JPH10103911A - Mounting structure for sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting structure by which the connection of an external application circuit to a multisize sensor can be performed simply and surely via a general connector, for a board, of high reliability in a sensor (the multisize sensor) devised to generate an output according to a pressurization position when a beltlike sensor face is pressurized partially. SOLUTION: A slender printed-wiring board 4 of large rigidity is used as a board, slender sheetlike sensors 6, 7, 8 which are shorter than the board are bonded onto the board, wiring patterns which are printed and formed on one end side of the printed-wiring board 4 are connected to wiring patterns of the sheetlike sensors, and a connector, for a board, which is connected to the printed patterns of the printed-wiring board 4 is mounted on one end part of the printed-wiring board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sensor mounting structure in which when a band-shaped sensor surface is partially pressurized, an output corresponding to a pressurized position is generated.

[0002]

2. Description of the Related Art When a band-shaped sensor surface is partially pressurized, a sensor that generates an output in accordance with the pressurized position (hereinafter, such a sensor is referred to as a "multi-size sensor" in this specification). FIG. 1 shows an example of the mounting structure of FIG. The main part of this multi-size sensor is an elongated strip-shaped sheet sensor 10 which is laminated by sandwiching a tape resist 13 between a lower sheet 11 and an upper sheet 12. Since the sheet-like sensor 10 is thin and flexible, it cannot be used as a multi-size sensor as it is. Therefore, the rigid and elongated metal substrate 20
(Usually an aluminum plate is used), and the sheet-like sensor 10 is bonded on the metal substrate 20. A protective film 3 is provided on the upper surface of the sheet-like sensor 10.
0 is adhered.

One end of the sheet-like sensor 10 has a terminal 10
a. The metal substrate 20 and the protective film 30 are shorter than the sheet sensor 10, and the terminal 10 a of the sheet sensor 10 protrudes from the metal substrate 20 as shown in FIG. Further, the sheet-like sensor 1 on the metal substrate 20
Most of the center of 0 is the effective area 10b, and when an arbitrary position on the effective area 10b is pressed, a resistance value corresponding to the pressed position is generated in the terminal portion 10a. Then, the contact position information can be obtained by detecting the resistance value by an application circuit (not shown).

The terminal portion 10a of the sheet-like sensor 10 and the application circuit are connected as shown in FIG. 2 or FIG. FIG.
In the connection example of FIG.
The connector 1 for a PC (flexible printed wiring board) is connected, the connector 1 for the FPC and the general connector 2 are connected by the lead wire 3, and connected to the application circuit via the general connector 2. In the connection example of FIG. 3, the FPC connector 2 is omitted, and the lead wire 3 extending from the general connector 2 is directly connected to the terminal portion 10a of the sheet-like sensor 10 by soldering or a conductive adhesive.

[0005]

In the method of connecting the sheet-like sensor 10 to an external application circuit using the FPC connector 1 as shown in FIG. 2, the contact portion between the FPC connector 1 and the terminal portion 10a is particularly required. The reliability was insufficient, and it was easy to cause poor contact when this part was repeatedly attached and detached. Also,
Since the FPC connector 1 is used in addition to the general connector 2, there is a problem that the wiring cost is high.

On the other hand, in the method of directly connecting the lead wire 3 to the terminal 10a of the sheet-like sensor 10 as shown in FIG. 3, when a large force is applied to the connection after the connection, the terminal 1
The wiring pattern 0a is easily peeled off to cause disconnection or poor contact. In addition, when replacing the multi-size sensor, the work of soldering and bonding must be performed again, which is troublesome.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described background, and has as its object to solve the above-described problems and to provide a highly reliable general-purpose connection between an external application circuit and a multi-size sensor. It is an object of the present invention to provide a sensor mounting structure which can be easily and reliably performed through a simple board connector.

[0008]

In order to achieve the above-mentioned object, in a sensor mounting structure according to the present invention, an elongated printed wiring board having a large rigidity is used as a substrate, and a short elongated sheet-shaped sensor is mounted on the substrate. A printed wiring board provided on one end side of the printed wiring board is connected to a wiring pattern of the sheet-like sensor, and a board connected to the drawn wiring pattern at one end of the printed wiring board. The connector is mounted (claim 1).

With this configuration, the sheet-like sensor, which is the sensing unit of the sensor (multi-size sensor), is mounted on a rigid printed wiring board. I don't care. Then, it can be connected to an external circuit via the board connector mounted on the end of the printed wiring board. This board connector has high reliability and can be easily attached to and detached from an external circuit. Further, since the board connector and the sensor are both mounted on the printed wiring board, it is possible to easily conduct electricity through the lead wiring pattern provided on the printed wiring board.

Various structures can be used to provide the sensor on the printed wiring board. In one example, the sheet-shaped sensor is formed by forming the wiring pattern different from the printed wiring board. The sensor can be joined to the printed wiring board, and the wiring pattern and the lead-out wiring pattern can be connected via a conductive connection member (claim 2). ). This corresponds to the first embodiment.

Further, a part of the wiring pattern of the sheet-like sensor is directly formed on the printed wiring board by printing, and the connection between the wiring pattern and the lead-out wiring pattern is made directly on the printed wiring board. It can be configured as follows (claim 3). This corresponds to the second embodiment.
In particular, according to the third aspect, the printed wiring board forms a part of the sensor, so that the number of components can be reduced. Further, the connection between the sensor wiring pattern and the lead wiring pattern can be easily performed.

[0012]

FIG. 4 shows the structure of the first embodiment of the present invention. Elongated printed wiring board 4 with large rigidity
Prepare Three wiring patterns A1, B1, and C1 are printed on the upper surface on one end side of the printed wiring board 4, and a ground pattern is formed on the entire back surface. A board connector 5 is mounted on the end of the printed wiring board 4, and the connector 5 and the lead-out wiring patterns A1, B
1, C1 and the ground pattern.

A sheet-like sensor, which is a main part of the multi-size sensor described in detail below, is formed in an elongated strip shape, but its length is shorter than that of the printed wiring board 4 and the side on which the board connector 5 is mounted. The sheet-like sensor does not overlap with the end of.

First, the lower sheet 6 is bonded to the upper surface of the printed wiring board 4. On the upper surface of the lower sheet 6, wiring patterns A2 and B2 are formed by printing. The ends of the lower sheet 6 correspond to the lead-out wiring patterns A1, B of the printed wiring board 4.
1, so as not to overlap with C1.

Further, a tape resist 7 is adhered on the lower sheet 6. The tape resist 7 is shorter than the lower sheet 6 and has a wiring pattern A on the upper surface of the lower sheet 6.
The tape resist 7 does not overlap on the ends of B2 and B2.

Then, the upper sheet 8 is bonded onto the tape resist 7. On the lower surface of the upper sheet 8, a wiring pattern C3 for sensor and a wiring pattern A3 for relay connection are provided.
And B3 are printed. The upper sheet 8 is longer than the lower sheet 6 and is positioned and adhered to form the wiring patterns A3, B on the lower surface of the upper sheet 8.
3 and C3 overlap the ends of the lead-out wiring patterns A1, B1 and C1 on the upper surface of the printed wiring board 4, respectively.
The other ends of the wiring patterns A3 and B3 are formed so as to overlap the ends of the wiring patterns A2 and B2 on the upper surface of the lower sheet 6.

The wiring patterns thus overlapped are firmly connected to each other via the conductive adhesive film 11 serving as a conductive connecting member. In this embodiment, the protective film 9 is bonded on the upper sheet 8, but the protective film 9 may not be provided depending on the material of the upper sheet 8. Furthermore, in this embodiment, the ground pattern is provided on the back surface of the printed wiring board 4. However, the present invention is not limited to this. For example, the ground pattern may be provided on the upper surface of the upper sheet 8.

With the above configuration, a multi-size sensor in which the tape resist 7 is interposed between the two wiring patterns A2 and B2 on the upper surface of the lower sheet 6 and the wiring pattern C3 on the lower surface of the upper sheet 8 provides a printing with high rigidity. It is mounted on the wiring board 4. That is, in this embodiment,
It is made of a film material on which the above-mentioned wiring pattern independent of the printed wiring board 4 is formed.

Moreover, the board connector 5 mounted on the end of the printed wiring board 4 and the wiring patterns A2, B2,
C3 is connected. Therefore, in order to connect this multi-size sensor to an external application circuit, it is only necessary to connect necessary wiring or a printed wiring board to the board connector 5.

In the above description of the embodiment, predetermined sheets and the like are sequentially laminated on the substrate, but this is for convenience of description and does not indicate the actual order of the manufacturing process. .

FIG. 5 shows a second embodiment of the present invention. In this case, the lower sheet 6 in the first embodiment shown in FIG. 4 is eliminated, and the wiring patterns A2 and B2 formed on the upper surface of the lower sheet 6 are directly printed on the printed wiring board 4. As a result, the wiring patterns A2 and B2 constituting the sensor and the lead wiring patterns A1 and B1 are formed on the same substrate surface, so that the corresponding patterns (A2 and A1, B2 and B1) are directly connected. Can be. That is, when forming patterns on the substrate, each pattern may be formed simultaneously.

A tape resist 7 is adhered on the wiring patterns A2 and B2 on the printed wiring board 4, and an upper sheet 8 is adhered thereon. The upper sheet 8 has a wiring pattern A3 for relay connection as in the embodiment of FIG.
And B3 are unnecessary. Also, the conductive connection film 11
Is also unnecessary. Note that the other configuration, operation, and effect are the same as those of the above-described embodiment, and a detailed description thereof will be omitted. Further, it is needless to say that the modification described in the first embodiment is also possible in the present embodiment.

[0023]

As described in detail above, in the sensor employing the mounting structure of the present invention, the sensor is connected to the outside through the general board connector mounted on the end of the printed wiring board serving as the board. Can be connected to an application circuit of the above, so that high contact reliability can be ensured even when attachment and detachment are repeated, and since the connector can be treated as an integral unit, maintenance is easy. Further, since external connections can be made very simply, wiring costs are low.

[Brief description of the drawings]

FIG. 1 is a plan view (A) and a cross-sectional view (B) of a conventional multi-size sensor having a mounting structure.

FIG. 2 is a diagram showing a connection example of a conventional sensor according to the first embodiment;

FIG. 3 is a diagram showing another connection example of the conventional sensor according to the first embodiment.

FIG. 4 is an exploded perspective view of a main part of the first embodiment of the present invention.

FIG. 5 is an exploded perspective view of a main part of a second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 FPC connector 2 General connector 3 Lead wire 4 Printed wiring board 5 Board connector 6 Lower sheet 7 Tape resist 8 Upper sheet 9 Protection film 11 Conductive adhesive film (conductive adhesive member)

Claims (3)

[Claims] An elongated printed wiring board having high rigidity is used as a substrate, a short elongated sheet-shaped sensor is provided on the substrate, and a lead-out wiring pattern printed and formed on one end side of the printed wiring board, and the sheet-shaped sensor is provided. And a connector for a board connected to the lead-out wiring pattern at one end of the printed wiring board. 2. The sheet-like sensor is formed of a film material on which the wiring pattern different from the printed wiring board is formed, and the sensor is joined on the printed wiring board, and the wiring pattern and the wiring pattern are connected to each other. 2. The sensor mounting structure according to claim 1, wherein the lead wiring pattern is connected to the lead wiring pattern via a conductive connection member. 3. A part of the wiring pattern of the sheet-like sensor is directly printed on the printed wiring board, and the connection between the wiring pattern and the lead-out wiring pattern is
The sensor mounting structure according to claim 1, wherein the mounting is performed directly on the printed wiring board.