JP2700631B2 - Circuit board and its manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board provided with various electronic elements, circuits and the like used in electronic equipment and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, a circuit board is formed by mounting an electronic element on a thermosetting resin laminate, and a socket or the like is later mounted for transmitting and receiving signals to and from the outside.

On the other hand, recently, as disclosed in Japanese Patent Application Laid-Open No. 63-44791, a circuit board in which a thermoplastic resin is formed into a board by injection molding and a circuit and an electronic element are mounted thereon has been proposed. .

[0004]

In the former case of the above-mentioned prior art, in response to recent demands for mass production of electronic devices and reduction in the number of manufacturing steps, the number of steps for assembling circuit boards such as mounting sockets is relatively large. Was. In addition, since a socket or the like is retrofitted, the shape becomes large, which hinders reduction in size and weight.

In the latter case of the above-mentioned conventional technique, although suitable for mass production, the thermoplastic resin for circuit boards is relatively expensive, and the production cost becomes high unless mass production is sufficient. There was a disadvantage.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and has a small number of manufacturing steps, a low cost, a high-density mounting, and a circuit board which contributes to reduction in size and weight of electronic equipment. It is an object of the present invention to provide a manufacturing method thereof.

[0007]

According to the present invention, a board and a socket body are integrally formed of a thermoplastic resin, a circuit pattern is provided on the board, and a socket contact is provided on the socket body. A circuit board including an electric element formed on one surface of the substrate and connected to the socket contact, and provided on the other surface of the substrate and electrically connected to the circuit pattern through a through hole.

Further, according to the present invention, a substrate having a through hole at a predetermined position is formed by integrally molding a thermoplastic resin,
The thermoplastic resin is molded simultaneously with this substrate to form a socket body, and a circuit pattern formed on one surface of the substrate and connected to the through hole is formed by transfer from a carrier tape during molding of the substrate. A socket contact connected to the circuit pattern and electrically connected to an external connection terminal is mounted on the socket body, an electric element is mounted on the other surface of the substrate, and the circuit pattern is electrically connected through the through hole. This is a method of manufacturing a circuit board to be connected to the circuit board.

[0009]

According to the circuit board of the present invention, a board and a socket attached thereto are integrally formed of a thermoplastic resin,
It is intended to reduce the number of assembling steps of the circuit board and to make the circuit board smaller.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1 to 3 show a first embodiment of the present invention, which is an embodiment of a circuit board mounted on a CRT. In this circuit board, the board 1 is made of a thermoplastic resin such as polysulfone, polyether sulfone, polyether imide, polyether ether ketone, polyphenylene sulfide, polyallyl sulfone, and other polyimine-based resins having good heat resistance. In addition, CR
The socket body 2a of the T socket 2 is also formed of the same thermoplastic resin, and a socket contact 2b is embedded inside the socket body 2a. A case portion 3 accommodating a discharge gap or the like integrally with the socket body 2a and the substrate 1.
Are also formed of the same thermoplastic resin.

Further, electronic elements such as a printed resistor 4, a capacitor 5, and a transistor 6 are mounted on the surface of the substrate 1, and a slider moves on a resistor printed on the surface of the substrate 1. A variable resistor 7 is attached. A circuit pattern is formed on the back surface of the substrate 1 by a method described later, and is connected to each electronic element on the front surface by a through hole 8.

The production of this circuit board is described in FIGS.
(B) As shown in (C), the substrate 1, the socket 2, and the case 3 are integrally formed by injection molding by the transfer molding machine 10. In this molding method, the thermoplastic resin is
From 1, it is sent to the heating cylinder 12, heated and kneaded, becomes a fluid state, and is injected into the gate of the fixed mold 13. At this time, the carrier film 15 is provided on the front surface of the movable mold 14 by the transfer device 16, and the movable mold 14 is
The circuit pattern 17 of the copper foil formed on the surface of the carrier film 15 is transferred to the injected resin in a state of contact with the resin film 3. This transfer is performed by the heat and pressure of the injected resin. Each time the injection molding is performed, the carrier film 15 is fed one by one by the transfer device 16, and the circuit pattern on the carrier film 15 is sequentially transferred to the injection-molded substrate 1. After the injection molding of the substrate 1, the socket and the case 3, the socket contact 2b is mounted on the socket body 2a, a discharge gap or the like is provided in the case 3, and an electronic element is mounted to complete a circuit board.

According to this embodiment, the socket body 2 is formed at the same time as the board 1 is formed, and the circuit pattern 17 is also transferred to the board 1 at the same time. And greatly contributes to cost reduction and reduction in size and weight of the circuit board.

Next, a second embodiment of the present invention will be described with reference to FIG. In the circuit board of this embodiment, the socket 2 into which the connector 20 is inserted and the board 1 are integrally formed of a thermoplastic resin. This circuit board is, for example, a printed board hybrid IC for TV, and is provided with an LSI 21, a transistor 6, a transformer 22, and the like on the board 1.

In the circuit board of this embodiment, as in the first embodiment, the board 1 and the socket body 2a are formed at the same time, and the circuit pattern is transferred and formed at the same time. Similarly, the socket contact is later mounted on the socket body 2a.

According to this embodiment, it is possible to reduce the number of steps for mounting the socket for the connector on the board later, and to increase the mounting strength of the socket.

The circuit board according to the present invention is different from the above-described embodiment,
The socket is mounted on the board with different kinds of thermoplastic resin.
It may be formed next and provided. Further, the socket contact may be fixed after being injection-molded in a mold after the injection molding, instead of being mounted later, and may be mounted by insert molding. Thereby, the man-hour for mounting the socket contact can be reduced.

[0018]

The circuit board and the method of manufacturing the same according to the present invention
Since the board and the socket provided on the board are integrally formed of a thermoplastic resin, the number of steps for assembling the circuit board can be reduced, and the mounting strength of the socket portion can be increased. Can also be made smaller. Furthermore, since there is no need to retrofit a socket, the mounting density of electronic elements on the board can be increased, the position of the socket can be arbitrarily determined, and a circuit board having an optimal shape can be easily manufactured. it can. Further, since the through hole can be formed at the time of molding the substrate, the number of steps is not increased, and the through hole can be easily provided at an arbitrary position. Further, since the circuit pattern of the circuit board is transferred by injection molding, the circuit board is completed only by the injection molding process.

[Brief description of the drawings]

FIG. 1 is a perspective view of a first embodiment of a circuit board according to the present invention.

FIG. 2 is a side view of a transfer molding machine for manufacturing the circuit board of the embodiment.

FIG. 3 is a process chart showing a manufacturing process of the circuit board of this embodiment.

FIG. 4 is a perspective view of a second embodiment of the circuit board of the present invention.

[Explanation of symbols]

 1 board 2 socket 2a socket body 2b socket contact . . . Circuit pattern

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code Agency reference number FI Technical display location H01R 33/945 9462-5B H01R 33/945 V 9462-5B W 9462-5B X H05K 1/11 7128 −4E H05K 1/11 C 3/20 7511−4E 3/20 A (72) Inventor Tadashi Nakagawa 3158 Shimookubo, Osawano-cho, Kamishinkawa-gun, Toyama Prefecture Hokuriku Electric Industry Co., Ltd. (72) Inventor Tatsunori Takayasu Toyama 3158 Shimo-Okubo, Osawano-cho, Kamishinkawa-gun Hokuriku Electric Industry Co., Ltd. (72) Inventor Yozo Ohara 3158 Shimo-Okubo, Osawano-cho, Kamishinkawa-gun, Toyama Pref.

Claims (2)

(57) [Claims] 1. A board formed by integrally molding a thermoplastic resin, a socket body formed by molding a thermoplastic resin integrally with the board, and an external connection terminal provided on the socket body and electrically connected to an external connection terminal. And the contacts on the board
It is formed on the surface opposite to the body of the
A circuit pattern, anti the above circuit pattern of the substrate
A circuit board comprising: an electric element provided on the opposite surface and electrically connected to the circuit pattern by a through hole. 2. A socket body is formed by integrally molding a thermoplastic resin to form a substrate having a through hole at a predetermined position, and simultaneously molding the thermoplastic resin with the substrate.
And opposite to the socket body of the board
A circuit pattern is formed on the side surface, a contact that is connected to the circuit pattern and electrically connected to an external connection terminal is mounted on the socket body , and an electric element is mounted on the other surface of the substrate, and the through hole is mounted. A method of manufacturing a circuit board electrically connected to the circuit pattern through the same.