JP4828088B2 - Ic tag - Google Patents

Ic tag Download PDF

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Publication number
JP4828088B2
JP4828088B2 JP2003161021A JP2003161021A JP4828088B2 JP 4828088 B2 JP4828088 B2 JP 4828088B2 JP 2003161021 A JP2003161021 A JP 2003161021A JP 2003161021 A JP2003161021 A JP 2003161021A JP 4828088 B2 JP4828088 B2 JP 4828088B2
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Prior art keywords
ic tag
body member
member
ic
outer layer
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JP2004362341A (en
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貴光 中林
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凸版印刷株式会社
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【0001】 [0001]
【発明の属する技術分野】 BACKGROUND OF THE INVENTION
本発明は、導線を巻き回したアンテナコイルにICモジュールを電気的に接続してなる内蔵部品を外層部材で被覆したICタグに関する。 The present invention is a built-in part formed by electrically connecting the IC module to the antenna coil by winding a conductor wire an IC tag coated with an outer layer member.
【0002】 [0002]
【従来の技術】 BACKGROUND OF THE INVENTION
非接触での自動認識技術としてRFID(高周波同一性認識)があり、その用途が拡大しつつある。 As an automatic recognition technology without contact has RFID (radio frequency identity recognition), is expanding its application. RFIDの一種にICタグがあり、ICタグは人が持ったり、物(商品等)に固定したりして使用される。 There are IC tag to a kind of RFID, IC tag or with a person, be used in or fixed in an object (product or the like).
【0003】 [0003]
ICタグに内蔵されるアンテナとして、導線を巻き回したアンテナコイルがある。 As an antenna built in the IC tag, there is an antenna coil by winding a conductor wire. アンテナコイルは周波数125kHzタイプのICタグの大半に採用されており、一部が周波数13.56MHzタイプのICタグに採用されている。 The antenna coil has been adopted in most of the IC tag frequency 125kHz type, part of which is adopted in the IC tag frequency 13.56MHz type.
【0004】 [0004]
図5に、従来のICタグの一例を示すように、ICタグ1は、アンテナコイル2にICモジュール3を電気的に接続し、アンテナコイル2及びICモジュール3を直接外層部材4で成型封止することにより被覆したものである。 5, as an example of a conventional IC tag, IC tag 1 is electrically connected to the IC module 3 on the antenna coil 2, molded sealing an outer layer member 4 an antenna coil 2 and the IC module 3 directly those coated by. この種のICタグ1の成型封止方法には、ラミネート、射出成型、樹脂注型等が挙げられる。 Molded sealing method of this type of IC tag 1, laminating, injection molding, resin casting, and the like. 成型に用いられる外層部材4としては、PVC(ポリ塩化ビニル)、ABS(アクリロニトリル−ブタジエン−スチレン共重合体樹脂)、エポキシ樹脂等、一般的に比較的硬度の高い硬質のものが挙げられる。 The outer layer member 4 used in the molding, PVC (polyvinyl chloride), ABS (acrylonitrile - butadiene - styrene copolymer resins), epoxy resins and the like, include those generally relatively high hardness hard.
【0005】 [0005]
外層部材4が硬質な素材で構成されたICタグ1を、例えば、配管等の曲面に固定して使用する場合、硬質のICタグ1では曲面への固定が困難である。 The IC tag 1 outer member 4 is constituted of a hard material, for example, when used in fixed the curved surface of the pipe or the like, fixed it is difficult to hard IC tag 1 in curved. そこで、配管等の曲面への固定を容易とすべく、外層部材を柔軟材(軟質材)で構成したフレキシブルICタグがある(例えば、特許文献1参照)。 Therefore, in order to facilitate fixing to a curved surface such as a pipe, there is a flexible IC tag constituting the outer layer member with a flexible material (soft material) (for example, see Patent Document 1).
【0006】 [0006]
【特許文献1】 [Patent Document 1]
実開平5−30874号公報【0007】 JP real-Open No. 5-30874 [0007]
【発明が解決しようとする課題】 [Problems that the Invention is to Solve
しかしながら、外層部材4として軟質材、例えば軟質樹脂を用いた場合、内蔵されたアンテナコイル2及びICモジュール3は軟質樹脂によって直接封止固定されているため、ICタグに伸縮等の外力が加わった時に、その伸縮が直接アンテナコイル2及びICモジュール3に伝わってしまう。 However, the soft material as the outer layer member 4, for example, the case of using a soft resin, the antenna coil 2 and the IC module 3 that is incorporated because it is directly sealed secured by soft resin, external force is applied in the expansion and contraction in the IC tag sometimes, the stretchable will transmitted to the antenna coil 2 and the IC module 3 directly. このため、アンテナコイル2が断線したり、ICモジュール3が破損したりするおそれがあるという問題があった。 Therefore, the antenna coil 2 or disconnected, IC module 3 there is a problem that there is a risk of damaged.
【0008】 [0008]
以上の事情を考慮して創案された本発明の目的は、軟質な外層部材に伸縮等の外力が加わっても、外層部材内部の内蔵部品に破損などのおそれの無いICタグを提供することにある。 The purpose of the consideration of the circumstances in the present invention that is conceived above, even when an external force is applied in the expansion and contraction in the soft outer layer member, to provide a possibility no IC tag, such as damage to the internal components inside the outer member is there.
【0009】 [0009]
【課題を解決するための手段】 In order to solve the problems]
上記目的を達成すべく本発明に係るICタグは、導線を巻き回したアンテナコイルにICモジュールを電気的に接続してなる内蔵部品を、 一方の面に接着層を設けた2枚の薄膜基板で挟み込んで、加熱処理により接着層を溶融、固化することで薄膜基板と内蔵基板とを強固に接着して高い剛性を有する本体部材を形成し、その本体部材を軟質樹脂からなる外層部材で被覆したものである。 IC tag according to the present invention for achieving the above-built parts formed by electrically connecting the IC module to the antenna coil by winding a conductor wire, two thin film substrate provided with the adhesive layer on one surface through insertion at the adhesive layer melt, forming a body member having a high rigidity and firmly bond the thin film substrate with embedded substrate by solidified by heat treatment, coating the body member with an outer layer member made of a soft resin one in which the.
【0011】 [0011]
ここで、軟質樹脂は、熱可塑性ウレタンエラストマー、熱硬化性ウレタン、又はホットメルト樹脂であることが好ましい。 Here, soft resin, thermoplastic urethane elastomers, thermoset urethane, or be a hot melt resin. また、薄膜基板は、熱硬化性樹脂のプリプレグシート、自己融着性を有する熱可塑性樹脂のシート、又はPET基材にホットメルト樹脂或いは粘着剤をコーティングしてなるシートであることが好ましい。 The thin-film substrate, prepreg sheet of thermosetting resin is preferably a thermoplastic resin having a self-bonding sheet, or formed by coating a hot-melt resin or adhesive on PET base sheet.
【0012】 [0012]
以上の構成によれば、剛性の高い本体部材を、軟質な外層部材で被覆したICタグが得られることから、外層部材に伸縮等の外力が加わったとしても、外層部材の内部に封入された内蔵部品に破損などが生じるおそれがない。 According to the above configuration, a high body member rigidity, since the IC tag is coated with a soft outer layer member is obtained, even when an external force is applied in the expansion and contraction in the outer layer member, which is enclosed inside the outer member there is no possibility of causing such damage to the internal parts.
【0013】 [0013]
【発明の実施の形態】 DETAILED DESCRIPTION OF THE INVENTION
以下、本発明の好適一実施の形態を添付図面に基づいて説明する。 It will be described below with reference the form of one preferred embodiment of the present invention with reference to the accompanying drawings.
【0014】 [0014]
(第1の実施形態) (First Embodiment)
本発明の好適な一実施形態に係るICタグの断面図を図1に示す。 The cross-sectional view of the IC tag according to a preferred embodiment of the present invention shown in FIG. 尚、図5と同様の部材については同じ符号を付しており、これらの部材については新たな説明を省略する。 Incidentally, are denoted by the same reference numerals refer to like members as in FIG. 5, it is omitted a new description of these members.
【0015】 [0015]
図1に示すように、本実施の形態に係るICタグ10は、導線を巻き回したアンテナコイル(例えばスパイラル状アンテナコイル)2にICモジュール3を電気的に接続してなる内蔵部品を、薄膜基板11上に載置・固定して本体部材13を形成し、その本体部材13を、軟質樹脂からなる外層部材14で被覆したものである。 As shown in FIG. 1, IC tag 10 according to this embodiment, the internal components of the IC module 3 in the antenna coil (e.g., a spiral-shaped antenna coil) 2 by winding a conductive wire formed by electrically connecting a thin film forming a body member 13 placed and fixed to onto the substrate 11, the body member 13 is obtained by coating with an outer layer member 14 made of a soft resin. このICタグ10に、適宜、打ち抜き加工等を施し、所定の形状(例えばカード状)を得るようにしてもよい。 This IC tag 10, as appropriate, subjected to a punching process or the like, may be obtained a predetermined shape (e.g., a card).
【0016】 [0016]
薄膜基板11は、PET(ポリエチレンテレフタレート)基材(例えば、約100μm厚)11aと、PET基材11aの一方の面(図1中では上面)に設けた接着層(例えば、約25μm厚)11bとで構成される。 Thin film substrate 11, PET (polyethylene terephthalate) substrate (e.g., approximately 100μm thick) and 11a, the adhesive layer provided on the (upper surface in FIG. 1) one surface of a PET substrate 11a (e.g., about 25μm thick) 11b constituted by the. この薄膜基板11上に内蔵部品(アンテナコイル2及びICモジュール3)を載置(配置)した後、加熱することで熱接着剤層11bが溶融、固化し、基板11と内蔵部品とが強固に接着、固定され、本体部材13が得られる。 After placing the internal components (antenna coil 2 and the IC module 3) on the thin film substrate 11 (arranged), a thermal adhesive layer 11b is melted by heating, solidified, and is firmly built with the substrate 11 parts adhesive is fixed, the body member 13 is obtained. 接着層11bの構成材としては、アクリル系の熱接着剤、ホットメルト樹脂(例えば、ポリアミド、ウレタン、EVA等)、又は粘着剤等が挙げられる。 The constituent material of the adhesive layer 11b, acrylic thermal adhesive, a hot melt resin (e.g., polyamide, polyurethane, EVA, etc.), or pressure-sensitive adhesive and the like.
【0017】 [0017]
外層部材14は、2枚のシート12a,12bで構成される。 The outer layer member 14, the two sheets 12a, formed of 12b. これらのシート12a,12bで本体部材13を挟んで積層した後、加熱、加圧することで、その内部に本体部材13が封入された外層部材14が形成される。 These sheets 12a, after laminating across the body member 13 at 12b, heating by pressurizing, outer member 14 the body member 13 is sealed to the inside is formed.
【0018】 [0018]
外層部材14を構成する軟質樹脂としては、熱可塑性ウレタンエラストマー(Thermoplastic Elastomers;以下、TPEと表す)が用いられる。 The soft resin constituting the outer layer member 14, a thermoplastic urethane elastomer (Thermoplastic Elastomers; hereinafter, referred to as TPE) is used. 軟質樹脂としてTPEを用いることにより、十分な柔軟性を有する外層部材14となる。 By using the TPE as soft resin, the outer member 14 having a sufficient flexibility. 軟質樹脂としては、TPEの他に、熱可塑性ウレタンエラストマー、熱硬化性ウレタン、ホットメルト樹脂(例えば、ポリアミド、ウレタン、EVA(エチレン−酢酸ビニル共重合体)等)が挙げられる。 The soft resin, in addition to the TPE, thermoplastic urethane elastomers, thermoset urethane, hot melt resins (e.g., polyamide, urethane, EVA (ethylene - vinyl acetate copolymer), etc.).
【0019】 [0019]
次に、本実施の形態の作用を説明する。 Next, the operation of this embodiment.
【0020】 [0020]
薄膜基板11のPET基材11aは薄く、それ自体の剛性は低いものの、内蔵部品は接着層11bを介して薄膜基板11と一体的に強固に固定されるため、得られた本体部材13は高い剛性を有する。 PET substrate 11a of the thin film substrate 11 is thin, although its stiffness itself is low, the internal parts to be integrally firmly fixed and the thin film substrate 11 via an adhesive layer 11b, the body member 13 resulting high rigid. よって、本体部材13の周囲に設けた軟質な外層部材14が伸縮したとしても、本体部材13は高い剛性を有していることから、外層部材14の伸縮に追従することはない。 Therefore, even if the soft outer layer member 14 provided around the body member 13 expands or contracts, the body member 13 from to have a high rigidity, does not follow the expansion and contraction of the outer layer member 14. その結果、ICタグ10に外力などが加わって屈曲したとしても、アンテナコイル2の断線、ICモジュール3の破損等といった内蔵部品の破損、損傷を防止することができる。 As a result, even if the external force such as bent applied to the IC tag 10, breakage of the antenna coil 2, breakage of internal components such as breakage of the IC module 3, it is possible to prevent damage.
【0021】 [0021]
また、本実施の形態に係るICタグ10を、名札や、カード等に取付けることで、名札により個人情報の識別を行うことができる。 Further, the IC tag 10 according to this embodiment, by attaching the name card or cards and the like, it is possible to identify personal information by name tag. 例えば、この名札を幼稚園や老人ホーム等において用い、名札を人が着ている衣服等に取り付けた場合、この状態で園児や老人が転倒したとしても、ICタグ10の外層部材14は軟質樹脂で構成される軟らかなものであることから、ICタグ10により園児や老人が怪我をすることはない。 For example, the name tag used in kindergartens and nursing homes and the like, when attached to such clothing name tags person wearing, even kindergarten and the elderly falls down in this state, the outer layer member 14 of the IC tag 10 is a soft resin since those softness configured, kindergarten and the elderly will not be injured by the IC tag 10.
【0022】 [0022]
また、本実施の形態に係るICタグ10を、配管等の曲面に固定するような場合でも、ICタグ10が配管等の曲面に追従して(沿って)屈曲するので、容易に配管等に固定することができる。 Further, the IC tag 10 of the present embodiment, even when a is fixed to a curved surface such as a pipe, the IC tag 10 is to follow the curved surface of the pipe or the like (along) so bent, easily piping it can be fixed.
【0023】 [0023]
次に、本発明の他の実施の形態を添付図面に基づいて説明する。 Next, a description will be given of a further embodiment of the present invention in the accompanying drawings.
【0024】 [0024]
(第2の実施形態) (Second Embodiment)
図1における本体部材の一変形例の断面図を図2に示す。 A cross-sectional view of a modification of the body member in FIG. 1 is shown in FIG. 尚、図1と同様の部材については同じ符号を付しており、これらの部材については新たな説明を省略する。 Incidentally, the same members as in FIG. 1 are identified by the same reference numerals and not a new description of these members.
【0025】 [0025]
図2に示す本実施の形態に係るICタグの本体部材23の基本的な構成は、図1に示したICタグ10の本体部材13と同様であるが、薄膜基板が熱硬化性樹脂のプリプレグシート21で構成される点で異なる。 The basic structure of the IC tag main body member 23 according to this embodiment shown in FIG. 2 is similar to the body member 13 of the IC tag 10 shown in FIG. 1, a thin film substrate is a thermosetting resin prepreg different point composed of a sheet 21.
【0026】 [0026]
プリプレグシート21は、ガラスエポキシ等の熱硬化性樹脂で構成される。 Prepreg sheet 21 is comprised of a thermosetting resin such as glass epoxy. このプリプレグシート21の一方の面(図2中では上面)に、内蔵部品を配置した状態で熱プレスすることにより、プリプレグシート21が熱硬化し、プリプレグシート21と内蔵部品とが強固に接着、固定され、本体部材23が得られる。 The one surface of the prepreg sheet 21 (upper surface in FIG. 2), by hot pressing in the state in which the internal components, prepreg sheet 21 is thermally cured, internal and prepreg sheet 21 parts and is firmly bonded, is fixed, the body member 23 is obtained. この本体部材23を、シート12a,12b(図1参照)で挟んで積層した後、加熱、加圧することで外層部材14が形成され、ICタグが得られる。 The body member 23, after stacking across a sheet 12a, 12b (see FIG. 1), heating the outer layer member 14 is formed by pressurizing, IC tag is obtained.
【0027】 [0027]
本実施の形態に係る本体部材23を用いたICタグにおいても、前実施の形態に係るICタグ10と同様の作用効果が得られる。 Also in IC tag using a body member 23 according to this embodiment, the same effect with the IC tag 10 according to the prior embodiment can be obtained.
【0028】 [0028]
(第3の実施形態) (Third Embodiment)
図1における本体部材の一変形例の断面図を図3に示す。 3 a sectional view of a modification of the body member in FIG. 尚、図1と同様の部材については同じ符号を付しており、これらの部材については新たな説明を省略する。 Incidentally, the same members as in FIG. 1 are identified by the same reference numerals and not a new description of these members.
【0029】 [0029]
図3に示す本実施の形態に係るICタグの本体部材33の基本的な構成は、図1に示したICタグ10の本体部材13と同様であるが、薄膜基板が自己融着性を有する熱可塑性樹脂シート31で構成される点で異なる。 The basic structure of the IC tag main body member 33 according to the present embodiment shown in FIG. 3 is similar to the body member 13 of the IC tag 10 shown in FIG. 1, a thin film substrate having a self-bonding different points composed of the thermoplastic resin sheet 31.
【0030】 [0030]
熱可塑性樹脂シート31は、PVC、PETG、PBT等の自己融着性を有する熱可塑性樹脂で構成される。 The thermoplastic resin sheet 31, PVC, PETG, composed of a thermoplastic resin having a self-bonding such as PBT. この熱可塑性樹脂シート31の一方の面(図3中では上面)に内蔵部品を配置した状態で熱プレスすることにより、熱可塑性樹脂シート31が溶融し、熱可塑性樹脂シート31に内蔵部品が埋まった状態で強固に接着、固定され、本体部材33が得られる。 By hot pressing while the heat (is in Figure 3 the upper surface) on one surface of the thermoplastic resin sheet 31 is arranged the internal components, melted thermoplastic resin sheet 31, filled is built-in component in the thermoplastic resin sheet 31 firmly bonded in a state, is fixed, the body member 33 is obtained. この本体部材33を、シート12a,12b(図1参照)で挟んで積層した後、加熱、加圧することで外層部材14が形成され、ICタグが得られる。 The body member 33, after stacking across a sheet 12a, 12b (see FIG. 1), heating the outer layer member 14 is formed by pressurizing, IC tag is obtained.
【0031】 [0031]
本実施の形態に係る本体部材33を用いたICタグにおいても、前実施の形態に係るICタグ10と同様の作用効果が得られる。 Also in IC tag using a body member 33 according to this embodiment, the same effect with the IC tag 10 according to the prior embodiment can be obtained.
【0032】 [0032]
(第4の実施形態) (Fourth Embodiment)
本発明の他の好適な一実施形態に係るICタグの断面図を図4に示す。 The cross-sectional view of the IC tag according to another preferred embodiment of the present invention shown in FIG. 尚、図1と同様の部材については同じ符号を付しており、これらの部材については新たな説明を省略する。 Incidentally, the same members as in FIG. 1 are identified by the same reference numerals and not a new description of these members.
【0033】 [0033]
図4に示す本実施の形態に係るICタグ40の基本的な構成は、図1に示したICタグ10と同様であるが、本体部材43が、内蔵部品を2枚の薄膜基板11,11で挟み込んでなる点で異なる。 The basic structure of the IC tag 40 according to this embodiment shown in FIG. 4 is similar to the IC tag 10 shown in FIG. 1, the body member 43, the two-chip component thin film substrates 11 and 11 different in a point which is sandwiched in.
【0034】 [0034]
薄膜基板11,11で内蔵部品を挟み込んだ後、加熱することで熱接着剤層11b,11bが溶融、固化し、基板11,11と内蔵部品とが強固に接着、固定され、本体部材43が得られる。 After sandwiching the internal parts with a thin film substrates 11 and 11, the thermal adhesive layer 11b by heating, 11b are melted, solidified, it built the substrates 11 and 11 parts and is firmly adhered, is fixed, the body member 43 can get. この本体部材43をシート12a,12bで挟んで積層した後、加熱、加圧することで外層部材14が形成され、ICタグ30が得られる。 After stacking across the body member 43 sheets 12a, at 12b, the heating, the outer layer member 14 is formed by pressurizing, IC tag 30 is obtained.
【0035】 [0035]
本実施の形態に係るICタグ40においても、前実施の形態に係るICタグ10と同様の作用効果が得られる。 Also in the IC tag 40 of the present embodiment, the same effect with the IC tag 10 according to the prior embodiment can be obtained.
【0036】 [0036]
【発明の効果】 【Effect of the invention】
以上要するに本発明によれば、軟質な外層部材に伸縮等の外力が加わっても、外層部材内部の内蔵部品に破損などのおそれの無いICタグを得ることができるという優れた効果を発揮する。 According to the brief present invention above, even when an external force is applied in the expansion and contraction in the soft outer layer member, there is exhibited an excellent effect that it is possible to obtain a risk-free IC tag, such as damage to the internal components inside the outer member.
【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS
【図1】本発明の好適な一実施形態に係るICタグの断面図である。 1 is a cross-sectional view of an IC tag according to a preferred embodiment of the present invention.
【図2】図1における本体部材の一変形例を示す断面図である。 Is a cross-sectional view illustrating a modification of the body member in FIG. 1;
【図3】図1における本体部材の一変形例を示す断面図である。 It is a cross-sectional view illustrating a modification of the body member in FIG. 3 FIG.
【図4】本発明の他の好適な一実施形態に係るICタグの断面図である。 It is a cross-sectional view of an IC tag according to another preferred embodiment of the invention; FIG.
【図5】従来のICタグの一例を示す断面図である。 5 is a cross-sectional view showing an example of a conventional IC tag.
【符号の説明】 DESCRIPTION OF SYMBOLS
2 アンテナコイル3 ICモジュール10 ICタグ11 薄膜基板13 本体部材14 外層部材 2 the antenna coil 3 IC module 10 IC tags 11 thin film substrate 13 the body member 14 outer member

Claims (2)

  1. 導線を巻き回したアンテナコイルにICモジュールを電気的に接続してなる内蔵部品を、樹脂からなる外層部材で被覆したICタグにおいて、 The built-in part formed by electrically connecting the IC module to the antenna coil by winding a conducting wire, in the IC tag is coated with an outer layer member made of resin,
    上記内蔵部品を、 一方の面に接着層を設けた2枚の薄膜基板で挟み込んで、加熱処理により接着層を溶融、固化することで薄膜基板と内蔵基板とを強固に接着して高い剛性を有する本体部材を形成し、その本体部材を軟質樹脂からなる外層部材で被覆したことを特徴とするICタグ。 The built-in component, sandwiched by two thin film substrate provided with the adhesive layer on one surface, melting the adhesive layer by heat treatment, a high rigidity and firmly bond the thin film substrate with embedded substrate by solidified IC tag to form the body member and the body member, characterized in that coated with an outer layer member made of a soft resin having.
  2. 上記軟質樹脂が、熱可塑性ウレタンエラストマー、熱硬化性ウレタン、又はホットメルト樹脂である請求項に記載のICタグ。 The soft resin, IC tag according to claim 1 which is a thermoplastic urethane elastomer, thermosetting urethane or hot-melt resin.
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