JP2756166B2 - Molded circuit board and manufacturing method thereof - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molded circuit board in which a circuit substrate such as a printed circuit film or a punched circuit conductor and a resin molded body are integrated, and a method of manufacturing the same. .

(Prior art)

Conventionally, a molded circuit board that integrates a printed circuit film and a resin molded body by performing resin injection molding (transfer molding or the like) with a printed circuit film such as an FPC set in a mold is known. (JP-A-63-98194, etc.). Such a circuit board,
Since the resin molded body corresponds to an insulating substrate in a normal printed circuit board and its shape can be arbitrarily selected, there is an advantage that, for example, a box-shaped circuit board also serving as a case of an electronic device can be formed.

〔Task〕

However, conventional molded circuit boards have a structure in which a resin molded body is integrally provided on one side of the printed circuit film, so when mounting electronic components, etc., only the other side of the printed circuit film can be used. And there are various inconveniences.

For example, when this type of molded circuit board is used as a lid of a case of an electronic device, it may be necessary to set connection pins on its inner surface (printed circuit film side) for electrical connection with the case body. . In this case, the base of the connection pin must be soldered to the pad of the printed circuit film. There is a problem.

When this type of molded circuit board is used as a case and a switch is provided outside the case, the terminals of the switch are passed through holes formed in the molded circuit board and the printed circuit film is formed inside the molded circuit board. It becomes a structure to be soldered to the pad part. Therefore, mounting the switch is troublesome.

[Means for solving the problem and its operation]

The present invention provides a molded circuit board that solves the above problems. In addition, as a molded circuit board, a punched circuit conductor punched and formed into a predetermined circuit pattern can be used in place of a printed circuit film. And

The molded circuit board provided by the present invention is a circuit board, in which a resin molded body is integrally formed except for a partial area on one surface, and a resin is formed on the other surface in correspondence with the partial area. The molding is formed integrally, and the resin moldings on both sides are integrated through a hole formed in the circuit substrate.

In this way, not only one surface of the circuit substrate but also the other surface of the circuit substrate can be used according to the mounting form of the component, and the range in which the molded circuit board can be used is expanded. In addition, the integrity of the resin moldings on both sides can be ensured.

The present invention also provides a method for manufacturing a molded circuit board as described above, the method comprising: setting a circuit substrate having a resin distribution hole formed in a mold; and one side of the circuit substrate. A resin molded body is formed on both sides of the circuit substrate by injecting a resin into a mold from the side and flowing the resin through the hole toward the other surface.

This makes it possible to easily manufacture the molded circuit board as described above.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

1 and 2 show an embodiment of the present invention. In this molded circuit board, a resin molded body 12a is integrally formed on one surface of a printed circuit film 11 having a circuit pattern on both surfaces, leaving a partial region A on one surface, and the partial region A on the other surface. Resin molded body 12b is integrally formed corresponding to the above, and has a structure in which resin molded bodies 12a and 12b on both sides are integrated through holes 13 formed in printed circuit film 11.

In a part A of the printed circuit film 11, connection pins 14 are provided upright so as to penetrate the printed circuit film 11 and the resin molded body 12b of the part and protrude to the other surface side of the printed circuit film 11. I have. The base of the connection pin 14 is embedded and fixed in the resin molded body 12b, and is soldered to a pad on one surface of the printed circuit film 11. Reference numeral 15 denotes a soldering portion. The connection pin 14 is the resin molded body 12
By setting the base in the mold at the time of molding the a. 12b, the base can be easily integrated with the resin molded body 12b. Reference numeral 16 denotes an electronic component mounted on the other surface of the printed circuit film 11.

According to the above configuration, the base of the connection pin 14 is
Therefore, even if an insertion / extraction force is applied to the connection pin 14, an unreasonable force is not applied to the soldered portion 15, and the reliability is improved. In addition, resin (preferably resin of the same type as the resin molded bodies 12a and 12b) is filled and solidified in the concave portion 17 where a part of the area A of the printed circuit film 11 is exposed.
Reliability is further improved.

3 and 4 show another embodiment of the present invention. This molded circuit board also has a resin molded body 12a formed integrally with one surface of the printed circuit film 11 while leaving a partial area A, and a resin molded body corresponding to the partial area A on the other surface. The body 12b is integrally formed, and the resin molded bodies 12a on both sides are formed.
As in the previous embodiment, 12b is integrated through a hole 13 formed in the printed circuit film 11.

In the case of this molded circuit board, a contact (not shown) is formed on one surface of the printed circuit film 11, and a contact plate 19 attached to a rubber-like insulating sheet 18 faces the contact. is there. The periphery of the rubber-like insulating sheet 18 is adhered and fixed to the edge 20 of the resin molded body 12a in a state of being stretched. A mark corresponding to the contact plate 19 is printed on the outer surface of the rubber-like insulating sheet 18. Thereby, when any mark on the rubber-like insulating sheet 18 is pressed, the contact plate 19 below it contacts the contact to close the circuit, and when released, the contact plate 19 separates from the contact to open the circuit. Switch is configured.

Next, a method of manufacturing the above-described molded circuit board will be described with reference to FIG. In the figure, 21a
1b is a split mold, 22 is a cavity filled with resin,
23 is a resin injection hole. First, on the inner surface of one mold 21b,
After setting the printed circuit film 11 in which the holes 13 for resin distribution are formed, and covering the other mold 21a, the cavity 22 is filled with resin. Although the resin is injected from one side of the printed circuit film 11, the resin flows around the other side through the holes 13 to form a resin molded body on both sides of the printed circuit film 11. In the illustrated example, a molded circuit board as shown in FIG. 4 is manufactured. As a molding method, an injection molding method, a transfer molding method, or the like can be used.

In the above embodiments, as the circuit substrate, a printed circuit film in which a circuit pattern is formed on an insulating film using a conductive paste or copper foil was used, but in the case where the current capacity of the circuit conductor is large or in the case of a simple circuit pattern, Instead of a printed circuit film, a punched circuit conductor obtained by stamping a metal plate such as copper into a required circuit pattern can be used.

FIGS. 6 to 9 show an embodiment of the present invention in which a punched circuit conductor is used. This molded circuit board uses a punched circuit conductor 31 which is punched and formed into a shape as shown in FIG. That is, the punched circuit conductor 31 has a pair of holes 13 for resin circulation formed at both ends (one end is not shown). As shown in FIGS. 6 to 8, the molded circuit board of the present embodiment is formed by integrally forming the resin molded body 12 a while leaving a partial area A on one surface of the punched circuit conductor 31 as described above. The resin molded body 12b is integrally formed on the other surface so as to correspond to the partial area A, and the resin molded bodies 12a on both surfaces are formed.
12b has a structure integrated through the hole 13 of the punched circuit conductor 31. In the case of this molded circuit board, a part A of the punched circuit conductor 31 is
It is exposed in the concave portion 17 of a, and that portion becomes a contact terminal with an external electronic device.

This molded circuit board can be manufactured in the same manner as in the above embodiment.

〔The invention's effect〕

As described above, since the molded circuit board according to the present invention can use both sides of the circuit substrate such as a printed circuit film and a punched circuit conductor, various arrangements of components can be developed in various ways. It is convenient and also effective in improving the reliability and miniaturization of electronic devices. According to the manufacturing method of the present invention, there is an advantage that the above-described molded circuit board can be easily manufactured.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a molded circuit board according to one embodiment of the present invention, FIG. 2 is a sectional view taken along line II-II of FIG. 1, and FIG. FIG. 4 is a cross-sectional view taken along the line IV-IV of FIG. 3, FIG. 5 is a cross-sectional view showing one embodiment of the manufacturing method according to the present invention, and FIG. FIG. 7 is a perspective view showing a molded circuit board according to still another embodiment of the present invention, and FIGS.
8 is a vertical and horizontal cross-sectional view of the main part of the circuit board,
FIG. 9 is a plan view showing a main part of a punched circuit conductor used for the circuit board. 11: Printed circuit film 12a / 12b: Resin molded body, 13: Hole 14: Connection pin, 15: Solder, 16: Electronic component 17: Concave, 18: Rubber-like insulating sheet, 19: Contact plate 21a / 21b: Mold, 22: cavity 31: stamped circuit conductor

Claims (2)

(57) [Claims] 1. A circuit board, such as a printed circuit film or a punched circuit conductor, in which a resin molded body is formed integrally with one surface while leaving a partial region, and the other surface corresponds to the partial region. A molded circuit board characterized in that a resin molded body is formed integrally with each other, and the resin molded bodies on both sides are integrated through holes formed in a circuit substrate. 2. A circuit substrate such as a printed circuit film or a punched circuit conductor having holes for resin distribution is set in a mold, and a resin is injected into the mold from one side of the circuit substrate. And forming a resin molded body on both sides of the circuit substrate by flowing the resin to the other surface side through the hole.