JPH0744347B2 - Resin molded product with circuit - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a resin-molded article with a circuit in which electronic components are integrally provided on a wall surface.

[Prior art and its problems]

BACKGROUND ART It has been conventionally known that a circuit transfer foil is set in a mold, injection molding is performed, and a circuit pattern is transferred to a resin molded body to produce a resin molded body with a circuit pattern (Japanese Patent Laid-Open Publication No. Sho.
No. 60-121791).

In the resin molded body with a circuit pattern thus obtained, the resin molded body corresponds to an insulating substrate in a normal circuit board, and its shape can be arbitrarily selected. In this case, there is an advantage that a resin molded body in which a circuit pattern is integrally provided on the inner surface of the housing can be formed.

By the way, when mounting an electronic component on such a resin molded body with a circuit pattern, after soldering the pad portion of the circuit pattern, the electronic component is placed and soldered by passing it through a reflow furnace. Will be done. However, in the case of a resin molded body with a circuit pattern, the resin molded body usually has a three-dimensional shape such as a housing, so that compared to a conventional flat circuit board, it is necessary to mount electronic components and solder. Is difficult to heat. Especially when the circuit pattern is three-dimensionally transferred (for example, when the bottom surface of the inner surface of the housing is transferred to the side surface), it is extremely difficult to place or solder the electronic component on the circuit pattern, and the three-dimensional The original characteristic that the circuit can be configured is lost.

In addition, in such a resin molded body with a circuit pattern, the resin molded body is usually considerably larger than the circuit pattern. Therefore, during injection molding, the amount of resin flowing on the circuit pattern surface increases, and There is a problem that the circuit pattern is easily damaged by heat or pressure. Further, since the shrinkage rate of the resin molded body after molding varies depending on the shape and size, there is a problem that the design must be changed depending on the shape and size of the resin molded body even if the circuit patterns have commonality.

[Means for solving problems and their effects]

An object of the present invention is to provide a resin-molded article with a circuit that solves the above-mentioned problems of the prior art.

A resin-molded article with a circuit according to the present invention which achieves this object is provided with a flat resin-molded substrate integrally on one surface of a flexible printed circuit film, and an electronic component is mounted on the other surface of the printed circuit film. And a resin-molded frame body having a window into which the resin-molded substrate of the circuit board is fitted. The resin-molded substrate is fitted and fixed in the window of the resin-molded frame body. It is a thing.

A flexible printed circuit film is a so-called FP in which a circuit conductor is formed by pattern-etching a metal foil attached to one or both sides of a plastic film.
It is preferable to use C (flexible printed circuit), but it is also possible to use one that has a circuit pattern printed on one or both sides of a plastic film with a conductive paste, or one that has a circuit pattern laminated printed with a conductive paste and an insulating paste. .

The resin-molded substrate is usually formed by setting the above-mentioned printed circuit film in a mold and injection-molding a resin. In order to integrate the resin-molded substrate and the printed circuit film, it is advisable to apply an adhesive agent in advance to the surface of the printed circuit film that contacts the resin (the surface on which the components are not mounted). Since the printed circuit film is integrated with the flat resin-molded substrate, the component mounting surface is flat and component mounting can be performed easily. The flat resin-molded substrate is a plate-shaped body having at least a flat surface to be joined to the printed circuit film, and reinforcing ribs or the like may be formed at other places as necessary.

On the other hand, the resin molding frame has a window into which the resin molding substrate is fitted. Therefore, when the resin molding substrate is fitted into the window and fixed by means such as adhesion or screwing, the resin molding substrate and the resin molding frame are The body and the body form a single three-dimensional resin molded body, for example, a housing, and the printed circuit film and the electronic component are fixed to the inner surface thereof.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 shows a resin molded body with a circuit according to an embodiment of the present invention. This resin-molded body with circuit 11 is composed of a circuit board 12 and a resin-molded frame body 13.

As shown in FIG. 2, the circuit board 12 is set with the FPC 15 having a predetermined circuit pattern in the mold 14 to perform resin injection molding, and as shown in FIG. After integrally forming the flat resin molded substrate 16 on the surface),
As shown in FIG. 4, the electronic component 17 is mounted on the opposite surface by the surface mounting method. As the base film of FPC15, a film made of polyimide, polyethylene terephthalate, polyether sulfone, or the like is used because it requires soldering heat resistance during component mounting. It is preferable to apply an adhesive to the molding resin in advance on one surface of the FPC 15. Further, since the resin molded substrate 16 also needs to have soldering heat resistance, the material thereof is thermoplastic resin such as polysulfone, polyethersulfone, polyetherimide, liquid crystal polymer, or thermosetting resin such as epoxy. , Diallyl phthalate, phenol resin and the like are preferable.

On the other hand, the resin-molded frame 13 is in the form of a casing as shown in FIG. 5, but has a window 18 formed at the bottom. The window 18 has a size such that the resin-molded substrate 16 is just fitted therein. The resin molding frame 13 is also manufactured by injection molding, but since solder heat resistance is not required, for example, acrylonitrile / butadiene / styrene resin is suitable as the material.

By fitting the resin-molded board 16 of the circuit board 12 into the window 18 of the resin-molded frame 13 as shown in FIG. 1 and fixing the engaging portions of the two with an adhesive or the like, the resin-molded frame 13 and the resin-molded frame 13 are formed. The FPC 15 is fixed to the inner surface of the casing made of the substrate 16, and the resin molded body with a circuit 11 on which the electronic component 17 is mounted can be configured.

FIG. 6 shows another embodiment of the present invention. This resin molded body with circuit 11 is also one in which the resin molded board 16 of the circuit board 12 is fitted and fixed in the window 18 of the resin molded frame body 13. The circuit board 12 used here is as shown in FIG. Terminal part 1 of FPC15
The structure is such that 5a is not fixed to the resin-molded substrate 16 and extends outside the resin-molded substrate 16. On the other hand, a connector 19 is attached to the resin molding frame 13, and the terminal portion 15a is connected to the connector 19 so that connection with an external device can be easily performed.

FIG. 8 shows still another embodiment of the present invention. The resin molded body 11 with a circuit is characterized in that the circuit board 12 as shown in FIG. 9 is used. That is, this circuit board 12 is
5 has two component mounting areas 15a and 15b, and a connecting portion 15c that does not mount components between them has a shape in which the two parts mounting areas 15a and 15b each have a flat resin molded substrate. It has a structure in which 16a and 16b are integrally provided.
Therefore, the circuit board 12 can be freely bent at the connecting portion 14c.

On the other hand, as shown in FIG. 8, windows 18a and 18b are formed in the bottom and side walls of the resin molding frame 13, and one resin molding board 16a of the circuit board 12 is placed in the bottom window 18a and the other. The resin-molded substrate 16b is fitted and fixed in the side wall windows 18b,
A resin molded body 11 with a circuit is configured.

〔The invention's effect〕

As described above, according to the present invention, the plate-shaped resin molded substrate is integrally provided on one surface of the printed circuit film, and the electronic component is mounted on the other surface. Can be done efficiently. Further, since the resin molded board portion of the circuit board thus obtained is fitted and fixed in the window of the resin molded frame, the printed circuit film is fixed in the three-dimensional resin molded body, and the electronic component It is possible to easily form a resin molded body with a circuit in which is mounted. In addition, the resin molded board may be about the same size as the printed circuit film, and the amount of resin is much smaller than when molding a three-dimensional housing. Therefore, the heat and pressure of the molten resin flowing on the printed circuit film surface can be reduced. Therefore, there is no fear that the circuit pattern or the like will be damaged, and a resin molded product with a circuit having stable quality can be obtained. Furthermore, since the resin molded board has a size corresponding to the printed circuit film, the shrinkage rate after molding the resin molded board is almost constant, and the common circuit pattern is the size and shape of the resin molded body such as the housing. There is also an advantage that it can be used as it is without considering.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a resin molded product with a circuit according to an embodiment of the present invention, FIGS. 2 and 3 are cross-sectional views showing a manufacturing process of a circuit board used therein, and FIG. 4 is a manufactured circuit. FIG. 5 is a perspective view of a substrate, FIG. 5 is a perspective view of a resin molding frame used in the resin molded body with a circuit, FIG. 6 is a sectional view showing another embodiment of the present invention, and FIG. 7 is a circuit used therefor. FIG. 8 is a perspective view of a substrate, FIG. 8 is a sectional view showing still another embodiment of the present invention,
FIG. 9 is a plan view of a circuit board used for it. 11 ~ resin molded body with circuit, 12 ~ circuit board, 13 ~ resin molded frame, 15 ~ FPC (printed circuit film), 16 ~ resin molded board, 17 ~ electronic component, 18 ~ window.

Claims (4)

[Claims] 1. A circuit board in which a flat resin molded substrate is integrally provided on one surface of a flexible printed circuit film, and electronic parts are mounted on the other surface of the printed circuit film, and the circuit board. And a resin-molded frame body in which a window for fitting the resin-molded substrate is formed, and the resin-molded substrate is fitted and fixed in the window of the resin-molded frame body to be fixed. 2. A resin molded article with a circuit according to claim 1, wherein the printed circuit film has a terminal portion which is not fixed to the resin molded substrate. 3. A resin-molded article with a circuit according to claim 1, wherein the resin-molded substrate is provided in a plurality of different locations on one surface of the printed circuit film, and the resin-molded frame body is provided with the resin-molded board. A plurality of windows formed corresponding to the resin molded substrate of. 4. A resin-molded article with a circuit according to claim 1, wherein the resin-molded substrate is made of a resin having solder heat resistance, and the resin-molded frame body is made of the resin. Made of resin with lower heat resistance.