JP2000222540A - Non-contact type semiconductor tag - Google Patents

Non-contact type semiconductor tag

Info

Publication number
JP2000222540A
JP2000222540A JP11026410A JP2641099A JP2000222540A JP 2000222540 A JP2000222540 A JP 2000222540A JP 11026410 A JP11026410 A JP 11026410A JP 2641099 A JP2641099 A JP 2641099A JP 2000222540 A JP2000222540 A JP 2000222540A
Authority
JP
Japan
Prior art keywords
antenna
semiconductor
tag
contact type
spherical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP11026410A
Other languages
Japanese (ja)
Inventor
Fumiyuki Inose
文之 猪瀬
Original Assignee
Hitachi Maxell Ltd
日立マクセル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Ltd, 日立マクセル株式会社 filed Critical Hitachi Maxell Ltd
Priority to JP11026410A priority Critical patent/JP2000222540A/en
Publication of JP2000222540A publication Critical patent/JP2000222540A/en
Withdrawn legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To make attainable a simplification of components and assembly by making an antenna, which is to be used for high frequency transmission/ reception, a dipole type and also using the antenna as a support for the main body of semiconductor. SOLUTION: A spherical semiconductor 100 has the diameter of about 1 mm with the multiple formation of semiconductor circuit on the spherical surface. This circuit is provided with a non-volatile memory, a transmission/ reception circuit for information and a power source circuit for preparing an operating power source from received power and two matching coils 101 for matching an impedance between the antenna and the circuit are provided corresponding to the left and right elements of the antenna. Antenna elements 201 and 202 are attached to the spherical semiconductor 100 by soldering 203, the operating carrier frequency of the element is about 2.45 GHz and the full length required as a simple dipole is about 61 mm. When the antenna is too long, the number of winding the matching coil 101 is increased and a loading inductance is increased so that the full length can be reduced by half. Thus, the practical tag having the full length of about 30 mm and the maximum thickness of about 1 mm can be realized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type semiconductor tag, and more particularly, to a semiconductor tag using a spherical semiconductor as a main body.

[0002]

2. Description of the Related Art Many proposals have been made to digitize tags (tags) used in various fields such as distribution and transportation, and to read them out in a non-contact manner to streamline operations. In these applications, a tag using a high frequency carrier is used by applying the technology of an IC card.

However, in distribution control and the like, the demand for cost is severe due to the requirement of disposable and the like, and it is difficult to realize this using a normal semiconductor and a mounting method similar to an IC card.

On the other hand, recently, there has been proposed a method of using a spherical semiconductor to greatly reduce the cost of the semiconductor. The circuit size of the semiconductor tag is not large and can be sufficiently accommodated on the surface of a silicon sphere having a diameter of 1 mm. In this respect, the spherical semiconductor is considered to be suitable for tag applications.

However, since the spherical semiconductor has a thickness of, for example, 1 mm and is three-dimensional, it is difficult to mount a printed circuit board, which is a conventional IC card construction method.

[0006] In this regard, the present invention seeks to provide an inexpensive and practical semiconductor tag using a spherical semiconductor.

[0007]

SUMMARY OF THE INVENTION An ordinary semiconductor is used.
In addition, the conventional semiconductor tag using a mounting method similar to an IC card has a limit in reducing the cost.

On the other hand, recently, a method using a spherical semiconductor is considered to be suitable for application to a tag. However, the problem is that the spherical semiconductor is three-dimensional and is not easily compatible with a conventional printed circuit board mounting method of an IC card. There is.

The present invention has been made in view of the above points, and an object of the present invention is to provide a structure of a high-frequency antenna suitable for a spherical semiconductor, and to provide an inexpensive and practical non-contact type semiconductor tag. .

[0010]

According to the present invention, in a non-contact type semiconductor tag using a spherical semiconductor, an antenna used for transmitting and receiving a high frequency is a dipole type,
Also, a non-contact type semiconductor tag is provided in which the antenna is configured to also serve as a support for the semiconductor body as required, and simplification of parts and simplification of assembly are achieved.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a non-contact type semiconductor tag according to the present invention will be described.

(Embodiment 1) FIG. 1 shows an embodiment of a non-contact type semiconductor tag according to the present invention employing a simple dipole as an antenna. Reference numeral 100 denotes a spherical semiconductor main body having a diameter of 1 mm, and multiple semiconductor circuits are formed on a spherical surface. The circuit includes a non-volatile memory, an information transmission / reception circuit, a power supply circuit for generating an operation power supply from received power, and a coil for impedance matching between the antenna and the circuit. 101 is a matching coil,
Two are provided corresponding to the left and right elements of the antenna.

Reference numerals 201 and 202 denote antenna elements which are mechanically attached to the sphere of the main body by soldering 203.

The operating carrier frequency of the element is 2.45 GHz.
And the total length required for a simple dipole (201, 2,
02 is 61 mm). If this is too long, the total length can be reduced by half by increasing the number of turns of the matching coil 101 to increase the loading inductance. As a result, the overall length is about 30 mm and the thickness is up to 1
A practical tag of about mm can be realized.

Since a semiconductor has a certain mechanical strength due to its spherical shape, it can withstand practical use in this form, but can be reinforced and protected by a resin coating.

(Embodiment 2) FIG. 2 shows an embodiment of a non-contact type semiconductor tag according to the present invention employing a folded dipole as an antenna. The antenna element is a folded type, has a total length of half a wavelength, and is about 60 m for a 2.45 GHz carrier.
m. The matching coil 101 uses a planar winding type. In this folded antenna type, the antenna element is 1
It is a series of mechanical parts that are easy to handle,
In addition, there is a feature that the positioning of the spherical connecting portion is easy. In addition, the antenna has a high impedance of about 300Ω and is easily matched with a semiconductor circuit.

(Embodiment 3) FIG. 3 shows an embodiment of a non-contact type semiconductor tag according to the present invention employing a dipole antenna of a type employing T-type matching. The total length of the antenna element is a half wavelength, and is about 60 mm for a 2.45 GHz carrier. The main body 201 of the antenna is a single continuous metal rod.

The matching portions 204 and 205 are attached to the central portion of the antenna main body, and have a total length of 12/100 wavelengths, which is about 15 mm for a 2.45 GHz carrier.
In this case, since the elements 204 and 205 are 7 mm and short, the mounting portion of the sphere is mechanically more stable than in the second embodiment,
The feature of easy handling is obtained. The impedance of the antenna is about 600Ω, and matching with the semiconductor circuit is easy.

(Embodiment 4) In the above embodiments, the sphere of the main body and the antenna element in contact with it have been described as having a structure sharing the center. Can cause problems. FIG.
Shows another structure of the joint surface between the antenna element and the sphere in the third embodiment. In this example, half of the sphere is configured to be in contact with the antenna element. According to this structure, there is an advantage that the antenna element does not become an obstacle when the sphere is inserted, and the assembling operation can be completed by simple translation without deforming the antenna element.

Although the embodiments of the non-contact type semiconductor tag of the present invention have been specifically described above, the present invention is not limited to the above embodiments. For example, the invention can be similarly applied to a Yagi antenna type in which a reflector or a director is attached to a dipole.

In the above embodiment, the rod-shaped antenna structure has been described. However, a similar effect can be obtained with a planar antenna such as a slit antenna.

[0022]

As described above, according to the present invention, a non-contact type semiconductor tag is formed by using a spherical semiconductor,
A non-contact type semiconductor tag is provided in which an antenna used for transmitting and receiving high-frequency waves is configured as a dipole type, and parts are simplified and assembly is simplified. As a result, the characteristics of a spherical semiconductor can be exhibited, and an inexpensive and practical non-contact type semiconductor tag can be provided.

Further, according to the present invention, the antenna to be used can be configured so that the antenna also serves as a support for the semiconductor body, so that simplification of parts and simplification of assembly can be achieved.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing an embodiment of a non-contact type semiconductor tag employing a simple dipole as an antenna.

FIG. 2 is an explanatory diagram showing an embodiment of a non-contact type semiconductor tag employing a folded dipole as an antenna.

FIG. 3 is an explanatory diagram showing an embodiment of a non-contact type semiconductor tag employing a dipole antenna employing T-type matching;

FIG. 4 shows another structure of the joint surface between the antenna element and the sphere.

[Explanation of symbols]

 REFERENCE SIGNS LIST 100 spherical semiconductor 101 matching coil formed on spherical semiconductor surface 201 antenna element 202 antenna element 203 welding part of antenna and spherical semiconductor 204 one piece of T matching part 205 another piece of T matching part

Claims (6)

    [Claims]
  1. In a semiconductor tag for communicating information in an internal memory with an external reader / writer in a non-contact manner using a high frequency, a semiconductor of a main body is a single sphere, and an antenna for transmitting / receiving a high frequency is a dipole type. Non-contact type semiconductor tag characterized by the above-mentioned.
  2. 2. The non-contact type semiconductor tag according to claim 1, wherein a matching circuit with the antenna is mounted on the main body semiconductor to reduce the length of the antenna.
  3. 3. The antenna is a simple dipole type,
    2. The non-contact type semiconductor tag according to claim 1, wherein antenna elements are attached to both ends of the main body sphere.
  4. 4. The non-contact type semiconductor tag according to claim 1, wherein the antenna is of a folded dipole type, and a sphere of a main body is arranged at a butt portion of the antenna.
  5. 5. The non-contact type semiconductor tag according to claim 1, wherein a central portion of the antenna main body is made of a continuous metal, and a spherical main body is arranged in the middle of the matching portion.
  6. 6. The non-contact type semiconductor tag according to claim 1, wherein a connecting portion between the antenna and the spherical semiconductor has a shape capable of receiving a sphere without deformation of the connecting portion.
JP11026410A 1999-02-03 1999-02-03 Non-contact type semiconductor tag Withdrawn JP2000222540A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11026410A JP2000222540A (en) 1999-02-03 1999-02-03 Non-contact type semiconductor tag

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11026410A JP2000222540A (en) 1999-02-03 1999-02-03 Non-contact type semiconductor tag

Publications (1)

Publication Number Publication Date
JP2000222540A true JP2000222540A (en) 2000-08-11

Family

ID=12192792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11026410A Withdrawn JP2000222540A (en) 1999-02-03 1999-02-03 Non-contact type semiconductor tag

Country Status (1)

Country Link
JP (1) JP2000222540A (en)

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JP2003058839A (en) * 2001-08-10 2003-02-28 Ricoh Co Ltd Medium, method and device for providing input information
JP2003060050A (en) * 2001-08-09 2003-02-28 Ricoh Co Ltd Inductance element, transformer and capacitance element
US6657542B2 (en) 2001-03-13 2003-12-02 Hitachi, Ltd. Electronic device and method of manufacture the same
JP2006080367A (en) * 2004-09-10 2006-03-23 Brother Ind Ltd Inductance element, radio tag circuit element, tagged tape roll, and manufacturing method of inductance element
WO2006064540A1 (en) * 2004-12-14 2006-06-22 Fujitsu Limited Antenna and noncontact tag
WO2007013168A1 (en) * 2005-07-29 2007-02-01 Fujitsu Limited Rf tag and rf tag manufacturing method
WO2007141836A1 (en) * 2006-06-02 2007-12-13 Hitachi, Ltd. Method for manufacturing inlet for ic tag
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JP2009003829A (en) * 2007-06-25 2009-01-08 Nec Tokin Corp Radio tag
JP2009071869A (en) * 2005-03-17 2009-04-02 Fujitsu Ltd Tag antenna
JP2009294953A (en) * 2008-06-05 2009-12-17 Hitachi Ltd Rfid thread, sheet with rfid thread and printing machine for sheet with rfid thread
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