JPS6360512B2 - - Google Patents
Info
- Publication number
- JPS6360512B2 JPS6360512B2 JP55115252A JP11525280A JPS6360512B2 JP S6360512 B2 JPS6360512 B2 JP S6360512B2 JP 55115252 A JP55115252 A JP 55115252A JP 11525280 A JP11525280 A JP 11525280A JP S6360512 B2 JPS6360512 B2 JP S6360512B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- molded body
- mold
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 239000011888 foil Substances 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 4
- 239000012778 molding material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 102100025490 Slit homolog 1 protein Human genes 0.000 description 1
- 101710123186 Slit homolog 1 protein Proteins 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
Description
【発明の詳細な説明】
本発明はたとえばコネクタを一体に有する印刷
配線基板の簡便な製造方法を提供するものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a simple method for manufacturing a printed wiring board having, for example, a connector integrated therein.
従来より印刷配線基板からリード線を引出す場
合、第1図に示すようにコネクタが用いられてい
る。すなわち硬質印刷配線基板1にコネクタ端子
部2を半田付け等により固定し、上記コネクタ端
子部2にソケツト部3を差込んで1つの印刷配線
基板と他基板あるいは部品との電気的接続を行な
うように構成されていた。 Conventionally, when drawing out lead wires from a printed wiring board, a connector as shown in FIG. 1 has been used. That is, the connector terminal portion 2 is fixed to the hard printed wiring board 1 by soldering or the like, and the socket portion 3 is inserted into the connector terminal portion 2 to establish an electrical connection between one printed wiring board and another board or component. It was composed of
しかしながら、この種の構造によれば、コネク
タ端子部をいちいち印刷配線基板に取付けなけれ
ばならないこと、コネクタ端子部の単価が比較的
高いこと等から作業性が悪くコスト高なものであ
つた。 However, this type of structure has poor workability and high cost because the connector terminals must be attached to the printed wiring board one by one and the unit cost of the connector terminals is relatively high.
そこで本発明はこのような従来の欠点を解消し
た印刷配線基板の簡便な製造方法を提供するもの
であり、以下にその一実施例について第2図以降
の図面と共に説明する。 Therefore, the present invention provides a simple method for manufacturing a printed wiring board that eliminates such conventional drawbacks, and one embodiment thereof will be described below with reference to FIG. 2 and subsequent drawings.
第2図は本発明の製造方法により製作した可撓
印刷配線基板であり、11はそのベースでポリイ
ミドやガラスエポキシ、ポリエステル等製の厚み
0.3mm程度の薄い可撓性シートで形成されている。
12は上記基板の導電箔、13は上記基板のベー
ス側から導電箔面側に突出するように設けられた
合成樹脂成形体で、この成形体13により、上記
印刷配線基板の一部すなわちコ字状のスリツト1
4によつて形成した舌片部15が折曲げられてい
る。上記成形体13は上記印刷配線基板のベース
11に溶解接合可能な材料たとえばABS樹脂あ
るいはベース11と同じ材料で形成されており、
上記ベース11に一体化固着されている。 Figure 2 shows a flexible printed wiring board manufactured by the manufacturing method of the present invention, and 11 is its base made of polyimide, glass epoxy, polyester, etc.
It is made of a thin flexible sheet approximately 0.3mm thick.
12 is a conductive foil of the board; 13 is a synthetic resin molded body provided so as to protrude from the base side of the board to the surface of the conductive foil; this molded body 13 forms a part of the printed wiring board, that is, a U-shape; shaped slit 1
The tongue portion 15 formed by 4 is bent. The molded body 13 is made of a material that can be melted and bonded to the base 11 of the printed wiring board, such as ABS resin or the same material as the base 11,
It is integrally fixed to the base 11.
第3図は上記印刷配線基板の舌片部15をコネ
クタ端子部として用いたものであり、この基板は
第4図に示すように金属板16を裏打ちしたもの
である。金属板16は上記ベース11及び成形樹
脂より熱収縮率が小さいもので、成形体13は連
続して設けられたランナー17と金属板16の孔
を通して上記ランナー17と可撓性印刷配線基板
のベース11を接続する接続部18とで外れ止め
されている。19はソケツト部で、これを成形体
13部分に装着すると、第5図に示すようにソケ
ツト部17内の接触子20が舌片15上の導電箔
15に接触されて、導電箔15とリード線21が
電気的に接続される。 In FIG. 3, the tongue portion 15 of the printed wiring board is used as a connector terminal portion, and this board is lined with a metal plate 16 as shown in FIG. The metal plate 16 has a smaller heat shrinkage rate than the base 11 and the molded resin, and the molded body 13 passes through the runner 17 and the hole in the metal plate 16, which are continuously provided, to connect the runner 17 and the base of the flexible printed wiring board. It is prevented from coming off by a connecting part 18 that connects 11. Reference numeral 19 designates a socket portion, and when this portion is attached to the molded body 13, the contact 20 in the socket portion 17 comes into contact with the conductive foil 15 on the tongue piece 15, as shown in FIG. Line 21 is electrically connected.
次に上述した印刷配線基板の製造方法につき、
第2図に示す基板の製造方法を代表させて第6図
と共に説明する。第6図アは可撓性印刷配線基板
でフラツトなベース11の上に回路を形成する導
電箔12がフラツトに印刷形成されている。さら
に上記基板の一部にはコ字状のスリツト14によ
つて舌片15が形成されている。22は上記成形
体13を形成するための凹所23を有する第1の
金型、24は上記印刷配線基板を収納する凹所2
5、上記第1の金型22の凹所23に対応する凹
所26とこの凹所26への樹脂注入口27を有す
る第2の金型である。そして第6図イに示すよう
に同図アの可撓性印刷配線基板を、その舌片15
が上記凹所23に対応するようにして第1、第2
の金型22,24を挾持し予熱する。この了熱状
態を第6図ウに示す。次に第6図エのように第2
の金型24の注入口27から樹脂を注入し凹所2
6に射出するとその射出圧が舌片15に加わり、
それを凹所23の周壁に押当てられるまで折曲げ
変形させる。さらに基板のベース11と成形体1
3の樹脂が反応し、成形体13がベース11に固
着される。その後、冷却させて金型22,24を
分割すれば第2図に示す印刷配線基板が完成す
る。 Next, regarding the method for manufacturing the printed wiring board mentioned above,
The manufacturing method of the substrate shown in FIG. 2 will be representatively explained with reference to FIG. 6. FIG. 6A shows a flexible printed wiring board on which a conductive foil 12 forming a circuit is printed flat on a flat base 11. Further, a tongue piece 15 is formed in a part of the substrate by a U-shaped slit 14. 22 is a first mold having a recess 23 for forming the molded body 13; 24 is a recess 2 for storing the printed wiring board;
5. A second mold having a recess 26 corresponding to the recess 23 of the first mold 22 and a resin injection port 27 into the recess 26. Then, as shown in FIG. 6A, the flexible printed wiring board shown in FIG.
correspond to the recess 23, and the first and second
The molds 22 and 24 are sandwiched and preheated. This heated state is shown in FIG. 6C. Next, the second
The resin is injected from the injection port 27 of the mold 24 into the recess 2.
6, the injection pressure is applied to the tongue piece 15,
It is bent and deformed until it is pressed against the peripheral wall of the recess 23. Furthermore, the base 11 of the substrate and the molded body 1
The resin No. 3 reacts, and the molded body 13 is fixed to the base 11. Thereafter, by cooling and dividing the molds 22 and 24, the printed wiring board shown in FIG. 2 is completed.
このように、成形樹脂の注入時の圧力でもつて
可撓性印刷配線基板の舌片を折曲げると同時に成
形体13を形成するようにしているので極めて簡
単に立体構造の印刷配線基板を作ることができ
る。 In this way, the molded body 13 is formed at the same time as the tongue piece of the flexible printed wiring board is bent by the pressure applied when the molding resin is injected, so it is possible to produce a three-dimensional printed wiring board extremely easily. I can do it.
なお第3図〜第5図に示した実施例で金属板1
6をたとえばテープレコーダのメカニズム基板と
すればこのメカニズム基板に印刷配線基板とコネ
クタを同時に形成できる。また図示しないが、成
形体13を作るのと同じ要領で基台、軸等の部品
をも樹脂成形時に同時にメカニズム基板上に形成
することができる。 In addition, in the embodiment shown in FIGS. 3 to 5, the metal plate 1
For example, if 6 is a mechanism board of a tape recorder, a printed wiring board and a connector can be formed on this mechanism board at the same time. Further, although not shown, parts such as a base and a shaft can be formed on the mechanism board at the same time as the molded body 13 is formed during resin molding.
また上記実施例では印刷配線基板上にスリツト
により形成した舌片を成形体で折曲げることとし
たが、これは印刷配線基板の端部を折曲げること
としてもよい。 Further, in the above embodiment, the tongue piece formed by a slit on the printed wiring board is bent using a molded body, but this may be done by bending the end portion of the printed wiring board.
以上説明したように本発明の印刷配線基板の製
造方法によれば、成形体によつて折曲げた基板の
一部をコネクタに利用することができ、従来のよ
うに別個にコネクタを用意してそれを基板に組付
けるといつた面倒な作業が一切不要になる。また
金型への樹脂注入圧を利用して上記基板の折曲げ
と成形体の形成を同時に行なうことができ、しか
も、成形体は可撓性印刷配線基板のベースと溶解
接合可能な樹脂材料であるため、成形時に成形体
に対して上記基板のベースを接合固着することが
できる。もつて、製造コストの大幅な低減を図る
ことができる。 As explained above, according to the method for manufacturing a printed wiring board of the present invention, a part of the board bent by the molded body can be used as a connector, instead of preparing a separate connector as in the past. Assembling it onto the board eliminates the need for all the troublesome work. In addition, the resin injection pressure into the mold can be used to simultaneously bend the board and form the molded body. Moreover, the molded body is made of a resin material that can be melted and bonded to the base of the flexible printed circuit board. Therefore, the base of the substrate can be bonded and fixed to the molded body during molding. As a result, manufacturing costs can be significantly reduced.
第1図は従来のコネクタを備えた印刷配線基板
の斜視図、第2図は本発明の製造方法により製作
した印刷配線基板を一部断面で示す斜視図、第3
図は同じく他の例を示す印刷配線基板の斜視図、
第4図は同基板の断面図、第5図は同基板にソケ
ツトを取付けた状態を示す断面図、第6図ア〜エ
は本発明の一実施例における印刷配線基板の製造
方法を説明するための図である。
11……ベース、12……導電箔、13……成
形体、22……第1の金型、24……第2の金
型、27……樹脂注入口。
FIG. 1 is a perspective view of a printed wiring board equipped with a conventional connector, FIG. 2 is a partially cross-sectional perspective view of a printed wiring board manufactured by the manufacturing method of the present invention, and FIG.
The figure is a perspective view of a printed wiring board showing another example.
FIG. 4 is a sectional view of the same board, FIG. 5 is a sectional view showing a state in which a socket is attached to the same board, and FIGS. This is a diagram for DESCRIPTION OF SYMBOLS 11... Base, 12... Conductive foil, 13... Molded body, 22... First mold, 24... Second mold, 27... Resin injection port.
Claims (1)
有する第1金型と、成形材料注入口を有する第2
金型とで、上記基板の導電箔面が第1の金型の凹
所に対応するようにして挾持し、上記第2金型の
注入口から注入した上記基板のベースと溶解接合
可能な樹脂材料の注入圧で上記基板を折曲げ、上
記基板のベース側から導電箔面側に突出しかつ上
記基板の主面と交差するように上記第1、第2の
金型にて形成した成形体に折曲げて固着された上
記基板の導電箔をコネクタ端子部とすることを特
徴とする印刷配線基板の製造方法。1 A flexible printed wiring board is placed in a first mold having a recess for forming a molded body, and a second mold having a molding material injection port.
A resin that can be melted and bonded to the base of the substrate, which is injected from the injection port of the second mold, is held between the molds so that the conductive foil surface of the substrate corresponds to the recess of the first mold. The substrate is bent by the injection pressure of the material, and the molded body is formed using the first and second molds so as to protrude from the base side of the substrate to the conductive foil side and intersect with the main surface of the substrate. A method of manufacturing a printed wiring board, characterized in that the conductive foil of the board bent and fixed is used as a connector terminal part.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11525280A JPS5738578A (en) | 1980-08-20 | 1980-08-20 | Printed circuit board and method of producing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11525280A JPS5738578A (en) | 1980-08-20 | 1980-08-20 | Printed circuit board and method of producing same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5738578A JPS5738578A (en) | 1982-03-03 |
JPS6360512B2 true JPS6360512B2 (en) | 1988-11-24 |
Family
ID=14658084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11525280A Granted JPS5738578A (en) | 1980-08-20 | 1980-08-20 | Printed circuit board and method of producing same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5738578A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US12115706B2 (en) * | 2020-02-06 | 2024-10-15 | Nissha Co., Ltd. | Molded article, electrical product and method for producing molded article |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5755127U (en) * | 1980-09-17 | 1982-03-31 | ||
JPS63229893A (en) * | 1987-03-19 | 1988-09-26 | 日本写真印刷株式会社 | Printed wiring board and manufacture of the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5337246U (en) * | 1976-09-07 | 1978-04-01 |
-
1980
- 1980-08-20 JP JP11525280A patent/JPS5738578A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5337246U (en) * | 1976-09-07 | 1978-04-01 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US12115706B2 (en) * | 2020-02-06 | 2024-10-15 | Nissha Co., Ltd. | Molded article, electrical product and method for producing molded article |
Also Published As
Publication number | Publication date |
---|---|
JPS5738578A (en) | 1982-03-03 |
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