JP2006195796A - Ic tag and ic tag inlet - Google Patents

Ic tag and ic tag inlet Download PDF

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Publication number
JP2006195796A
JP2006195796A JP2005007583A JP2005007583A JP2006195796A JP 2006195796 A JP2006195796 A JP 2006195796A JP 2005007583 A JP2005007583 A JP 2005007583A JP 2005007583 A JP2005007583 A JP 2005007583A JP 2006195796 A JP2006195796 A JP 2006195796A
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ic tag
mm
antenna
ic
transmission
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JP2005007583A
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Japanese (ja)
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Hironobu Ishizaka
Koji Tazaki
耕司 田崎
裕宣 石坂
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Hitachi Chem Co Ltd
日立化成工業株式会社
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC tag inlet and IC tag of small size effective for preventing erroneous reading, inexpensive and excellent in productivity by using a double-sided electrode chip. <P>SOLUTION: In this IC tag inlet provided with the IC chip for radio communication with external electrodes formed on a set of respective opposed faces, a transmission/reception antenna formed with a slit, and a short-circuiting plate for connecting electrically the IC chip to the transmission/reception antenna, the external electrode formed on the one face of the IC chip is connected to the transmission/reception antenna, the external electrode formed on the other face of the IC chip is connected to the short-circuiting plate, the transmission/reception antenna is connected to the short-circuiting plate, and a length of the transmission/reception antenna along a direction having the maximum length is within a range from 3mm to 10mm. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an IC tag and an IC tag inlet.

  In recent years, a non-contact type individual identification system using an IC tag has attracted attention as a system for managing the entire life cycle of goods in all business categories of manufacturing, distribution, sales, and recycling. In particular, radio frequency type IC tags using UHF waves and microwaves are attracting attention due to the feature that an external antenna is attached to an IC chip and a communication distance of several meters is possible. System construction is underway for the purpose of product history management.

  As a radio wave type IC tag using a microwave of 2.45 GHz, for example, a tag using a TCP (Tape Carrier Package) type inlet developed by Hitachi, Ltd. and Renesas Technology Corp. is known. Here, the inlet is a non-contact type solid identification IC chip mounted on a transmission / reception antenna, and is an intermediate form of an IC tag.

As another inlet structure, for example, an IC chip in which one external electrode is formed on each of the front and back surfaces by Usami of Hitachi, Ltd., a glass diode that connects a dipole antenna to each external electrode formed on each surface A package structure has been developed (see Patent Document 1). Further, by Usami et al., When mounting an IC chip having the two external electrodes formed on the front and back surfaces (hereinafter referred to as a double-sided electrode chip) on an excitation slit type dipole antenna, the external electrode of the IC chip is sandwiched by the antenna. Has been developed (see Patent Document 2). The dipole antenna structure having the excitation slit can match the impedance of the antenna and the input impedance of the IC chip by changing the width and length of the slit, and can obtain good communication characteristics.
JP 2002-269520 A Japanese Patent Laid-Open No. 2004-127230

  In order to realize a large quantity of merchandise distribution and article management with a non-contact type individual identification system using an IC tag, it is necessary to attach an IC tag to each of the merchandise. However, when the product to which the IC tag can be attached is very small, it is necessary to match the IC tag to the size of the product. For example, when mounting on the round surface of small and cylindrical products such as lipsticks and seals, or when mounting on the top of caps such as PET bottles or bottles, the IC tag is about 10 mm or smaller Must.

  Also, when managing production history, expiry date, etc. for each product, especially when those products are lined up on a conveyor, on a shelf or in a packing box, they are not subject to reading. Care must be taken not to misread the IC tag. When the product to which the IC tag is attached is small, it is necessary to limit the communication distance of the IC tag with respect to the reader to be used. The present invention has been made in view of the above, and provides an IC tag inlet and an IC tag that are small in size and effective in preventing misreading, and that are inexpensive and excellent in productivity by using a double-sided electrode chip. Is.

  In order to explain the means for solving the above problems, an example of a structure of a radio frequency IC tag inlet using a microwave of 2.45 GHz and a length of a transmission / reception antenna (hereinafter abbreviated as an antenna) is 20 mm or less. Shows an example of communication distance measurement

  FIG. 1A shows a schematic view of an inlet of an IC tag inlet according to the present invention, in which a double-sided electrode chip is mounted on an excitation slit dipole antenna through a short-circuit plate, as viewed from above. In this structure, by adjusting the length and width of the T-shaped excitation slit 21 to the optimum dimensions, impedance matching between the double-sided electrode chip 10 and the antenna 20 can be achieved and good characteristics can be obtained. The detailed structure including the cross-sectional structure will be described in the next section.

  FIG. 2 shows the communication distance measured using the IC tag inlet of FIG. Four types of slit widths of the antenna were measured from 0.2 mm to 0.7 mm. When 2.45 GHz is used for the transmission / reception wave, the length of the half-wavelength dipole antenna, which is an example of the antenna having the highest transmission / reception efficiency, is about 60 mm, so the communication distance decreases as the antenna becomes shorter. In the range of the antenna length from 3 mm to 10 mm, the communication distance was stably obtained at about 5 mm with respect to the slit width of 0.2 mm to 0.7 mm. When the antenna length was shortened to 2 mm, the communication distance drastically decreased to about 1 mm.

  Table 1 below shows the relationship between the slit length at which the maximum communication distance of each IC tag inlet was obtained and the slit width. Table 1 below shows that there is an inversely proportional relationship between the optimum slit length and width, and the optimum slit length is 3.0 mm to 2.0 mm for a slit width of 0.2 mm to 0.7 mm. is there. When the slit width was 0.2 mm, even when the slit length was 2.8 mm, which was slightly shorter than the optimum slit length, a communication distance of about 5 mm was obtained as in the case where the antenna length was 3 mm.

  Here, the communication distance of about 5 mm is, for example, information on the IC tag attached to the product by a stationary interrogator when a small product flows through a manufacturing apparatus or an inspection apparatus configured by a conveyor-type conveyance line. For reading, it is a distance that can be practically used even if variations in the transport height are taken into account. Also, for example, when reading IC tags attached to products one by one with a hand-held interrogator, the distance is sufficient. is there.

That is, the present invention is as follows.
1. An IC chip for wireless communication formed on each surface of a set of external electrodes facing each other, a transmission / reception antenna formed with a slit, and a short-circuit plate for electrically connecting the IC chip and the transmission / reception antenna An IC tag inlet provided,
The external electrode formed on one surface of the IC chip is connected to a transmission / reception antenna, the external electrode formed on the other surface of the IC chip is connected to the short-circuit plate, and the transmission / reception antenna The shorting plate is connected,
An IC tag inlet, wherein a length of the transmitting / receiving antenna in a direction having the maximum length is in a range of 3 mm to 10 mm.
2. The slit formed in the transmission / reception antenna has a T-shape, the length of the slit is in the range of 2.0 mm to 3.0 mm, and the width of the slit is 0.2 mm to 0.7 mm. Item 2. The IC tag inlet according to Item 1, which is in the range.
3. A portion where the external electrode formed on one surface of the IC chip and the transmission / reception antenna are connected, a portion where the external electrode formed on the other surface of the IC chip and the short-circuit plate are connected, the transmission / reception antenna and the Item 3. The IC tag inlet according to Item 1 or 2, wherein the connected portion of the short-circuit plate is formed of either a conductive adhesive, an anisotropic conductive adhesive, or a nonconductive adhesive.
4). Item 4. The IC tag inlet according to any one of Items 1 to 3, wherein at least one of the external electrodes formed on the IC chip is an external electrode obtained by processing an IC chip base substrate made of silicon.
5. Item 5. The IC tag inlet according to any one of Items 1 to 4, wherein the transmission / reception antenna is one of an aluminum foil, a copper foil, or a cured product of a conductive paste.
6). A transmission / reception antenna is supported on a base substrate made of an organic resin, and the organic resin includes vinyl chloride resin (PVC), acrylonitrile butadiene styrene (ABS), polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PETG), Item 6. The IC tag inlet according to any one of Items 1 to 5, which is an organic resin selected from the group consisting of polyethylene naphthalate (PEN), polycarbonate resin (PC), biaxially stretched polyester (O-PET), and polyimide resin.
7). Item 6. The IC tag inlet according to any one of Items 1 to 5, wherein the transmission / reception antenna is supported by a base substrate made of paper.
8). Item 8. An IC tag formed by integrating the IC tag inlet according to any one of Items 1 to 7 with any one of an organic resin, paper, an inorganic material, or a member combining them.
9. Item 9. The IC tag according to item 8, wherein the information stored in the IC tag can be read in free space using an interrogator, and the maximum readable distance between the information stored in the interrogator and the IC tag is An IC tag that is equal to or shorter than a length in a direction having the shortest length of the IC tag.
10. Item 9. The IC tag according to item 8, wherein the information stored in the IC tag can be read in free space using an interrogator, and the read target having the IC tag and the reading non-target having the IC tag An IC tag characterized in that the center-to-center distance (closest distance) to the adherend is equal to or greater than the maximum distance at which information stored in the IC tag can be read.

  By using a double-sided electrode chip that is small and effective in preventing misreading, it has become possible to provide an IC tag inlet and an IC tag that are inexpensive and excellent in productivity.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
The IC tag inlet of the present invention is a wireless communication IC chip formed on each surface of a set of external electrodes facing each other, a transmission / reception antenna having a slit with a long side of 3 mm to 10 mm, It is comprised by the short circuit board which electrically connects an IC chip and a transmission / reception antenna. FIG. 1A is an example of an IC tag inlet according to the present invention, and shows a schematic view of an inlet in which a double-sided electrode chip is mounted on an excitation slit dipole antenna as viewed from above. In the following description, the IC chip for wireless communication formed on each surface of a set of external electrodes facing each other is a double-sided electrode chip.

  A slit 21 is formed in the antenna 20 having a long side length of 3 mm to 10 mm. The width of this slit is preferably in the range of 0.2 mm to 0.7 mm, and the length is 2.0 mm to 3.mm. The range of 0 mm is preferable, and by changing within this range, the impedance of the antenna 20 and the double-sided electrode chip 10 can be matched. The double-sided electrode chip 10 is connected to one side across the slit 21, and is connected via the short-circuit portion 32 of the short-circuit plate 30 on the opposite side of the slit 21 to the electrode connected to the antenna 20. The slit 21 may have any shape such as a T-shape or an L-shape, but a T-shape that can reduce the length and width of the antenna 20 is preferable.

  FIG. 3 shows an IC tag inlet using an antenna having an L-shaped slit for comparison with a T-shaped excitation slit. FIG. 4 shows the communication distance when the antenna length of the IC tag inlet using the T-shaped and L-shaped antennas with a slit width of 0.5 mm is 20 mm or less.

  From FIG. 4, the L-shaped slit has an antenna length of 5 mm or less, and the communication distance sharply decreases. This is because when the slit width is 0.5 mm, the optimum slit length is 4.0 mm, which is longer than the T-shaped, and when the antenna length is 4 mm or less, This is because the deviation increases. That is, a T-shaped excitation slit is suitable for a small IC tag inlet.

  FIG. 1B is a schematic cross-sectional view taken along the line A-A ′ of FIG. The double-sided electrode chip 10 includes an external electrode 11 formed on a circuit surface made of a semiconductor element and an external electrode 12 formed on a base substrate surface. One external electrode of the double-sided electrode chip 10 and the antenna 20, the other external electrode of the double-sided electrode chip 10 and the short-circuit plate 30, and the antenna 20 and the short-circuit plate 30 on the opposite side of the chip sandwiching the slit 21 are anisotropic. Portions connected by the conductive adhesive 40 are formed.

  The anisotropic conductive adhesive 40 is a connecting material composed of conductive particles 41 that are in charge of electrical connection and a matrix resin 42. The electrodes in the opposite direction sandwiching the conductive particles have conductivity and are not facing each other. Insulating in the direction. In this method, by optimizing the amount of the anisotropic conductive adhesive, an effect of sealing the gap between the antenna 20 and the short-circuit plate simultaneously with electrical connection can be obtained, and the process can be simplified.

  Although not shown in the figure, each connection may be made by applying ultrasonic waves while pressing the electrodes facing each other and connecting them by metal bonding or the like and sealing with an organic resin for sealing. Similarly, connection by contact between electrodes and connection by a non-conductive adhesive may be used in combination. Further, after forming each connected portion (electrical connection) with a conductive adhesive, the gap between the antenna 20 and the short-circuit plate 30 is sealed with an organic resin for sealing or a non-conductive adhesive. May be.

  Here, FIG. 1B shows a structure in which the external electrode 11 formed on the circuit surface of the double-sided electrode is connected to the antenna 20 and the external electrode 12 formed on the base substrate surface is connected to the short-circuit plate 30. However, there is no change in performance even if the vertical orientation of the double-sided electrodes is reversed.

  Moreover, it is preferable that at least one of the external electrodes formed on the IC chip, for example, the external electrode 12 formed on the base substrate surface, is an external electrode formed by processing a base substrate made of silicon. Moreover, it is preferable that an antenna is either the hardened | cured material of aluminum foil, copper foil, or an electrically conductive paste. Although it does not specifically limit as an electrically conductive paste, The commercial item which added electroconductive particles, such as copper, silver, and solder, to a thermosetting resin is used, and 120-200 degreeC and 30-120 minutes are as conditions for hardening. preferable. Moreover, it is preferable that the thickness of the antenna which consists of either aluminum foil or copper foil, or the hardened | cured material of an electrically conductive paste is 0.5-30 micrometers.

  Further, although the antenna 20 is shown supported on the base substrate 22 and the short-circuit plate 30 is supported on the base substrate 31, each base substrate is made of vinyl chloride resin (PVC), acrylonitrile butadiene styrene (ABS), polyethylene. Organic resin films such as terephthalate (PET), glycol-modified polyethylene terephthalate (PETG), polyethylene naphthalate (PEN), polycarbonate resin (PC), biaxially stretched polyester (O-PET), and polyimide resin may be used. There may be. As long as the antenna 20 and the short-circuit plate 30 have appropriate rigidity per se, the respective base substrates may be omitted.

  For comparison of IC chip mounting structures, FIG. 5A shows an example of an IC tag inlet structure using a conventional IC chip 13 in which external electrodes are generated only on the circuit surface. FIG. 5B shows a schematic cross-sectional view along B-B ′ of FIG. When the conventional IC chip 13 is used, the two external electrodes 14 and 15 are connected to the antenna 20 in a state of straddling the slit 21 and sealed with the sealing organic resin 60.

FIG. 6 is a diagram showing the principle of the present invention, and FIG. 6 (a) shows a simplified equivalent circuit of an IC tag inlet using a double-sided electrode chip. Between the double-sided electrode chip 100 and the antenna 102, there are a portion corresponding to a short-circuit plate and composed of an inductance L B1 and a capacitance C B1 , and a portion corresponding to a slit and composed of an inductance L S1 and a capacitance C S1 . L B and L S tend to be proportional to the length of the short-circuit plate and the length of the slit, respectively, C B tends to be proportional to the distance between the short-circuit plate and the antenna, and C S tends to be inversely proportional to the width of the slit. have. In order to efficiently supply energy from the antenna to the chip, it is only necessary to match the characteristic impedance so that reflection does not occur. The length and width of the slit, the length of the short-circuit plate, and the distance from the antenna are adjusted. be able to.

FIG. 6B shows an equivalent circuit of an IC tag inlet using a conventional IC chip, as in FIG. Between the IC chip 101 and the antenna 102, an inductance L S2 corresponding to a slit and a capacitance C S2 are formed. That is, when the input impedances of the IC chips are equal, in the conventional structure, it is necessary to compensate for the absence of inductance contribution due to the short-circuit plate by the slit length.

  FIG. 7 shows the relationship between the slit length and the communication distance ratio in the structure of the present invention and the conventional structure according to the experimental results. FIG. 7 shows that the IC tag inlet using the double-sided electrode chip of the present invention can obtain the maximum communication distance with a short slit as compared with the conventional structure, which contradicts the prediction obtained from the above-described equivalent circuit. do not do. FIG. 7 also shows experimental results when the double-sided electrode chip 10 shown in FIG. 8 is wire-bonded to the antenna via the gold wire 33. This result shows that the effect of shortening the length of the slit for obtaining the maximum communication distance is obtained not only by using the double-sided electrode chip 10 but also by the inductance and capacitance caused by the short-circuit plate.

Therefore, if the present invention is used, the characteristic impedance can be matched with a short slit, so that the antenna can be miniaturized and an IC tag inlet of 3 mm to 10 mm can be realized.

  In terms of productivity, the conventional IC tag inlet structure shown in FIG. 5 is connected to the antenna with the two external electrodes of the IC chip straddling the slit. The point that needs to be done well is an issue. As the chip size becomes smaller, higher accuracy is required, and a decrease in productivity and an accompanying increase in processing costs are expected.

  On the other hand, in the structure of the present invention, as described with reference to FIG. 1, one external electrode of the double-sided electrode chip 10 is connected to the antenna on one side across the slit, and the other side of the slit via the short-circuit plate. Therefore, it is not necessary to highly align the tip and the slit. When the size of the double-sided electrode chip 10 is 0.5 mm × 0.5 mm, considering the alignment error, the short-circuit plate has a width of about 1.0 mm to 1.5 mm and a length of about 2.5 mm to 3.0 mm. By doing so, it is possible to shorten the time required for positioning the antenna, the chip, and the short-circuit plate, and it is possible to reduce the productivity and the processing cost.

  Further, since the chip itself does not need to straddle the slit, it is possible to further reduce the cost by making the chip smaller than the width of the slit. That is, the configuration in which the double-sided electrode chip, the antenna, and the short-circuit plate are connected by the anisotropic conductive adhesive is suitable for realizing an IC tag inlet that is inexpensive and excellent in productivity.

  The IC tag of the present invention is formed by integrating the IC tag inlet of the present invention with any one of an organic resin, paper, an inorganic material, or a member combining them. FIG. 9 is a perspective transparent view of an IC tag as an example of the present invention. For example, in the IC tag of the present invention, the IC tag inlet of the present invention is sandwiched between two tag base materials 70 each having the adhesive layer 71 formed on one surface, and the adhesive layer is melted and cured by heating. Obtained by laminating. An organic resin such as vinyl chloride resin (PVC), polyethylene terephthalate (PET), or glycol-modified polyethylene terephthalate (PETG) can be used for the tag substrate 70. Further, when the mechanical strength may be small, it may be simply bonded without using a pressure-sensitive adhesive tape made of paper as a base material. Moreover, as the tag base material 70, ceramic which is an inorganic material can be cited, and a member in which any of organic resin, paper, and inorganic material is combined can also be used.

  On the surface of the IC tag, a part of information built in the IC chip, a printed matter 72, or a design can be printed. Moreover, the hole 73 can be given and the strap 73 can also be attached.

  FIG. 10 is a perspective transparent view of the IC tag of the present invention. The figure which stuck the label-like tag 80 which consists of the paper or resin film in which the adhesive layer 81 was formed in one surface on the IC tag inlet of this invention, and was further affixed on the to-be-adhered body 83 is shown. Similarly to the IC tag of FIG. 9, a part of information built in the IC chip and the printed material 82 can be described on the surface of the IC tag, or a design can be printed.

  FIG. 11A and FIG. 11B show examples of IC tags for preventing misreading. Center-to-center distance between the adherend 90 to be read and the adherends 89 and 91 not to be read when the cylindrical or prismatic IC tag adherends with IC tags attached to the upper surface are arranged without gaps. The (closest distance) is preferably at least the maximum distance at which the IC tag can be read (the maximum distance at which information stored in the IC tag can be read) or more. That is, when the interrogator 92 such as an IC tag reader is aligned with the position of the adherend 90 to be read, the maximum distance at which the IC tag can be read (the maximum distance at which information stored in the IC tag can be read). ) Is preferably equal to or shorter than the length in the shortest direction of the IC tag, whereby the non-target adherends 89 and 91 are in a position where they cannot communicate with the interrogator 92 and read information other than the target object. Misreading can be prevented.

  Here, the readable distance of the IC tag varies depending on the output of the interrogator, the antenna, and the reading environment, but using an interrogator with an output of 150 mW recognized as a local radio station by the Radio Law, If the condition is satisfied, the effect of preventing misreading is great in practical use.

  If an IC tag with an antenna length of 10 mm or less according to the present invention is used, the length of a half-wave dipole antenna, which is an example of an antenna having the highest transmission / reception efficiency for UHF waves in the vicinity of 900 MHz, is about 160 mm, Alternatively, for a microwave of 2.45 GHz, it is very short as compared with about 60 mm, and the transmission / reception efficiency is extremely reduced, so that the communicable distance can be limited to be short, and information other than the object can be stored. It is suitable for preventing reading errors.

  As described with reference to FIGS. 1 to 11, the configuration in which the double-sided electrode chip and the antenna having the T-shaped excitation slit are connected via the short-circuit plate is effective for reducing the size of the IC tag inlet and the IC tag. It is suitable for realizing an IC tag inlet that is inexpensive and excellent in productivity. Further, by limiting the maximum distance that can be read to the length of the shortest direction of the IC tag, it is possible to obtain an IC tag that can prevent misreading that reads information that is not the target.

EXAMPLES Hereinafter, although the suitable Example of this invention is described, this invention is not limited to these Examples.
Example 1
Example 1 will be described with reference to a process diagram shown in FIG.
First, as shown in the plan view of FIG. 12A, an aluminum foil of a tape-like base material in which an aluminum foil of 9 μm thickness is bonded to a base base material (polyethylene terephthalate base material) 220 of 50 μm thickness with an adhesive. After forming an etching resist on the surface by screen printing, an antenna circuit (antenna) 200 in which a T-shaped slit 210 was formed using a ferric chloride aqueous solution as an etching solution was produced. Here, the length of the long side of the antenna circuit (antenna) 200 is 10 mm, the width is 2.5 mm, the slit length is 2.7 mm, and the width is 0.3 mm, which is the same size as the antenna circuit (antenna) 200. A base substrate (polyethylene terephthalate substrate) 220 was cut into a rectangular shape to obtain an antenna substrate. FIG. 12B shows a cross section when cut along the line DD ′ passing through the portion where the chip is mounted.

  Next, as shown in FIG. 12 (c), an anisotropic conductive adhesive film 400 (AC-2052P-45, manufactured by Hitachi Chemical Co., Ltd.) having a width of 1.2 mm is placed at a predetermined position on the antenna circuit (antenna) 200. ) Was laminated at 80 ° C., and the separator film was peeled off to form an anisotropic conductive adhesive layer.

  Next, as shown in FIG. 12D, the double-sided electrode chip 110 having a transmission / reception frequency of 2.45 GHz was aligned at a predetermined position on the antenna circuit (antenna) 200 and temporarily fixed. In the figure, the external electrode 112 formed on the base substrate surface obtained by processing the silicon base substrate, which is a base substrate made of silicon, is shown to face the antenna circuit, but is formed upside down on the circuit surface. There is no problem even if the external electrode 111 is temporarily fixed so as to face the surface of the antenna circuit 200.

  Next, as shown in FIG. 12 (e), a tape material having a width of 1.2 mm, in which an aluminum foil 300 having a thickness of 9 μm is bonded to a base substrate (polyethylene terephthalate substrate) 310 having a thickness of 50 μm with an adhesive. On the aluminum foil surface of the base material, the anisotropic conductive adhesive film 400 having the same width as the tape base material is laminated at 80 ° C., the separator film is peeled off, and the length is cut to 2.5 mm to anisotropic conductive adhesive. After forming the short-circuit plate 300 with the agent layer, the anisotropic conductive adhesive layer was aligned with a predetermined position in a direction facing the double-sided electrode chip 110 and temporarily fixed.

  Next, as shown in FIG. 12 (f), the pressure-bonding head 500 is lowered from the side of the short-circuit plate 300 with the anisotropic conductive adhesive layer, and the anisotropy is performed under the conditions of a pressure of 12 MPa, a temperature of 200 ° C., and a heating time of 20 seconds. The short-circuit plate 300 with the conductive adhesive layer is heat-bonded at a predetermined position to the double-sided electrode chip 110 and the antenna circuit (antenna) 200, and the gap between the antenna substrate (antenna circuit and base substrate) and the short-circuit plate 300 is formed. Sealed with an organic resin for sealing. The crimping head includes a connection between the double-sided electrode chip 110 and the antenna substrate (antenna circuit and base substrate), a connection between the double-sided electrode chip 110 and the short-circuit plate 300, and a short-circuit plate 300 and the antenna substrate (antenna circuit and base substrate). The protrusions corresponding to the thickness of the double-sided electrode chip 110 are formed so that the two can be connected simultaneously.

  Through the above steps, an IC tag inlet having a cross-sectional shape shown in FIG. 12G and a length of 10 mm and a width of 2.5 mm was obtained. Next, the IC tag inlet was temporarily fixed to an adhesive paper label as a tag base material, and cut out into a circle having a diameter of 14 mm so that the IC tag inlet 600 was positioned substantially at the center. FIG. 13A shows a label-like IC tag 700 obtained in this way. Next, the label-like IC tag 700 is affixed to the lid surface of the PET bottle, and an IC tag reader (MR-STD2, output 150 mW, manufactured by Hitachi Kokusai Electric Co., Ltd.) and an antenna (YCE-5223, Yokoo Co., Ltd.) as an interrogator. Was used to measure the communication distance between the interrogator and the label-like IC tag 700, and a maximum distance (maximum communication distance) of 5.3 mm was obtained. Therefore, the maximum communication distance that can be read was 14 mm or less in diameter of the label-like IC tag 700.

(Example 2)
An IC tag inlet was produced in the same manner as in Example 1 except that the length of the long side of the antenna circuit was 8 mm. Next, the IC tag inlet was temporarily fixed to a paper-made label-like tag having adhesiveness, and cut out into a circle having a diameter of 12 mm so that the IC tag inlet was positioned substantially at the center. FIG. 13B shows the label-like IC tag thus obtained.

  Next, this label-like IC tag is affixed to the lid surface of the PET bottle, and an interrogator IC tag reader (MR-STD2, output 150 mW, manufactured by Hitachi Kokusai Electric) and antenna (YCE-5223, manufactured by Yokoo Co., Ltd.) ) Was used to measure the communication distance between the interrogator and the label-like IC tag, and a maximum distance (maximum communication distance) of 5.0 mm was obtained. Therefore, the maximum communication distance that can be read was 12 mm or less in diameter of the label-like IC tag.

(Example 3)
An IC tag inlet was produced in the same manner as in Example 1 except that the length of the long side of the antenna circuit was 6 mm. Next, the IC tag inlet was temporarily fixed to a paper-made label-like tag having adhesiveness, and cut out into a circle having a diameter of 10 mm so that the IC tag inlet was positioned substantially at the center. FIG. 13C shows the label-like IC tag thus obtained.

  Next, this label-like IC tag is affixed to the lid surface of the PET bottle, and an interrogator IC tag reader (MR-STD2, output 150 mW, manufactured by Hitachi Kokusai Electric) and antenna (YCE-5223, manufactured by Yokoo Co., Ltd.) ) Was used to measure the communication distance between the interrogator and the label-like IC tag, and a maximum distance (maximum communication distance) of 5.1 mm was obtained. Therefore, the maximum communication distance that can be read was 10 mm or less in diameter of the label-like IC tag.

Example 4
An IC tag inlet was produced in the same manner as in Example 1 except that the length of the long side of the antenna circuit was 4 mm. Next, the IC tag inlet was temporarily fixed to an adhesive paper-made label-like tag, and cut out into a circle having a diameter of 8 mm so that the IC tag inlet was positioned substantially at the center. FIG. 13D shows the label-like IC tag thus obtained.

  Next, this label-like IC tag is affixed to the lid surface of the PET bottle, and an interrogator IC tag reader (MR-STD2, output 150 mW, manufactured by Hitachi Kokusai Electric) and antenna (YCE-5223, manufactured by Yokoo Co., Ltd.) ) Was used to measure the communication distance between the interrogator and the label-like IC tag, and a maximum distance (maximum communication distance) of 5.0 mm was obtained. Therefore, the maximum communication distance that can be read was 8 mm or less in diameter of the label-like IC tag.

(Example 5)
An IC tag inlet was produced in the same manner as in Example 1 except that the length of the long side of the antenna circuit was 3 mm. Next, the IC tag inlet was temporarily fixed to an adhesive paper-made label-like tag, and cut out into a circle having a diameter of 7 mm so that the IC tag inlet was positioned substantially at the center. FIG. 13E shows the label-like IC tag thus obtained.

  Next, this label-like IC tag is affixed to the lid surface of the PET bottle, and an interrogator IC tag reader (MR-STD2, output 150 mW, manufactured by Hitachi Kokusai Electric) and antenna (YCE-5223, manufactured by Yokoo Co., Ltd.) ) Was used to measure the communication distance between the interrogator and the label-like IC tag, and a maximum distance (maximum communication distance) of 4.9 mm was obtained. Therefore, the maximum communication distance that can be read was 7 mm or less in diameter of the label-like IC tag.

  FIG. 14 collectively shows the antenna (antenna substrate) length of the IC tag inlet, the diameter of the IC tag, and the maximum communication distance based on the results obtained in Examples 1 to 5.

  According to the IC tag inlet and the IC tag of the present invention, the following effects can be obtained. That is, by connecting the double-sided electrode chip and the antenna via the short-circuit plate, it is possible to realize an IC tag inlet that can be miniaturized and that is inexpensive and excellent in productivity. Further, by limiting the maximum communication distance that can be read to the length of the shortest direction of the IC tag, it is possible to realize an IC tag that can prevent misreading that reads information that is not the target.

(A) It is a top view which shows an example of the IC tag inlet of this invention, (b) is AA 'sectional drawing of (a). It is a figure which shows the effect of this invention. It is a top view which shows an example of the IC tag inlet of this invention. It is a figure which shows the effect of this invention. (A) It is a top view which shows an example of the conventional IC tag inlet, (b) is BB 'sectional drawing of (a). (A) It is a figure which shows the equivalent circuit of the IC tag inlet of this invention, (b) It is a figure which shows the equivalent circuit of the conventional IC tag inlet. It is a figure which shows the effect of this invention. (A) It is a top view which shows an example of the IC tag inlet using a double-sided electrode chip, (b) is C-C 'sectional drawing of (a). It is a perspective view which shows an example of the IC tag of this invention. It is a perspective view which shows an example of the IC tag of this invention. (A) It is a figure explaining the misreading prevention method of the IC tag of this invention, (b) is a figure explaining the misreading prevention method of the IC tag of this invention. It is a figure explaining the manufacturing process of the IC tag inlet of this invention. It is a figure which shows the Example of this invention. It is a figure which shows the effect of this invention.

Explanation of symbols

10: Double-sided electrode chip 11: External electrode formed on the circuit surface 12: External electrode formed on the base substrate surface 13: Conventional IC chip 14, 15: External electrode 20: Antenna 21: Slit 22: Base substrate 30: Short-circuit plate 31: Base substrate 32: Short-circuit portion 33: Gold wire 40: Anisotropic conductive adhesive 41: Conductive particle 42: Matrix resin 50: Conductive adhesive 60: Organic resin for sealing 70: Tag substrate 71: Adhesive layer 72: Printed matter 73: Strap 80: Label-like tag 81: Adhesive layer 82: Printed matter 83: Substrate 90: Substrate to be read 89, 91: Substrate to be read non-target 92: Interrogator 100: Symbol 101 indicating a double-sided electrode chip: Symbol 102 indicating a conventional IC chip: Symbol 110 indicating an antenna 110: Double-sided electrode chip 111: External electrode 112 formed on a circuit surface: External electrodes 200 formed over the scan board surface: an antenna circuit (antenna)
210: Slit 220: Base substrate (polyethylene terephthalate substrate)
300: Short-circuit plate 310: Base substrate (polyethylene terephthalate substrate)
400: Anisotropic conductive adhesive film 500: Crimp head 600: IC tag inlet 700: Labeled IC tag L B1 : Inductance L S1 : Inductance L S2 : Inductance C B1 : Capacitance C S1 : Capacitance C S2 : Capacitance



Claims (10)

  1. An IC chip for wireless communication formed on each surface of a set of external electrodes facing each other, a transmission / reception antenna formed with a slit, and a short-circuit plate for electrically connecting the IC chip and the transmission / reception antenna An IC tag inlet provided,
    The external electrode formed on one surface of the IC chip is connected to a transmission / reception antenna, the external electrode formed on the other surface of the IC chip is connected to the short-circuit plate, and the transmission / reception antenna The shorting plate is connected,
    An IC tag inlet, wherein a length of the transmitting / receiving antenna in a direction having the maximum length is in a range of 3 mm to 10 mm.
  2.   The slit formed in the transmission / reception antenna has a T-shape, the length of the slit is in the range of 2.0 mm to 3.0 mm, and the width of the slit is 0.2 mm to 0.7 mm. The IC tag inlet according to claim 1, which is in a range.
  3.   A portion where the external electrode formed on one surface of the IC chip and the transmission / reception antenna are connected, a portion where the external electrode formed on the other surface of the IC chip and the short-circuit plate are connected, the transmission / reception antenna and the The IC tag inlet according to claim 1 or 2, wherein the connected portion of the short-circuit plate is formed of either a conductive adhesive, an anisotropic conductive adhesive, or a non-conductive adhesive.
  4.   4. The IC tag inlet according to claim 1, wherein at least one of the external electrodes formed on the IC chip is an external electrode formed by processing an IC chip base substrate made of silicon.
  5.   The IC tag inlet according to any one of claims 1 to 4, wherein the transmitting / receiving antenna is one of an aluminum foil, a copper foil, or a cured product of a conductive paste.
  6.   A transmitting / receiving antenna is supported by a base substrate made of an organic resin, and the organic resin is made of vinyl chloride resin (PVC), acrylonitrile butadiene styrene (ABS), polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PETG), The IC tag inlet according to any one of claims 1 to 5, which is an organic resin selected from the group consisting of polyethylene naphthalate (PEN), polycarbonate resin (PC), biaxially stretched polyester (O-PET), and polyimide resin.
  7.   6. The IC tag inlet according to claim 1, wherein the transmission / reception antenna is supported by a base substrate made of paper.
  8.   An IC tag formed by integrating the IC tag inlet according to any one of claims 1 to 7 with any one of an organic resin, paper, an inorganic material, or a member combining them.
  9.   9. The IC tag according to claim 8, wherein the information stored in the IC tag can be read in a free space using an interrogator, and the maximum readable distance between the information stored in the interrogator and the IC tag is An IC tag that is equal to or shorter than the length in the direction having the shortest length of the IC tag.
  10. 9. The IC tag according to claim 8, wherein the information stored in the IC tag can be read in a free space using an interrogator, and the adherend to be read having the IC tag and the non-reading having the IC tag. An IC tag characterized in that the distance between the centers of the target adherends (the closest distance) is equal to or greater than the maximum distance at which information stored in the IC tag can be read.


JP2005007583A 2005-01-14 2005-01-14 Ic tag and ic tag inlet Granted JP2006195796A (en)

Priority Applications (1)

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JP2005007583A JP2006195796A (en) 2005-01-14 2005-01-14 Ic tag and ic tag inlet

Applications Claiming Priority (1)

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JP2005007583A JP2006195796A (en) 2005-01-14 2005-01-14 Ic tag and ic tag inlet

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JP2006195796A true JP2006195796A (en) 2006-07-27

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Cited By (4)

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WO2009014213A1 (en) * 2007-07-25 2009-01-29 Fujitsu Limited Wireless tag and method for manufacturing the same
WO2009019738A1 (en) * 2007-08-08 2009-02-12 Fujitsu Limited Patch antenna for tag and rfid tag employing the patch antenna
US8220717B2 (en) 2006-01-05 2012-07-17 Hitachi Chemical Co., Ltd. Tubular container enabling individual identification
WO2013161388A1 (en) * 2012-04-25 2013-10-31 株式会社村田製作所 Wireless ic device and wireless communication terminal

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JP2001308234A (en) * 2000-04-24 2001-11-02 Nissan Motor Co Ltd Manufacturing method of semiconductor device
JP2003058845A (en) * 2001-08-17 2003-02-28 Oji Paper Co Ltd Method for manufacturing non-contact ic card
JP2004086644A (en) * 2002-08-28 2004-03-18 Renesas Technology Corp Inlet for electronic tag and its manufacturing method
JP2004127230A (en) * 2002-08-08 2004-04-22 Renesas Technology Corp Semiconductor device, method of manufacturing semiconductor device, method for electronic commerce and transponder reader

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JP2001308234A (en) * 2000-04-24 2001-11-02 Nissan Motor Co Ltd Manufacturing method of semiconductor device
JP2003058845A (en) * 2001-08-17 2003-02-28 Oji Paper Co Ltd Method for manufacturing non-contact ic card
JP2004127230A (en) * 2002-08-08 2004-04-22 Renesas Technology Corp Semiconductor device, method of manufacturing semiconductor device, method for electronic commerce and transponder reader
JP2004086644A (en) * 2002-08-28 2004-03-18 Renesas Technology Corp Inlet for electronic tag and its manufacturing method

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8220717B2 (en) 2006-01-05 2012-07-17 Hitachi Chemical Co., Ltd. Tubular container enabling individual identification
WO2009014213A1 (en) * 2007-07-25 2009-01-29 Fujitsu Limited Wireless tag and method for manufacturing the same
WO2009013817A1 (en) * 2007-07-25 2009-01-29 Fujitsu Limited Wireless tag
US8570173B2 (en) 2007-07-25 2013-10-29 Fujitsu Limited Radio frequency tag and method of manufacturing the same
WO2009019738A1 (en) * 2007-08-08 2009-02-12 Fujitsu Limited Patch antenna for tag and rfid tag employing the patch antenna
US8629809B2 (en) 2007-08-08 2014-01-14 Fujitsu Limited Tag patch antenna and RFID tag using tag patch antenna
WO2013161388A1 (en) * 2012-04-25 2013-10-31 株式会社村田製作所 Wireless ic device and wireless communication terminal
US9336475B2 (en) 2012-04-25 2016-05-10 Murata Manufacturing Co., Ltd. Radio IC device and radio communication terminal

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