WO2008047436A1

WO2008047436A1 - Ic tag

Info

Publication number: WO2008047436A1
Application number: PCT/JP2006/320844
Authority: WO
Inventors: Haruhiko Nitta; Hideo Hatanaka; Shinya Nitta
Original assignee: Nitta Ind. Co., Ltd.
Priority date: 2006-10-19
Filing date: 2006-10-19
Publication date: 2008-04-24
Also published as: JP4971347B2; JPWO2008047436A1

Abstract

Provided is an IC tag having a coat layer, which incorporates an electronic component and is not easily peeled even with operation of folding or the like, and having a structure which prevents the incorporated electronic component protected by the coat layer from easily breaking. In the IC tag, an IC module wherein the electronic component having an IC chip and an antenna coil on an insulating substrate is coated with the coat layer made of an elastic material. The coat layer in the vicinity of the IC chip is protruded to form a protruding section. Since a cavity section is formed between the protruding section and the IC chip, the cavity section functions as a buffer layer for modifying a bending stress generated when being folded, and breakage of a connecting section between the IC chip and the antenna coil is suppressed.

Description

IC tag

Technical field

TECHNICAL FIELD [0001] The present invention relates to an IC tag that stores various information and is attached to an article or the like.

[0002] In recent years, as a system for automatically reading and identifying tag information attached to articles, etc., a larger amount of information can be handled instead of the conventionally known barcode method. Development of an IC tag identification system called a data carrier system that has excellent environmental resistance and strength and can be read remotely is underway.

[0003] This IC tag identification system is composed of a responder called an IC tag attached to an article, etc., and an interrogator connected to the host side. Between these responders and the interrogator, magnetism, It is characterized in that it communicates in a non-contact manner via a transmission medium such as an induced magnetic field or microwave (radio wave).

[0004] By using this IC tag, for example, for the purpose of management of goods, various information about the goods, such as the name and weight of the goods, the content, the manufacture / seller name, the manufacturing place, the manufacturing date, etc. Information such as date and expiration date is recorded. This IC tag is attached to an article by applying an adhesive or adhesive to the back side of a label-like tag with electronic parts attached to a base material such as plastic film, metal foil, paper, or a laminate of these. A method of attaching to an article using this adhesive or adhesive is common.

[0005] For example, as this IC tag, Patent Document 1 discloses an IC tag as shown in FIG. In Fig. 37! /, 301 ί antenna antenna, 302 咅 electronic 咅 tP port, 303 ま is a base containing these components, 304 is an outer layer that seals this base 303 and constitutes the outer layer It is a hot melt material used as a resin. In this IC tag, the surface of the base 303 on which the antenna coil 301 and the electronic component 302 are arranged is sealed with a hot melt material 304, and the base 303 and the hot melt material 304 are integrated together.

[0006] Patent Document 2 discloses an IC tag as shown in FIG. In Figure 38 Reference numeral 311 denotes an IC, and a heat-sealable resin layer 312 having the same size as the IC is bonded to both surfaces of the IC 311.

[0007] Patent Document 3 discloses an IC tag as shown in FIG. In FIG. 39, reference numeral 321 denotes an IC tag inlet, 322 denotes a molded resin, the IC tag inlet 321 is embedded in the molded resin 322, and the IC tag inlet 321 is provided with an opening 323. Molding When the resin 322 is manufactured by injection molding, when the injected molten resin first comes into contact with the IC tag inlet 321 placed on the mold, the IC tag inlet 321 is heated close to the melting temperature. Since the force to push and spread the IC tag inlet 321 is applied by the molten resin flow, the inlet base material directly under the gate port for injecting the molten resin is likely to be broken. Thus, by providing the opening 323 in this way, the injected molten resin passes through the opening 323 and first contacts the mold, and the resin that has started to solidify by contacting the mold is IC Since it flows through the tag inlet 321, the effect of weakening the force to push and spread the IC tag inlet 321 can be expected.

[0008] Patent Document 4 discloses a method of manufacturing an IC tag as shown in FIG.

In the method shown in FIG. 40, a primary molding die 333 having a groove 331 and a protrusion 332 is prepared (FIG. 40 (1)), an electronic component 334 is arranged in the groove 331, and the outer periphery of the protrusion 332 is arranged. The antenna coil 335 (Fig. 40 (2))), then the outer layer resin 336 is injected (Fig. 40 (3)), and the built-in components 334 and 335 are covered with the outer layer resin 336. Molded product 337 was obtained (Fig. 40 (4)), and then primary molded product 337 was inserted into secondary molding die 338 and outer layer grease 339 was injected (Fig. 40 (5)). This is a method of obtaining an electronic tag 340 incorporating a 334 and an antenna coil 335 (FIG. 40 (6)).

Patent Document 1: Japanese Patent Laid-Open No. 2002-163627

Patent Document 2: Japanese Patent Laid-Open No. 2002-236896

Patent Document 3: Japanese Patent Laid-Open No. 2002-355847

Patent Document 4: Japanese Unexamined Patent Publication No. 2003-36431

Disclosure of the invention

Problems to be solved by the invention

[0009] However, the electronic tags disclosed in Patent Documents 1 to 4 are described below. There are drawbacks.

[0010] That is, the IC tag in FIG. 37 has a structure in which a hot melt material 304, which is a different substance, is joined to the base 303. Therefore, when it is repeatedly used, the hot melt material 304 is partially peeled by an operation such as bending. Or the electronic component 302 may be damaged.

[0011] In addition, the IC tag of FIG. 38 has an open end of the IC 311. Therefore, the IC 311 is damaged and valuable data is destroyed immediately.

[0012] In addition, since the IC tag inlet 321 has an opening 323 in the IC tag of FIG. 39, the bonding area between the molded resin 322 and the IC tag inlet 321 is large. It is difficult to peel off from the tag inlet 321. However, since one side of the IC tag inlet 321 is open, the IC tag inlet 321 is damaged and valuable data is destroyed immediately.

In the IC tag manufacturing method of FIG. 40, since the outer layer resin is molded twice by the primary molding die 333 and the secondary molding die 338, the molded electronic Since the joint line 341 is generated in the tag 340, when it is repeatedly used, the electronic parts 334 may be damaged due to separation of the upper and lower outer layer resins 336 and 339 from the joint line 341 by the operation such as bending. .

[0014] The present invention has been made in view of such problems of the prior art. The purpose of the present invention is to prevent the coating layer containing the electronic component from being peeled off easily even by an operation such as bending. It is an object to provide an IC tag having a structure in which a built-in electronic component protected by a layer is not easily damaged.

Means for solving the problem

In order to achieve the above object, the IC tag of the present invention is an IC tag in which an IC module in which an electronic component having an IC chip and an antenna coil is mounted on an insulating substrate is covered with a coating layer of an elastic material. The tag is characterized in that a protruding portion is formed by protruding a covering layer in the vicinity of the IC chip, and a cavity is formed between the protruding portion and the IC chip.

[0016] The joint between the IC chip and the antenna coil is easily broken by bending or the like when the IC tag is used. However, since the cavity is formed around the IC chip of the present invention, the cavity is bent. It functions as a buffer layer that relieves the bending stress that accompanies it, and prevents breakage at the joint between the IC chip and the antenna coil. [0017] It is preferable to provide a resin core layer on the upper surface and the Z or lower surface of the insulating substrate. The resin core layer acts as a resistance to deformation, and it is difficult to bend the insulating substrate at a certain bending angle or more during use, so that the antenna coil can be prevented from being damaged. In this case, if the upper and lower resin core layers having the same plane dimensions as the insulating substrate are provided on both the upper and lower surfaces of the insulating substrate, the function as a resistance antibody against deformation increases. Since the insulating substrate is folded further, damage to the antenna coil can be suppressed almost completely.

[0018] It is preferable to provide a protective layer having a grease material strength on the inner side surface of the protrusion. This is because the IC chip can be protected by the impact force during use. In this case, the first projecting portion and the second projecting portion are respectively formed on one side and the other side by projecting the covering layers on both sides of the insulating substrate so as to be symmetric with respect to the insulating substrate. It is preferable to provide a protective layer made of a resin material on the inner side surfaces of the protruding portion and the second protruding portion, because the effect of protecting the IC chip against impact during use is increased. As an alternative to the second protrusion, if a protective plate that also has a grease material strength is attached to the position on the insulating substrate opposite to the side where the IC chip is mounted, directly under the IC chip, This is preferable because the effect of protecting the IC chip against impact is increased.

The invention's effect

[0019] The IC tag of the present invention is an IC chip over an IC tag in which an IC module in which an electronic component including an IC chip and an antenna coil is mounted on an insulating substrate is covered with a coating layer of an elastic material. Protruding portions are formed by projecting the nearby coating layer, and a cavity is provided between the projecting portion and the IC chip, so that the buffer relieves bending stress that occurs when the cavity is bent. If it functions as a layer and the breakage of the joint between the IC chip and the antenna coil is suppressed, there is an effect.

[0020] In addition, the IC tag of the present invention is provided with a resin core layer on the upper surface and Z or lower surface of the insulating substrate, so that the resin core layer acts as a resistance to deformation, and is used in use. Since it becomes difficult to bend the insulating substrate at a bending angle of a certain level or more, it is effective if damage to the antenna coil is suppressed.

[0021] Furthermore, the IC tag of the present invention includes a protrusion formed by protruding a coating layer in the vicinity of the IC chip. By providing a protective layer on the side surface that also has a grease material strength, there is an effect that it is possible to protect the impact force IC chip during use.

Brief Description of Drawings

FIG. 1 is a cross-sectional view showing a schematic configuration of an IC tag according to a first embodiment of the present invention.

2 is a plan view of an IC module that can be used for the IC tag of FIG.

FIG. 3 is a circuit diagram of an IC module that can be used for the IC tag of FIG.

FIG. 4 is an enlarged cross-sectional view showing an IC chip mounting portion of an IC module.

FIG. 5 is a cross-sectional view showing a schematic configuration of a second embodiment of the IC tag of the present invention.

FIG. 6 is a cross-sectional view showing a schematic configuration of a third embodiment of the IC tag of the present invention.

FIG. 7 is a cross-sectional view showing a schematic configuration of a fourth embodiment of the IC tag of the present invention.

FIG. 8 is a cross-sectional view showing a schematic configuration of a fifth embodiment of the IC tag of the present invention.

FIG. 9 is a cross-sectional view showing a schematic configuration of a sixth embodiment of the IC tag of the present invention.

FIG. 10 is a cross-sectional view showing a schematic configuration of a seventh embodiment of the IC tag of the present invention.

FIG. 11 is a cross-sectional view showing a schematic configuration of an eighth embodiment of the IC tag of the present invention.

FIG. 12 is a cross-sectional view showing a schematic configuration of a ninth embodiment of the IC tag of the present invention.

FIG. 13 is a cross-sectional view showing a schematic configuration of the tenth embodiment of the IC tag of the present invention.

FIG. 14 is a cross-sectional view showing a schematic configuration of an eleventh embodiment of the IC tag of the present invention.

FIG. 15 is a cross-sectional view showing a schematic configuration of a twelfth embodiment of the IC tag of the present invention.

FIG. 16 is a cross-sectional view showing a schematic configuration of a thirteenth embodiment of the IC tag of the present invention.

FIG. 17 is a cross-sectional view showing a schematic configuration of the fourteenth embodiment of the IC tag of the present invention.

FIG. 18 is a cross-sectional view showing a schematic configuration of the fifteenth embodiment of the IC tag of the present invention.

FIG. 19 is a cross-sectional view showing a schematic configuration of a sixteenth embodiment of the IC tag of the present invention. FIG. 20 is a cross-sectional view showing a schematic configuration of the seventeenth embodiment of the IC tag of the present invention.

FIG. 21 is a cross-sectional view showing a schematic configuration of an eighteenth embodiment of an IC tag according to the present invention.

FIG. 22 is a cross-sectional view showing a schematic configuration of the nineteenth embodiment of the IC tag of the present invention.

FIG. 23 is a cross-sectional view showing a schematic configuration of a twentieth embodiment of the IC tag of the present invention.

FIG. 24 is a cross-sectional view showing a schematic configuration of the twenty-first embodiment of the IC tag of the present invention.

FIG. 25 is a cross-sectional view showing a schematic configuration of a twenty-second embodiment of the IC tag of the present invention.

FIG. 26 is a cross-sectional view showing a schematic configuration of the twenty-third embodiment of the IC tag of the present invention.

FIG. 27 is a cross-sectional view showing a schematic configuration of a twenty-fourth embodiment of the IC tag of the present invention.

FIG. 28 is a cross-sectional view showing a schematic configuration of the twenty-fifth embodiment of the IC tag of the present invention.

FIG. 29 is a cross-sectional view showing a schematic configuration of a twenty-sixth embodiment of the IC tag of the present invention.

FIG. 30 is a cross-sectional view showing a schematic configuration of the twenty-seventh embodiment of the IC tag of the present invention.

FIG. 31 is a cross-sectional view showing a schematic configuration of the twenty-eighth embodiment of the IC tag of the present invention.

[FIG. 32] FIG. 32 (a) is a plan view showing a state in which the IC modules are arranged on the lower coating layer, and FIG. 32 (b) is a plan view of the upper coating layer.

FIG. 33 is an exploded perspective view of an upper / middle / lower mold and an intermediate insertion mold for explaining a method of molding an IC tag according to the present invention. FIG. 34 is a cross-sectional view for explaining the molding process of the IC tag of the present invention.

FIG. 35 is an exploded perspective view different from FIG. 33 of the upper / middle / lower molds and the intermediate insertion mold for explaining the molding method of the IC tag of the present invention.

FIG. 36 is a cross-sectional view different from FIG. 34 for illustrating the molding process of the IC tag of the present invention.

FIG. 37 is a cross-sectional view of a conventional IC tag.

FIG. 38 is a cross-sectional view of another conventional IC tag.

FIG. 39 (a) is a plan view of still another conventional IC tag, and FIG. 39 (b) is a cross-sectional view taken along the line BB in FIG. 39 (a).

FIG. 40 is a diagram showing another method of manufacturing an IC tag different from the conventional IC tag of FIGS. 37 to 38.

Explanation of symbols

1 IC tag

2 IC module

3 Coating layer

3a Lower coating layer

3b Upper coating layer

4 IC chip

4a electrode

5 Protrusion (first protrusion)

5a Second protrusion

6 Cavity

6a Cavity

7 Insulating substrate

8 Antenna coin

9 Tuning capacitor

10 Rectifier diode

11 Smoothing capacitor Adhesive layer

a Adhesive layer

b Adhesive layer

c Adhesive part

d Adhesive part

e Adhesive layer

Lower resin core layer Upper resin core layer Protective layer (first protective layer) a Second protective layer

b Protection plate

IC tag

1 IC tag

1 IC tag 191 IC tag

201 IC tag

211 IC tag

221 IC tag

231 IC tag

241 IC tag

251 IC tag

261 IC tag

271 IC tag

281 IC tag

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, preferred embodiments of the IC tag of the present invention will be described, but the present invention is not limited to the following embodiments, and can be appropriately changed and modified without departing from the technical scope of the present invention. It is.

(1) When having a cavity

[First embodiment]

FIG. 1 is a cross-sectional view showing a schematic configuration of the first embodiment of the IC tag of the present invention. In this IC tag 1, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4. There is a cavity 6 between them.

FIG. 2 is a plan view of an IC module 2 that can be used for the IC tag 1 of FIG. As shown in FIG. 2, the IC module 2 has a configuration in which an antenna coil 8 and an IC chip 4 are attached on an insulating substrate 7.

FIG. 3 is a circuit diagram of an IC module that can be used for the IC tag 1 of FIG. As shown in FIG. 3, a rectifying diode 10, a smoothing capacitor 11, and an IC chip 4 are connected to a resonance circuit composed of an antenna coil 8 and a tuning capacitor 9. The tuning capacitor 9, the rectifying diode 10, and the smoothing capacitor 11 are the forces mounted in the IC chip 4 in this embodiment. These components 9, 10, and 11 are different from the IC chip 4. It can also be arranged.

FIG. 4 is a cross-sectional view schematically showing an example of a method for connecting the electrode 4 a of the IC chip 4 and the antenna coil 8 via the adhesive layer 12. Examples of the material of the adhesive layer 12 include polyurethane, acrylonitrile-styrene copolymer resin, acrylonitrile-butadiene-styrene copolymer resin, polystyrene, polymethyl methacrylate, vinyl acetate resin, polyvinyl alcohol. A single substance or a mixture of polycarbonate, phenol resin, epoxy resin, etc. can be used.

[0028] The material of the coating layer 3 includes styrene thermoplastic elastomer, olefin thermoplastic elastomer, urethane thermoplastic elastomer, polyester thermoplastic elastomer, polyamide thermoplastic elastomer, fluorine thermoplastic. Thermoplastics such as elastomers In addition to elastomers, thermosetting urethane rubber, thermosetting silicone rubber, and the like can be used. In this case, a mixed elastomer containing a mixture of an olefin-based thermoplastic elastomer and a styrene-based thermoplastic elastomer as an essential component is preferable.

[0029] Olefin-based thermoplastic elastomers have the lowest specific gravity compared to other thermoplastic elastomers, have a wide operating temperature range (about 60 to 150 ° C), and are excellent in heat resistance and weather resistance. The styrenic thermoplastic elastomer is soft and easy to stretch, so it is a thermoplastic elastomer with the best resistance that is closest to the properties of vulcanized rubber, and has high strength and acid resistance. It has the feature that it is excellent in alkali resistance. Therefore, the hard segment is made of polyethylene or polypropylene, the soft segment is made of an ethylene-based thermoplastic elastomer using an ethylene propylene copolymer or ethylene propylene copolymer, and the hard segment is made of polystyrene. Preferred is a mixed elastomer containing, as an essential component, a mixture of a thermoplastic elastomer composed of a styrene-based thermoplastic elastomer using polybutadiene, polyisoprene or polyolefin.

[0030] The olefin-based thermoplastic elastomer and the styrene-based thermoplastic elastomer each have the above-mentioned characteristics. Thermoplastic elastomers have the disadvantage of being somewhat inferior in wear resistance. Therefore, olefin thermoplastic elastomer and styrene thermoplastic By using a mixed elastomer containing a mixture of thermoplastic elastomers mixed with an elastomeric elastomer as an essential component, these thermoplastic elastomers can complement each other's drawbacks. In order to enjoy the effect, the ratio of hard segment to soft segment in the olefin-based thermoplastic elastomer is 10 to 50 parts by weight for the hard segment and 50 to 90 parts by weight for the soft segment. The weight part is preferred. The ratio of the hard segment to the soft segment in the styrene thermoplastic elastomer is preferably 10 to 50 parts by weight for the hard segment, 50 to 90 parts by weight for the soft segment, and the total is 100 parts by weight.

[0031] The weight ratio of ethylene to propylene in the ethylene propylene copolymer is 70/30 to 50/50 girls' power! / ヽ.

[0032] As the third component gen of the ethylene-propylene-gen copolymer, dicyclopentagen, 5-ethylidene-12-norbornene is preferably used from the viewpoint of polymerization reactivity. The weight ratio of ethylene to propylene of ethylene propylene diene copolymer 80 to 20 to 40 to 60 forces Preferably, that contains Zhen 1-15 wt ^_0/0 have preferred.

[0033] The blending ratio of the olefin thermoplastic elastomer and the styrene thermoplastic elastomer is 20 to 80 parts by weight for the olefin thermoplastic elastomer and 20 to 80 parts by weight for the styrene thermoplastic elastomer. The total of these two thermoplastic elastomers is preferably 100 parts by weight.

[0034] Further, in order to facilitate the mixing and dispersion of various compounding agents and facilitate the molding operation, the thermoplastic elastomer material may be a mineral oil plasticizer, a vegetable oil plasticizer, a phthalate plasticizer, or an adipate plasticizer. It is preferable to contain an appropriate amount of a plasticizer. Further, the thermoplastic elastomer material can contain a filler and a reinforcing agent such as calcium carbonate, basic magnesium carbonate, natural key acid, and key salt as required. Further, the thermoplastic elastomer material may contain a deterioration preventing agent for preventing acid deterioration and ozone deterioration as required. The thermoplastic elastomer material may contain a pigment such as a white pigment such as titanium oxide or a black pigment such as carbon black, if necessary. In addition, thermoplastic elastomer materials require organic modifiers to improve properties such as durability and heat resistance. It can be contained as required. Further, the thermoplastic elastomer material may contain a finishing agent and a paint as required in order to improve the appearance.

[0035] Examples of the material of the insulating substrate 7 include polyesters such as polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polyethylene terephthalate Z isophthalate copolymer, polyolefin resins such as polyethylene and polypropylene, and poly (vinyl fluoride). Polyfluorinated vinylidene, polytetrafluoroethylene, polytetrafluoroethylene such as ethylene-tetrafluoroethylene, polyamides such as nylon 6 and nylon 66, polyvinyl chloride, vinyl chloride Z vinyl acetate Copolymer, ethylene Z vinyl acetate copolymer, ethylene Z butyl alcohol copolymer, etc., cellulose triacetate, cellulose triacetate, cellulose, etc., polymethyl methacrylate, polymethacrylate , Polyethyl acrylate, polyacyl A simple substance or a mixture of acrylic resin such as butyl acrylate, polystyrene, polycarbonate, polyimide, etc. can be used, and any insulating organic material can be used.

[0036] Examples of the method of arranging the antenna coil 8 and the IC chip 4 on the insulating substrate include a method of fixing with an organic material such as thermoplastic resin or thermosetting resin.

[0037] As a method of manufacturing the IC tag configured as described above, a melt lamination method using a hot press can be used. The melt laminating method is a method in which each material of a tag is sandwiched between mirror plates larger than this, and they are integrated by a hot melt press. As the mirror plate used at this time, a chrome-plated copper plate, a stainless steel plate whose surface is polished, an aluminum plate whose surface is polished, and the like can be used. After melt lamination, the integrated tag is peeled off with a mirror plate and punched into a tag shape by punching with a mold.

[0038] For the present embodiment, the IC chip 4 is covered with the coating layer 3, and the cavity 6 is provided around the IC chip 4, so that the cavity 6 is generated along with the bending. It functions as a buffer layer that relieves bending stress and suppresses breakage of the joint between the IC chip 4 and the antenna coil 8.

[0039] The shape of the cavity 6 is not limited to that shown in Fig. 1 as long as it can hold air and function as a buffer layer. (2) When having a cavity and a resin core layer

[Second Embodiment]

FIG. 5 is a cross-sectional view showing a schematic configuration of the second embodiment of the IC tag of the present invention. In this IC tag 21, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4, and the protruding portion 5 and the IC chip 4 are A cavity 6 is provided between them, and a lower resin core layer 14 having the same plane dimensions as that of the insulating substrate 7 is attached to the lower surface of the insulating substrate 7 constituting the IC module 2 via an adhesive layer 13a. It has been done.

[0040] The material of the adhesive layer 13a includes epoxy resin-based adhesives, polyurethane-based adhesives, acrylic resin-based adhesives, chloroprene rubber-based adhesives, nitrile rubber-based adhesives, glues, and adhesive tapes. A loop or the like can be used and is not particularly limited.

[0041] Materials for the lower resin core layer 14 include acrylonitrile monochlorinated polyethylene monostyrene copolymer resin, acrylonitrile monoethylene 'propylene' gen monostyrene copolymer resin, acrylonitrile styrene copolymer resin, butadiene Styrene methyl methacrylate copolymer Coffin, chlorinated poly (vinyl chloride), chlorinated polyethylene, norbornene resin, fluorine resin, polyamideimide, thermoplastic polyimide, polyetherimide, polycarbonate, polyparamethylstyrene, polybul formal, Thermoplastic resins having excellent heat resistance such as polyphenylene sulfide and polymethylpentene, and thermosetting resins having excellent heat resistance such as epoxy resin, furan resin and polyimide can be used.

In the present embodiment, in addition to the effect that the cavity 6 can prevent the joint portion between the IC chip 4 and the antenna coil 8 from being broken, the lower resin core layer 14 adhered to the lower surface of the insulating substrate 7. Acts as a resistance to deformation, and it becomes difficult to bend the insulating substrate 7 at a bending angle of a certain level or more during use, so that the effect of suppressing the breakage of the antenna coil can be expected.

[Third embodiment]

FIG. 6 is a cross-sectional view showing a schematic configuration of a third embodiment of the IC tag of the present invention. In this IC tag 31, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding portion 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4, and the protruding portion 5 and the IC chip 4 are In between A cavity 6 is provided, and an upper resin core layer 15 having the same plane dimensions as that of the insulating substrate 7 is attached to the upper surface of the insulating substrate 7 constituting the IC module 2 via an adhesive layer 13b. . As materials for the adhesive layer 13b and the upper resin core layer 15, the same materials as those for the adhesive layer 13a and the lower resin core layer 14 of the second embodiment can be used.

In the present embodiment, in addition to the effect that the cavity 6 suppresses the breakage of the joint between the IC chip 4 and the antenna coil 8, the upper resin core layer 15 adhered to the upper surface of the insulating substrate 7 is used. Acts as a resistance to deformation, and it becomes difficult to bend the insulating substrate 7 at a bending angle of a certain value or more during use, so that the effect of suppressing the breakage of the antenna coil can be expected.

[Fourth embodiment]

FIG. 7 is a cross-sectional view showing a schematic configuration of the fourth embodiment of the IC tag of the present invention. In this IC tag 41, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding portion 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4, and the protruding portion 5 and the IC chip 4 are A cavity 6 is provided between them, and a lower resin core layer 14 having the same plane dimensions as that of the insulating substrate 7 is attached to the lower surface of the insulating substrate 7 constituting the IC module 2 via an adhesive layer 13a. The upper resin core layer 15 having the same plane dimensions as the insulating substrate 7 is attached to the upper surface of the insulating substrate 7 constituting the IC module 2 via the adhesive layer 13b.

In the present embodiment, in addition to the effect that the breakage of the joint between the IC chip 4 and the antenna coil 8 is suppressed by the cavity 6, the upper resin core layer is formed on the upper surface and the lower surface of the insulating substrate 7, respectively. By attaching 15 and the lower resin core layer 14, the resistance function against deformation of the insulating substrate is further increased as compared with the second embodiment and the third embodiment, so that the insulating substrate 7 is more difficult to bend. Therefore, damage to the antenna coil can be almost completely suppressed.

[Fifth embodiment]

FIG. 8 is a cross-sectional view showing a schematic configuration of the fifth embodiment of the IC tag of the present invention. The IC tag 51 has a lower resin core layer 14 attached to the lower surface of the insulating substrate 7 constituting the IC module 2 so as to cover a part of the insulating substrate 7 via an adhesive layer 13a. This is different from the second embodiment. The greater the area that the resin core layer covers the insulating substrate, the greater the effect of suppressing the damage to the antenna coil. However, depending on the application or use conditions of the IC tag, the resin core layer only covers a part of the insulating substrate. However, there may be no practical problem. The present embodiment, the sixth embodiment, the seventh embodiment, the fourteenth embodiment, the fifteenth embodiment, the sixteenth embodiment, the twenty-second embodiment, the twenty-first embodiment, the twenty-second embodiment to be described later. The second embodiment, the twenty-sixth embodiment, the twenty-seventh embodiment, and the twenty-eighth embodiment can be applied to such a case.

[Sixth embodiment]

FIG. 9 is a cross-sectional view showing a schematic configuration of the sixth embodiment of the IC tag of the present invention. The IC tag 61 has an upper resin core layer 15 attached to the upper surface of the insulating substrate 7 constituting the IC module 2 so as to cover a part of the insulating substrate 7 via an adhesive layer 13b. This is different from the third embodiment.

[Seventh embodiment]

FIG. 10 is a cross-sectional view showing a schematic configuration of the seventh embodiment of the IC tag of the present invention. In this IC tag 71, an upper resin core layer 15 is attached to the upper surface of the insulating substrate 7 constituting the IC module 2 so as to cover a part of the insulating substrate 7 via an adhesive layer 13b. 2 is different from the fourth embodiment in that the lower resin core layer 14 is attached to the lower surface of the insulating substrate 7 constituting 2 so as to cover a part of the insulating substrate 7 via the adhesive layer 13a. .

(3) When having a cavity and protective layer

[Eighth embodiment]

FIG. 11 is a cross-sectional view showing a schematic configuration of the eighth embodiment of the IC tag of the present invention. In this IC tag 81, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4. Between them, a cavity 6 is provided, and a protective layer 16 is provided along the inner side surface of the protrusion 5 via an adhesive part 13c coated on the insulating substrate 7. As the material of the adhesive part 13c, the same material as that of the adhesive layer 13a of the second embodiment can be used. Examples of the material of the protective layer 16 include thermoplastic resin that can be used for the above-described upper resin core layer 15 and lower resin core layer 14, thermosetting resin, glass fiber, carbon fiber, and amide. Fiber, ceramic fiber (silicon carbide, boron, alumina), whisker (Al 2 O, β—SiC, graphite, Those containing potassium titanate, polyoxymethylene) or the like can be used.

In the present embodiment, in addition to the effect that the cavity 6 can prevent the joint portion between the IC chip 4 and the antenna coil 8 from being broken, the IC chip 4 is protected by the protective layer 16. The impact force at can also protect the IC chip.

[Ninth embodiment]

FIG. 12 is a cross-sectional view showing a schematic configuration of the ninth embodiment of the IC tag of the present invention. In this IC tag 91, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the coating layer 3 in the vicinity of the IC chip 4 is projected to form the first projection 5. A cavity 6 is provided between the IC chip 4 and a first protective layer 16 is provided along an inner surface of the first protrusion 5 via an adhesive 13c coated on the insulating substrate 7. ing. Further, the second protruding portion 5a is formed by protruding the covering layer 3 on the opposite side of the first protruding portion 5 with the insulating substrate 7 interposed therebetween so as to be symmetrical with the first protruding portion 5. A cavity 6a is provided between the part 5a and the insulating substrate 7, and the second protective layer 16a is provided on the inner surface of the second protruding portion 5a via an adhesive part 13d coated on the insulating substrate 7. Has been established. As the material of the adhesive part 13d, the same material as that of the adhesive layer 13a of the second embodiment can be used. As the material of the first protective layer 16 and the second protective layer 16a, the same material as that of the protective layer 16 of the eighth embodiment can be used.

In the present embodiment, in addition to the effect that the cavity portion 6 can prevent the joint portion between the IC chip 4 and the antenna coil 8 from being broken, the IC chip 4 includes the first protective layer 16 and the second protective layer 16a. Since it is protected, it can be expected that the IC chip protection effect is greater than that of the eighth embodiment.

[Tenth embodiment]

FIG. 13 is a cross-sectional view showing a schematic configuration of the tenth embodiment of the IC tag of the present invention. In this IC tag 101, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4. A cavity 6 is provided between and a protective layer 16 is provided along the inner surface of the protrusion 5 via an adhesive part 13c coated on the insulating substrate 7. In addition, an adhesive layer 13e is interposed at a position corresponding to the IC chip 4 directly below the insulating substrate 7 on the side opposite to the side on which the IC chip 4 is mounted. The protective plate 16b is attached. As the material of the adhesive layer 13e, the same material as that of the adhesive layer 13a of the second embodiment can be used. As the material of the protective plate 16b, the same material as that of the protective layer 16 of the eighth embodiment can be used.

In the present embodiment, in addition to the effect that the breakage of the joint between the IC chip 4 and the antenna coil 8 is suppressed by the cavity 6, the IC chip 4 is protected by the protective layer 16 and the protective plate 16b. Compared to the eighth embodiment, it can be expected that the IC chip protection effect is increased.

(4) When having a cavity, protective layer, and resin core

[Eleventh embodiment]

FIG. 14 is a cross-sectional view showing a schematic configuration of the eleventh embodiment of the IC tag of the present invention. In this IC tag 111, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4, and the protruding portion 5 and the IC chip 4 A cavity 6 is provided between and a protective layer 16 is provided on the inner surface of the protruding part 5 via an adhesive layer 13b coated on the insulating substrate 7, and on the upper surface of the insulating substrate 7. The upper resin core layer 15 having the same plane dimension as that of the insulating substrate 7 is stuck through the adhesive layer 13b.

[0049] In the present embodiment, in addition to the effect that the cavity 6 can suppress the breakage of the joint between the IC chip 4 and the antenna coil 8, the upper resin core layer 15 can suppress the damage of the antenna coil. The effect of protecting the IC chip by the protective layer 16 can be expected.

[Twelfth embodiment]

FIG. 15 is a cross-sectional view showing a schematic configuration of the twelfth embodiment of the IC tag of the present invention. In this IC tag 121, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4. A cavity 6 is provided between and a protective layer 16 is provided on the inner surface of the protruding part 5 via an adhesive layer 13b coated on the insulating substrate 7, and on the upper surface of the insulating substrate 7. The upper resin core layer 15 having the same plane dimension as that of the insulating substrate 7 is stuck through the adhesive layer 13b. Further, a protective plate 16b is attached via an adhesive layer 13e at a position corresponding to the IC chip 4 directly below the insulating substrate 7 on the side opposite to the side on which the IC chip 4 is mounted. [0050] In the present embodiment, in addition to the effect that the cavity 6 can prevent the joint portion of the IC chip 4 and the antenna coil 8 from being broken, the upper resin core layer 15 can prevent the antenna coil from being broken. Thus, the protective layer 16 and the protective plate 16b increase the IC chip protection effect compared to the eleventh embodiment.

[13th embodiment]

FIG. 16 is a cross-sectional view showing a schematic configuration of the thirteenth embodiment of the IC tag of the present invention. In this IC tag 131, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the coating layer 3 in the vicinity of the IC chip 4 is projected to form the first projection 5 and the first projection 5 A cavity 6 is provided between the IC chip 4 and the IC chip 4, and the first protective layer 16 is provided on the inner surface of the first protrusion 5 via an adhesive layer 13b applied on the insulating substrate 7. An upper resin core layer 15 having the same plane dimensions as that of the insulating substrate 7 is attached to the upper surface of the insulating substrate 7 via an adhesive layer 13b. Further, the second projecting portion 5a is formed by projecting the coating layer 3 on the opposite side of the first projecting portion 5 across the insulating substrate 7 so as to be symmetric with the first projecting portion 5. A cavity 6a is provided between 5a and the insulating substrate 7, and a second protective layer 16a is provided on the inner surface of the second protruding portion 5a via an adhesive portion 13d coated on the insulating substrate 7. It is installed.

[0051] In the present embodiment, in addition to the effect that the cavity 6 can prevent the joint portion between the IC chip 4 and the antenna coil 8 from being broken, the upper resin core layer 15 can prevent the antenna coil from being damaged. The effect can be expected, and the first protective layer 16 and the second protective layer 16a increase the IC chip protection effect compared to the eleventh embodiment.

[14th embodiment]

FIG. 17 is a sectional view showing a schematic configuration of the fourteenth embodiment of the IC tag of the present invention. This IC tag 141 has an eleventh point that the upper resin core layer 15 is attached to the upper surface of the insulating substrate 7 through the adhesive layer 13b so as to cover a part of the insulating substrate 7. Different from the embodiment. [Fifteenth embodiment]

FIG. 18 is a cross-sectional view showing a schematic configuration of the fifteenth embodiment of the IC tag of the present invention. This IC tag 151 is characterized in that an upper resin core layer 15 is attached to the upper surface of the insulating substrate 7 via an adhesive layer 13b so as to cover a part of the insulating substrate 7. Different from the embodiment. [Sixteenth embodiment] FIG. 19 is a cross-sectional view showing a schematic configuration of the sixteenth embodiment of the IC tag of the present invention. This IC tag 161 has a thirteenth point in that an upper resin core layer 15 is attached to the upper surface of the insulating substrate 7 so as to cover a part of the insulating substrate 7 via an adhesive layer 13b. Different from the embodiment. [17th embodiment]

FIG. 20 is a sectional view showing a schematic configuration of the seventeenth embodiment of the IC tag of the present invention. In this IC tag 171, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding portion 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4. A cavity 6 is provided between and a protective layer 16 is provided on the inner surface of the protruding part 5 via an adhesive part 13c coated on the insulating substrate 7, and is provided on the lower surface of the insulating substrate 7. A lower resin core layer 14 having the same plane dimensions as that of the insulating substrate 7 is attached via an adhesive layer 13a.

In the present embodiment, in consideration of the effect that the cavity 6 can prevent the joint portion between the IC chip 4 and the antenna coil 8 from being broken, the lower resin core layer 14 can prevent the antenna coil from being damaged. The effect of protecting the IC chip by the protective layer 16 can be expected.

[Eighteenth embodiment]

FIG. 21 is a sectional view showing a schematic configuration of the eighteenth embodiment of the IC tag of the present invention. In this IC tag 181, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4. A cavity 6 is provided between and a protective layer 16 is provided along the inner surface of the protrusion 5 via an adhesive part 13c coated on the insulating substrate 7. In addition, a protective plate 16b is attached to the lower surface of the insulating substrate 7 via an adhesive layer 13a at a position corresponding to the IC chip 4 directly below the insulating substrate 7 on the side opposite to the side on which the IC chip 4 is mounted. The lower resin core layer 14 having the same plane dimension as that of the insulating substrate 7 is stuck through the adhesive layer 13a.

In the present embodiment, in addition to the effect that the cavity 6 can prevent the joint portion between the IC chip 4 and the antenna coil 8 from being broken, the lower resin core layer 14 can prevent the antenna coil from being broken. The protective layer 16 and the protective plate 16b increase the IC chip protection effect compared to the seventeenth embodiment.

[Nineteenth embodiment] FIG. 22 is a cross-sectional view showing a schematic configuration of the nineteenth embodiment of the IC tag of the present invention. In this IC tag 191, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4. A hollow portion 6 is provided between the first protective layer 16 and the inner surface of the protruding portion 5 along the adhesive portion 13c coated on the insulating substrate 7. Further, the second projecting portion 5a is formed by projecting the coating layer 3 opposite to the first projecting portion 5 with the insulating substrate 7 interposed therebetween so as to be symmetric with the first projecting portion 5. A cavity 6a is provided between the insulating substrate 7 and the insulating substrate 7, and a second protective layer 16a is provided along the inner surface of the second protruding portion 5a via an adhesive layer 13a. A lower resin core layer 14 having the same plane dimension as that of the insulating substrate 7 is attached via an adhesive layer 13a.

In the present embodiment, in addition to the effect that the cavity 6 can suppress the breakage of the joint between the IC chip 4 and the antenna coil 8, the lower resin core layer 14 is expected to suppress the damage of the antenna coil. In addition, the first protective layer 16 and the second protective layer 16a increase the IC chip protection effect compared to the seventeenth embodiment.

[20th embodiment]

FIG. 23 is a cross-sectional view showing a schematic configuration of the twentieth embodiment of the IC tag of the present invention. The IC tag 201 is characterized in that the lower resin core layer 14 is attached to the lower surface of the insulating substrate 7 so as to cover a part of the insulating substrate 7 via the adhesive layer 13a. Different from the seventh embodiment. [21st embodiment]

FIG. 24 is a cross-sectional view showing a schematic configuration of the twenty-first embodiment of the IC tag of the present invention. The IC tag 211 has an eighteenth point that the lower resin core layer 14 is attached to the lower surface of the insulating substrate 7 so as to cover a part of the insulating substrate 7 via the adhesive layer 13a. Different from the embodiment

[22nd embodiment]

FIG. 25 is a cross-sectional view showing a schematic configuration of a twenty-second embodiment of the IC tag of the present invention. The IC tag 221 has a nineteenth feature in that the lower resin core layer 14 is attached to the lower surface of the insulating substrate 7 so as to cover a part of the insulating substrate 7 via the adhesive layer 13a. Different from the embodiment. [23rd embodiment] FIG. 26 is a sectional view showing a schematic configuration of the twenty-third embodiment of the IC tag of the present invention. In this IC tag 231, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4. A cavity 6 is provided between them, adhesive layers 13b and 13a are coated on the upper and lower surfaces of the insulating substrate 7, respectively, and a protective layer 16 is provided on the inner surface of the protrusion 5 via the adhesive layer 13b. The upper resin core layer 15 having the same plane dimensions as that of the insulating substrate 7 is adhered to the upper surface of the insulating substrate 7 through the adhesive layer 13b, and the adhesive layer is disposed on the lower surface of the insulating substrate 7. A lower resin core layer 14 having the same plane dimensions as that of the insulating substrate 7 is attached via 13a.

In the present embodiment, in addition to the effect that the cavity 6 can prevent the joint portion of the IC chip 4 and the antenna coil 8 from being broken, the upper resin core layer 15 and the lower resin core layer 14 In addition, the effect that the damage of the antenna coil can be almost completely suppressed can be expected, and the protective effect of the IC chip by the protective layer 16 can be expected.

[24th embodiment]

FIG. 27 is a cross-sectional view showing a schematic configuration of the twenty-fourth embodiment of the IC tag of the present invention. In this IC tag 241, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, the protruding portion 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4, and the protruding portion 5 and the IC chip 4 A cavity 6 is provided between them, adhesive layers 13b and 13a are coated on the upper and lower surfaces of the insulating substrate 7, respectively, and a protective layer 16 is provided on the inner surface of the protrusion 5 via the adhesive layer 13b. The upper resin core layer 15 having the same plane dimension as that of the insulating substrate 7 is attached to the upper surface of the insulating substrate 7 via the adhesive layer 13b. In addition, a protective plate 16b is attached via an adhesive layer 13a to a position corresponding to the IC chip 4 directly below the insulating substrate 7 on the side opposite to the side on which the IC chip 4 is mounted. The lower resin core layer 14 having the same plane dimension as that of the insulating substrate 7 is adhered to the insulating layer 7 through the adhesive layer 13a.

In the present embodiment, in addition to the effect that the cavity portion 6 can prevent the joint portion between the IC chip 4 and the antenna coil 8 from being broken, the upper resin core layer 15 and the lower resin core layer 14 Further, the effect that the damage of the antenna coil can be almost completely suppressed can be expected, and the protective effect of the IC chip is enhanced by the protective layer 16 and the protective plate 16b as compared with the twenty-third embodiment. [25th embodiment] FIG. 28 is a cross-sectional view showing a schematic configuration of the twenty-fifth embodiment of the IC tag of the present invention. In this IC tag 251, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the coating layer 3 in the vicinity of the IC chip 4 is projected to form the first projection 5, and the first projection 5 and the IC A cavity 6 is provided between the chip 4, adhesive layers 13 b and 13 a are applied to the upper and lower surfaces of the insulating substrate 7, and an adhesive is applied to the inner surface of the first protrusion 5. The first protective layer 16 is provided along the layer 13b, and the upper resin core layer 15 having the same plane dimensions as the insulating substrate 7 is attached to the upper surface of the insulating substrate 7 via the adhesive layer 13b. Yes. Further, the second protruding portion 5a is formed by protruding the coating layer 3 on the opposite side of the first protruding portion 5 with the insulating substrate 7 interposed therebetween so as to be symmetric with the first protruding portion 5. A cavity 6a is provided between 5a and the insulating substrate 7, and a second protective layer 16a is provided along the inner surface of the second protruding portion 5a via an adhesive layer 13a. The lower resin core layer 14 having the same plane dimensions as the insulating substrate 7 is adhered to the insulating layer 7 through the adhesive layer 13a.

In the present embodiment, in addition to the effect that the cavity 6 can prevent the joint portion of the IC chip 4 and the antenna coil 8 from being broken, the antenna coil is formed by the upper resin core layer 15 and the lower resin core layer 14. The first protective layer 16 and the second protective layer 16a increase the IC chip protection effect compared to the twenty-third embodiment.

[26th embodiment]

FIG. 29 is a cross-sectional view showing a schematic configuration of the twenty-sixth embodiment of the IC tag of the present invention. This IC tag 261 has a lower resin core layer 14 attached to the lower surface of the insulating substrate 7 via an adhesive layer 13a so as to cover a part of the insulating substrate 7, and adhered to the upper surface of the insulating substrate 7. The upper resin core layer 15 is attached so as to cover a part of the insulating substrate 7 through the agent layer 13b, and is different from the twenty-third embodiment.

[27th embodiment]

FIG. 30 is a cross-sectional view showing a schematic configuration of the twenty-seventh embodiment of the IC tag of the present invention. In this IC tag 271, a lower resin core layer 14 is attached to the lower surface of the insulating substrate 7 via an adhesive layer 13 a so as to cover a part of the insulating substrate 7, and is adhered to the upper surface of the insulating substrate 7. The upper resin core layer 15 is attached so as to cover a part of the insulating substrate 7 through the agent layer 13b, and the second point is This is different from the fourteenth embodiment.

[28th embodiment]

FIG. 31 is a cross-sectional view showing a schematic configuration of the twenty-eighth embodiment of the IC tag of the present invention. In this IC tag 281, a lower resin core layer 14 is attached to the lower surface of the insulating substrate 7 via an adhesive layer 13 a so as to cover a part of the insulating substrate 7, and the IC tag 281 is bonded to the upper surface of the insulating substrate 7. The upper resin core layer 15 is attached so as to cover a part of the insulating substrate 7 through the agent layer 13b, and is different from the twenty-fifth embodiment.

Example

[0058] Examples of the present invention will be described below. The present invention is not limited to the specific numerical values of the following examples, and various changes and modifications can be made without departing from the technical scope of the present invention.

(1) Manufacture of IC modules

An aluminum foil having a thickness of 25 μm was attached to a polyethylene terephthalate film having a thickness of 50 μm via an adhesive. Next, an antenna pattern was formed on the resist material, and the resist material was placed on the aluminum foil, and an aluminum antenna pattern (antenna coil) was formed by etching. Then, as shown in FIG. 4, an IC chip 4 (0.4 mm X O. 4 mm X O. 15 mm) is laminated on this antenna pattern (antenna coil) 8 via an adhesive organic conductive film 12 for flip chip. Then, it was heated to about 170 ° C. to produce an IC module 2 as shown in FIG.

[0059] As a method of forming the antenna pattern, a method of forming by screen printing using a conductive paste composition and other known methods can be employed.

(2) Manufacture of a coating layer that can be used as a thermoplastic elastomer

The coating layer in this embodiment is composed of a lower coating layer made of a thermoplastic elastomer and an upper coating layer made of a thermoplastic elastomer. These lower coating layer and upper coating layer were obtained as follows.

[0060] The thermoplastic elastomer first material is polystyrene 10 weight ^_0/0, polybutadiene 20 by weight ^_0/0, polypropylene 5 weight ^_0/0, ethylene propylene diene copolymer 25 wt%, a plasticizer (paraffin oil) is the blending ratio of 40 wt ^_0/0. Ethylene-propylene- Ethylene diene copolymer is 54 weight ^_0/0, propylene 43 wt ^_0/0, dicyclopenta Jen is the ratio blend of 3% by weight. A styrene-based and olefin-based mixed thermoplastic elastomer having such a mixing ratio was mixed for about 2 minutes at 12 Orpm in a Banbury mixer heated to 80 ° C. During this time, the temperature of the mixture in the Banbury mixer increased to about 170 ° C. At this temperature, after another 2 minutes of mixing, the plasticizer was added and the mixture was mixed for 3 minutes. As a result, the temperature of the mixture rose to about 200 ° C. Next, the mixture in the Banbury mixer was taken out and rolled into a 2 mm thick sheet with a roller. The sheet was punched with a punching machine (not shown) to obtain a planar lower coating layer 3a and upper coating layer 3b as shown in FIGS. 32 (a) and 32 (b).

(3) Manufacture of IC tags

[Manufacture of IC tags corresponding to the first embodiment]

As shown in Fig. 33, the nine IC modules 2 obtained as described above are arranged in alignment on the lower coating layer 3a shown in Fig. 32 (a) on the lower die D1 made of stainless steel. The upper covering layer 3b shown in FIG. 32 (b) is placed thereon, and further, an intermediate insertion type Sl made of millable type silicone rubber and a millable type silicone rubber made thereon. Intermediate insertion mold S2, stainless steel middle mold D2, and stainless steel upper mold D3 were stacked one after another. Nine through holes h are formed in each of the intermediate insertion type Sl, the intermediate insertion type S2, and the middle mold D2. Note that the position of each through hole h corresponds to the position directly above the IC chip 4 of the arranged IC module 2, and the action of the through hole facilitates the formation of the protrusion as will be described later. Next, the lower mold D1, the middle mold D2, and the upper mold D3 are preheated to about 100 to 120 ° C, and further, the lower mold D1, the middle mold D2, and the upper mold D3 are about 140 ° C. And press the middle mold D2 and the upper mold D3 against the lower mold D 1 to apply a pressure of about 200 kN / m ² through the intermediate insertion mold S1 and the intermediate insertion mold S2 to form the lower coating layer 3a. When added to the IC module 2 and the upper coating layer 3b, the lower coating layer 3a, the IC module 2 and the upper coating layer 3b are in close contact with each other, and the upper coating layer 3b at the periphery of the through hole h is raised as shown in FIG. Furthermore, by sucking the air in the through hole h through a small hole (not shown) provided in the intermediate insertion type S1 and S2, this raised portion is raised. Finally, a protrusion 5 as shown in Fig. 1 is formed along the inner wall of the middle mold D2 and the upper mold D3, and below the part where the IC module 2 is not sandwiched. The upper cover layer 3a and the upper cover layer 3b are heat-fused and mixed together. After the mold is cooled and opened, it is cut into IC tags of a predetermined size (length 330mm x width 480mm). A number of IC tags 1 having a cross section as shown in Fig. 1 could be obtained simultaneously. Note that an electric heater for heating is embedded in the lower mold D1, the middle mold D2, and the upper mold D3.

[0062] When an IC tag is to be manufactured by hot pressing as described above, the lower coating layer 3a and the upper coating layer 3b have a thickness and heat that hardly rotate. Each thickness should be 5mm or less!

[0063] Even when heated by a heat press, the heating time is generally very short (about 1 to 2 seconds), so the IC tag is not damaged by the heat, but the heating time is increased or the heating temperature is increased. If the temperature is high, the function of some or all of the IC tag may be impaired. Therefore, the heat pressing time should be kept within 5 seconds at the maximum, and the heating temperature should not exceed the melting temperature of the thermoplastic elastomer! /, It is preferable to set the temperature below the softening point.

[0064] The temperature during the above hot pressing is about 130 to 150 ° C for styrene, olefin and urethane thermoplastic elastomers and about 150 to 170 ° for polyester and polyamide thermoplastic elastomers. C and the molding pressure is preferably 100 to 350 kNZm ² .

[0065] Further, since the silicone rubber is excellent in heat resistance and releasability, it can be preferably used as the intermediate insertion type of this example. Needless to say, other materials can be used as long as they have the same heat resistance and releasability as silicone rubber.

[Manufacture of IC tags corresponding to the second embodiment]

In the case of manufacturing the IC tag corresponding to the first embodiment, the IC module 2 is the same as the insulating substrate 7 via the adhesive layer 13a (heat-resistant adhesive tape) on the lower surface side of the insulating substrate 7 as the IC module 2. An IC tag 21 having a cross section as shown in FIG. 5 was obtained by the same method as above except that a flat resin-coated lower resin core layer 14 (polycarbonate) was used.

[Manufacture of IC tags corresponding to the third embodiment]

In the case of manufacturing the IC tag corresponding to the first embodiment, the adhesive layer 13b (heat-resistant adhesive tape) applied to the part excluding the IC chip 4 on the insulating substrate 7 is used as the IC module 2. IC board having a cross section as shown in FIG. 6 by the same method as above except that the upper resin core layer 15 (polycarbonate) having the same plane dimensions as the insulating substrate 7 is used. Got 31.

[Manufacture of IC tags corresponding to the fourth embodiment]

In the case of manufacturing an IC tag corresponding to the first embodiment, the upper resin core body having the same plane dimensions as the insulating substrate 7 is respectively formed on the upper surface side and the lower surface side of the insulating substrate 7 as the IC module 2. An IC tag 41 having a cross section as shown in FIG. 7 was obtained by the same method as above except that a layer 15 (polycarbonate) and a lower resin core layer 14 (polycarbonate) were used.

[Manufacture of IC tags corresponding to the fifth embodiment]

In the case of manufacturing an IC tag corresponding to the first embodiment, as an IC module 2, a part of the insulating substrate 7 is provided on the lower surface side of the insulating substrate 7 via an adhesive layer 13a (heat resistant adhesive tape). An IC tag 51 having a cross section as shown in FIG. 8 was obtained by the same method as above except that a lower resin core layer 14 (polycarbonate) adhered so as to cover the surface was used.

[Manufacture of IC tags corresponding to the sixth embodiment]

In the case of manufacturing an IC tag corresponding to the first embodiment, as an IC module 2, a part of the insulating substrate 7 is provided on the upper surface side of the insulating substrate 7 via an adhesive layer 13b (heat resistant adhesive tape). An IC tag 61 having a cross section as shown in FIG. 9 was obtained by the same method as above except that the upper resin core layer 15 (polycarbonate) adhered so as to cover the surface was used.

[Manufacture of IC tags corresponding to the seventh embodiment]

In the case of manufacturing the IC tag corresponding to the first embodiment, as the IC module 2, the upper resin is provided so as to cover a part of the insulating substrate 7 on the upper surface side and the lower surface side of the insulating substrate 7, respectively. An IC tag 71 having a cross section as shown in FIG. 10 was obtained by the same method as above except that the core layer 15 (polycarbonate) and the lower resin core layer 14 (polycarbonate) were used.

[Manufacture of IC tags corresponding to the eighth embodiment]

In the case of manufacturing an IC tag corresponding to the first embodiment, the adhesive applied to surround the IC chip 4 with a slight distance between the IC chip 4 and the IC module 2. IC tag having a cross section as shown in FIG. 11 by the same method as above except that a protective layer 16 (epoxy resin containing glass fiber) is pasted through part 13c (heat-resistant adhesive tape) is used. 8 Got one.

[Manufacture of IC tags corresponding to the ninth embodiment]

In the case of manufacturing an IC tag corresponding to the first embodiment, the adhesive applied to surround the IC chip 4 with a slight distance between the IC chip 4 and the IC module 2. First protective layer 16 (epoxy resin containing glass fiber) is pasted via part 13c (heat-resistant adhesive tape), and the opposite side across insulating substrate 7 so as to be symmetrical with first protective layer 16 The production example corresponding to the first embodiment is different in that a second protective layer 16a (epoxy resin containing glass fiber) is pasted on an adhesive part 13d (heat-resistant adhesive tape).

[0066] Then, as shown in FIG. 35, a stainless steel middle mold D2-1 is placed on a stainless steel lower mold D1, and an intermediate insert made of millable silicone rubber is placed thereon. The mold S1 is placed, and further, the lower covering layer 3a, the IC module 2 having the above-described configuration, and the upper covering layer 3b are placed in order thereon, and further, an intermediate insertion made of millable silicone rubber is placed thereon. The mold S2, the stainless steel middle mold D2-2, and the stainless steel upper mold D3 were stacked one after another. The intermediate insertion type Sl, the intermediate insertion type S2, the middle mold D2-1, and the middle mold D2-2 each have nine through holes h. Note that the position of each through hole h corresponds to directly above or directly below the IC chip 4 of the IC module 2 arranged in alignment, and the action of this through hole facilitates the formation of the protrusion as will be described later.

[0067] Next, the lower mold D1, the middle mold D2-1, the middle mold D2-2, and the upper mold D3 are preheated to about 100 to 120 ° C, and the lower mold D1 and the middle mold are further heated. D2-1—Middle mold D2-2—Upper mold D3 is heated to about 140 ° C to lower mold D1, middle mold D2-1—middle mold D2-2—upper mold By pressing D3 and applying a pressure of about 200 kNZm ² to the lower coating layer 3a, IC module 2 and upper coating layer 3b through the intermediate insertion type S1 and intermediate insertion type S2, as shown in FIG. The covering layer 3a, the IC module 2, and the upper covering layer 3b are in close contact with each other, and the upper covering layer 3b and the lower covering layer 3a at the periphery of the through-hole h are raised, and furthermore, the small holes (see FIG. By suctioning the air in the through-hole h through (not shown) (connected to a vacuum source of lOOkPa), this raised part is raised and finally the middle mold D2-1 and the lower mold Inner wall of D1 and middle mold D2-2— and upper mold D3 A first projecting portion 5 as shown in FIG. 12 along the second projecting portion 5a is made form undercoat layer 3a and the top coat layer 3b of portion not sandwiched between the IC module 2 heat IC tag with a cross-section as shown in Fig. 12 by fusing and becoming united, cooling the mold and opening it, then cutting it into IC tags of a predetermined size (length 330mm x width 480mm) I was able to get a lot of 91 at the same time. Note that an electric heater for heating is embedded in the middle mold D2-1 and middle mold D2-2.

[Manufacture of IC tags corresponding to the tenth embodiment]

In the case of manufacturing an IC tag corresponding to the first embodiment, the adhesive applied to surround the IC chip 4 with a slight distance between the IC chip 4 and the IC module 2. Protective layer 16 (epoxy resin containing glass fiber) is pasted via part 13c (heat-resistant adhesive tape), and further, directly below IC chip 4 on insulating substrate 7 on the side opposite to the side where IC chip 4 is mounted Fig. 13 shows the same method as above except that a protective plate 16b (epoxy resin containing glass fiber) is pasted through an adhesive layer 13e (heat-resistant adhesive tape) at a position corresponding to An IC tag 101 having such a cross section was obtained.

[Manufacturing of an IC tag corresponding to the eleventh embodiment]

In the case of manufacturing the IC tag corresponding to the first embodiment, the adhesive layer 13b (heat-resistant adhesive tape) applied to the part excluding the IC chip 4 on the insulating substrate 7 is used as the IC module 2. Then, the protective layer 16 (epoxy resin containing glass fiber) is attached, and the upper resin core layer 15 (poly force) having the same plane dimensions as the insulating substrate 7 is provided via the adhesive layer 13b (heat-resistant adhesive tape). The IC tag 111 having a cross section as shown in FIG. 14 was obtained by the same method as above except that a paste having a carbonate) was used.

[Manufacture of IC tags corresponding to the twelfth embodiment]

In the case of manufacturing the IC tag corresponding to the first embodiment, the adhesive layer 13b (heat-resistant adhesive tape) applied to the part excluding the IC chip 4 on the insulating substrate 7 is used as the IC module 2. Then, a protective layer 16 (epoxy resin containing glass fiber) is attached, and an adhesive layer 13e (on the insulating substrate 7 on the side opposite to the side on which the IC chip 4 is mounted is located at a position corresponding to directly under the IC chip 4. Adhere protective plate 16b (epoxy resin with glass fiber) via heat-resistant adhesive tape), and upper resin core with the same plane dimensions as insulating substrate 7 via adhesive layer 13b (heat-resistant adhesive tape) An IC tag 121 having a cross section as shown in FIG. 15 was obtained by the same method as above except that the body layer 15 (polycarbonate) adhered was used. [Manufacture of IC tags corresponding to the thirteenth embodiment]

In the case of manufacturing an IC tag corresponding to the ninth embodiment, as the IC module 2, a first adhesive layer 13 b (heat-resistant adhesive tape) applied to the portion excluding the IC chip 4 on the insulating substrate 7 is used. Adhere one protective layer 16 (epoxy resin containing glass fiber), and sandwich the insulating substrate 7 so that it is symmetrical with the first protective layer 16, with the adhesive part 13d (heat-resistant adhesive tape) on the opposite side A second protective layer 16a (epoxy resin containing glass fiber) is adhered, and an upper resin core layer 15 (polyester) having the same plane dimensions as the insulating substrate 7 is bonded via an adhesive layer 13b (heat-resistant adhesive tape). An IC tag 131 having a cross section as shown in FIG. 16 was obtained by the same method as above except that the one with carbonate) was used.

[Manufacture of IC tags corresponding to the fourteenth embodiment]

In the case of the manufacture of the IC tag corresponding to the above-mentioned ^-embodiment, the IC module 2 is formed on the insulating substrate 7 via the adhesive layer 13b (heat-resistant adhesive tape) on the upper surface side of the insulating substrate 7. An IC tag 141 having a cross section as shown in FIG. 17 was obtained by the same method as above except that the upper resin core layer 15 (polycarbonate) adhered so as to cover a part was used.

[Manufacture of IC tags corresponding to the fifteenth embodiment]

In the case of manufacturing an IC tag corresponding to the above twelfth embodiment, as the IC module 2, the insulating substrate 7 is provided on the upper surface side of the insulating substrate 7 via an adhesive layer 13b (heat-resistant adhesive tape). An IC tag 151 having a cross section as shown in FIG. 18 was obtained by the same method as above except that an upper resin core layer 15 (polycarbonate) adhered so as to cover a part was used.

[Manufacture of IC tags corresponding to the sixteenth embodiment]

In the case of manufacturing an IC tag corresponding to the thirteenth embodiment, as the IC module 2, the insulating substrate 7 is provided on the upper surface side of the insulating substrate 7 via an adhesive layer 13b (heat-resistant adhesive tape). An IC tag 161 having a cross section as shown in FIG. 19 was obtained by the same method as above except that an upper resin core layer 15 (polycarbonate) adhered so as to cover a part was used.

[Manufacture of IC tags corresponding to the seventeenth embodiment]

In the case of manufacturing an IC tag corresponding to the first embodiment, the adhesive applied to surround the IC chip 4 with a slight distance between the IC chip 4 and the IC module 2. Adhere protective layer 16 (epoxy resin with glass fiber) through part 13c (heat-resistant adhesive tape). The same as above except that a lower resin core layer 14 (polycarbonate) having the same plane dimensions as that of the insulating substrate 7 is attached via the adhesive layer 13a applied to the lower surface side of the insulating substrate 7. By the method, an IC tag 171 having a cross section as shown in FIG. 20 was obtained.

[Manufacture of IC tags corresponding to the eighteenth embodiment]

In the case of manufacturing an IC tag corresponding to the first embodiment, the adhesive applied to surround the IC chip 4 with a slight distance between the IC chip 4 and the IC module 2. The protective layer 16 (epoxy resin containing glass fiber) is pasted through the part 13c (heat-resistant adhesive tape), the adhesive layer 13a is applied to the lower surface side of the insulating substrate 7, and the side on which the IC chip 4 is mounted A protective plate 16b (epoxy resin containing glass fiber) is attached via an adhesive layer 13a (heat-resistant adhesive tape) at a position corresponding to the IC chip 4 on the insulating substrate 7 on the opposite side, and further, The method is the same as above except that an adhesive layer 1 3a (heat-resistant adhesive tape) is used and a lower resin core layer 14 (polycarbonate) with the same plane dimensions as the insulating substrate 7 is used. An IC tag 181 having a cross section as shown in 21 was obtained.

[Manufacture of IC tags corresponding to the nineteenth embodiment]

In the case of manufacturing an IC tag corresponding to the ninth embodiment, the adhesive applied to surround the IC chip 4 with a slight distance between the IC chip 4 and the IC module 2. Adhering the protective layer 16 (epoxy resin containing glass fiber) via the part 13c (heat-resistant adhesive tape), excluding the part corresponding to the IC chip 4 directly below the insulating substrate 7! (Heat-resistant adhesive tape) is applied, and the second protective layer 16a is placed via the adhesive layer 13a (heat-resistant adhesive tape) on the opposite side across the insulating substrate 7 so as to be symmetrical with the first protective layer 16. (Epoxy resin containing glass fiber) was adhered, and further, a lower resin core layer 14 (polycarbonate) having the same plane dimensions as the insulating substrate 7 was adhered via an adhesive layer 13a (heat resistant adhesive tape). An IC tag 191 having a cross section as shown in FIG. 22 was obtained by the same method as described above except that the product was used.

[Manufacturing of IC tag corresponding to 20th embodiment]

In the case of manufacturing an IC tag corresponding to the above seventeenth embodiment, as the IC module 2, the insulating substrate 7 is provided on the lower surface side of the insulating substrate 7 via an adhesive layer 13a (heat resistant adhesive tape). An IC tag 201 having a cross-section as shown in FIG. 23 was obtained by the same method as above except that a part having a lower resin core layer 14 (polycarbonate) attached so as to cover a part was used. [Manufacture of IC tags corresponding to the 21st embodiment]

In the case of manufacturing an IC tag corresponding to the eighteenth embodiment, as the IC module 2, the insulating substrate 7 is provided on the lower surface side of the insulating substrate 7 via an adhesive layer 13a (heat-resistant adhesive tape). An IC tag 211 having a cross section as shown in FIG. 24 was obtained by the same method as above except that a part having a lower resin core layer 14 (polycarbonate) attached so as to cover a part was used.

[Manufacture of IC tags corresponding to the twenty-second embodiment]

In the case of manufacturing an IC tag corresponding to the nineteenth embodiment, as the IC module 2, a part of the insulating substrate 7 is attached to the lower surface side of the insulating substrate 7 via an adhesive layer 13a (heat-resistant adhesive tape). An IC tag 221 having a cross section as shown in FIG. 25 was obtained by the same method as above except that a lower resin core layer 14 (polycarbonate) pasted so as to be covered was used.

[Manufacture of IC tags corresponding to the 23rd embodiment]

In the case of manufacturing the IC tag corresponding to the first embodiment, the adhesive layer 13b (heat-resistant adhesive tape) applied to the part excluding the IC chip 4 on the insulating substrate 7 is used as the IC module 2. Then, the protective layer 16 (epoxy resin containing glass fiber) is attached, and the upper resin core layer 15 (poly force) having the same plane dimensions as the insulating substrate 7 is provided via the adhesive layer 13b (heat-resistant adhesive tape). -Bonate) is used, and the lower resin core layer 14 (polycarbonate) with the same plane dimensions as the insulating substrate 7 is attached via the adhesive layer 13a applied to the lower surface of the insulating substrate 7. Except for the above, an IC tag 231 having a cross section as shown in FIG. 26 was obtained by the same method as above. [Manufacture of IC tags corresponding to the twenty-fourth embodiment]

In the case of manufacturing the IC tag corresponding to the first embodiment, the adhesive layer 13b (heat-resistant adhesive tape) applied to the part excluding the IC chip 4 on the insulating substrate 7 is used as the IC module 2. Then, the protective layer 16 (epoxy resin containing glass fiber) is attached, and the upper resin core layer 15 (polycarbonate) having the same plane dimensions as the insulating substrate 7 is provided via the adhesive layer 13b (heat-resistant adhesive tape). ), And adhesive layer 13a is applied to the lower surface of insulating substrate 7, and the position corresponding to the position immediately below IC chip 4 on insulating substrate 7 on the side opposite to the side where IC chip 4 is mounted A protective plate 16b (epoxy resin containing glass fiber) is pasted through the adhesive layer 13a (heat-resistant adhesive tape), and the same plane dimensions as the insulating substrate 7 through the adhesive layer 13a (heat-resistant adhesive tape) The same method as above, except that the lower resin core layer 14 (polycarbonate) attached was used. An IC tag 241 having a cross section as shown in FIG. 27 was obtained.

[Manufacture of IC tags corresponding to the 25th embodiment]

In the case of manufacturing an IC tag corresponding to the ninth embodiment, the IC module 2 is protected via an adhesive layer 13b (heat-resistant adhesive tape) applied to a portion of the insulating substrate 7 excluding the IC chip 4. Adhere layer 16 (epoxy resin with glass fiber) and upper resin core layer 15 (polycarbonate) with the same plane dimensions as insulating substrate 7 via adhesive layer 13b (heat-resistant adhesive tape). Apply the adhesive layer 13a to the lower surface of the insulating substrate 7 except for the part directly under the IC chip 4, and the opposite side of the insulating substrate 7 so that it is symmetrical with the first protective layer 16. The second protective layer 16a (epoxy resin containing glass fiber) is pasted through the adhesive layer 13a (heat-resistant adhesive tape), and the insulating substrate 7 and the adhesive layer 13a (heat-resistant adhesive tape). Except for the fact that a lower resin core layer 14 (polycarbonate) with the same planar dimensions was used, the same It was obtained IC tag 251 having the cross section shown in FIG. 28 by the method.

[Manufacture of IC tags corresponding to the 26th embodiment]

In the case of manufacturing an IC tag corresponding to the above-described twenty-third embodiment, the upper portion of the insulating substrate 7 is covered as the IC module 2 on the upper surface side and the lower surface side of the insulating substrate 7 respectively. An IC tag 261 having a cross section as shown in FIG. 29 is obtained by the same method as above except that the one having the resin core layer 15 (polycarbonate) and the lower resin core layer 14 (polycarbonate) attached is used. It was.

[Manufacture of IC tags corresponding to the 27th embodiment]

In the case of manufacturing the IC tag corresponding to the twenty-fourth embodiment, as the IC module 2, the upper surface of the insulating substrate 7 is covered with the upper resin core so as to cover a part of the insulating substrate 7, respectively. An IC tag 271 having a cross section as shown in FIG. 30 was obtained by the same method as above except that the body layer 15 (polycarbonate) and the lower resin core layer 14 (polycarbonate) were used.

[Manufacture of IC tags corresponding to the 28th embodiment]

In the case of manufacturing an IC tag corresponding to the above twenty-fifth embodiment, the upper part of the insulating substrate 7 is covered as an IC module 2 on the upper surface side and the lower surface side of the insulating substrate 7 respectively. Adhesion of the resin core layer 15 (polycarbonate) and the lower resin core layer 14 (polycarbonate) An IC tag 281 having a cross section as shown in FIG. 31 was obtained by the same method as above except that the above was used.

Industrial applicability

The IC tag of the present invention can be used as a life cycle related application, for example, attached to a receipt at a supermarket department store or the like as a checkout management tag for a register, a book management tag for a library, or an impact resistance for courier management. As a tag for impact management for airline baggage management, as a flexible tag for prepaid management, as a tag for various traceability, as a production management tag attached to a rotating sushi plate, As a management tag at the time of nursing, as a tag for medical instrument management at a hospital, as a tag for drug management at a pharmacy, as a care status management tag for nursing support, as a collection management tag for household waste and industrial waste, Admission to a specific area as a time measurement tag for marathon runners, as a guide tag attached to exhibits at museums, etc. As a tag to be attached to the wrist for managers, as a tag for environmental management in harsh or special environments, mobile phones' personal personal digital assistants · refrigerators · digital cameras · optical discs · universal serial bus · home appliances for cooking, etc. Integrated RFID (Radio Frequency Identification) RFID tags, and security-related applications such as personal authentication management tags, employee entry / exit management tags, jewelry, luxury clothing, etc. As a tag for shoplifting 'anti-counterfeiting, as a tag for recording maintenance of equipment and structures, as a tag for parking and entering / leaving management, as a tag for managing important documents, and as a tag for managing important documents, It can be used as a security control tag that manages entry and exit and prevents illegal entry.

Claims

The scope of the claims

[1] An IC module in which an electronic module having an IC chip and an antenna coil mounted on an insulating substrate is coated with a coating layer of a neutral material, and a coating layer in the vicinity of the IC chip is formed. An IC tag, wherein a protruding portion is formed by protruding, and a hollow portion is provided between the protruding portion and the IC chip.

2. The IC tag according to claim 1, wherein a lower resin core layer is attached to the lower surface of the insulating substrate.

[3] The IC tag according to claim 1, wherein an upper resin core layer is attached to the upper surface of the insulating substrate.

[4] The IC tag according to claim 1, wherein an upper resin core layer and a lower resin core layer are attached to the upper surface and the lower surface of the insulating substrate, respectively.

[5] An IC module in which an electronic component having an IC chip and an antenna coil mounted on an insulating substrate is coated with a coating layer of a neutral material, and then a coating layer in the vicinity of the IC chip is formed. Protrusions are formed by projecting, and a cavity is provided between the projecting part and the IC chip, and a protective layer is also provided on the inner surface of the projecting part, which also has a grease material strength. IC tag.

[6] An IC module in which an electronic module having an IC chip and an antenna coil mounted on an insulating substrate is covered with a coating layer made of a natural material. The first protrusion is formed to protrude, and a cavity is provided between the first protrusion and the IC chip, and a protective layer made of a resin material is provided on the inner surface of the first protrusion, (1) Form the second protrusion by projecting the coating layer on the opposite side of the first protrusion, sandwiching the insulating substrate so as to be symmetrical with the protrusion, and between the second protrusion and the insulating substrate An IC tag, characterized in that a hollow portion is provided and a protective layer having a resin material strength is provided on the inner surface of the second protruding portion.

[7] An IC tag in which an electronic module having an IC chip and an antenna coil mounted on an insulating substrate is coated with a coating layer of a neutral material, and a coating layer in the vicinity of the IC chip is formed. A protruding portion is formed by projecting, and a cavity is provided between the protruding portion and the IC chip, and a protective layer made of a resin material is provided on the inner surface of the protruding portion, so that the IC chip is actually implemented. An IC tag characterized in that a protective plate made of a resin material is attached at a position corresponding to an IC chip directly below an insulating substrate on the side opposite to the mounted side.

[8] An IC tag in which an electronic module having an IC chip and an antenna coil mounted on an insulating substrate is coated with a coating layer of a neutral material, and a coating layer in the vicinity of the IC chip is formed. A protrusion is formed, and a cavity is provided between the protrusion and the IC chip, and a protective layer made of a resin material is provided on the inner surface of the protrusion, and the upper surface of the insulating substrate is provided. Is an IC tag characterized in that an upper resin core layer is attached.

[9] An IC tag in which an electronic module having an IC chip and an antenna coil mounted on an insulating substrate is coated with a coating layer of a natural material, and a coating layer in the vicinity of the IC chip is formed. A protruding portion is formed by projecting, and a cavity is provided between the protruding portion and the IC chip, and a protective layer made of a resin material is provided on the inner surface of the protruding portion, and the IC chip is mounted. A protective plate made of a resin material is installed at a position corresponding to the IC chip on the insulating substrate opposite to the opposite side, and an upper resin core layer is installed on the upper surface of the insulating substrate. IC tag characterized by

[10] An IC tag in which an electronic module having an IC chip and an antenna coil mounted on an insulating substrate is coated with a coating layer of a neutral material, and a coating layer in the vicinity of the IC chip is formed. The first protrusion is formed to protrude, and a cavity is provided between the first protrusion and the IC chip, and a protective layer made of a resin material is provided on the inner surface of the first protrusion, (1) Form the second protrusion by projecting the coating layer on the opposite side of the first protrusion, sandwiching the insulating substrate so as to be symmetrical with the protrusion, and between the second protrusion and the insulating substrate An IC tag characterized in that a cavity is provided, a protective layer made of a resin material force is provided on the inner surface of the second protrusion, and an upper resin core layer is attached to the upper surface of the insulating substrate. .

[11] An IC module in which an electronic module having an IC chip and an antenna coil mounted on an insulating substrate is coated with a coating layer of a neutral material, and a coating layer in the vicinity of the IC chip is formed. A protruding portion is formed by projecting, and a cavity is provided between the protruding portion and the IC chip, and a protective layer made of a resin material is provided on the inner surface of the protruding portion, and the lower surface of the insulating substrate is provided. Is an IC tag characterized in that a lower resin core layer is attached.

[12] IC module in which electronic components with IC chip and antenna coil are mounted on an insulating substrate An IC tag formed by coating one surface with a coating layer of a coasting material is formed by projecting the coating layer in the vicinity of the IC chip to form a projection, and a cavity is formed between the projection and the IC chip. In addition, a protective layer with a grease material strength is provided on the inner side surface of the protrusion, and the resin material is placed in a position corresponding to directly under the IC chip on the insulating substrate opposite to the side where the IC chip is mounted. An IC tag, wherein a protective plate is attached, and a lower resin core layer is attached to the lower surface of the insulating substrate.

[13] An IC tag in which an electronic module having an IC chip and an antenna coil mounted on an insulating substrate is covered with a coating layer of a neutral material, and a coating layer in the vicinity of the IC chip is formed. The first protrusion is formed to protrude, and a cavity is provided between the first protrusion and the IC chip, and a protective layer made of a resin material is provided on the inner surface of the first protrusion, (1) Form the second protrusion by projecting the coating layer on the opposite side of the first protrusion, sandwiching the insulating substrate so as to be symmetrical with the protrusion, and between the second protrusion and the insulating substrate An IC tag characterized in that a cavity is provided, a protective layer having a resin material strength is provided on the inner surface of the second protrusion, and a lower resin core layer is attached to the lower surface of the insulating substrate. .

[14] An IC tag in which an electronic module having an IC chip and an antenna coil mounted on an insulating substrate is covered with a coating layer of a neutral material, and a coating layer in the vicinity of the IC chip is formed. A protruding portion is formed by projecting, and a cavity is provided between the protruding portion and the IC chip, and a protective layer made of a resin material is provided on the inner surface of the protruding portion, and the upper surface of the insulating substrate An IC tag characterized in that an upper and lower resin core layers are respectively attached to the lower surface.

[15] An IC tag in which an electronic module having an IC chip and an antenna coil mounted on an insulating substrate is coated with a coating layer of a neutral material, and a coating layer in the vicinity of the IC chip is formed. A protruding portion is formed by projecting, and a cavity is provided between the protruding portion and the IC chip, and a protective layer made of a resin material is provided on the inner surface of the protruding portion, and the IC chip is mounted. A protective plate made of a resin material is attached at a position corresponding to the IC chip directly on the opposite side of the insulating substrate, and the upper and lower surfaces of the insulating substrate are respectively formed on the upper and lower surfaces of the insulating substrate. An IC tag characterized in that a fat core layer is attached.

[16] IC module in which electronic components with IC chip and antenna coil are mounted on an insulating substrate The first tag is formed by projecting the coating layer in the vicinity of the IC chip, and the first projecting part is formed between the first projecting part and the IC chip. A cavity is provided, and a protective layer made of a resin material is provided on the inner surface of the first protrusion, and on the opposite side of the first protrusion with the insulating substrate interposed therebetween so as to be symmetrical with the first protrusion. A coating layer is protruded to form a second protrusion, a cavity is provided between the second protrusion and the insulating substrate, and a protective layer made of a resin material is provided on the inner surface of the second protrusion. An IC tag, wherein an upper and lower resin core layers are attached to an upper surface and a lower surface of an insulating substrate, respectively.