JP2000222540A - Non-contact type semiconductor tag - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make attainable a simplification of components and assembly by making an antenna, which is to be used for high frequency transmission/ reception, a dipole type and also using the antenna as a support for the main body of semiconductor. SOLUTION: A spherical semiconductor 100 has the diameter of about 1 mm with the multiple formation of semiconductor circuit on the spherical surface. This circuit is provided with a non-volatile memory, a transmission/ reception circuit for information and a power source circuit for preparing an operating power source from received power and two matching coils 101 for matching an impedance between the antenna and the circuit are provided corresponding to the left and right elements of the antenna. Antenna elements 201 and 202 are attached to the spherical semiconductor 100 by soldering 203, the operating carrier frequency of the element is about 2.45 GHz and the full length required as a simple dipole is about 61 mm. When the antenna is too long, the number of winding the matching coil 101 is increased and a loading inductance is increased so that the full length can be reduced by half. Thus, the practical tag having the full length of about 30 mm and the maximum thickness of about 1 mm can be realized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to relates to a semiconductor tag using the spherical semiconductor body further detail relates contactless semiconductor tag.

[0002]

BACKGROUND ART logistics, tags are used, such as in many fields traffic (the tag) and digitized, it has been made many further proposals to streamline operations by reading it in a non-contact manner. In these applications the application of IC card technology, the tag using a high frequency carrier is used.

However it demands for cost the demand for such disposable in logistics control strictly, using conventional semiconductor, also using the mounting method of the IC card similar realization is difficult.

On the other hand, recently, a method to significantly reduce the cost of semiconductor by using a spherical semiconductor has been proposed. Circuit size not large in the semiconductor tag, a scale enough to accommodate the surface of the silicon spheres having a diameter of 1 mm, in the surface considered spherical semiconductors are suitable for application of the tag.

However spherical semiconductor, for example has a thickness of 1 mm, since a three-dimensional printed circuit board mounting is difficult familiar a method of a conventional IC card.

[0006] The present invention relates to this point, using a spherical semiconductor, it is intended to provide a practical semiconductor tags inexpensive.

[0007]

Using a conventional semiconductor [0006],
Also there is a limit to devaluation cost in the conventional semiconductor tag using the mounting method of the IC card similar.

On the other hand, recently, methods using a spherical semiconductor is considered to be suitable for application of the tag, a spherical semiconductor steric, a problem that hardly familiar with conventional printed circuit board mounting a method of IC card there is.

[0009] The present invention has been made in view of the foregoing, the purpose is to provide a structure of a radio-frequency antenna which is suitable for spherical semiconductor is to provide a practical non-contact type semiconductor tags inexpensive .

[0010]

According to the present invention SUMMARY OF], in a non-contact type semiconductor tag using spherical semiconductor, the antenna used for transmitting and receiving radio frequency and dipole,
The antenna necessary is configured to serve as a support for the semiconductor body, a non-contact type semiconductor tag, characterized in that tried to simplify and simplify the assembly of the parts is provided.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments will be described non-contact type semiconductor tag according to the present invention.

[0012] (Embodiment 1) FIG. 1 is an example of a non-contact type semiconductor tag according to the present invention which employs a simple dipole antenna. 100 is a body of 1mm spherical semiconductor diameter, a semiconductor circuit is formed on the multi-spherical. Transmitting and receiving circuit of the nonvolatile memory and the information on the circuit, it includes a power supply circuit for producing operation power from the received power, has a built-in coil for further impedance matching between the antenna and the circuit. 101 is a matching coil,
The left and right elements of the antenna are provided two correspondingly.

[0013] 201 and 202 by soldering 203 a piece of antenna elements, mechanically attached to the spherical body.

[0014] The operation carrier frequency of the element is 2.45GHz
, And the required overall length as a simple dipole (201,2
The sum of the length of 02) is 61mm. If when this is too long by increasing the loading inductance by increasing the number of turns of the matching coil 101, it is possible to practically half the total length. Up to 1 thereby overall length thickness of about 30mm is
It is possible to realize a practical tag of about mm.

[0015] Since the semiconductor some mechanical strength for the sphere is secured, but sufficient for practical use even in this form, can also be subjected to further reinforce and protected by a resin Kotengu.

[0016] (Embodiment 2) FIG. 2 is an example of a non-contact type semiconductor tag according to the present invention employing a folded dipole antenna. Antenna element is folded, the full length is half wavelength, about the case of 2.45GHz carrier 60m
A m. Matching coil 101 uses a form of planar winding. Antenna elements in the form of the folded antenna 1
A consecutive mechanical parts are easy to handle,
And there is easy features to position the spherical connecting portion. The impedance of the antenna is as high as about 300 [Omega, it is consistent and easily characterized with the semiconductor circuit.

[0017] (Embodiment 3) FIG. 3 shows an embodiment of a non-contact type semiconductor tag according to the present invention employing a type of dipole antenna adopts a T-type matching. The total length of the antenna element is a half wavelength, in the case of 2.45GHz carrier is about 60 mm. Body 201 of the antenna is a single metal bar unbroken.

The matching unit 204 and 205 includes its entire length attached to the center portion of the antenna body a 12 wavelength of 100 minutes, in the case of 2.45GHz carrier is about 15 mm.
In this case elements 204 and 205 shorter in 7 mm, mounting portion of the spherical body is mechanically stable than the second embodiment,
Characterized easy to handle is obtained. Impedance of the antenna is easily matched with a semiconductor circuit at about 600 ohms.

[0019] While the antenna elements in contact therewith and the sphere of the body (Example 4) above embodiment has been described as a structure that shares the center, in the case of Examples 2 and 3, the insertion of the sphere element during assembly of the device there is a case in which a problem to occur. Figure 4
Shows another structure of the junction surface of the antenna element and the spherical body in the third embodiment. It constructed as half of a sphere is in contact with the antenna element in this example. Not again antenna elements to insert spheres According to this structure in the way, there is an advantage that the assembling operation is completed in a simple parallel movement without deforming the antenna elements.

[0020] Although the embodiments of the non-contact type semiconductor tag of the present invention have been specifically described, the present invention is not limited to the above embodiment. For example, it can be similarly applied to a Yagi format structure of the antenna gave a reflector or director dipole.

[0021] While the above embodiments have been described in the antenna structure of the rod-like, the same effect in the antenna surface structure such as a slit antenna.

[0022]

As has been described in the foregoing, according to the present invention, it constitutes a non-contact type semiconductor tag using spherical semiconductor,
The antennas used in order to perform a high-frequency transmission and reception constructed in dipole contactless semiconductor tag which attained simplification and ease of assembly of the component is provided. This allows exhibiting the spherical semiconductor, it is possible to provide a practical non-contact type semiconductor tags inexpensive.

[0023] The antennas used in accordance with the present invention the antenna also can be configured to also serve as a support for the semiconductor body, can be simplified and simplification of assembly of the parts.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an explanatory diagram showing an example of a non-contact type semiconductor tag employing a simple dipole antenna.

FIG. 2 is an explanatory diagram showing an example of a non-contact type semiconductor tag adopting a folded dipole antenna.

3 is an explanatory diagram showing an example of a non-contact type semiconductor tag employing a dipole antenna which employs the T-type matching.

Figure 4 is another structure of the junction surface of the antenna elements and spheres.

DESCRIPTION OF SYMBOLS

100 spherical semiconductor 101 other piece of spherical semiconductor surface configured a matching coil 201 antenna element 202 antenna element 203 antenna weld 204 T matching portion of the spherical semiconductor piece 205 T matching unit

Claims (6)

[The claims]
1. 1. A semiconductor tag using a high frequency of exchanging information of the internal memory in an external reader-writer and the non-contact, the semiconductor body is a single sphere, the antenna for transmitting and receiving high frequency is a dipole non-contact type semiconductor tag, characterized in that.
2. 2. A mounting a matching circuit between the antenna body semiconductor contactless semiconductor tag according to claim 1, characterized in that to reduce the length of the antenna.
3. Wherein the antenna is a simple dipole type,
   Non-contact type semiconductor tag according to claim 1, characterized by being fitted with the antenna elements at both ends of the body sphere.
4. Wherein the antenna is a folded dipole, a non-contact type semiconductor tag according to claim 1, characterized in that a spherical body in the abutting portion of the antenna.
5. Central portion of 5. The antenna body is a continuous metal, non-contact type semiconductor tag according to claim 1, characterized in that a spherical body in the middle of the matching portion.
6. 6. A non-contact type semiconductor tag according to claim 1, wherein the connection portion of the antenna and the spherical semiconductor is characterized in that a shape of a sphere can be received without deformation of the connecting portion.