JPS5923438Y2 - Printed wiring board component mounting device - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a component mounting device for a printed wiring board.

As shown in FIG. 1, this type of printed wiring board component mounting device is formed by forming an insertion hole 5 penetrating a part of the printed wiring board 2, and press-fitting and holding a disc capacitor 1 into the insertion hole 5. Alternatively, the shape of the disc container 1 can be changed to the insertion hole 5.
After inserting it in a structure that locks it when inserted into the
The double-sided electrodes 6 of the circular plate container 1 are attached to the circuit pattern 4 of the printed wiring board 2 by soldering.

However, in the case of such a component mounting device, the printed wiring board does not have a large elastic force due to dimensional errors in the thickness direction of the disk capacitor or dimensional errors in the insertion hole 5, so press-fitting and clamping is impossible. However, it has the disadvantage that it may become extremely difficult to insert.

Further, in the case of a structure in which the disk capacitor is simply inserted into the insertion hole and locked by the shape of the disk capacitor, there is a risk that the disk capacitor may be lifted out of the insertion hole due to the buoyancy of the solder during the flow soldering process.

The present invention has been devised to address the above-mentioned problems, and it is an object of the present invention to provide an extremely superior printed wiring board component mounting device with a simple structure.

Embodiments of the present invention will be described in detail below with reference to FIGS. 2 to 4.

That is, FIG. 2A and 2B respectively indicate the material of the printed wiring board according to the present invention, and for example, components are attached to predetermined locations of the board 11 obtained by molding an organic polymeric insulating resin material with a mold such as an injection molding method. An insertion hole 12 is formed.

A pair of thin elastic protrusions 14 are formed from one peripheral edge 13 of the component insertion hole 12 and extend toward the center so as to face each other.

As shown in FIG. 3, a desired circuit pattern 15 is formed on the surface of the substrate 11 so as to cover the pair of protruding pieces 14 and the gap between the pair of protruding pieces 14.

This circuit pattern 15 can be formed, for example, by metallizing the entire surface of the substrate 11 by plating and then etching it.

Next, an electronic component element such as a disk capacitor 16 is inserted into the component insertion hole 12 of the substrate 11 from the side where the protruding piece 14 is not formed.

At this time, the protruding pieces 14 elastically expand as shown in FIG. 4, thereby elastically holding the disk container 16.

In this case, the holding force of the disc capacitor of the protruding piece 14 is not only the elastic force of the protruding piece 14 but also the deflection force due to the deformation of the circuit pattern 15, and a more effective clamping force can be obtained.

Next, such a disk capacitor 16 and circuit pattern 1
The installation is completed by soldering 17.

In this case, the inner wall of the component insertion hole 12 is connected to the disk capacitor 16.
Since the capacitor 16 is located close to and surrounding the capacitor 16, the capacitor 16 will not wobble even if an external force is applied to the capacitor 16 during soldering.

Therefore, soldering is unlikely to be defective.

Further, since the circuit pattern 15 is formed to span the gap between the pair of protruding pieces 14, when the disk container 16 is inserted into the component insertion hole 12, the protruding piece 14 is in front of the circuit pattern 15. Nevertheless, since the portion of the circuit pattern 15 protruding from the protruding piece 14 comes into contact with the disk capacitor 16 as shown in FIG. 4, good contact between the two can be obtained.

The thickness of the thin protruding piece 14 is preferably such that it can be easily deformed when a part is press-fitted, and in the case of a general insulating resin material, it is preferably within the range of 0.001 to 0.02 cm. It is.

It goes without saying that the component mounting device of the present invention can be applied not only to disk capacitors but also to mounting other shapes of capacitors, resistors, semiconductor elements, etc.

According to the device of the present invention as described above, the electric component element can be effectively held in the component insertion hole of the printed wiring board by using the deformation force of the circuit pattern, so the stability after holding is excellent. There is no subsequent movement of the board or movement of the mounting state of the parts during one process of boot soldering, and furthermore, this improves the stability of the state of soldering after soldering.

Also, there is almost no change in the mounting condition due to dimensional errors as in the conventional case.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a conventional component mounting device, FIGS. 2 and 3 are sectional views of a board according to the present invention, and FIG. 4 is a sectional view also showing the component mounting device. 11... Board, 12... Insertion hole, 14
...Protruding piece, 15...Circuit pattern.

Claims (1)

[Scope of utility model registration request] An insulating substrate having an elastic thin protruding piece protruding toward the center from one peripheral edge of a component insertion hole, and a circuit pattern formed on the substrate surface including the protruding piece and the gap other than the protruding piece of the insulating substrate. and an electrical component element that is inserted into the component insertion hole of the insulating substrate from the side opposite to the protruding piece, is held in the hole by the protruding piece and the circuit pattern, and is soldered at the protruding piece. A printed wiring board component mounting device featuring: