JP2000222540A - Non-contact type semiconductor tag - Google Patents

Non-contact type semiconductor tag

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Publication number
JP2000222540A
JP2000222540A JP2641099A JP2641099A JP2000222540A JP 2000222540 A JP2000222540 A JP 2000222540A JP 2641099 A JP2641099 A JP 2641099A JP 2641099 A JP2641099 A JP 2641099A JP 2000222540 A JP2000222540 A JP 2000222540A
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Prior art keywords
antenna
semiconductor
non
circuit
contact type
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Withdrawn
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JP2641099A
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Japanese (ja)
Inventor
Fumiyuki Inose
文之 猪瀬
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Hitachi Maxell Ltd
日立マクセル株式会社
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Abstract

PROBLEM TO BE SOLVED: To make attainable a simplification of components and assembly by making an antenna, which is to be used for high frequency transmission/ reception, a dipole type and also using the antenna as a support for the main body of semiconductor. SOLUTION: A spherical semiconductor 100 has the diameter of about 1 mm with the multiple formation of semiconductor circuit on the spherical surface. This circuit is provided with a non-volatile memory, a transmission/ reception circuit for information and a power source circuit for preparing an operating power source from received power and two matching coils 101 for matching an impedance between the antenna and the circuit are provided corresponding to the left and right elements of the antenna. Antenna elements 201 and 202 are attached to the spherical semiconductor 100 by soldering 203, the operating carrier frequency of the element is about 2.45 GHz and the full length required as a simple dipole is about 61 mm. When the antenna is too long, the number of winding the matching coil 101 is increased and a loading inductance is increased so that the full length can be reduced by half. Thus, the practical tag having the full length of about 30 mm and the maximum thickness of about 1 mm can be realized.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は非接触型半導体タグに関しさらに詳細には本体に球形の半導体を用いた半導体タグに関する。 The present invention relates to relates to a semiconductor tag using the spherical semiconductor body further detail relates contactless semiconductor tag.

【0002】 [0002]

【従来の技術】物流、交通など多方面に用いられているタグ(荷札)を電子化し、さらに非接触でこれを読み取ることにより業務の合理化を図る提案が多くなされている。 BACKGROUND ART logistics, tags are used, such as in many fields traffic (the tag) and digitized, it has been made many further proposals to streamline operations by reading it in a non-contact manner. これらの応用ではICカードの技術を応用し、高周波キャリアを用いたタグが用いられている。 In these applications the application of IC card technology, the tag using a high frequency carrier is used.

【0003】しかしながら物流制御などでは使い捨てなどの要請からコストに対する要求は厳しく、通常の半導体を用い、またICカード類似の実装方法を用いてはその実現が困難である。 However it demands for cost the demand for such disposable in logistics control strictly, using conventional semiconductor, also using the mounting method of the IC card similar realization is difficult.

【0004】一方、最近、球形の半導体を用いて半導体のコストを大幅に低減する方式が提案されている。 On the other hand, recently, a method to significantly reduce the cost of semiconductor by using a spherical semiconductor has been proposed. 半導体タグでは回路規模も大きくなく、直径1mmのシリコン球の表面に十分に収容できる規模であって、この面では球形半導体はタグの応用に適していると考えられる。 Circuit size not large in the semiconductor tag, a scale enough to accommodate the surface of the silicon spheres having a diameter of 1 mm, in the surface considered spherical semiconductors are suitable for application of the tag.

【0005】しかしながら球形半導体はたとえば1mmの厚さがあり、立体であるから、従来のICカードの工法であるプリント基板実装はなじみにくい。 However spherical semiconductor, for example has a thickness of 1 mm, since a three-dimensional printed circuit board mounting is difficult familiar a method of a conventional IC card.

【0006】本発明はこの点に関し、球形半導体を用い、安価で実用的な半導体タグを提供しようとするものである。 [0006] The present invention relates to this point, using a spherical semiconductor, it is intended to provide a practical semiconductor tags inexpensive.

【0007】 [0007]

【発明が解決しようとする課題】通常の半導体を用い、 Using a conventional semiconductor [0006],
またICカード類似の実装方法を用いた従来の半導体タグではコストの切り下げに限界がある。 Also there is a limit to devaluation cost in the conventional semiconductor tag using the mounting method of the IC card similar.

【0008】一方、最近、球形の半導体を用いる方式はタグの応用に適していると考えられるが、球形半導体が立体であり、従来のICカードの工法であるプリント基板実装とはなじみにくいという問題がある。 On the other hand, recently, methods using a spherical semiconductor is considered to be suitable for application of the tag, a spherical semiconductor steric, a problem that hardly familiar with conventional printed circuit board mounting a method of IC card there is.

【0009】本発明は、かかる点に鑑みてなされたものであり、その目的は球形半導体に適した高周波アンテナの構造を提供し、安価で実用的な非接触型半導体タグを提供することである。 [0009] The present invention has been made in view of the foregoing, the purpose is to provide a structure of a radio-frequency antenna which is suitable for spherical semiconductor is to provide a practical non-contact type semiconductor tags inexpensive .

【0010】 [0010]

【課題を解決するための手段】本発明に従えば、球形半導体を用いた非接触型半導体タグにおいて、高周波の送受を行うために使用するアンテナをダイポール型とし、 According to the present invention SUMMARY OF], in a non-contact type semiconductor tag using spherical semiconductor, the antenna used for transmitting and receiving radio frequency and dipole,
また必要によりアンテナが半導体本体の支持体を兼ねるように構成し、部品の簡単化と組み立ての簡単化を図ったことを特徴とする非接触型半導体タグが提供される。 The antenna necessary is configured to serve as a support for the semiconductor body, a non-contact type semiconductor tag, characterized in that tried to simplify and simplify the assembly of the parts is provided.

【0011】 [0011]

【発明の実施の形態】以下、本発明に従う非接触型半導体タグの実施形態について説明する。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments will be described non-contact type semiconductor tag according to the present invention.

【0012】(実施例1)図1はアンテナに単純ダイポールを採用した本発明に従う非接触型半導体タグの実施例である。 [0012] (Embodiment 1) FIG. 1 is an example of a non-contact type semiconductor tag according to the present invention which employs a simple dipole antenna. 100は直径が1mmの球形半導体の本体であり、球面に多重に半導体回路が形成されている。 100 is a body of 1mm spherical semiconductor diameter, a semiconductor circuit is formed on the multi-spherical. その回路には不揮発性メモリおよび情報の送受回路、受信電力から動作電源を作り出すための電源回路が含まれ、さらにアンテナと回路間のインピーダンス整合を取るためのコイルが内蔵されている。 Transmitting and receiving circuit of the nonvolatile memory and the information on the circuit, it includes a power supply circuit for producing operation power from the received power, has a built-in coil for further impedance matching between the antenna and the circuit. 101は整合コイルであり、 101 is a matching coil,
アンテナの左右素子に対応して2個設けられている。 The left and right elements of the antenna are provided two correspondingly.

【0013】201、202はアンテナ素子の一片であり半田付け203により、本体の球体に機械的に取り付けられている。 [0013] 201 and 202 by soldering 203 a piece of antenna elements, mechanically attached to the spherical body.

【0014】素子の動作キャリア周波数は2.45GHz [0014] The operation carrier frequency of the element is 2.45GHz
であり、単純ダイポールとして必要な全長(201、2 , And the required overall length as a simple dipole (201,2
02の長さの和)は61mmとなる。 The sum of the length of 02) is 61mm. もしこれが長すぎるときは整合コイル101の巻数を増して装荷インダクタンスを増やすことにより、全長を実用上半減することが可能である。 If when this is too long by increasing the loading inductance by increasing the number of turns of the matching coil 101, it is possible to practically half the total length. これにより全長が約30mmで太さが最大1 Up to 1 thereby overall length thickness of about 30mm is
mm程度の実用的なタグを実現することが出来る。 It is possible to realize a practical tag of about mm.

【0015】半導体は球体のためある程度の機械強度が確保されるので、この形でも実用に耐えるが、さらに樹脂コーテングにより補強および保護を施すことも出来る。 [0015] Since the semiconductor some mechanical strength for the sphere is secured, but sufficient for practical use even in this form, can also be subjected to further reinforce and protected by a resin Kotengu.

【0016】(実施例2)図2はアンテナに折り返し型ダイポールを採用した本発明に従う非接触型半導体タグの実施例である。 [0016] (Embodiment 2) FIG. 2 is an example of a non-contact type semiconductor tag according to the present invention employing a folded dipole antenna. アンテナ素子は折り返し型であり、全長は半波長であり、2.45GHzキャリアの場合約60m Antenna element is folded, the full length is half wavelength, about the case of 2.45GHz carrier 60m
mである。 A m. 整合コイル101は平面巻きの形式を用いている。 Matching coil 101 uses a form of planar winding. この折返しアンテナの形式ではアンテナ素子が1 Antenna elements in the form of the folded antenna 1
個の連続した機械部品であって取り扱いが容易であり、 A consecutive mechanical parts are easy to handle,
かつ球体接続部の位置決めが容易な特徴がある。 And there is easy features to position the spherical connecting portion. またアンテナのインピーダンスは約300Ωと高く、半導体回路と整合しやすい特徴がある。 The impedance of the antenna is as high as about 300 [Omega, it is consistent and easily characterized with the semiconductor circuit.

【0017】(実施例3)図3はT型整合を採用した型のダイポールアンテナを採用した本発明に従う非接触型半導体タグの実施例である。 [0017] (Embodiment 3) FIG. 3 shows an embodiment of a non-contact type semiconductor tag according to the present invention employing a type of dipole antenna adopts a T-type matching. アンテナ素子の全長は半波長であり、2.45GHzキャリアの場合は約60mmである。 The total length of the antenna element is a half wavelength, in the case of 2.45GHz carrier is about 60 mm. アンテナの本体201は切れ目のない一本の金属棒である。 Body 201 of the antenna is a single metal bar unbroken.

【0018】整合部204、205はアンテナ本体の中央部に取り付けられその全長は100分の12波長であって、2.45GHzキャリアの場合は約15mmである。 The matching unit 204 and 205 includes its entire length attached to the center portion of the antenna body a 12 wavelength of 100 minutes, in the case of 2.45GHz carrier is about 15 mm.
この場合素子204、205は7mmで短いため、球体の取り付け部は実施形態2に比べて機械的に安定であり、 In this case elements 204 and 205 shorter in 7 mm, mounting portion of the spherical body is mechanically stable than the second embodiment,
取り扱いが容易という特徴が得られる。 Characterized easy to handle is obtained. アンテナのインピーダンスは約600Ωで半導体回路との整合も容易である。 Impedance of the antenna is easily matched with a semiconductor circuit at about 600 ohms.

【0019】(実施例4)以上の実施形態では本体の球体とそれに接するアンテナ素子は中心を共有する構造として説明したが、実施例2、3の場合は、素子の組み立て時の球体素子の挿入に問題が生じる場合がある。 [0019] While the antenna elements in contact therewith and the sphere of the body (Example 4) above embodiment has been described as a structure that shares the center, in the case of Examples 2 and 3, the insertion of the sphere element during assembly of the device there is a case in which a problem to occur. 図4 Figure 4
は実施例3におけるアンテナ素子と球体の接合面の他の構造を示す。 Shows another structure of the junction surface of the antenna element and the spherical body in the third embodiment. この例では球体の半分がアンテナ素子に接するように構成される。 It constructed as half of a sphere is in contact with the antenna element in this example. この構造によれば球体を挿入するさいアンテナ素子が邪魔にならず、アンテナ素子を変形することなしに単純な平行移動で組み立て動作が完了するという利点がある。 Not again antenna elements to insert spheres According to this structure in the way, there is an advantage that the assembling operation is completed in a simple parallel movement without deforming the antenna elements.

【0020】以上、本発明の非接触型半導体タグの実施形態について具体的に説明してきたが、本発明は上記実施形態に限定されるものではない。 [0020] Although the embodiments of the non-contact type semiconductor tag of the present invention have been specifically described, the present invention is not limited to the above embodiment. 例えば、アンテナの構造がダイポールに反射器や導波器をつけた八木アンテナ形式にも同様に適用できる。 For example, it can be similarly applied to a Yagi format structure of the antenna gave a reflector or director dipole.

【0021】また上記実施形態では棒状のアンテナ構造で説明したが、スリットアンテナなどの面構造のアンテナでも同様の効果がある。 [0021] While the above embodiments have been described in the antenna structure of the rod-like, the same effect in the antenna surface structure such as a slit antenna.

【0022】 [0022]

【発明の効果】以上説明してきたように、本発明に従えば、球形半導体を用いて非接触型半導体タグを構成し、 As has been described in the foregoing, according to the present invention, it constitutes a non-contact type semiconductor tag using spherical semiconductor,
高周波の送受を行うために使用するアンテナをダイポール型に構成し、部品の簡単化と組み立ての簡単化を図った非接触型半導体タグが提供される。 The antennas used in order to perform a high-frequency transmission and reception constructed in dipole contactless semiconductor tag which attained simplification and ease of assembly of the component is provided. これにより球形半導体の特徴を発揮でき、安価で実用的な非接触型半導体タグを提供することができる。 This allows exhibiting the spherical semiconductor, it is possible to provide a practical non-contact type semiconductor tags inexpensive.

【0023】また本発明によれば使用するアンテナをアンテナが半導体本体の支持体を兼ねるように構成することも出来、部品の簡単化と組み立ての簡単化を図ることが出来る。 [0023] The antennas used in accordance with the present invention the antenna also can be configured to also serve as a support for the semiconductor body, can be simplified and simplification of assembly of the parts.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】アンテナに単純ダイポールを採用した非接触型半導体タグの実施例を示す説明図である。 FIG. 1 is an explanatory diagram showing an example of a non-contact type semiconductor tag employing a simple dipole antenna.

【図2】アンテナに折り返しダイポールを採用した非接触型半導体タグの実施例を示す説明図である。 FIG. 2 is an explanatory diagram showing an example of a non-contact type semiconductor tag adopting a folded dipole antenna.

【図3】T型整合を採用したダイポールアンテナを採用した非接触型半導体タグの実施例を示す説明図である。 3 is an explanatory diagram showing an example of a non-contact type semiconductor tag employing a dipole antenna which employs the T-type matching.

【図4】アンテナ素子と球体の接合面の他の構造である。 Figure 4 is another structure of the junction surface of the antenna elements and spheres.

【符号の説明】 DESCRIPTION OF SYMBOLS

100 球形半導体 101 球形半導体面に構成された整合コイル 201 アンテナ素子 202 アンテナ素子 203 アンテナと球形半導体の溶接部 204 T整合部の一片 205 T整合部の他の一片 100 spherical semiconductor 101 other piece of spherical semiconductor surface configured a matching coil 201 antenna element 202 antenna element 203 antenna weld 204 T matching portion of the spherical semiconductor piece 205 T matching unit

Claims (6)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 高周波を用いて内部のメモリの情報を外部のリーダライタと非接触で交信する半導体タグにおいて、本体の半導体は一個の球体であり、高周波の送受を行うアンテナはダイポール型であることを特徴とする非接触型半導体タグ。 1. A semiconductor tag using a high frequency of exchanging information of the internal memory in an external reader-writer and the non-contact, the semiconductor body is a single sphere, the antenna for transmitting and receiving high frequency is a dipole non-contact type semiconductor tag, characterized in that.
  2. 【請求項2】 本体半導体にアンテナとの整合回路を搭載しアンテナの長さを短縮したことを特徴とする請求項1記載の非接触型半導体タグ。 2. A mounting a matching circuit between the antenna body semiconductor contactless semiconductor tag according to claim 1, characterized in that to reduce the length of the antenna.
  3. 【請求項3】 アンテナは単純ダイポール形式であり、 Wherein the antenna is a simple dipole type,
    本体球の両端にアンテナ素子を取り付けてなることを特徴とする請求項1記載の非接触型半導体タグ。 Non-contact type semiconductor tag according to claim 1, characterized by being fitted with the antenna elements at both ends of the body sphere.
  4. 【請求項4】 アンテナは折り返しダイポール型であり、アンテナの突き合わせ部分に本体の球体を配置したことを特徴とする請求項1記載の非接触型半導体タグ。 Wherein the antenna is a folded dipole, a non-contact type semiconductor tag according to claim 1, characterized in that a spherical body in the abutting portion of the antenna.
  5. 【請求項5】 アンテナ本体の中央部は連続した金属であり、整合部の中間に球体の本体を配置したことを特徴とする請求項1記載の非接触型半導体タグ。 Central portion of 5. The antenna body is a continuous metal, non-contact type semiconductor tag according to claim 1, characterized in that a spherical body in the middle of the matching portion.
  6. 【請求項6】 アンテナと球体半導体の接続部が接続部の変形なしに球体を受容できる形状としたことを特徴とする請求項1記載の非接触型半導体タグ。 6. A non-contact type semiconductor tag according to claim 1, wherein the connection portion of the antenna and the spherical semiconductor is characterized in that a shape of a sphere can be received without deformation of the connecting portion.
JP2641099A 1999-02-03 1999-02-03 Non-contact type semiconductor tag Withdrawn JP2000222540A (en)

Priority Applications (1)

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