JPS58158486U - igniter - Google Patents
igniterInfo
- Publication number
- JPS58158486U JPS58158486U JP5365582U JP5365582U JPS58158486U JP S58158486 U JPS58158486 U JP S58158486U JP 5365582 U JP5365582 U JP 5365582U JP 5365582 U JP5365582 U JP 5365582U JP S58158486 U JPS58158486 U JP S58158486U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- case
- insulating
- injected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
Landscapes
- Casings For Electric Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Insulating Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面は本考案の一実施例を示すもので、第１図は絶縁樹
脂注入前の状態の断面図、第２図はプリント配線基板の
平面図、第３図は絶縁樹脂を注入し、硬化させた状態の
断面図で、図中、１はケース、２はプリント配線基板、
３は導電層、４は電子部品、５は打抜孔、６は絶縁壁、
ｆ、ａ、 ５ｂは絶縁樹脂層を示す。The drawings show one embodiment of the present invention; Fig. 1 is a cross-sectional view of the state before injecting insulating resin, Fig. 2 is a plan view of the printed wiring board, and Fig. 3 is a cross-sectional view of the printed wiring board after injecting insulating resin and hardening. In the figure, 1 is the case, 2 is the printed wiring board,
3 is a conductive layer, 4 is an electronic component, 5 is a punched hole, 6 is an insulating wall,
f, a, and 5b indicate insulating resin layers.
Claims (1)
収納し、絶縁樹脂をケース内に注入、充填して電子部品
ごとプリント配線基板をケース中に埋没、固定した点火
装置において、 プリント配線基板には導電層の隣接間隔に打抜孔を開設
し、注入充填した絶縁樹脂の打抜孔を満たして硬化した
一部により隣接した導電層間に絶縁壁を形成したことを
特徴とする点火装置。 −[Scope of Utility Model Registration Claim] A printed wiring board with electronic components attached is housed in an insulating case, an insulating resin is injected and filled into the case, and the printed wiring board together with the electronic components is buried and fixed in the case. The device is characterized in that the printed wiring board has punched holes at intervals between adjacent conductive layers, and a portion of the injected insulating resin that fills the punched holes and hardens forms an insulating wall between the adjacent conductive layers. ignition device. −
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5365582U JPS58158486U (en) | 1982-04-15 | 1982-04-15 | igniter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5365582U JPS58158486U (en) | 1982-04-15 | 1982-04-15 | igniter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58158486U true JPS58158486U (en) | 1983-10-22 |
Family
ID=30064309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5365582U Pending JPS58158486U (en) | 1982-04-15 | 1982-04-15 | igniter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58158486U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0316193A (en) * | 1989-03-31 | 1991-01-24 | Furukawa Electric Co Ltd:The | Molded circuit board and its manufacturing method |
| JPH09214071A (en) * | 1996-01-31 | 1997-08-15 | Hitachi Ltd | Control board for household electrical equipment |
| JP2022038977A (en) * | 2020-08-27 | 2022-03-10 | キヤノン株式会社 | Image forming apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5334639B2 (en) * | 1973-10-15 | 1978-09-21 |
-
1982
- 1982-04-15 JP JP5365582U patent/JPS58158486U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5334639B2 (en) * | 1973-10-15 | 1978-09-21 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0316193A (en) * | 1989-03-31 | 1991-01-24 | Furukawa Electric Co Ltd:The | Molded circuit board and its manufacturing method |
| JPH09214071A (en) * | 1996-01-31 | 1997-08-15 | Hitachi Ltd | Control board for household electrical equipment |
| JP2022038977A (en) * | 2020-08-27 | 2022-03-10 | キヤノン株式会社 | Image forming apparatus |
| US11997784B2 (en) | 2020-08-27 | 2024-05-28 | Canon Kabushiki Kaisha | Image forming apparatus having circuit board positioned to minimize damage from drops during shipping |
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