつ半田付の信頼性に優れた光ピック
アップを実現することができる。Effect of the Invention As described above, the present invention comprises a printed circuit board to be inserted into a terminal of a semiconductor laser by a flexible printed circuit board lined with a reinforcing plate, and by making the hole shapes of the reinforcing plate and the flexible printed circuit board different from each other, It is possible to realize an optical pickup that can be automatically inserted into a terminal and has excellent soldering reliability.
第１図は本発明の一実施例におけるフレキシブルプリン
ト基板の構成を示す分解斜視図、第２図は第１図でのフ
レキシブルプリント基板と補強板を貼合わせ、端子と光
の位置関係を示した平面図、第３図は他の実施例におけ
る構成を示す分解斜視図、第４図は第３図でのフレキシ
ブルプリント基板と補強板を貼合わせた平面図、第５
図，第６図は従来例の構成を示す斜視図、第７図，第８
図はそれぞれ第５図，第６図における端子とパターンの
半田付状態を示した平面図である。 １……半導体レーザ、2a,2b,2c……端子、３……補強
板、５……フレキシブルプリント基板、４……補強板の
孔、６……フレキシブルプリント基板の孔、7a,7b,7c…
…フレキシブルプリント基板の端子半田付部孔、8a,8b,
8c……スリット。FIG. 1 is an exploded perspective view showing a configuration of a flexible printed circuit board according to an embodiment of the present invention, and FIG. 2 shows a positional relationship between terminals and light by bonding the flexible printed circuit board and a reinforcing plate in FIG. FIG. 3 is an exploded perspective view showing the structure of another embodiment, FIG. 4 is a plan view of the flexible printed circuit board and the reinforcing plate of FIG.
FIG. 6 and FIG. 6 are perspective views showing the structure of a conventional example, and FIGS.
The figures are plan views showing the soldered state of the terminals and the patterns in FIGS. 5 and 6, respectively. DESCRIPTION OF SYMBOLS 1 ... Semiconductor laser, 2a, 2b, 2c ... Terminal, 3 ... Reinforcement plate, 5 ... Flexible printed circuit board, 4 ... Reinforcement plate hole, 6 ... Flexible printed circuit board hole, 7a, 7b, 7c …
… Holes for soldering terminals on flexible printed circuit boards, 8a, 8b,
8c …… Slit.
Claims (2)
ク上の信号を再生するための半導体レーザと、前記半導
体レーザの端子を電気的に接続するための、補強板を裏
打したフレキシブルプリント基板とを備え、前記半導体
レーザの端子を挿入する孔部が、補強板，フレキシブル
プリント基板共に一つ孔で構成されると共に、フレキシ
ブルプリント基板の孔部が補強板の孔部より小さく、か
つ半導体レーザの個々の端子と半周以上で接することを
特徴とする光ピックアップ。1. A semiconductor laser for recording a signal on a disk or reproducing a signal on a disk, and a flexible printed circuit board lined with a reinforcing plate for electrically connecting terminals of the semiconductor laser. A hole into which the terminal of the semiconductor laser is inserted is constituted by one hole for both the reinforcing plate and the flexible printed board, and the hole of the flexible printed board is smaller than the hole of the reinforcing plate; An optical pickup characterized by being in contact with at least one half of a terminal.
ク上の信号を再生するための半導体レーザと、前記半導
体レーザの端子を電気的に接続するための、補強板を裏
打したフレキシブルプリント基板とを備え、前記半導体
レーザの端子を挿入する孔部が補強板は一つ孔、フレキ
シブルプリント基板は端子数の孔で構成され、かつフレ
キシブルプリント基板のそれぞれの孔が、スリットによ
って結ばれていることを特徴とする光ピックアップ。2. A semiconductor laser for recording a signal on a disk or reproducing a signal on a disk, and a flexible printed circuit board lined with a reinforcing plate for electrically connecting terminals of the semiconductor laser. The holes for inserting the terminals of the semiconductor laser are provided such that the reinforcing plate has one hole, the flexible printed circuit board has the number of terminals, and the holes of the flexible printed circuit board are connected by slits. An optical pickup that features.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63173350A JP2638953B2 (en) | 1988-07-12 | 1988-07-12 | Optical pickup |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63173350A JP2638953B2 (en) | 1988-07-12 | 1988-07-12 | Optical pickup |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0223540A JPH0223540A (en) | 1990-01-25 |
| JP2638953B2 true JP2638953B2 (en) | 1997-08-06 |
Family
ID=15958787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63173350A Expired - Lifetime JP2638953B2 (en) | 1988-07-12 | 1988-07-12 | Optical pickup |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2638953B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9063455B2 (en) | 2012-08-28 | 2015-06-23 | Ricoh Company, Limited | Light-emitting substrate, method for manufacturing the same, optical writing device, and image forming apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014138049A (en) | 2013-01-16 | 2014-07-28 | Ricoh Co Ltd | Electronic circuit, light source device, and method for manufacturing electronic circuit |
-
1988
- 1988-07-12 JP JP63173350A patent/JP2638953B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9063455B2 (en) | 2012-08-28 | 2015-06-23 | Ricoh Company, Limited | Light-emitting substrate, method for manufacturing the same, optical writing device, and image forming apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0223540A (en) | 1990-01-25 |
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