JP2000299544A - Connection structure for rigid circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connection structure of a rigid substrate which allows easy connection while copes with small-amount production. SOLUTION: A connection member 10 provided with an adhesive part 12 having conductivity and adhesiveness is pasted to first and second rigid circuit boards 1 and 3 so that the first and second rigid circuit boards 1 and 3 are electrically connected. A plurality of connection members 10 are chained, and required units are cut and pasted to the rigid circuit boards 1 and 3 for use.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rigid circuit board connection structure for electrically connecting a first rigid circuit board and a second rigid circuit board.

[0002]

2. Description of the Related Art As a structure for electrically connecting a rigid circuit board (a rigid printed circuit board) to each other, 2
2. Description of the Related Art A connection structure in which two rigid printed circuit boards are soldered to each other with a flexible printed board is conventionally known (see Japanese Patent Application Laid-Open No. 8-116147). In this connection structure, more points can be connected in a small space, and the configuration is simple.

[0003]

However, in the connection structure of the above-mentioned boards, since a rigid circuit board and a flexible printed board need to be soldered, a dedicated heating device is required for assembling. As another connection structure, there is known a structure in which two rigid printed circuit boards are connected to each other using a bridge board and a connector (see Japanese Utility Model Laid-Open No. 8-660). According to this connection structure, soldering is unnecessary, and the connection operation can be easily performed. However, in this connection structure, there is a problem that the number of components increases because two sets of connectors and a bridge board are required.

Further, any of the above-described rigid board connection structures requires the use of dedicated connection parts in accordance with the number of terminals of the board to be connected, and is not suitable for small-scale production. In view of the above, the present invention makes it possible to easily perform an electrical connection in a connection structure of a rigid board,
It is another object of the present invention to provide a connection structure that can be used for small-scale production.

[0005]

According to the first aspect of the present invention, a first rigid circuit board (1) and a second rigid circuit board (3) are provided.
Are connected by a connecting member (10) having an adhesive portion (12) having conductivity and adhesiveness.

Thus, the rigid boards can be electrically connected to each other only by attaching the connecting member (10), and the connection can be easily performed. In addition, the said adhesive part (12) can be specifically comprised from conductive powders, such as aluminum and copper, and a thermoplastic or thermosetting adhesive material. According to a second aspect of the present invention, the connecting member (10) is formed in a state where a plurality of connecting members are connected to each other, and is cut into a necessary number at the time of use and is attached to the rigid circuit board (1, 3). It is characterized by being.

[0007] This makes it possible to easily cope with the case where the number of terminals of the circuit board to be connected is changed, and to achieve commonality of components. Therefore, it is possible to easily cope with small-scale production. In addition, the code in parentheses of each of the above means,
It is an example showing a correspondence relationship with specific means described in an embodiment described later.

[0008]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing a first embodiment of the present invention. (First Embodiment) FIG. 1 shows a connection structure of a rigid circuit board to which the present invention is applied. In the present embodiment, a printed circuit board is used as the first rigid circuit board 1 and the second rigid circuit board 3. Although not shown in FIG. 1, a wiring pattern of a predetermined shape is formed on each of the rigid circuit boards 1 and 3, and various electronic components are mounted on the wiring pattern. As shown in FIG. 1A, a plurality of terminal portions 2 and 4 of the wiring pattern are formed on the rigid circuit boards 1 and 3 at a predetermined interval d.

The first rigid circuit board 1 and the second rigid circuit board 3 are fixed to a case 5 of an electronic device such that the terminals 2 and 4 face each other. The terminal portion 2 of the first rigid circuit board 1 and the second
The terminal portions 4 of the rigid circuit board 3 are electrically connected to each other by a conductive tape (connecting member) 10 having conductivity.

The conductive tape 10 is formed on one surface of a conductor portion 11 made of a conductive metal such as copper by, for example, aluminum,
A conductive adhesive material 12 having conductivity and tackiness such as a conductive powder such as copper compounded with a vinyl acetate-based pressure-sensitive adhesive material or the like.
Is applied, and the other surface of the conductor portion 11 is coated with a resin 13 having an insulating property such as an epoxy resin and having a non-adhesive property after curing. The conductive adhesive 12 constitutes an adhesive part, and the non-adhesive resin 13 constitutes an insulating part. The conductive tape 10 is adhered to the rigid circuit boards 1 and 3 by the adhesive portion 12.

Hereinafter, a method of manufacturing the conductive tape 10 will be described with reference to FIG.
It will be described based on. FIG. 2A shows a configuration of the conductive tape 10 before being attached to the rigid circuit boards 1 and 3,
FIG. 2B is a sectional view taken along line BB of the conductive tape 10 of FIG. 2A, and FIG. 2C is a sectional view taken along line CC.
First, a non-adhesive resin is applied to one surface of a flexible thin plate-shaped conductor portion 11 to form an insulating portion 13. A slit portion 20 is formed in the conductor portion 11 at a distance d where the terminal portions 2 and 4 on the substrate are formed. As a result, the plurality of conductors 11 are connected by both ends.

Next, notches 21 are formed near both ends of the conductor portion 11 except for the non-adhesive resin 13 portion.
1 is divided into a first conductor 11a and a second conductor 11b. Next, a conductive adhesive material is applied to the other surface of the second conductor portion 11b to form the adhesive portion 12. As described above, the plurality of conductive tapes 10 are formed in a state where they are held at equal intervals.

When using the conductive tape 10 formed by the above process, first, the adhesive portion 12 is attached so that the side of the adhesive portion 12 adheres to the corresponding terminal portions 2, 4 of the rigid circuit boards 1, 3. At this time, one end of the conductive tape 10 is connected to the terminal 2 of the first rigid circuit board 1, and the other end of the conductive tape 10 is connected to the terminal 4 of the second rigid circuit board 3.

Next, the unnecessary first conductor portion 11 a is cut off from the conductive tape 10. At this time, the conductive tape 1
Since the notch 21 is formed at 0, the first conductor 11a can be easily separated. As a result, the terminal portions 2 of the first rigid circuit board 1 and the corresponding terminal portions 4 of the second rigid circuit board 3 are connected to the conductive tape 1.
0 is electrically connected.

As described above, according to the rigid circuit board connection structure of the present embodiment, the rigid circuit boards can be electrically connected to each other only by attaching the conductive tape 10 to the rigid circuit boards. As a result, the number of components can be reduced as compared with the related art, and connection can be easily performed. Further, in this embodiment, the conductive tape 10 is formed in a state where five terminals are held at equal intervals, but the conductive tape 1 for a larger number of terminals is formed.
It may be configured such that 0 is formed, and this is made into, for example, a reel shape, and is cut by the necessary number of terminals when used. With this configuration, it is possible to easily cope with a case where the number of terminals of the circuit board is changed, and it is possible to use common components. Therefore, it is possible to easily cope with small-scale production. (Second Embodiment) The second embodiment is different from the first embodiment in the configuration of the conductive tape 10.
The same parts as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment, and description thereof will be omitted.

Hereinafter, a method of manufacturing the conductive tape 10 according to the second embodiment will be described with reference to FIG. FIG. 3 shows a configuration of the conductive tape 10 before being attached to the rigid circuit boards 1 and 3, and FIG. 3B is a cross-sectional view of the conductive tape 10 of FIG. First, a slit portion 20 is formed in a flexible thin plate-shaped conductor portion 11 at a distance d in which terminal portions 2 and 4 to be connected are formed. A conductive adhesive material is applied to one surface of the conductor portion 11 to form an adhesive portion 1
Form 2

Next, a sheet 14 made of, for example, non-stretchable and insulating paper is prepared, and a non-adhesive resin 13 is applied to one surface of the sheet 14, and the other surface is made of, for example, vinyl acetate. An insulating adhesive material 15 made of a system adhesive or the like is applied. The sheet 14, the non-adhesive resin 13, and the insulating adhesive 15 constitute the insulating parts 13, 14, 15. The insulating adhesive material 13 side of the insulating parts 13, 14 and 15 is attached to the surface of the conductor part 11 on the side opposite to the adhesive part 12. At this time, the insulating parts 13, 14, 15 are
Is configured to cover the entirety including the slit portion 20.

Next, the conductive tape 10 formed as described above is cut at predetermined intervals e along broken lines f, g, h, i, and j in FIG. The predetermined distance e is determined by the distance between the terminal 2 of the first rigid circuit board 1 to be connected and the terminal 4 of the second rigid circuit board 3. As a result, the plurality of conductive tapes 10 are connected to each other by the sheet 14, and are formed in a state where the respective conductive tapes 10 are held at equal intervals.

When the conductive tape 10 formed by the above process is used, the conductive tape 10 is stuck so that the adhesive portion 12 contacts the corresponding terminals 2 and 4 on the rigid circuit boards 1 and 3. As a result, the terminal portions 2 of the first rigid circuit board 1 and the terminal portions 4 of the second rigid circuit board 3 are electrically connected. At this time, there is no need to remove the sheet 14 after attaching the conductive tape 10 to the terminals 2 and 4 of the rigid circuit boards 1 and 3.

Although the conductive tape 10 is formed for five terminals in the second embodiment, the conductive tape 10 for a larger number of terminals is formed and used similarly to the first embodiment. At times, it may be configured to cut only the required number of terminals. As described above, also with the configuration of the conductive tape 10 of the second embodiment, the number of components can be reduced as in the first embodiment, and connection can be easily performed. Further, it can easily cope with small-scale production. (Other Embodiments) In the above embodiment, the first rigid circuit board 1 and the second rigid circuit board 3 are each a printed circuit board. However, the present invention is not limited to this, and the present invention relates to a printed circuit board and a ceramic circuit board. The present invention can also be applied to a combination of rigid circuit boards 1 and 3 such as ceramic circuit boards.

[Brief description of the drawings]

FIG. 1A is a plan view of a connection structure of a rigid circuit board to which the present invention is applied, and FIG. 1B is an AA cross-sectional view of the connection structure of FIG.

2A is a plan view of the conductive tape according to the first embodiment, FIG. 2B is a cross-sectional view taken along the line BB of FIG. 2A, and FIG. 2C is a cross-sectional view of FIG. It is CC sectional drawing of a conductive tape.

FIG. 3A is a plan view of a conductive tape according to a second embodiment, and FIG. 3B is a cross-sectional view of the conductive tape taken along line DD of FIG.

[Explanation of symbols]

1, 3, a rigid circuit board, 2, 4, a terminal portion, 10 ... a conductive tape (connecting member), 11: a conductor portion, 12: an adhesive portion, 13: a non-adhesive resin.

Claims (2)

[Claims] 1. A rigid circuit board connection structure for electrically connecting a first rigid circuit board (1) and a second rigid circuit board (3), wherein the first rigid circuit board (1) and the rigid circuit board (3) are electrically connected to each other. The connection structure for a rigid circuit board, wherein the second rigid circuit board (3) is connected by a connection member (10) having an adhesive portion (12) having conductivity and adhesiveness. 2. The connecting member (10) is formed in a state where a plurality of connecting members are connected, cut at a necessary number in use, and affixed to the rigid circuit board (1, 3). The connection structure for a rigid substrate according to claim 1, wherein: