JP2810877B2 - Circuit board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board on which various electronic elements are mounted.

[0002]

2. Description of the Related Art Conventionally, thermosetting resin laminates are often used for circuit boards provided in electronic equipment. In recent years, there has been proposed a circuit board manufactured by injection molding of a thermoplastic resin, and a circuit pattern is formed by plating and etching, or a copper foil pattern is transferred or integrally formed. There is something. Furthermore, in many cases, a socket for a connector is attached to the circuit board, and this socket is provided separately from the circuit board, and each contact of the circuit pattern on the surface of the circuit board has a contact on the socket side. What is connected.

[0003]

In the case of the above-mentioned conventional technology, it takes a lot of man-hours to attach a socket or the like to be attached later.
In addition, it takes a lot of man-hours to solder each contact of the later-installed socket. Further, in the case of the thermosetting resin laminate of the above-mentioned conventional technology, mechanical processing such as drilling of a substrate is required, which requires a relatively large number of manufacturing steps, a large relative dielectric constant, and migration is likely to occur. There is a disadvantage that it hinders high-density mounting.

The present invention has been made in view of the above-mentioned drawbacks of the related art, and has as its object to provide a circuit board which is easy to manufacture and has high durability and reliability.

[0005]

SUMMARY OF THE INVENTION The present invention relates to a circuit pattern formed by punching a thin plate of a conductor such as a copper plate, and a terminal formed by punching together with the circuit pattern and formed on a peripheral portion and continuing from the circuit pattern. The circuit pattern and terminals are insert-molded in a thermoplastic resin, and a socket having a plurality of contact holes into which a row of terminals provided in an external connector is inserted is integrated with the circuit board by the thermoplastic resin. The circuit board is formed in such a manner that the terminal is exposed in the contact hole of the socket to form an electric contact connecting portion. The socket having the terminal is provided at one end of the circuit board, and the contact hole is opened on a surface perpendicular to the circuit board surface. In the circuit pattern, upstanding pieces for through holes for electrically connecting the front and back of the circuit board are formed.

[0006]

The circuit board of the present invention forms a circuit pattern and terminals by punching a thin plate of a conductor, insert-molds these in a thermoplastic resin, and integrally connects the circuit board and an electrical contact connecting portion such as a socket. It is formed to increase reliability and reduce manufacturing man-hours and costs.

[0007]

An embodiment of the present invention will be described below with reference to the drawings. The circuit board 10 of this embodiment is shown in FIG.
As shown in FIG. 2, the circuit pattern thin plate 3 is formed by insert molding of a thermoplastic resin, and a socket 12 serving as an electrical contact connection portion is integrally formed at one end of the circuit board 10 at the same time as the circuit board 10 is formed. Have been. The socket 12 is integrally formed in a convex shape on the side surface of one end of the substrate 10, and the contact holes 14 in which the terminals 8 of the substrate 10 are respectively exposed inside.
Are integrally formed, and are provided so that the respective terminals 15 of the external connector 13 can be inserted and connected to the respective terminals 8.

FIG. 2 shows a process of manufacturing the circuit board of this embodiment. As shown in FIG. 2A, a thin plate 1 made of a conductor such as copper is mounted on a press 2 and punched into a desired circuit pattern. (B) is the circuit pattern thin plate 3 punched out in this way. The circuit pattern thin plate 3 is formed so that the circuit pattern 4 is held by the outermost frame 5 and the connecting portions 6 at various places, so that the circuit pattern 4 does not fall apart. Further, as shown in FIG. 3C, in this embodiment, the standing pieces 7 for the conductive through holes and the terminals 8 for the sockets 12 are raised and bent. Then, as shown in (D), this circuit pattern thin plate 3 is mounted in a mold 9 of an injection molding machine, and polysulfone, polyether sulfone,
A thermoplastic resin such as polyetherimide, polyetherketone, polyphenylene sulfide, or polyallyl sulfone is injected into the mold 9. At this time, the contact hole 14 is formed by a known method, for example, the split mold 9a or the like. As a result, as shown in FIG.
And the socket 12 are integrally formed, and the standing pieces 7 and the terminals 8 are located on the side opposite to the circuit pattern forming surface of the substrate 10.
Thereafter, the connecting portion 6 connecting the frame 5 and the circuit pattern 4 is punched and cut at a fixed width, and the frame 5 is removed. Therefore, the circuit patterns 4 on both sides of the connecting portion 6 are reliably insulated by the through holes 11. The circuit board 10 is formed as described above.

A necessary circuit pattern (not shown) is formed on the surface by a conventional method, and electronic elements 16 such as an IC, a resistor, and a capacitor are mounted on the circuit board 10. According to the circuit board 10 of this embodiment, the socket 12 is formed together with the board 10, and the circuit pattern 4
Is extremely easy to manufacture, and the number of manufacturing steps and cost can be significantly reduced. In addition, since the reliability of the circuit pattern 4 is high and the strength of the circuit board 10 is high, the durability is extremely high. The socket 12 is connected to the circuit board 10.
Of the connector 1
At the time of pulling out 3, no force is applied in the direction in which the circuit board 10 is bent, and there is no apparent influence on the circuit board.

In the present invention, in addition to the above embodiment, a thermoplastic resin may be injection-molded on both sides of the circuit pattern so that only necessary terminals and the like are exposed on the substrate surface. As a result, the substrate itself can be used as a case of the electronic device, and the insulation properties are improved, the short circuit due to dew condensation is eliminated, and the substrates can be easily laminated. Also, the circuit pattern may be punched out without leaving a connection portion at the time of punching, and this may be pasted to an adhesive film, and the circuit pattern may be transferred to a substrate surface during molding, and only the adhesive film may be peeled off later. good. Further, the standing pieces and terminals may be provided simultaneously with the punching,
In some cases, it is not necessary to form them. In addition, the conductive thin plate may be aluminum or conductive ceramics other than copper, and an iron plate, a copper plate or the like further plated with copper to improve compatibility with the resin may be arbitrarily selected. Things.

In the circuit board of the present invention, a plurality of boards may be formed on the same plane, and then each may be cut into individual circuit boards. This further improves mass productivity.

[0012]

According to the circuit board of the present invention, a circuit pattern is formed by punching a thin plate of a conductor, and a thermoplastic resin is molded on the circuit pattern to integrally provide a connection portion such as a board and a socket. The number of manufacturing steps and cost of the circuit board can be greatly reduced, and the reliability and durability can be increased. In addition, productivity is further improved by forming a large number of substrates on the same plane, and cutting each of them later into individual circuit boards.

[Brief description of the drawings]

FIG. 1 is a perspective view of a circuit board manufactured by a method of manufacturing a circuit board according to one embodiment of the present invention, on which electronic elements are mounted.

FIG. 2 is a process chart showing a method for manufacturing a circuit board according to one embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 3 circuit pattern thin plate 4 circuit pattern 6 connecting portion 8 terminal 9 mold 10 circuit board 12 socket 13 connector 14 contact hole 16 electronic element

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Go Nakata 3158, Shimo-Okubo, Osawano-machi, Kamishinkawa-gun, Toyama Prefecture Inside Hokuriku Electric Industry Co., Ltd. (56) References JP-A-62-13093 (JP, A) JP-A-63-132499 (JP, A) JP-A-63-116496 (JP, A) JP-A-56-59488 (JP) JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H05K 3/20 H01R 9/09 H05K 1/11 H05K 1/02

Claims (3)

(57) [Claims] 1. A circuit pattern formed by punching a thin sheet of a conductor on an insulating circuit board on which electronic elements are mounted on a surface, and a circuit pattern formed by punching together with the circuit pattern and being formed on a peripheral portion. A continuous terminal and a socket having a plurality of contact holes into which a terminal row provided in an external connector is inserted while the circuit pattern and the terminal are insert-molded in a thermoplastic resin are formed by the thermoplastic resin. A circuit board formed integrally with the circuit board, wherein the terminal is exposed in a contact hole of the socket to form an electrical contact connection portion. 2. The circuit according to claim 1, wherein said socket having said terminal is provided at one end of said circuit board, and said contact hole is opened on a surface perpendicular to said circuit board surface. substrate. 3. The circuit board according to claim 1, wherein an upright piece for a through hole for electrically connecting the front and back of the circuit board is formed in the circuit pattern.