JP4828088B2 - IC tag - Google Patents

IC tag Download PDF

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Publication number
JP4828088B2
JP4828088B2 JP2003161021A JP2003161021A JP4828088B2 JP 4828088 B2 JP4828088 B2 JP 4828088B2 JP 2003161021 A JP2003161021 A JP 2003161021A JP 2003161021 A JP2003161021 A JP 2003161021A JP 4828088 B2 JP4828088 B2 JP 4828088B2
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Japan
Prior art keywords
ic tag
outer layer
main body
body member
built
Prior art date
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Application number
JP2003161021A
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Japanese (ja)
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JP2004362341A (en
Inventor
貴光 中林
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凸版印刷株式会社
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Priority to JP2003161021A priority Critical patent/JP4828088B2/en
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Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC tag in which a built-in component formed by electrically connecting an IC module to an antenna coil wound with a conductive wire is covered with an outer layer member.
[0002]
[Prior art]
RFID (High Frequency Identity Recognition) is a non-contact automatic recognition technology, and its application is expanding. There is an IC tag as a kind of RFID, and the IC tag is used by a person or fixed to an object (product or the like).
[0003]
As an antenna built in an IC tag, there is an antenna coil in which a conductive wire is wound. The antenna coil is used in most of the 125 kHz frequency type IC tags, and a part thereof is used in the 13.56 MHz type IC tags.
[0004]
FIG. 5 shows an example of a conventional IC tag. In the IC tag 1, the IC module 3 is electrically connected to the antenna coil 2, and the antenna coil 2 and the IC module 3 are directly molded and sealed by the outer layer member 4. It coats by doing. Examples of the molding and sealing method for this type of IC tag 1 include laminating, injection molding, and resin casting. As the outer layer member 4 used for molding, generally hard materials such as PVC (polyvinyl chloride), ABS (acrylonitrile-butadiene-styrene copolymer resin), epoxy resin and the like are relatively high.
[0005]
For example, when the IC tag 1 in which the outer layer member 4 is made of a hard material is fixed to a curved surface such as a pipe, it is difficult to fix the curved surface to the curved surface with the hard IC tag 1. Thus, there is a flexible IC tag in which an outer layer member is made of a flexible material (soft material) in order to facilitate fixing to a curved surface such as a pipe (for example, see Patent Document 1).
[0006]
[Patent Document 1]
Japanese Utility Model Laid-Open No. 5-30874 [0007]
[Problems to be solved by the invention]
However, when a soft material such as a soft resin is used as the outer layer member 4, the built-in antenna coil 2 and IC module 3 are directly sealed and fixed by the soft resin, so that an external force such as expansion and contraction is applied to the IC tag. Sometimes, the expansion and contraction is directly transmitted to the antenna coil 2 and the IC module 3. For this reason, there was a problem that the antenna coil 2 may be disconnected or the IC module 3 may be damaged.
[0008]
The object of the present invention, which was created in view of the above circumstances, is to provide an IC tag that does not cause damage to internal components inside the outer layer member even when an external force such as expansion and contraction is applied to the soft outer layer member. is there.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, an IC tag according to the present invention comprises two thin-film substrates each having a built-in component in which an IC module is electrically connected to an antenna coil wound with a conductive wire, and an adhesive layer provided on one surface. The adhesive layer is melted and solidified by heat treatment to firmly bond the thin film substrate and the built-in substrate to form a highly rigid body member, and the body member is covered with an outer layer member made of a soft resin. It is a thing.
[0011]
Here, the soft resin is preferably a thermoplastic urethane elastomer, a thermosetting urethane, or a hot melt resin. The thin film substrate is preferably a thermosetting resin prepreg sheet, a self-bonding thermoplastic resin sheet, or a sheet obtained by coating a PET base material with a hot-melt resin or an adhesive.
[0012]
According to the above configuration, since an IC tag in which a highly rigid main body member is covered with a soft outer layer member can be obtained, even if an external force such as expansion and contraction is applied to the outer layer member, it is enclosed inside the outer layer member. There is no risk of damage to internal components.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, a preferred embodiment of the invention will be described with reference to the accompanying drawings.
[0014]
(First embodiment)
FIG. 1 shows a cross-sectional view of an IC tag according to a preferred embodiment of the present invention. In addition, the same code | symbol is attached | subjected about the member similar to FIG. 5, and new description is abbreviate | omitted about these members.
[0015]
As shown in FIG. 1, the IC tag 10 according to the present embodiment includes a built-in component formed by electrically connecting an IC module 3 to an antenna coil (for example, a spiral antenna coil) 2 around which a conductive wire is wound. A main body member 13 is formed by being placed and fixed on a substrate 11, and the main body member 13 is covered with an outer layer member 14 made of a soft resin. The IC tag 10 may be appropriately punched to obtain a predetermined shape (for example, a card shape).
[0016]
The thin film substrate 11 includes a PET (polyethylene terephthalate) base material (for example, about 100 μm thickness) 11a and an adhesive layer (for example, about 25 μm thickness) 11b provided on one surface (the upper surface in FIG. 1) of the PET base material 11a. It consists of. After the built-in components (the antenna coil 2 and the IC module 3) are placed (arranged) on the thin film substrate 11, the thermal adhesive layer 11b is melted and solidified by heating, and the substrate 11 and the built-in components are strengthened. The body member 13 is obtained by bonding and fixing. Examples of the constituent material of the adhesive layer 11b include an acrylic thermal adhesive, a hot melt resin (for example, polyamide, urethane, EVA, etc.), an adhesive, and the like.
[0017]
The outer layer member 14 includes two sheets 12a and 12b. After laminating the main body member 13 between the sheets 12a and 12b, the outer layer member 14 in which the main body member 13 is sealed is formed by heating and pressurizing.
[0018]
As the soft resin constituting the outer layer member 14, a thermoplastic urethane elastomer (Thermoplastic Elastomers; hereinafter referred to as TPE) is used. By using TPE as the soft resin, the outer layer member 14 having sufficient flexibility is obtained. Examples of the soft resin include thermoplastic urethane elastomer, thermosetting urethane, and hot melt resin (for example, polyamide, urethane, EVA (ethylene-vinyl acetate copolymer), etc.) in addition to TPE.
[0019]
Next, the operation of the present embodiment will be described.
[0020]
Although the PET substrate 11a of the thin film substrate 11 is thin and its own rigidity is low, the built-in component is firmly fixed integrally with the thin film substrate 11 through the adhesive layer 11b, and thus the obtained main body member 13 is high. It has rigidity. Therefore, even if the soft outer layer member 14 provided around the main body member 13 expands and contracts, the main body member 13 does not follow the expansion and contraction of the outer layer member 14 because it has high rigidity. As a result, even if the IC tag 10 is bent due to an external force or the like, it is possible to prevent damage to and damage to the built-in components such as disconnection of the antenna coil 2 and damage to the IC module 3.
[0021]
Further, by attaching the IC tag 10 according to the present embodiment to a name tag, a card or the like, personal information can be identified by the name tag. For example, when this name tag is used in a kindergarten or a nursing home, and the name tag is attached to clothes worn by a person, even if the child or the elderly falls in this state, the outer layer member 14 of the IC tag 10 is made of a soft resin. Since it is a soft material constructed, the IC tag 10 does not injure the child or the elderly.
[0022]
Even when the IC tag 10 according to the present embodiment is fixed to a curved surface such as a pipe, the IC tag 10 bends (follows) the curved surface such as the pipe, so that it can be easily applied to the pipe or the like. Can be fixed.
[0023]
Next, another embodiment of the present invention will be described with reference to the accompanying drawings.
[0024]
(Second Embodiment)
FIG. 2 shows a cross-sectional view of a modification of the main body member in FIG. In addition, the same code | symbol is attached | subjected about the member similar to FIG. 1, and new description is abbreviate | omitted about these members.
[0025]
The basic structure of the main body member 23 of the IC tag according to the present embodiment shown in FIG. 2 is the same as that of the main body member 13 of the IC tag 10 shown in FIG. 1, but the thin film substrate is a prepreg made of a thermosetting resin. The difference is that the sheet 21 is configured.
[0026]
The prepreg sheet 21 is made of a thermosetting resin such as glass epoxy. On one surface of the prepreg sheet 21 (upper surface in FIG. 2), the prepreg sheet 21 is thermally cured by heat-pressing in a state where the built-in components are arranged, and the prepreg sheet 21 and the built-in components are firmly bonded. The body member 23 is obtained by being fixed. The main body member 23 is sandwiched and stacked between sheets 12a and 12b (see FIG. 1), and then heated and pressed to form the outer layer member 14, and an IC tag is obtained.
[0027]
Also in the IC tag using the main body member 23 according to the present embodiment, the same operational effects as those of the IC tag 10 according to the previous embodiment can be obtained.
[0028]
(Third embodiment)
FIG. 3 shows a cross-sectional view of a modification of the main body member in FIG. In addition, the same code | symbol is attached | subjected about the member similar to FIG. 1, and new description is abbreviate | omitted about these members.
[0029]
The basic configuration of the main body member 33 of the IC tag according to the present embodiment shown in FIG. 3 is the same as that of the main body member 13 of the IC tag 10 shown in FIG. 1, but the thin film substrate has self-bonding properties. It differs by the point comprised with the thermoplastic resin sheet 31. FIG.
[0030]
The thermoplastic resin sheet 31 is made of a thermoplastic resin having self-bonding properties such as PVC, PETG, and PBT. The thermoplastic resin sheet 31 is melted and embedded in the thermoplastic resin sheet 31 by hot pressing in a state where the built-in components are arranged on one surface (the upper surface in FIG. 3) of the thermoplastic resin sheet 31. In this state, the main body member 33 is obtained by being firmly bonded and fixed. The main body member 33 is sandwiched and stacked between sheets 12a and 12b (see FIG. 1), and then heated and pressed to form the outer layer member 14, thereby obtaining an IC tag.
[0031]
Also in the IC tag using the main body member 33 according to the present embodiment, the same effects as those of the IC tag 10 according to the previous embodiment can be obtained.
[0032]
(Fourth embodiment)
FIG. 4 shows a cross-sectional view of an IC tag according to another preferred embodiment of the present invention. In addition, the same code | symbol is attached | subjected about the member similar to FIG. 1, and new description is abbreviate | omitted about these members.
[0033]
The basic configuration of the IC tag 40 according to the present embodiment shown in FIG. 4 is the same as that of the IC tag 10 shown in FIG. 1, but the main body member 43 includes two thin-film substrates 11, 11. It differs in that it is sandwiched between.
[0034]
After the built-in components are sandwiched between the thin film substrates 11 and 11, the heat adhesive layers 11b and 11b are melted and solidified by heating, and the substrates 11 and 11 and the built-in components are firmly bonded and fixed. can get. After the main body member 43 is sandwiched between the sheets 12a and 12b and laminated, the outer layer member 14 is formed by heating and pressurizing, and the IC tag 30 is obtained.
[0035]
Also in the IC tag 40 according to the present embodiment, the same effects as those of the IC tag 10 according to the previous embodiment can be obtained.
[0036]
【The invention's effect】
In short, according to the present invention, even if an external force such as expansion and contraction is applied to the soft outer layer member, an excellent effect is obtained that an IC tag can be obtained which does not cause damage to built-in components inside the outer layer member.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of an IC tag according to a preferred embodiment of the present invention.
FIG. 2 is a cross-sectional view showing a modified example of the main body member in FIG.
FIG. 3 is a cross-sectional view showing a modified example of the main body member in FIG.
FIG. 4 is a cross-sectional view of an IC tag according to another preferred embodiment of the present invention.
FIG. 5 is a cross-sectional view showing an example of a conventional IC tag.
[Explanation of symbols]
2 Antenna coil 3 IC module 10 IC tag 11 Thin film substrate 13 Main body member 14 Outer layer member

Claims (2)

  1. In an IC tag in which a built-in component formed by electrically connecting an IC module to an antenna coil wound with a conductive wire is covered with an outer layer member made of resin,
    The above-mentioned built-in component is sandwiched between two thin film substrates provided with an adhesive layer on one surface, and the adhesive layer is melted and solidified by heat treatment , so that the thin film substrate and the built-in substrate are firmly bonded to provide high rigidity. An IC tag characterized in that a main body member is formed and the main body member is covered with an outer layer member made of a soft resin.
  2. The IC tag according to claim 1 , wherein the soft resin is a thermoplastic urethane elastomer, a thermosetting urethane, or a hot melt resin.
JP2003161021A 2003-06-05 2003-06-05 IC tag Active JP4828088B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003161021A JP4828088B2 (en) 2003-06-05 2003-06-05 IC tag

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003161021A JP4828088B2 (en) 2003-06-05 2003-06-05 IC tag

Publications (2)

Publication Number Publication Date
JP2004362341A JP2004362341A (en) 2004-12-24
JP4828088B2 true JP4828088B2 (en) 2011-11-30

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