JP4737505B2 - IC tag inlet and manufacturing method of IC tag inlet - Google Patents

Description

  The present invention relates to an IC tag inlet and a method for manufacturing an IC tag inlet.

  In recent years, a non-contact type individual identification system using an IC tag has attracted attention as a system for managing the entire life cycle of goods in all business categories of manufacturing, distribution, sales, and recycling. In particular, radio frequency type IC tags using UHF waves and microwaves are attracting attention due to the feature that an external antenna is attached to an IC chip and a communication distance of several meters is possible. System construction is underway for the purpose of product history management.

  As a radio wave type IC tag using a microwave, for example, a tag using a TCP (Tape Carrier Package) type inlet developed by Hitachi, Ltd. and Renesas Technology Corp. is known. Here, the inlet is a non-contact type solid identification IC chip mounted on a transmission / reception antenna, and is an intermediate form of an IC tag.

  As another inlet structure, for example, Hitachi, Ltd. has developed a structure in which an IC chip (hereinafter referred to as a double-sided electrode chip) in which one external electrode is formed on each of the front and back surfaces is sandwiched between excitation slit dipole antennas ( Patent Document 1). The dipole antenna structure having the excitation slit can match the impedance of the antenna and the input impedance of the IC chip by changing the width and length of the slit, and can obtain good communication characteristics.

  In addition, the above inlet structure in which the double-sided electrode chip is sandwiched between the antennas does not need to straddle the excitation slit with two external electrodes formed in the same plane as in the case of an inlet using a conventional IC chip. Alignment is unnecessary and high productivity can be realized. Currently, in order to reduce the cost of IC chips, further downsizing of the chips is being promoted, and the above-described TCP type inlet has been put into practical use with an IC chip having a size of 0.4 mm × 0.4 mm. . Further, other manufacturers have also reported the development of an IC chip having a size of 0.15 mm × 0.15 mm (see Non-Patent Document 1).

On the other hand, as a technology for mounting small electronic components, development of technology for mounting extremely small chip components such as resistors and capacitors, which are passive components, has progressed, and the 0603 type (0.6 mm × 0) has already been developed with a high-speed chip mounting machine. .3 mm) component mounting has been put into practical use, and the 0402 type has also been adopted. However, further miniaturization is expected to involve problems such as the friction between the parts and the conveyor, the processing accuracy of the parts constituting the mounting machine, and the minute roughness of the surface.
Japanese Patent Laid-Open No. 2004-127230 COMPUTER & NETWORK LAN p. 32 JANUARY. 2004

  In order to realize a large quantity of merchandise distribution and article management with a non-contact type individual identification system using an IC tag, it is necessary to attach an IC tag to each of the merchandise. For this purpose, a technology capable of mass-producing inexpensive IC tags is indispensable. In order to reduce the price of an IC tag, first, an IC tag inlet, which is an intermediate form of the IC tag and has an IC chip mounted on a transmission / reception antenna, must be produced inexpensively and efficiently. Since the IC tag inlet has a simple configuration composed of an IC chip and a transmission / reception antenna, the proportion of the IC chip in the price is large, and in order to reduce it, the chip is being downsized.

  However, if the size of the IC chip is smaller than 0.3 mm × 0.3 mm, it becomes difficult to carry the IC chip or handle it at the time of mounting, and it is expected that the cost for mounting will increase as productivity decreases. Is done. The present invention has been made in view of the above, and when the IC chip is approximately 0.3 mm × 0.3 mm or smaller, the IC chip can be easily handled by 0.3 mm × 0.3 mm. By supporting it with a metal plate that is larger than about, it can be efficiently mounted on the antenna. That is, the present invention provides an IC tag inlet structure and a method for manufacturing the same that can suppress a reduction in productivity and an increase in mounting cost caused by downsizing of an IC chip.

That is, the present invention is as follows.
1 . An IC chip for wireless communication formed on each face of a set of external electrodes facing each other, a metal plate supporting the IC chip, a transmission / reception antenna, and the IC chip and the transmission / reception antenna are electrically connected. In an IC tag inlet having a short-circuit plate to be connected, an external electrode on one surface of the IC chip is connected and fixed to the metal plate, and an external electrode on the other surface is connected to the transmission / reception antenna or the short-circuit plate The fixed surface of the metal plate opposite to the surface to which the IC chip is connected and fixed is connected and fixed to one of the transmitting / receiving antenna and the short-circuit plate to which the IC chip is not connected and fixed. Characteristic IC tag inlet.
2 . Item 2. The IC tag inlet according to Item 1, wherein the size of the IC chip is 0.3 mm x 0.3 mm or less.
3 . Item 3. The IC according to Item 1 or 2 , wherein the metal plate has a size of 0.3 mm × 0.3 mm or more.
Tag inlet.
4 . Item 4. The IC tag inlet according to any one of Items 1 to 3 , wherein an external electrode formed on one surface of the IC chip and the metal plate are connected and fixed by an anisotropic conductive adhesive or a conductive adhesive.
5 . Item 5. The IC tag inlet according to any one of Items 1 to 4, wherein at least one of the external electrodes formed on the IC chip is an external electrode obtained by processing an IC chip base substrate made of silicon.
6 . Item 6. The IC tag inlet according to any one of Items 1 to 5 , wherein the metal plate is a metal plate obtained by plating at least one of nickel, gold, and tin on an aluminum plate or a copper plate.
7 . A transmitting / receiving antenna is supported on a base substrate made of an organic resin, and the organic resin is vinyl chloride resin (PVC), acrylonitrile butadiene styrene (ABS), polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PE
Item 6. The IC tag according to any one of Items 1 to 6, which is an organic resin selected from the group consisting of TG), polyethylene naphthalate (PEN), polycarbonate resin (PC), biaxially stretched polyester (O-PET), and polyimide resin. Inlet.
8 . Item 7. The IC tag inlet according to any one of Items 1 to 6, wherein the transmission / reception antenna is supported by a base substrate made of paper.
9 . An IC chip for wireless communication formed on each face of a set of external electrodes facing each other, a metal plate supporting the IC chip, a transmission / reception antenna, and the IC chip and the transmission / reception antenna are electrically connected. In the manufacturing method of an IC tag inlet provided with a short-circuit plate
Cutting a semiconductor wafer on which a plurality of IC chip circuits are formed in a state of being fixed to a dicing tape, and separating the wafer into individual IC chips;
Attaching a dicing tape to a stretcher in a state where the IC chip is fixed, and stretching the IC chip so that the distance between the IC chips is 0.3 mm or more;
Preparing a metal plate for collectively transferring the IC chips;
Forming an anisotropic conductive adhesive layer on one surface of the metal plate;
The dicing tape is attached to the surface of the metal plate on which the anisotropic conductive adhesive layer is formed so that the IC chip faces, and heating and pressurization are performed to attach the IC chip to the anisotropic conductive adhesive layer of the metal plate. The process of transferring to
The step of fixing the surface opposite the anisotropic conductive adhesive layer is formed surface of the front Symbol metal plate to the dicing tape,
Cutting the metal plate in accordance with the interval of the IC chip and dividing it into pieces,
An external electrode on one side of the IC chip fixed to the metal plate is connected and fixed to the metal plate; and
An external electrode on the other surface is connected and fixed to the transmitting / receiving antenna or the short-circuit plate, and
The surface opposite to the surface to which the IC chip of the metal plate is connected and fixed is short-circuited with the transmitting / receiving antenna.
A method of manufacturing an IC tag inlet, comprising a step of connecting and fixing one of the plates to which the IC chip is not connected and fixed .

  It has become possible to provide a structure of an IC tag inlet and a method for manufacturing the same that can suppress a decrease in productivity and an increase in cost for mounting caused by downsizing of an IC chip.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
One of the IC tag inlets of the present invention includes an IC chip having an external electrode having a circuit, a metal plate that supports the IC chip, and a transmission / reception antenna. FIG. 1A is an example of an IC tag inlet according to the present invention, and a schematic view of an inlet in which an IC chip 13 is mounted on an excitation slit dipole antenna (transmission / reception antenna) is viewed from above. A slit 31 is formed in the transmission / reception antenna 30, and the impedance between the transmission / reception antenna 30 and the IC chip 13 can be matched by changing the width and length of the slit 31. Further, the size of the IC chip of the IC tag inlet of the present invention is preferably 0.3 mm × 0.3 mm or less, and the size of the metal plate is preferably 0.3 mm × 0.3 mm or more. .

  FIG. 1B is a schematic cross-sectional view taken along the line A-A ′ of FIG. The IC chip 13 has external electrodes 14 formed on a circuit surface made of semiconductor elements. The base substrate surface of the IC chip 13 and the metal plate 20 are connected and fixed via an adhesive 53. The IC chip 13 supported by the metal plate 20 is connected and fixed to the connection terminal of the transmission / reception antenna 30 with the two external electrodes 14 sandwiching the slit. Examples of the adhesive 53 include a non-conductive adhesive such as an epoxy adhesive film.

  FIG. 1B shows an example in which the external electrode 14 of the IC chip 13 and the transmitting / receiving antenna 30 are connected and fixed with an anisotropic conductive adhesive 50. The anisotropic conductive adhesive 50 is a connecting material composed of conductive particles 51 that are in charge of electrical connection and a matrix resin 52. The electrodes in the facing direction sandwiching the conductive particles 51 have conductivity and are not facing each other. It has insulation in the lateral direction. By adjusting the adhesive to an appropriate amount, the effect of sealing the gap between the transmitting / receiving antenna 30 and the metal plate 20 with the matrix resin 52 can be obtained, and the process can be simplified.

  Although not shown in the drawing, as a method for connecting and fixing the IC chip 13 and the metal plate 20, if a gold thin film layer is formed on the surface of the metal plate 20, the IC chip 13 is formed by gold plating. It is also possible to perform gold-gold metal bonding by applying ultrasonic waves to the protruding electrode, and if a tin plating layer or a solder layer is formed on the surface of the metal plate 20, the IC chip 13 is sufficiently heated. It is also possible to perform gold-tin bonding or gold-solder bonding with a protruding electrode formed by gold plating. The metal plate 20 is preferably a metal plate obtained by plating at least one of nickel, gold, or tin on an aluminum plate or a copper plate. The solder layer on the surface of the metal plate 20 may be formed by solder plating or solder paste.

  Moreover, you may use conductive adhesives, such as a silver paste, as a method of connecting and fixing each. In these cases, the gap between the transmission / reception antenna 30 and the IC chip 13 is maintained in order to maintain mechanical strength after the electrical connection portion (connection fixed portion) between the IC chip 13 and the transmission / reception antenna 30 is formed. Is preferably sealed with an organic resin.

  An IC tag inlet according to the present invention includes an IC chip for wireless communication formed on each surface of a set of external electrodes facing each other, a metal plate supporting the IC chip, a transmission / reception antenna, the IC chip, And a short-circuit plate for electrically connecting the transmission / reception antenna. The IC chip for wireless communication formed on each surface of a set of external electrodes facing each other is, for example, a double-sided electrode chip provided with each external electrode on both surfaces of the IC chip. Further, the size of the IC chip of the IC tag inlet of the present invention is preferably 0.3 mm × 0.3 mm or less, and the size of the metal plate is preferably 0.3 mm × 0.3 mm or more. .

  FIG. 2A shows an example of an IC tag inlet according to the present invention, and shows a schematic view of an inlet in which a double-sided electrode chip 10 is mounted on an excitation slit type dipole antenna as viewed from above. A slit 31 is formed in the transmission / reception antenna 30, and impedance of the transmission / reception antenna 30 and the double-sided electrode chip 10 can be matched by changing the width and length of the slit. One external electrode of the double-sided electrode chip 10 is connected and fixed to the metal plate 20. The transmitting / receiving antenna 30 on one side across the slit 31 and one of the external electrode surfaces of the double-sided electrode chip 10 connected and fixed to the metal plate 20 or the metal plate surface are fixedly connected. The transmitting / receiving antenna 30 on the opposite side across the slit 31 and one external electrode surface or metal plate surface of the double-sided electrode chip 10 are electrically connected via a short-circuit portion 42 of the short-circuit plate.

  FIG. 2B shows a schematic cross-sectional view along B-B ′ of FIG. The double-sided electrode chip 10 includes an external electrode 11 formed on the circuit surface and an external electrode 12 formed on the base substrate surface. The base substrate is preferably a base substrate made of silicon, and the external electrode 12 may be formed by processing the base substrate. The external electrode 11 and the metal plate 20 formed on the circuit surface of the double-sided electrode chip 10 are connected and fixed via an anisotropic conductive adhesive 50. The anisotropic conductive adhesive 50 is a connecting material composed of conductive particles 51 that are in charge of electrical connection and a matrix resin 52. The electrodes in the facing direction sandwiching the conductive particles 51 have conductivity and are not facing each other. It has insulation in the lateral direction.

  The external electrode 11 formed on the circuit surface of the double-sided electrode chip 10 is preferably a protruding electrode formed by gold plating in order to prevent electrical connection between the insulating film on the circuit surface and the metal plate. The conductive particles 51 of the anisotropic conductive adhesive 50 include metal particles such as nickel, particles obtained by applying gold plating to the surface of a granular organic resin, and the oxidation formed on the surface of the metal plate when pressed. If metal particles having hardness that can break the film are used, an inexpensive aluminum plate or copper plate can be used without subjecting the metal plate 20 to rust prevention treatment, etc., so that the process is simplified and the metal plate 20 is supported. It is suitable for suppressing the material cost that increases due to use as a body.

  Although not shown in the figure, if a gold thin film layer is formed on the surface of the metal plate 20, a protruding electrode (external electrode) formed by gold plating of the double-sided electrode chip 10 and the application of ultrasonic waves It is also possible to perform gold metal bonding, and if a tin plating layer or a solder layer is formed on the surface of the metal plate 20, a protruding electrode formed by gold plating of the double-sided electrode chip 10 by sufficient heating It is also possible to perform gold-tin bonding or gold-solder bonding with the (external electrode). The metal plate 20 is preferably a metal plate obtained by plating at least one of nickel, gold, or tin on an aluminum plate or a copper plate. The solder layer on the surface of the metal plate 20 may be formed by solder plating or solder paste.

  The external electrode 12 formed on the base substrate surface of the double-sided electrode chip 10 may be formed by a method such as sputtering using a conductive material such as gold, or from silicon as shown in FIG. The surface of the base substrate to be used may be used as an electrode surface as it is. Since the potential of this electrode is the same as that of the base substrate surface of the double-sided electrode chip 10, the base substrate can be used as an electrode, which is preferable for simplifying the process.

  The double-sided electrode chip 10 supported by the metal plate 20 has one surface of the double-sided electrode chip surface or the metal plate surface connected and fixed to the transmission / reception antenna 30 and the other surface connected and fixed to the short-circuit plate 40. In addition, the transmission / reception antenna 30 and the short-circuit plate 40 are connected and fixed on the opposite side of the double-sided electrode chip 10 across the slit 31. For each of these electrical connections, an anisotropic conductive adhesive 50 may be used as shown in FIG. 2 (b). In this case, by adjusting the anisotropic conductive adhesive 50 to an appropriate amount, The effect of sealing the gap between the transmission / reception antenna 30 and the short-circuit plate 40 at the same time as the connection is also obtained, and the process can be simplified.

  Although not shown in the drawing, a conductive adhesive such as silver paste may be used as a method for connecting and fixing each of them. In this case, it is preferable to seal the gap between the transmission / reception antenna 30 and the short-circuit plate 40 with an organic resin in order to maintain mechanical strength after forming each electrical connection with a conductive adhesive. .

  In FIG. 2 (c), the external electrode 12 surface formed on the base substrate surface of the double-sided electrode chip 10 supported by the metal plate 20 is connected to the transmitting / receiving antenna 30, and the metal plate surface is connected to the short-circuit plate. Show the case. Also in this case, there is no difference in performance from the structure shown in FIG.

  FIG. 1B shows a base substrate 32 that supports the transmission / reception antenna, and FIG. 2B shows a base substrate 32 that supports the transmission / reception antenna and a base substrate 41 that indicates a short-circuit plate. However, these base substrates include vinyl chloride resin (PVC), acrylonitrile butadiene styrene (ABS), polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PETG), polyethylene naphthalate (PEN), and polycarbonate resin (PC). Biaxially stretched polyester (O-PET), organic resin films such as polyimide resin, and paper can be used. In addition, if the transmission / reception antenna and the short-circuit plate themselves have such a rigidity that does not hinder the handling thereof, these base substrates may be omitted.

  As described with reference to FIG. 1 and FIG. 2, the configuration of the IC tag inlet of the present invention is such that a conventional IC chip in which external electrodes are formed on the circuit surface is connected across the slits of the transmitting and receiving antennas. On the other hand, the IC chip cannot be made smaller than the width of the slit of the transmitting / receiving antenna, whereas the configuration in which the double-sided electrode chip and the short-circuit plate are combined can make the chip smaller regardless of the width of the slit. It is suitable for price. In addition, the conventional IC chip needs to align the external electrode and the slit of the transmission / reception antenna with high accuracy. However, in the configuration using the double-sided electrode chip, high accuracy can be achieved by appropriately adjusting the size of the short-circuit plate. Therefore, it is suitable for improving productivity.

  Next, the manufacturing method of the IC tag inlet of the present invention will be described. Here, a configuration using a double-sided electrode chip will be described in detail. First, the manufacturing method of the double-sided electrode chip 10 supported by the metal plate is demonstrated using FIG.

  FIG. 3A shows a state in which the semiconductor wafer 1 on which the IC circuit having the double-sided electrode structure is formed is bonded to the dicing tape 60 and then cut. Next, FIG. 3B shows a state in which the dicing tape 60 with the double-sided electrode chip 10 fixed is attached to the stretching jig and stretched. As a dicing tape 60 that is generally used, there is a film made of a vinyl chloride resin, and the elongation rate when stretched is 110 to 200%. When the size of the double-sided electrode chip 10 is 0.15 mm × 0.15 mm or more, the distance between individual chips can be set to 0.3 mm × 0.3 mm or more by stretching the dicing tape 60 by 200%.

  Next, FIG. 3C shows a state in which the anisotropic conductive adhesive 50 layer is formed on one surface of the metal plate 2. The anisotropic conductive adhesive film may be bonded together, and the paste-form anisotropic conductive adhesive may be apply | coated. Next, in FIG. 3 (d), a double-sided electrode chip in which the space shown in FIG. 3 (b) is widened on the surface on which the anisotropic conductive adhesive layer of the metal plate 2 shown in FIG. 3 (c) is formed. 10 is bonded, and only the dicing tape 60 is peeled off, and then a heating and pressurizing process is performed from the surface of the double-sided electrode chip 10 to connect and fix the double-sided electrode chip 10 and the metal plate 2.

  Next, in FIG. 3E, the metal plate 2 to which the double-sided electrode chip 10 is connected and fixed is bonded to the dicing tape 60 and cut into a predetermined size of 0.3 mm × 0.3 mm or larger. Indicates.

  FIG. 3F shows the double-sided electrode chip 10 supported by the metal plate 20 after being cut. In the procedure outlined above, the external electrode 11 formed on the circuit surface of the double-sided electrode chip is connected and fixed to the metal plate 20 as shown in FIG. 3 (f). Before the electrode chip 10 is bonded onto the metal plate, the external electrode 12 formed on the base substrate surface of the double-sided electrode chip 10 is connected and fixed to the metal plate by transferring it to another dicing tape 60 once. A structure is also possible.

  Similarly, even in the case of an IC tag inlet manufacturing method using a conventional IC chip in which external electrodes are formed only on the circuit surface, the IC chip is once transferred to another dicing tape before being bonded onto the metal plate. By doing so, it is possible to obtain a structure in which the base substrate surface is connected and fixed to the metal plate in a structure in which the external electrodes are exposed. In addition, when forming an adhesive bond layer on one surface of a metal plate, any of an anisotropic conductive adhesive, a conductive adhesive, and a nonconductive adhesive may be sufficient as an adhesive agent.

  Next, a method for manufacturing the IC tag inlet by mounting the double-sided electrode chip 10 connected and fixed to the metal plate 20 on the transmission / reception antenna 30 will be described with reference to FIG. First, FIG. 4A shows a plan view of a transmission / reception antenna substrate in which a transmission / reception antenna 30 having a circuit formed with a slit 31 is supported by a base substrate 32. The slit 31 is for matching the impedances of the transmission / reception antenna 30 and the double-sided electrode chip 10, and may be L-shaped or other suitable shape in addition to the T-shape as shown. FIG. 4B is a view showing a C-C ′ cross section of FIG.

  Next, FIG. 4C shows a state in which the anisotropic conductive adhesive 50 layer is formed at a predetermined position on the transmission / reception antenna. The anisotropic conductive adhesive film may be bonded together, and the paste-form anisotropic conductive adhesive may be apply | coated.

  Next, FIG. 4D shows a state where the double-sided electrode chip 10 supported by the metal plate 20 is aligned and temporarily fixed at a predetermined position on the anisotropic conductive adhesive layer. In the figure, the metal plate surface is shown to face the transmission / reception antenna circuit, but it may be temporarily fixed so that the double-sided electrode chip surface faces the transmission / reception antenna circuit.

  Next, in FIG. 4 (e), after forming the anisotropic conductive adhesive layer 50 on the short-circuit plate 40 supported by the base substrate 41, both surfaces of the anisotropic conductive adhesive layer supported by the metal plate 20. A state in which the electrode chip 10 is temporarily fixed by being aligned with a predetermined position facing the electrode tip 10 is shown.

  Next, in FIG. 4 (f), the double-sided electrode chip 10 in which the crimping head 70 is lowered from the side of the shorting plate with the anisotropic conductive adhesive layer and the shorting plate 40 with the anisotropic conductive adhesive 50 is supported by the metal plate 20. In addition, a state is shown in which the gap between the transmission / reception antenna substrate and the short-circuit plate 40 is sealed at the same time as being electrically connected to the transmission / reception antenna 30 circuit by heat pressing. In the crimping head 70, the metal plate 20 and the double-sided electrode chip 10 supported on the metal plate 20, the transmission / reception antenna substrate and the short-circuit plate 40, and the short-circuit plate 40 and the transmission / reception antenna substrate can be connected simultaneously. The protrusions corresponding to the thickness of the electrode tip 10 are formed.

  Through the above steps, an IC tag inlet having a cross-sectional shape shown in FIG. 4G can be obtained. As described in the embodiment of the present invention with reference to FIGS. 1 to 4, for example, when the IC chip is 0.3 mm × 0.3 mm or less, the IC chip can be easily handled by 0.3 mm. By supporting by a metal plate of × 0.3 mm or more, it can be efficiently mounted on the transmitting / receiving antenna. That is, according to the present invention, it is possible to realize a low-cost and high-productivity IC tag inlet by suppressing a decrease in productivity and an increase in mounting cost caused by downsizing of an IC chip.

EXAMPLES Hereinafter, although the suitable Example of this invention is described, this invention is not limited to these Examples.
(Example 1)
First, a test chip in which external electrodes were formed only on a circuit surface supported by a copper plate was prepared by the following procedure.
First, a semiconductor wafer having a thickness of 50 μm was bonded to a dicing tape and diced to divide into 0.3 mm × 0.3 mm test chips. Next, the dicing tape holding the test chips was attached to a stretching jig and stretched so that the distance between the chips was about 0.5 mm. Next, the test chip was transferred to another dicing tape.

Next, a copper plate having a thickness of 100 μm was prepared, an epoxy adhesive film was laminated on one surface thereof at 80 ° C., and the separator film was peeled off to form an adhesive layer. Next, the dicing tape holding the above-described test chip was stacked on the surface of the copper plate on which the adhesive layer was formed, with the chip surface facing each other, heated to 80 ° C. and pressurized with a roller, and then only the dicing tape was peeled off. . Further, a fluororesin sheet for preventing the adhesive from adhering to the pressure bonding head is placed on the chip surface, and the pressure bonding head is lowered from above, and the test chip and the copper plate are subjected to a pressure of 12 MPa, a temperature of 200 ° C. and a heating time of 20 seconds. The connection was fixed.

Next, the copper surface of the copper plate to which the test chip was connected and fixed was bonded to a dicing tape and cut at intervals of 0.5 mm × 0.5 mm both vertically and horizontally to obtain a test chip supported by the copper plate. The test chip supported by the metal plate was transferred from the dicing tape to the chip tray using a suction head.

Next, a transmitting / receiving antenna substrate was prepared by the following procedure.
First, an etching resist is formed by screen printing on an aluminum foil surface of a tape-like substrate obtained by bonding a 9 μm thick aluminum foil to a polyethylene terephthalate substrate having a thickness of 50 μm with an adhesive. Using an iron aqueous solution, a transmission / reception antenna circuit having a T-shaped slit having a width of 0.1 mm was formed.

Next, the anisotropic conductive adhesive film having a width of 1.0 mm was laminated at a predetermined position on the transmission / reception antenna circuit at 80 ° C., and the separator film was peeled off to form an anisotropic conductive adhesive layer.
Next, an IC tag inlet test sample was assembled by the following procedure.
First, the test chip supported on the copper plate from the chip tray was aligned at a predetermined position on the anisotropic conductive adhesive layer of the transmission / reception antenna substrate by using a suction head and temporarily fixed.

Next, the pressure-bonding head is lowered from the test chip side, and the test chip supported by the copper plate is heat-bonded to a predetermined position with respect to the transmission / reception antenna circuit under the conditions of pressure 12 MPa, temperature 200 ° C., and heating time 20 seconds The gap between the transmission / reception antenna substrate and the copper plate was sealed with an organic resin. Next, the tape-shaped transmitting / receiving antenna substrates formed continuously were separated one by one.
Through the above steps, a test sample of an IC tag inlet having a test chip on which external electrodes were formed only on a circuit surface having a size of 0.3 mm × 0.3 mm was obtained.

(Example 2)
First, a double-sided electrode chip supported by a copper plate was prepared by the following procedure.
First, a 50 μm thick semiconductor wafer was bonded to a dicing tape and diced to divide into 0.3 mm × 0.3 mm double-sided electrode test chips. Next, the dicing tape holding the double-sided electrode test chip was attached to a stretching jig and stretched so that the distance between the chips was about 0.5 mm. Next, a copper plate having a thickness of 100 μm was prepared, and an anisotropic conductive adhesive film (AC-2052P-45, manufactured by Hitachi Chemical Co., Ltd.) was laminated on one surface at 80 ° C. A one-way conductive adhesive layer was formed.

Next, the dicing tape holding the double-sided electrode test chip is placed on the surface of the copper plate on which the anisotropic conductive adhesive layer is formed so that the chip surfaces face each other, heated to 80 ° C. and pressed with a roller, and then dicing. Only the tape was removed. Furthermore, a fluororesin sheet for preventing the adhesive from adhering to the pressure bonding head is placed on the chip surface, the pressure bonding head is lowered from above, and a double-sided electrode test chip under the conditions of pressure 12 MPa, temperature 200 ° C., and heating time 20 seconds. And the copper plate was connected and fixed.

Next, the opposite surface of the copper plate to which the double-sided electrode test chip was connected and fixed was bonded to a dicing tape, and was cut at intervals of 0.5 mm × 0.5 mm both vertically and horizontally to obtain a double-sided electrode test chip supported by the copper plate. . The double-sided electrode test chip supported by the copper plate was transferred from the dicing tape to the chip tray using a suction head.

Next, a transmitting / receiving antenna substrate and a short-circuit plate were prepared by the following procedure.
First, an etching resist is formed by screen printing on an aluminum foil surface of a tape-like substrate obtained by bonding a 9 μm thick aluminum foil to a polyethylene terephthalate substrate having a thickness of 50 μm with an adhesive. Using an iron aqueous solution, a transmission / reception antenna circuit in which a T-shaped slit having a width of 0.3 mm was continuously formed was produced.

  Next, the anisotropic conductive adhesive film having a width of 1.2 mm was laminated at a predetermined position on the transmission / reception antenna circuit at 80 ° C., and the separator film was peeled off to form an anisotropic conductive adhesive layer. Next, on the aluminum foil surface of a tape-like substrate having a width of 1.2 mm, in which a polyethylene terephthalate substrate having a thickness of 50 μm and an aluminum foil having a thickness of 9 μm are bonded together with the adhesive, the different width of the tape substrate and the same width as the tape substrate. The anisotropic conductive adhesive film was laminated at 80 ° C., the separator film was peeled off, the length was cut to 3 mm, and a short-circuit plate with an anisotropic conductive adhesive layer was produced.

Next, an IC tag inlet test sample was assembled by the following procedure.
First, as shown in FIG. 5, a double-sided electrode chip 10 (double-sided electrode test chip) supported on a copper plate from a chip tray 80 is attached to a predetermined conductive conductive adhesive layer on the substrate of the transmitting / receiving antenna 30 using an adsorption head 90. Positioned and temporarily fixed. Next, the adhesive layer surface of the short-circuit plate with the anisotropic conductive adhesive layer was temporarily fixed in accordance with a predetermined position in a direction facing the double-sided electrode chip.

Next, the pressure-bonding head is lowered from the side of the short-circuit plate with the anisotropic conductive adhesive layer and supported by the short-circuit plate with the anisotropic conductive adhesive layer and the copper plate under the conditions of a pressure of 12 MPa, a temperature of 200 ° C., and a heating time of 20 seconds. The double-sided electrode test chip and the transmission / reception antenna circuit were heat-bonded to a predetermined position, and the gap between the transmission / reception antenna substrate and the short-circuit plate was sealed. The crimping head is formed with protrusions for the thickness of the copper plate and the double-sided electrode test chip so that the double-sided electrode test chip, the transmission / reception antenna substrate and the short-circuit plate can be connected simultaneously, and the short-circuit plate and the transmission / reception antenna substrate can be connected simultaneously. . Next, the tape-shaped transmitting / receiving antenna substrates formed continuously were separated one by one.
Through the above steps, an IC tag inlet test sample on which a double-sided electrode test chip having a size of 0.3 mm × 0.3 mm was mounted was obtained.

(Example 3)
First, a 50 μm thick semiconductor wafer was bonded to a dicing tape and diced to divide into 0.15 mm × 0.15 mm double-sided electrode test chips. Subsequently, a double-sided electrode test chip, a transmission / reception antenna substrate, and a short-circuit plate supported by a copper plate in the same procedure as in Example 2 were prepared.

  Next, as shown in FIG. 6, the double-sided electrode test chip supported by the separated copper plate one by one is supplied to the high-frequency parts feeder 100, and the linear feeder 110 connected to the high-frequency parts feeder 100 and the parts feeder is provided. By continuously vibrating at a frequency of 280 Hz, the double-sided electrode test chips supported on the copper plate were aligned in a line on the linear feeder 110.

  Next, the chips are placed one by one in the notch 121 of the disk-shaped transporter 120 having a plurality of notches 121 connected to the linear feeder 110 and capable of inserting one double-sided electrode test chip supported by a copper plate on the outer periphery. Insert continuously, rotate the disk-shaped transporter 120, and when the chip is located above a predetermined position on the transmission / reception antenna substrate, the chip is removed from the notch 121 with a temporary pin, and anisotropic conductive bonding Temporarily fix to the agent layer.

  Thereafter, the short-circuit plate with the anisotropic conductive adhesive layer was temporarily fixed in the same procedure as in Example 2, and the continuous tape-shaped transmitting / receiving antenna substrates were separated one by one after being heat-bonded by the pressure-bonding head. Through the above steps, an IC tag inlet test sample on which a double-sided electrode test chip having a size of 0.15 mm × 0.15 mm was mounted was obtained.

  According to the IC tag inlet of the present invention, the following effects can be obtained. That is, by supporting an IC chip of 0.3 mm × 0.3 mm or less with a metal plate of 0.3 mm × 0.3 mm or more, it can be easily handled and can be efficiently mounted on a transmission / reception antenna. . Therefore, it is possible to reduce the cost by reducing the size of the IC chip, and it is possible to suppress the decrease in productivity caused by the reduction in size and the increase in the cost of mounting. can do.

(A) is a top view which shows an example of the IC tag inlet of this invention, (b) is an example of the AA 'cross section of (a). (A) is a top view which shows an example of the IC tag inlet of this invention, (b) is an example of the BB 'cross section of (a), (c) is the BB' cross section of (a). It is an example. It is process drawing explaining embodiment of the IC tag inlet of this invention. It is process drawing explaining embodiment of the IC tag inlet of this invention. It is a figure for demonstrating the chip mounting method of the IC tag inlet of this invention. It is a figure for demonstrating the chip mounting method of the IC tag inlet of this invention.

Explanation of symbols

1: Semiconductor wafer 2: Metal plate 10: Double-sided electrode chip 11: External electrode 12 formed on the circuit surface: External electrode 13 formed on the base substrate surface: IC chip 14: External electrode 20: Metal plate 30: Transmission / reception Antenna 31: Slit 32: Base substrate 40: Short circuit board 41: Base substrate 42: Short circuit part 50: Anisotropic conductive adhesive 51: Conductive particle 52: Matrix resin 53: Adhesive 60: Dicing tape 70: Crimp head 80 : Chip tray 90: Suction head 100: High-frequency parts feeder 110: Linear feeder 120: Disk-shaped transporter 121: Notch

Claims (9)

An IC chip for wireless communication formed on each face of a set of external electrodes facing each other, a metal plate supporting the IC chip, a transmission / reception antenna, and the IC chip and the transmission / reception antenna are electrically connected. In an IC tag inlet having a short-circuit plate to be connected, an external electrode on one surface of the IC chip is connected and fixed to the metal plate, and an external electrode on the other surface is connected to the transmission / reception antenna or the short-circuit plate The fixed surface of the metal plate opposite to the surface to which the IC chip is connected and fixed is connected and fixed to one of the transmitting / receiving antenna and the short-circuit plate to which the IC chip is not connected and fixed. Characteristic IC tag inlet. The IC tag inlet according to claim 1, wherein the size of the IC chip is 0.3 mm x 0.3 mm or less. I according to claim 1 or 2 size of the metal plate is 0.3 mm × 0.3 mm or more
C tag inlet. The IC tag inlet according to any one of claims 1 to 3 , wherein an external electrode formed on one surface of the IC chip and the metal plate are connected and fixed by an anisotropic conductive adhesive or a conductive adhesive. At least one of, IC tag inlet according to claims 1 to 4 or an external electrode formed by processing the IC chip base substrate made of silicon of the external electrode formed on the IC chip. The IC tag inlet according to any one of claims 1 to 5 , wherein the metal plate is a metal plate obtained by plating an aluminum plate or a copper plate with at least one of nickel, gold, and tin. A transmitting / receiving antenna is supported on a base substrate made of an organic resin, and the organic resin is vinyl chloride resin (PVC), acrylonitrile butadiene styrene (ABS), polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PET).
The IC according to any one of claims 1 to 6, which is an organic resin selected from the group consisting of G), polyethylene naphthalate (PEN), polycarbonate resin (PC), biaxially stretched polyester (O-PET), and polyimide resin. Tag inlet. The IC tag inlet according to any one of claims 1 to 6, wherein the transmission / reception antenna is supported by a base substrate made of paper. An IC chip for wireless communication formed on each face of a set of external electrodes facing each other, a metal plate supporting the IC chip, a transmission / reception antenna, and the IC chip and the transmission / reception antenna are electrically connected. In the manufacturing method of an IC tag inlet provided with a short-circuit plate
Cutting a semiconductor wafer on which a plurality of IC chip circuits are formed in a state of being fixed to a dicing tape, and separating the wafer into individual IC chips;
A dicing tape is attached to a stretcher with the IC chip fixed, and the IC
A process of stretching so that the distance between the chips is 0.3 mm or more,
Preparing a metal plate for collectively transferring the IC chips;
Forming an anisotropic conductive adhesive layer on one surface of the metal plate;
The dicing tape is attached to the surface of the metal plate on which the anisotropic conductive adhesive layer is formed so that the IC chip faces, and heating and pressurization are performed to attach the IC chip to the anisotropic conductive adhesive layer of the metal plate. The process of transferring to
The step of fixing the surface opposite the anisotropic conductive adhesive layer is formed surface of the front Symbol metal plate to the dicing tape,
Cutting the metal plate in accordance with the interval of the IC chip and dividing it into pieces,
The external electrode on one side of the IC chip fixed to the metal plate is connected and fixed to the metal plate.
An external electrode on the other surface is connected and fixed to the transmitting / receiving antenna or the short-circuit plate, and the front
The surface opposite to the surface where the IC chip of the metal plate is connected and fixed is connected to the transmitting / receiving antenna and the short circuit.
A method of manufacturing an IC tag inlet, comprising a step of connecting and fixing one of the enveloping plates to which the IC chip is not connected and fixed .

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