JPH0644131Y2 - Substrate spacer - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] The present invention relates to a spacer for a board used for connecting printed boards, for example.

[Conventional technology]

A spacer made of metal such as brass is used when connecting the printed circuit boards with a certain gap. This substrate spacer has a shape such as a hexagonal column shape, and screws or female threads are formed on the upper and lower surfaces thereof.

When the printed circuit boards are connected to each other by the substrate spacers, the substrate spacers are interposed between the printed circuit boards, and the upper and lower surfaces of the substrate spacers are brought into contact with the printed circuit board. Then insert a male screw from the hole formed in the printed circuit board and screw it into the female screw of the substrate spacer, or screw the female screw into the male screw of the substrate spacer protruding from the hole formed in the printed circuit board. Then, the printed circuit boards are connected to each other with a certain gap.

[Problems to be solved by the device]

However, with the recent miniaturization of electronic devices,
Since the printed circuit board mounted on the printed circuit board is also downsized, the metal board spacer is likely to come into contact with the conductor pattern formed on the surface of the printed circuit board, which may cause current leakage.

Therefore, it is conceivable that the board spacer is made of an insulating resin, but the resin board spacer cannot be used in a place where a large force is applied because the strength of the screw part is small, and due to the pressure. It has a drawback that it may be easily deformed.

In order to eliminate these drawbacks, it is possible to interpose a washer made of an insulating resin between the board spacer and the printed board.

However, this would increase the number of parts.

The present invention has been made in view of the above-mentioned conventional problems, and an object thereof is to provide a substrate spacer which has no fear of current leakage, has sufficient strength, and does not increase the number of components. And

[Means for Solving the Problems]

The substrate spacer of the present invention for achieving the above object is a block-shaped substrate spacer body made of metal that connects substrates having conducting parts on the surface, and a tip on the end face of the substrate spacer body. The edge formed on the outer periphery of the tip is gradually expanded toward the tip and is projected to be smaller than the main body diameter and a short dimension, and the projection having the female thread in the center and the substantially ring-shaped outer peripheral edge are L-shaped in cross section. An insulating member that is bent to open the fitting opening on one surface is formed. The edge of the protrusion is pushed into the inner peripheral surface of the fitting opening to integrate the insulating member and the ring inner hole is connected to the female screw.

In addition, the end surface refers to a surface of the substrate spacer body that is connected to the substrate.

[Action]

According to the substrate spacer of the present invention, the insulating member fitted to the protrusion formed on the substrate spacer body is brought into contact with the substrate surface on which the conductor pattern is formed, and the metallic substrate spacer and the substrate. The conductor pattern is separated and insulated.

〔Example〕

 An embodiment of the present invention will be described below.

In FIG. 1, reference numerals 1 and 2 denote substrate spacers,
These substrate spacers 1 and 2 are both composed of block-shaped substrate spacer bodies 1a and 2a made of brass and insulating members 5 and 7.

An internal thread 3 is formed on the upper surface side of the substrate spacer body 1a, and an external thread 4 is formed on the lower surface side. On the upper surface side of the substrate spacer body 1a, a ring-shaped insulating member 5 made of an insulating resin such as polytetrafluoroethylene is provided integrally with the substrate spacer body 1a. 5c is the female screw 3 of the substrate spacer body 1a.
Is a ring inner hole communicated with. Substrate spacer body
Female threads 6 are formed on both the upper surface side and the lower surface side of 2a (in FIG. 1, the female threads on the lower surface side are not visible). On the upper surface of this substrate spacer body 2a,
Like the substrate spacer 1a, the ring-shaped insulating member 7 made of an insulating resin is used as the substrate spacer body 2a.
It is integrated with and provided.

Reference numerals 10 and 11 denote printed circuit boards, and conductor patterns 13 and 14 as conductive portions are formed on the surfaces (the lower surface side in FIG. 1) of these printed circuit boards 10 and 11. Electronic components are mounted on the printed circuit boards 10 and 11, and pins of the electronic components are soldered to the conductor patterns 13 and 14. The printed circuit boards 10 and 11 have a rectangular shape, and holes 15 and
16 are formed.

Next, using the board spacers 1 and 2, the printed board 10,
The step of connecting 11 will be described.

The board spacer 1 is interposed between the printed boards 10 and 11, the insulating member 5 is brought into contact with the peripheral portion of the hole 15 on the lower surface of the printed board 10, and the male screw 4 is fitted into the hole 16 of the printed board 11. And project it to the lower surface side.

Then, the mounting screw 18 is fitted into the hole 15 of the printed circuit board 10, screwed into the female screw 3 of the substrate spacer 1, and further the female screw 6 of the substrate spacer 2 is screwed into the male screw 4 of the substrate spacer 1. Printed circuit board 10 and printed circuit board
Connect with 11. Note that this work is performed simultaneously at the four corners of the printed circuit board.

As shown in FIG. 2, the diameter of the insulating member 5 is smaller than the diameter of the spacer body 1a for substrate by a dimension α. Therefore, the board spacer 1 is replaced by the conductor pattern 14 by the dimension α.
Can be placed close to, which is advantageous in terms of space.

The insulating member 5 is fixed to the substrate spacer body 1 by the method shown in FIGS. That is, a short projection 1b is formed on the upper surface of the spacer main body 1a for a substrate, the diameter of which gradually increases toward the tip, and the projection 1b is forcibly pushed into the fitting port 5a of the insulating member 5 to form the projection. The insulating member 5 is integrated with the substrate spacer body 1a by pressing the edge E of 1a against the inner peripheral surface of the fitting port 5a. The female screw 3 is a protrusion
It is formed in the center of 1b. Insulating member 5 as shown in FIG.
The thickness dimension β is set such that the insulating member 5 does not bend even if the protrusion 1b is pushed into the fitting hole 5a.

Unlike the board spacer made of an insulating resin, if the ground wire 27 is connected to the mounting screw 18 as shown in FIG. 5, the printed board can be grounded.

6 and 7 show the second embodiment. Symbols in the figure
20 indicates a spacer for the substrate, and this spacer 20 for the substrate
Is composed of a substrate spacer body 20a and insulating members 23 and 24. The substrate spacer body 20a has a rectangular parallelepiped shape, and female screws 21 and 22 are formed on the upper surface and the left side surface thereof. Ring-shaped insulating members 23 and 24 made of an insulating resin are formed on the upper surface and the left side surface of the substrate spacer 20 by the same method as that of the substrate spacer 1.
It is integrated into 20a. The board spacer 20 is used when the printed board 25 and the printed board 26 are connected to each other as shown in FIG.

[Effect of device]

As described above, according to the present invention, the end surface of the substrate spacer body is connected to the substrate by being separated from the conductive portion on the substrate surface by the insulating member formed to have a diameter smaller than the diameter of the substrate spacer body. The current flowing through the conductor pattern does not leak to the side of the substrate spacer body, and it becomes possible to arrange the end face of the substrate spacer body exposed around the insulating member close to the position where it overlaps the conducting portion vertically. At the same time, since the board spacer body can be made of metal, the strength of the screw part connected to the board can be made significantly larger than that made of resin, and the board spacer body can be manufactured with a small diameter. It is possible to connect small boards having a high mounting density of electronic components.

Further, since the insulating member is substantially ring-shaped and the substrate spacer main body is made of metal, it is possible to connect the ground wire to the mounting screw to ground the printed circuit board.

Further, since the substrate spacer main body and the insulating member are integrated, the number of parts is reduced and the substrates can be easily connected and separated.

Furthermore, on the end surface of the substrate spacer body, a short projection whose diameter gradually increases toward the tip is formed, and the outer edge of this projection has a fitting opening formed on one surface side of the insulating member. Since the inner peripheral surface is firmly press-fitted, the insulating member will not fall off during storage or transportation of the substrate spacer, and accidents such as a short circuit may be caused by mistakenly using the missing substrate spacer. There is nothing to wake up.

[Brief description of drawings]

FIG. 1 is a perspective view showing a state in which printed circuit boards are connected to each other by a board spacer according to a first embodiment of the present invention, and FIG. 2 is a view for explaining a relationship of a diameter dimension between an insulating member and a board spacer body. , FIG. 3 and FIG. 4 are views for explaining the method of integrating the insulating member with the substrate spacer main body, and FIG. 5 is a diagram showing a state in which a ground wire is attached to the substrate spacer, FIG. FIG. 7 is a perspective view showing a substrate spacer according to the second embodiment, and FIG. 7 is a diagram showing a usage state of the substrate spacer according to the second embodiment. 1,2,20 …… Board spacer 1a, 2a, 20a …… Board spacer body 3,6 …… Female thread 1b …… Projection 5,7,23,24 …… Insulation member 5b …… Inner peripheral surface 5c …… Inner ring 10,11,25,26 …… Printed circuit board 13,14 …… Conductor pattern (conduction part)

Claims (1)

[Scope of utility model registration request] 1. A spacer body 1 for a substrate, which is made of a metal and has a block shape, for connecting substrates having conductive portions on the surface thereof.
a, 2a, 20a and spacer body 1a, 2a, 20a for this substrate
An edge E formed on the end face of the blade is gradually expanded toward the tip and formed on the outer circumference of the tip, and the edge E is smaller than the main body diameter and protrudes in a short dimension, and has a female screw 3 or 6 at the center.
And insulating members 5, 7, 23, 24 that open the fitting port 5a on one surface by bending the outer periphery of the substantially ring shape into an L shape, and the edge E of the protrusion 1b is the inner peripheral surface of the fitting port 5a. Insulating members 5, 7, 23, 24 are integrated by being pressed into 5b, and ring inner hole
5c is a spacer for the board which is connected to the female screws 3 and 6.