GB2461443B - Magnetic field coupling antenna module arrangements including a magnetic core embedded in an insulating layer and their manufacturing methods. - Google Patents

Magnetic field coupling antenna module arrangements including a magnetic core embedded in an insulating layer and their manufacturing methods.

Info

Publication number
GB2461443B
GB2461443B GB0917865.8A GB0917865A GB2461443B GB 2461443 B GB2461443 B GB 2461443B GB 0917865 A GB0917865 A GB 0917865A GB 2461443 B GB2461443 B GB 2461443B
Authority
GB
United Kingdom
Prior art keywords
insulating layer
antenna module
manufacturing methods
field coupling
magnetic field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0917865.8A
Other versions
GB0917865D0 (en
GB2461443A (en
Inventor
Tsutomu Ieki
Hiroyuki Kubo
Masamichi Ando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of GB0917865D0 publication Critical patent/GB0917865D0/en
Publication of GB2461443A publication Critical patent/GB2461443A/en
Application granted granted Critical
Publication of GB2461443B publication Critical patent/GB2461443B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
    • H01Q7/08—Ferrite rod or like elongated core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/022—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Details Of Aerials (AREA)
  • Near-Field Transmission Systems (AREA)
  • Soft Magnetic Materials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
GB0917865.8A 2007-04-13 2008-04-10 Magnetic field coupling antenna module arrangements including a magnetic core embedded in an insulating layer and their manufacturing methods. Expired - Fee Related GB2461443B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007105513 2007-04-13
PCT/JP2008/057078 WO2008133018A1 (en) 2007-04-13 2008-04-10 Magnetic field coupling type antenna, magnetic field coupling type antenna module, magnetic field coupling type antenna device, and their manufacturing methods

Publications (3)

Publication Number Publication Date
GB0917865D0 GB0917865D0 (en) 2009-11-25
GB2461443A GB2461443A (en) 2010-01-06
GB2461443B true GB2461443B (en) 2012-06-06

Family

ID=39925477

Family Applications (2)

Application Number Title Priority Date Filing Date
GB0917865.8A Expired - Fee Related GB2461443B (en) 2007-04-13 2008-04-10 Magnetic field coupling antenna module arrangements including a magnetic core embedded in an insulating layer and their manufacturing methods.
GB1202765.2A Expired - Fee Related GB2485318B (en) 2007-04-13 2008-04-10 Magnetic field coupling antenna module and magnetic field coupling antenna device

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB1202765.2A Expired - Fee Related GB2485318B (en) 2007-04-13 2008-04-10 Magnetic field coupling antenna module and magnetic field coupling antenna device

Country Status (4)

Country Link
JP (2) JP5170087B2 (en)
CN (1) CN101657938B (en)
GB (2) GB2461443B (en)
WO (1) WO2008133018A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11315726B2 (en) 2017-01-31 2022-04-26 Murata Manufacturing Co., Ltd. LC resonator

Families Citing this family (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7519328B2 (en) 2006-01-19 2009-04-14 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US9064198B2 (en) 2006-04-26 2015-06-23 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
WO2008001561A1 (en) 2006-06-30 2008-01-03 Murata Manufacturing Co., Ltd. Optical disc
DE112007002024B4 (en) 2006-09-26 2010-06-10 Murata Mfg. Co., Ltd., Nagaokakyo-shi Inductively coupled module and element with inductively coupled module
US8235299B2 (en) 2007-07-04 2012-08-07 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
EP2138962B1 (en) 2007-04-26 2012-01-04 Murata Manufacturing Co. Ltd. Wireless ic device
JP4666102B2 (en) 2007-05-11 2011-04-06 株式会社村田製作所 Wireless IC device
KR101023582B1 (en) 2007-07-09 2011-03-21 가부시키가이샤 무라타 세이사쿠쇼 Wireless ic device
CN101578616A (en) 2007-07-17 2009-11-11 株式会社村田制作所 Wireless IC device and electronic apparatus
CN102915462B (en) 2007-07-18 2017-03-01 株式会社村田制作所 Wireless IC device
EP2251934B1 (en) 2008-03-03 2018-05-02 Murata Manufacturing Co. Ltd. Wireless ic device and wireless communication system
EP2590260B1 (en) 2008-05-21 2014-07-16 Murata Manufacturing Co., Ltd. Wireless IC device
CN104077622B (en) 2008-05-26 2016-07-06 株式会社村田制作所 The authenticating method of wireless IC device system and Wireless IC device
JP5434920B2 (en) 2008-08-19 2014-03-05 株式会社村田製作所 Wireless IC device and manufacturing method thereof
WO2010055945A1 (en) 2008-11-17 2010-05-20 株式会社村田製作所 Antenna and wireless ic device
JP4752909B2 (en) * 2008-12-24 2011-08-17 株式会社村田製作所 Magnetic material antenna and antenna device
JP5041075B2 (en) 2009-01-09 2012-10-03 株式会社村田製作所 Wireless IC device and wireless IC module
JP5267578B2 (en) 2009-01-30 2013-08-21 株式会社村田製作所 Antenna and wireless IC device
JP4987893B2 (en) * 2009-02-27 2012-07-25 東光株式会社 High frequency coupler and contactless transmission communication system using the same
JP2010245371A (en) * 2009-04-08 2010-10-28 Elpida Memory Inc Semiconductor device and method of manufacturing semiconductor device
WO2010119854A1 (en) 2009-04-14 2010-10-21 株式会社村田製作所 Component for wireless ic device and wireless ic device
WO2010122685A1 (en) 2009-04-21 2010-10-28 株式会社村田製作所 Antenna apparatus and resonant frequency setting method of same
WO2010140429A1 (en) 2009-06-03 2010-12-09 株式会社村田製作所 Wireless ic device and production method thereof
JP5516580B2 (en) 2009-06-19 2014-06-11 株式会社村田製作所 Wireless IC device and method for coupling power feeding circuit and radiation plate
CN102474009B (en) 2009-07-03 2015-01-07 株式会社村田制作所 Antenna and antenna module
JP4715954B2 (en) * 2009-08-28 2011-07-06 パナソニック株式会社 Antenna device
WO2011037234A1 (en) 2009-09-28 2011-03-31 株式会社村田製作所 Wireless ic device and method for detecting environmental conditions using same
WO2011040393A1 (en) 2009-09-30 2011-04-07 株式会社村田製作所 Circuit substrate and method of manufacture thereof
JP5304580B2 (en) 2009-10-02 2013-10-02 株式会社村田製作所 Wireless IC device
CN102576939B (en) 2009-10-16 2015-11-25 株式会社村田制作所 Antenna and wireless ic device
CN102598413A (en) 2009-10-27 2012-07-18 株式会社村田制作所 Transmitting/receiving apparatus and wireless tag reader
JP5299518B2 (en) 2009-11-04 2013-09-25 株式会社村田製作所 Information processing system
CN102549838B (en) 2009-11-04 2015-02-04 株式会社村田制作所 Communication terminal and information processing system
CN102576930A (en) 2009-11-04 2012-07-11 株式会社村田制作所 Communication terminal and information processing system
GB2487491B (en) 2009-11-20 2014-09-03 Murata Manufacturing Co Antenna device and mobile communication terminal
JP4978756B2 (en) 2009-12-24 2012-07-18 株式会社村田製作所 Communication terminal
JP5569011B2 (en) * 2010-01-29 2014-08-13 大日本印刷株式会社 Antenna parts
CN102792520B (en) 2010-03-03 2017-08-25 株式会社村田制作所 Wireless communication module and Wireless Telecom Equipment
CN102782937B (en) 2010-03-03 2016-02-17 株式会社村田制作所 Wireless communication devices and wireless communication terminal
JP5477459B2 (en) 2010-03-12 2014-04-23 株式会社村田製作所 Wireless communication device and metal article
GB2491447B (en) 2010-03-24 2014-10-22 Murata Manufacturing Co RFID system
WO2011122163A1 (en) 2010-03-31 2011-10-06 株式会社村田製作所 Antenna and wireless communication device
JP5376060B2 (en) 2010-07-08 2013-12-25 株式会社村田製作所 Antenna and RFID device
CN104752813B (en) 2010-07-28 2018-03-02 株式会社村田制作所 Antenna assembly and communication terminal device
JP5423897B2 (en) 2010-08-10 2014-02-19 株式会社村田製作所 Printed wiring board and wireless communication system
CN101976762A (en) * 2010-09-19 2011-02-16 北京握奇数据系统有限公司 Two-channel coil antenna and device applying same
WO2012043432A1 (en) 2010-09-30 2012-04-05 株式会社村田製作所 Wireless ic device
WO2012050037A1 (en) 2010-10-12 2012-04-19 株式会社村田製作所 Antenna apparatus and communication terminal apparatus
GB2501385B (en) 2010-10-21 2015-05-27 Murata Manufacturing Co Communication terminal device
JP5716891B2 (en) * 2010-11-10 2015-05-13 横浜ゴム株式会社 Information acquisition device
JP5510560B2 (en) 2011-01-05 2014-06-04 株式会社村田製作所 Wireless communication device
JP5304956B2 (en) 2011-01-14 2013-10-02 株式会社村田製作所 RFID chip package and RFID tag
WO2012117843A1 (en) 2011-02-28 2012-09-07 株式会社村田製作所 Wireless communication device
JP5630566B2 (en) 2011-03-08 2014-11-26 株式会社村田製作所 Antenna device and communication terminal device
WO2012137717A1 (en) 2011-04-05 2012-10-11 株式会社村田製作所 Wireless communication device
JP5482964B2 (en) 2011-04-13 2014-05-07 株式会社村田製作所 Wireless IC device and wireless communication terminal
JP5569648B2 (en) 2011-05-16 2014-08-13 株式会社村田製作所 Wireless IC device
EP3041087B1 (en) 2011-07-14 2022-09-07 Murata Manufacturing Co., Ltd. Wireless communication device
JP5333707B2 (en) 2011-07-15 2013-11-06 株式会社村田製作所 Wireless communication device
WO2013011865A1 (en) 2011-07-19 2013-01-24 株式会社村田製作所 Antenna module, antenna device, rfid tag, and communication terminal device
WO2013035821A1 (en) 2011-09-09 2013-03-14 株式会社村田製作所 Antenna device and wireless device
CN102354813A (en) * 2011-09-23 2012-02-15 深圳市江波龙电子有限公司 Communication antenna, as well as manufacturing method and application terminal of communication antenna
JP5344108B1 (en) 2011-12-01 2013-11-20 株式会社村田製作所 Wireless IC device and manufacturing method thereof
JP5354137B1 (en) 2012-01-30 2013-11-27 株式会社村田製作所 Wireless IC device
WO2013125610A1 (en) 2012-02-24 2013-08-29 株式会社村田製作所 Antenna device and wireless communication device
WO2013146003A1 (en) 2012-03-29 2013-10-03 株式会社村田製作所 Magnetic field probe
WO2013153697A1 (en) 2012-04-13 2013-10-17 株式会社村田製作所 Rfid tag inspection method, and inspection device
JP6062691B2 (en) * 2012-04-25 2017-01-18 Ｎｅｃトーキン株式会社 Sheet-shaped inductor, multilayer substrate built-in type inductor, and manufacturing method thereof
GB2516128B (en) 2012-04-27 2017-04-19 Murata Manufacturing Co Coil antenna and communication terminal device
JP5700233B2 (en) * 2012-05-09 2015-04-15 株式会社村田製作所 Coil antenna element and antenna module
JP6089446B2 (en) * 2012-05-22 2017-03-08 株式会社村田製作所 Antenna device and communication terminal device
JP5967028B2 (en) 2012-08-09 2016-08-10 株式会社村田製作所 ANTENNA DEVICE, WIRELESS COMMUNICATION DEVICE, AND ANTENNA DEVICE MANUFACTURING METHOD
CN204335178U (en) * 2012-08-09 2015-05-13 株式会社村田制作所 Antenna assembly and radio communication device
JP5633662B1 (en) * 2013-01-15 2014-12-03 株式会社村田製作所 Antenna coil built-in module, antenna device, and communication device
CN103298258B (en) * 2013-05-21 2016-09-21 华为技术有限公司 Circuit board and there is the power supply change-over device of this circuit board
CN104508909B (en) * 2013-06-14 2017-04-12 株式会社村田制作所 Antenna device and communication-terminal device
WO2016093808A1 (en) * 2014-12-09 2016-06-16 Intel Corporation Three dimensional structures within mold compound
CN103682641A (en) * 2013-12-30 2014-03-26 深圳市麦捷微电子科技股份有限公司 Small-sized ferrite chip antenna
JP6323213B2 (en) * 2014-06-26 2018-05-16 株式会社村田製作所 Coil module
WO2016063762A1 (en) * 2014-10-22 2016-04-28 株式会社村田製作所 Coil component
CN106233310B (en) * 2014-12-19 2019-05-10 株式会社村田制作所 Wireless IC device, resin-formed body and its manufacturing method
KR101642612B1 (en) * 2014-12-30 2016-07-25 삼성전기주식회사 Inductor and Method of Fabricating the Same
JP6428792B2 (en) * 2015-01-07 2018-11-28 株式会社村田製作所 Coil parts
CN106133761B (en) * 2015-03-06 2019-03-29 株式会社村田制作所 The manufacturing method of wireless IC equipment, the resin-formed body for having the wireless IC equipment and communication terminal and the wireless IC equipment
JP6172418B2 (en) * 2015-04-08 2017-08-02 株式会社村田製作所 ANTENNA DEVICE, CARD TYPE INFORMATION MEDIUM, ELECTRONIC DEVICE, AND ANTENNA DEVICE MANUFACTURING METHOD
KR101878162B1 (en) * 2015-09-16 2018-07-13 주식회사 아모텍 Near field communication antenna module and portable device having the same
JP6135837B1 (en) * 2016-02-19 2017-05-31 株式会社村田製作所 WIRELESS COMMUNICATION DEVICE, ITS MANUFACTURING METHOD, AND RESIN MOLDED BODY
WO2017141771A1 (en) * 2016-02-19 2017-08-24 株式会社村田製作所 Wireless communications device, production method therefor, and resin molded body
WO2017141597A1 (en) * 2016-02-19 2017-08-24 株式会社村田製作所 Wireless communications device, production method therefor, and resin molded body
JP6160796B1 (en) * 2016-02-19 2017-07-12 株式会社村田製作所 WIRELESS COMMUNICATION DEVICE, ITS MANUFACTURING METHOD, AND RESIN MOLDED BODY
JP6520861B2 (en) 2016-08-10 2019-05-29 株式会社村田製作所 Electronic parts
CN210129584U (en) 2016-12-13 2020-03-06 株式会社村田制作所 Wireless communication device and article including the same
JP6669279B2 (en) * 2016-12-28 2020-03-18 株式会社村田製作所 Inductor and DC-DC converter
CN109741903B (en) * 2018-12-11 2021-02-09 北京航空航天大学 MEMS linear solenoid inductor and manufacturing method thereof
WO2020087972A1 (en) * 2018-10-30 2020-05-07 北京航空航天大学 Mems solenoid inductor and manufacturing method therefor
JP7463937B2 (en) * 2020-10-13 2024-04-09 株式会社村田製作所 Inductor Components
US20230082743A1 (en) * 2021-09-13 2023-03-16 RF360 Europe GmbH Integrated passive devices
CN114242421B (en) * 2021-12-28 2023-07-21 横店集团东磁股份有限公司 Thin film inductor and manufacturing method

Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04354404A (en) * 1991-05-31 1992-12-08 Sumitomo Electric Ind Ltd Receiver
JPH06112655A (en) * 1992-09-29 1994-04-22 Matsushita Electric Ind Co Ltd Multilayer printed wiring board with built-in coil, and its manufacture
JPH0993015A (en) * 1995-09-25 1997-04-04 Murata Mfg Co Ltd Antenna system
JPH09162625A (en) * 1995-12-08 1997-06-20 Murata Mfg Co Ltd Chip antenna
JPH09214227A (en) * 1996-02-07 1997-08-15 Murata Mfg Co Ltd Chip antenna
WO1998010389A1 (en) * 1996-09-06 1998-03-12 Sensormatic Electronics Corporation Electronic article surveillance protection for printed circuit boards
JPH1098322A (en) * 1996-09-20 1998-04-14 Murata Mfg Co Ltd Chip antenna and antenna system
JPH10200318A (en) * 1997-01-09 1998-07-31 Fec:Kk Antenna element for portable communication terminal
JPH11261325A (en) * 1998-03-10 1999-09-24 Shiro Sugimura Coil element and its manufacture
JP2002204121A (en) * 2000-10-31 2002-07-19 Mitsubishi Materials Corp Antenna, radio wave transmitting and receiving equipment using the same and method for manufacturing the same
WO2002089157A1 (en) * 2001-04-27 2002-11-07 Ajinomoto Co., Inc. Multilayer coil and its manufacturing method
JP2003197426A (en) * 2001-12-25 2003-07-11 Tdk Corp Composite electronic component containing inductance element
US20030137385A1 (en) * 2000-03-10 2003-07-24 Ahn Kie Y Integrated circuit inductor with a magnetic core
JP2003218626A (en) * 2002-01-17 2003-07-31 Sony Corp Antenna circuit, antenna circuit apparatus, and its manufacturing method
JP2003289007A (en) * 1999-12-28 2003-10-10 Tdk Corp Electronic component
US20040124961A1 (en) * 2002-12-16 2004-07-01 Alps Electric Co., Ltd. Printed inductor capable of raising Q value
JP2004213196A (en) * 2002-12-27 2004-07-29 Fujikura Ltd Semiconductor module, non-contact ic tag and manufacturing method for semiconductor module
JP2004348497A (en) * 2003-05-23 2004-12-09 Mitsubishi Materials Corp Rfid antenna structure, tag with antenna having the same structure, and reader/writer
JP2005184094A (en) * 2003-12-16 2005-07-07 Olympus Corp Antenna and manufacturing method of antenna
WO2006035623A1 (en) * 2004-09-28 2006-04-06 Aisin Seiki Kabushiki Kaisha Antenna assembly and door handle unit
JP2006340101A (en) * 2005-06-02 2006-12-14 Citizen Watch Co Ltd Antenna structure and radio wave correction clock
JP2007019891A (en) * 2005-07-07 2007-01-25 Toda Kogyo Corp Magnetic antenna

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0725407A1 (en) * 1995-02-03 1996-08-07 International Business Machines Corporation Three-dimensional integrated circuit inductor
JP2000137779A (en) * 1998-10-30 2000-05-16 Hitachi Maxell Ltd Non-contact information medium and production thereof
US6525921B1 (en) * 1999-11-12 2003-02-25 Matsushita Electric Industrial Co., Ltd Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same
JP4089167B2 (en) * 2001-03-30 2008-05-28 三菱マテリアル株式会社 RFID tag
US7608477B2 (en) * 2003-07-04 2009-10-27 Murata Manufacturing Co., Ltd. Process for substrate incorporating component
DE10334830A1 (en) * 2003-07-30 2005-05-19 Siemens Ag Coil for motor vehicle equipment has a magnetic core integrated in a printed circuit board and through-hole plated top and bottom strip conductor layers to form a continuous winding
JP2006074534A (en) * 2004-09-03 2006-03-16 Hitachi Ltd Portable terminal
JP2007041666A (en) * 2005-08-01 2007-02-15 Ricoh Co Ltd Rfid tag and method for manufacturing the same

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04354404A (en) * 1991-05-31 1992-12-08 Sumitomo Electric Ind Ltd Receiver
JPH06112655A (en) * 1992-09-29 1994-04-22 Matsushita Electric Ind Co Ltd Multilayer printed wiring board with built-in coil, and its manufacture
JPH0993015A (en) * 1995-09-25 1997-04-04 Murata Mfg Co Ltd Antenna system
JPH09162625A (en) * 1995-12-08 1997-06-20 Murata Mfg Co Ltd Chip antenna
JPH09214227A (en) * 1996-02-07 1997-08-15 Murata Mfg Co Ltd Chip antenna
WO1998010389A1 (en) * 1996-09-06 1998-03-12 Sensormatic Electronics Corporation Electronic article surveillance protection for printed circuit boards
JPH1098322A (en) * 1996-09-20 1998-04-14 Murata Mfg Co Ltd Chip antenna and antenna system
JPH10200318A (en) * 1997-01-09 1998-07-31 Fec:Kk Antenna element for portable communication terminal
JPH11261325A (en) * 1998-03-10 1999-09-24 Shiro Sugimura Coil element and its manufacture
JP2003289007A (en) * 1999-12-28 2003-10-10 Tdk Corp Electronic component
US20030137385A1 (en) * 2000-03-10 2003-07-24 Ahn Kie Y Integrated circuit inductor with a magnetic core
JP2002204121A (en) * 2000-10-31 2002-07-19 Mitsubishi Materials Corp Antenna, radio wave transmitting and receiving equipment using the same and method for manufacturing the same
WO2002089157A1 (en) * 2001-04-27 2002-11-07 Ajinomoto Co., Inc. Multilayer coil and its manufacturing method
JP2003197426A (en) * 2001-12-25 2003-07-11 Tdk Corp Composite electronic component containing inductance element
JP2003218626A (en) * 2002-01-17 2003-07-31 Sony Corp Antenna circuit, antenna circuit apparatus, and its manufacturing method
US20040124961A1 (en) * 2002-12-16 2004-07-01 Alps Electric Co., Ltd. Printed inductor capable of raising Q value
JP2004213196A (en) * 2002-12-27 2004-07-29 Fujikura Ltd Semiconductor module, non-contact ic tag and manufacturing method for semiconductor module
JP2004348497A (en) * 2003-05-23 2004-12-09 Mitsubishi Materials Corp Rfid antenna structure, tag with antenna having the same structure, and reader/writer
JP2005184094A (en) * 2003-12-16 2005-07-07 Olympus Corp Antenna and manufacturing method of antenna
WO2006035623A1 (en) * 2004-09-28 2006-04-06 Aisin Seiki Kabushiki Kaisha Antenna assembly and door handle unit
JP2006340101A (en) * 2005-06-02 2006-12-14 Citizen Watch Co Ltd Antenna structure and radio wave correction clock
JP2007019891A (en) * 2005-07-07 2007-01-25 Toda Kogyo Corp Magnetic antenna

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11315726B2 (en) 2017-01-31 2022-04-26 Murata Manufacturing Co., Ltd. LC resonator

Also Published As

Publication number Publication date
JP5573937B2 (en) 2014-08-20
GB201202765D0 (en) 2012-04-04
GB0917865D0 (en) 2009-11-25
GB2485318A (en) 2012-05-09
JP5170087B2 (en) 2013-03-27
WO2008133018A1 (en) 2008-11-06
GB2461443A (en) 2010-01-06
CN101657938B (en) 2014-05-14
JP2013078144A (en) 2013-04-25
GB2485318B (en) 2012-10-10
CN101657938A (en) 2010-02-24
JPWO2008133018A1 (en) 2010-07-22

Similar Documents

Publication Publication Date Title
GB2461443B (en) Magnetic field coupling antenna module arrangements including a magnetic core embedded in an insulating layer and their manufacturing methods.
EP2086089A4 (en) Laminated iron core, and its manufacturing method
EP2139011A4 (en) Magnetic core for antenna, method for producing magnetic core for antenna, and antenna
EP2146417A4 (en) Laminated iron core, and its manufacturing method
EP2036165A4 (en) Antenna array and unit cell using an artificial magnetic layer
GB2462951B (en) Laminated plate and manufacturing method thereof
EP2383242A4 (en) Mnzn ferrite core and manufacturing method therefor
GB2445247B (en) Nuclear magnetic resonance module
EP2187502A4 (en) Laminated core and method for manufacturing the same
EP2228808A4 (en) Composite magnetic material for magnet and method for manufacturing such material
EP2063489A4 (en) Antenna element and method for manufacturing same
EP2383241A4 (en) Mnznco ferrite core and manufacturing method therefor
EP1716561A4 (en) Spin transfer magnetic element having low saturation magnetization free layers
IL180516A0 (en) Miniature coils on core with printed circuit
EP2216882A4 (en) Laminated stator core, and manufacturing method therefor
HK1122135A1 (en) A nicuzn ferrite and a manufacturing method thereof
GB2470113B (en) Magnetic core and conductive plate arrangement for a magnetic antenna
GB2432260B (en) A resin-impregnated superconducting magnet coil comprising a cooling layer
WO2009001848A1 (en) Microrelay
EP2274751A4 (en) Procedure for manufacturing of a magnetic core and a magnetic core
EP2197006A4 (en) Coil device and its manufacturing method
EP2084779A4 (en) Patch antenna and manufacturing method thereof
SI2138807T1 (en) Method of manufacturing irregularly shaped laminated core and irregularly shaped laminated core manufactured by using the method
TWI347606B (en) Magnetic memory and memory cell thereof and method of manufacturing the memory cell
TWI341602B (en) Magnetic element and manufacturing method therefor

Legal Events

Date Code Title Description
789A Request for publication of translation (sect. 89(a)/1977)

Ref document number: 2008133018

Country of ref document: WO

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20210410